CN1738512B - 3d circuit module, multilayer 3d circuit module formed thereof and method for manufacturing the circuit modules - Google Patents

3d circuit module, multilayer 3d circuit module formed thereof and method for manufacturing the circuit modules Download PDF

Info

Publication number
CN1738512B
CN1738512B CN200510085118XA CN200510085118A CN1738512B CN 1738512 B CN1738512 B CN 1738512B CN 200510085118X A CN200510085118X A CN 200510085118XA CN 200510085118 A CN200510085118 A CN 200510085118A CN 1738512 B CN1738512 B CN 1738512B
Authority
CN
China
Prior art keywords
mentioned
circuit module
bonding land
supporting member
depressed part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200510085118XA
Other languages
Chinese (zh)
Other versions
CN1738512A (en
Inventor
小野正浩
近藤繁
西川和宏
西田一人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN1738512A publication Critical patent/CN1738512A/en
Application granted granted Critical
Publication of CN1738512B publication Critical patent/CN1738512B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06517—Bump or bump-like direct electrical connections from device to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06582—Housing for the assembly, e.g. chip scale package [CSP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
    • H01L2225/1035—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the device being entirely enclosed by the support, e.g. high-density interconnect [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1047—Details of electrical connections between containers
    • H01L2225/1064—Electrical connections provided on a side surface of one or more of the containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/1627—Disposition stacked type assemblies, e.g. stacked multi-cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive

Abstract

A 3D circuit module which is highly reliable, easily layered and able to mount electronic components in high density is obtained by providing a support member having a frame in the periphery thereof and a recess; a coating layer for coating the frame and filling in the recess, the coating layer being made of resin material which is adhesive and has a softening temperature lower than the softening temperature of the support member; a wiring pattern formed on the coating layer, the wiring pattern including a first land on the frame, a second land on the recess, and a wiring part for connecting between the first land and the second land; and an electronic component having a projecting electrode formed on a side thereof, the electronic component being bonded to the coating layer and accommodated in the recess, with the projecting electrode connected to the second land.

Description

Three-dimensional circuit module and with its lamination three-dimensional circuit module and manufacture method thereof
Technical field
The present invention, relate to the storage card that will use as the recording medium of pocket digital device etc., the slim electronic unit of memory IC chip etc. is installed in the circuit module among the predetermined size to high-density, only three-dimensional circuit module and with the lamination three-dimensional circuit module of this module with the portable terminal device and the manufacture method thereof of these modules.
Background technology
As the circuit module substrate that is used in the existing storage card etc., the technology of opening 2002-207986 communique (below, note is made " patent documentation 1 ") in for example spy on the books.
Figure 13 A and Figure 13 B are the profiles that is recorded in the circuit module substrate of patent documentation 1.
Figure 13 A, the electronic unit 1020 of expression IC chip etc. are installed in the circuit module substrate 1030 of the only single face of the circuit board 1010 that is made of epoxy resin etc.Figure 13 B, expression electronic unit 1050,1060 is installed in the double-edged circuit module substrate 1070 of circuit board 1040.
Then, shown in the profile of Figure 14, with the predetermined electrode 1020A of foregoing circuit module substrate 1030 and the predetermined electrode 1050A and the 1060A of circuit module substrate 1070, the conductive ball 1080 by for example copper ball etc. connects with scolding tin 1090.
And, circuit module substrate 1030,1070 is laminated on the basal substrate 1100, form the circuit module substrate 1110 of stereo circuit structure with storage card etc.
; in the circuit module substrate 1030 of the only single face that electronic unit 1020 is installed on existing circuit board 1010; because poor by the coefficient of linear expansion of circuit board 1010 and electronic unit 1020 or electrode 1020A is easy to produce warpage after installation, be difficult to slimming.
And in the circuit module substrate 1070 on the two sides that electronic unit 1050,1060 is installed on circuit board 1040, electronic unit 1050 or 1060 is installed on after the single face, and electronic unit 1060 or 1050 is installed on another side.Therefore, be subjected to the poor of thermal process between the two sides, the problem that produces difference on engaging force is arranged by electronic unit 1050,1060 is loaded into.
And,, form stereo circuit with laminated construction by circuit module substrate 1030,1070 is connected with scolding tin 1090 by conductive ball 1080.This occasion usually, because be difficult to conductive ball 1080 is gathered supply together for electrode 1020A, 1050A, 1060A, must be supplied with one by one, and production efficiency reduces.
And, for fear of the damage that causes by the contact each other of circuit module substrate, the gap of certain degree must be set.Therefore, the stereo circuit with laminated construction is arranged, more slim densification becomes the problem of difficulty etc.
Summary of the invention
Three-dimensional circuit module of the present invention possesses:
The frame portion around having and the supporting member of depressed part;
Be covered in set on the frame portion of supporting member the landfill depressed part by the cover layer that constitutes than the low resin material of supporting member softening temperature with cementability;
By the 1st bonding land and the 2nd bonding land on depressed part top and the wiring figure that the wiring portion that connects between the 1st bonding land and the 2nd bonding land is constituted that are arranged at supratectal frame portion top; With
Have the electrode of overshooting shape and be connected in the 2nd bonding land of wiring figure and the electrode of overshooting shape is adhered to cover layer and places electronic unit in depressed part at single face.
Lamination three-dimensional circuit module of the present invention has overlapping a plurality of three-dimensional circuit module of the present invention, by the cover layer in the frame portion of the supporting member of contact bonded to each other each other and the 1st bonding land of connecting wiring figure each other, the formation of lamination.
The manufacture method of three-dimensional circuit module of the present invention comprises:
The operation of the frame portion around formation has and the supporting member of depressed part;
Cover above the frame portion of supporting member and the landfill depressed part like that, by forming tectal operation than the low resin material of supporting member softening temperature with cementability;
On cover layer, form the operation of the wiring figure that constitutes by the 2nd bonding land on the 1st bonding land on frame portion top and depressed part top and with the wiring portion that connects between the 1st bonding land and the 2nd bonding land;
On cover layer, the electrode of the 2nd bonding land of connecting wiring figure and the overshooting shape of the single face that is formed at electronic unit, and the operation of loading electronic unit; With
Be heated to more than or equal to the softening temperature of resin material and with predetermined pressure, be pressed into intratectal operation in the depressed part being loaded into supratectal electronic unit.
The manufacture method of three-dimensional circuit module of the present invention comprises:
The operation of the frame portion around formation has and the supporting member of depressed part;
On than the frame portion that covers supporting member at least and on the emulsion sheet that constitutes of the low resin material of the supporting member softening temperature above the depressed part with cementability, after the wiring figure that formation constitutes by the 2nd bonding land of the 1st bonding land of frame portion position and depressed part position and with the wiring portion that connects between the 1st bonding land and the 2nd bonding land, the electrode that connects the 2nd bonding land and the overshooting shape of the single face that is formed at electronic unit, and the operation of loading electronic unit;
Make the emulsion sheet that loads electronic unit in the 1st bonding land of wiring figure frame of living in portion position, make the 2nd bonding land and electronic unit in the depressed part position, the operation that overlaps with supporting member; With
Be heated to more than or equal to the softening temperature of resin material and with predetermined pressure, emulsion sheet and electronic unit integrally be pressed into the operation in the depressed part in the depressed part position of supporting member.
The manufacture method of lamination three-dimensional circuit module of the present invention, comprise: with a plurality of three-dimensional circuit modules of the present invention, a plurality of overlappingly overlapping by the frame portion of supporting member, be heated to more than or equal to the softening temperature of resin material and with predetermined pressure, cover layer by the frame portion of the supporting member of three-dimensional circuit module bonded to each other makes the 1st bonding land of wiring figure connect each other each other, the operation of lamination.
Description of drawings
Fig. 1 is the profile of the 1st embodiment neutral body circuit module of the present invention.
Fig. 2 is the stereoscopic figure of same embodiment neutral body circuit module.
Fig. 3 is the profile of the other routine neutral body circuit module of same embodiment.
Fig. 4 is the profile of the other routine neutral body circuit module of same embodiment.
Fig. 5 is the profile of the other routine neutral body circuit module of same embodiment.
Fig. 6 A, Fig. 6 B, Fig. 6 C, Fig. 6 D are the profiles of the manufacture method of the same embodiment neutral body circuit module of explanation.
Fig. 7 A, Fig. 7 B, Fig. 7 C, Fig. 7 D are the stereoscopic figure of the manufacture method of the same embodiment neutral body circuit module of explanation.
Fig. 8 is the profile that is pressed into operation of the same embodiment neutral body circuit module of explanation.
Fig. 9 is the profile that is pressed into operation of the other routine neutral body circuit module of the same embodiment of explanation.
Figure 10 is the profile of lamination three-dimensional circuit module and manufacture method thereof among explanation the 2nd embodiment of the present invention.
Figure 11 is the profile that is pressed into operation of the manufacture method of lamination three-dimensional circuit module among the same embodiment of explanation.
Figure 12 is the stereoscopic figure of lamination three-dimensional circuit module among the same embodiment.
Figure 13 A, Figure 13 B are the profiles of existing circuit module substrate.
Figure 14 is the profile of circuit module substrate with stereo circuit of existing laminated construction.
Embodiment
Below, about embodiments of the invention, with reference to description of drawings.
Also have, accompanying drawing at random enlarges expression in order to understand easily.
(the 1st embodiment)
Fig. 1 is the profile of the 1st embodiment neutral body circuit module of the present invention, and Fig. 2 is its stereoscopic figure.
In Fig. 1 and Fig. 2, supporting member 110 has frame portion 120 on every side, is formed at the depressed part 140,150 and the basal component 130 on the two sides of its thickness direction.And, supporting member 110, shape stability is good, thermal endurance is high by the high rigidity of for example liquid crystal polymer, polyphenylene sulfide, polyphthalamide etc. thermoplastic resin or thermosetting resin form.Also have, by cover layer described later, can guarantee and the occasion of the insulation of wiring figure etc., also can form supporting member 110 with the metal series material.
And when covering the top 120A of frame portion 120 on the two sides be formed at supporting member 110 and following 120B, landfill depressed part 140,150 is provided with the cover layer 160,170 that is made of resin material like that.Cover layer 160,170, softening temperature is lower than supporting member 110, and its surface has cementability at least.And, cover layer 160,170, or landfill is extremely identical with following 120B with the top 120A of frame portion 120, and perhaps landfill is to the position that enters into a little in the depressed part 140,150.Also have, as resin material, though, be not limited to this with polyethylene terephthalate, PEN etc.
And, in cover layer 160,170, partly be pressed into and be provided with, for example with formation such as Copper Foils and implement gold-plated wiring figure 180,190.
Be formed at the wiring figure 180 of cover layer 160, constitute by the 2nd bonding land 210 of the position of the 1st bonding land 200 of the position of frame portion 120 and depressed part 140 and with the wiring portion 220 that connects between the 1st bonding land 200 and the 2nd bonding land 210.Similarly, be formed at the wiring figure 190 of cover layer 170, constitute by the 1st bonding land 230 and the 2nd bonding land 240 and wiring portion 250.
And the 2nd bonding land 210,240 is pressed into the near position of basal component 130 of the depressed part 140,150 that covers from lining cap rock 160,170.And, the 2nd bonding land 210,240,260A, 270A connect with the electrode of the overshooting shape of electronic unit 260,270 (below, note is made " electrode ").Also have, electronic unit is for example IC chip or semiconductor memory etc., by abrasive sheetization to for example 50 μ m～200 μ m degree.
And, the face of the electrode 260A of electronic unit 260,270,270A side at least, to cover layer 160,170, quilt is placed among depressed part 140,150, is mounted by bonding or bonding (below, note is made " bonding ").But, usually, the side of electronic unit 260,270, the cap rock 160,170 that also is covered by being pressed into covers, and is bonded.
The 1st embodiment neutral body circuit module 100 of the present invention, electronic unit 260,270 are pressed into cover layers 160,170 in the depressed part 140,150 of supporting member 110 and bonded placing.Therefore, the engaging force of the 2nd bonding land 210,240 of electrode 260A, the 270A of electronic unit 260,270 and wiring figure 180,190 improves, and the reliability height that connects.
And,,, can obtain slim three-dimensional circuit module 100 because be difficult to produce the distortion of warpage after the installation of electronic unit 260,270 etc. by frame portion 120 around the supporting member 110.
And the 1st bonding land 200,230 of wiring figure 180,190 is arranged at the top 120A and the following 120B of the frame portion 120 of supporting member 110.Therefore, by electronic unit 260,270 being pressed in the depressed part 140,150 of supporting member 110, form three-dimensional wiring figure 180,190.Thus, lamination three-dimensional circuit module described later is by the 1st bonding land 200,230, by a plurality of three-dimensional circuit modules directly being connected each other and obtaining.
And, in Fig. 1 and Fig. 2, the formation that is placed symmetrically is shown in the cover layer 160,170 that is pressed in the depressed part 140,150 that is arranged at supporting member 110 and the electronic unit 260,270 of bonding.Thus, as described later,, can make the difference that is subjected to thermal process when installing little because electronic unit 260,270 can be installed simultaneously.Its result is difficult to produce the distortion of warpage etc., when improving the reliability that connects, can realize can slim densification three-dimensional circuit module 100.
Also have, shown in the profile of the three-dimensional circuit module of Fig. 3, also can be used as the three-dimensional circuit module 330 that only single side face at the supporting member 280 with basal component 300 possesses depressed part 310 and constitute.Even in this occasion because the frame portion 290 of supporting member 280, be arranged at depressed part 310 around, the distortion that also can after the installation of electronic unit 320, be difficult to produce warpage etc.
And, in the 1st embodiment of the present invention,, be not limited thereto though be illustrated in the occasion of respectively loading 1 electronic unit 260,270 in the depressed part 140,150.For example, shown in the profile of the three-dimensional circuit module of Fig. 4, also can be used as in the depressed part 140,150 of supporting member 110 and load respectively more than or equal to 2 electronic unit 330A, 330B and the three-dimensional circuit module 350 of electronic unit 340A, 340B etc.Thus, the be improved three-dimensional circuit module of packing density of electronic unit.
And, also can be used as the support member that has a plurality of depressed parts shown in Figure 5ly and constitute.For example, by the frame portion 370 and the spacing frame portion 380 of support member 360, depressed part 390 is divided into 2 depressed part 390A, 390B, and depressed part 400 is divided into 2 depressed part 400A, 400B.Then, in depressed part 390A, the 390B cut apart and depressed part 400A, 400B, place and load electronic unit 410A, the 410B and electronic unit 420A, the 420B that are pressed into cover layer and bonding.
So,,, the distortion of warpage etc. can be prevented, the high three-dimensional circuit module of reliability 425 can be obtained because mechanical strength is enhanced by the spacing frame portion 380 of support member 360.And, also the 1st bonding land of wiring figure can be arranged at spacing frame portion 380.
Below, press the process sequence explanation about the manufacture method of the three-dimensional circuit module of the 1st embodiment of the present invention.
From Fig. 6 A to Fig. 6 D, be the profile of manufacture method of the three-dimensional circuit module of explanation the 1st embodiment of the present invention, from Fig. 7 A to Fig. 7 D, be its stereoscopic figure.
At first, shown in Fig. 6 A and Fig. 7 A, be produced on the supporting member 110 of frame portion 120, basal component 130 and depressed part 140,150 around having on the two sides (the top 120A and the following 120B that are equivalent to frame portion 120) of the thickness direction of frame portion 120.Supporting member 110, the thermoplastic resin that shape stability is good, thermal endurance is high with the high rigidity of for example liquid crystal polymer, polyphenylene sulfide, polyphthalamide etc. etc. are made by die forming or cut.At this, depressed part has the size that can bury electronic unit described later at least.And the section shape of the medial surface of depressed part is not limited to as from shown in Fig. 6 A to Fig. 6 D, can be that cone-shaped also can be a vertical configuration, so long as the arbitrary shape that wiring figure does not break.
Secondly, shown in Fig. 6 B and Fig. 7 B, the top 120A of the frame portion 120 of covering supporting member 110 and following 120B and depressed part 140,150 are like that with cover layer 160,170 landfills.At this, cover layer 160,170, lower than supporting member 110 softening temperatures, the material that has the thermoplastic resin etc. of cementability with its surface at least constitutes.Also have, as tectal resin material, though can be not limited thereto with for example polyethylene terephthalate, PEN etc.
Then, cover layer 160,170 is the occasion of polyethylene terephthalate at for example supporting member 110 for liquid crystal polymer, tectal resin material, with 250 ℃～300 ℃ of heating-up temperatures, with the plus-pressure 300kgf/cm of institute 2～700kgf/cm 2Form.
Secondly, shown in Fig. 6 C and Fig. 7 C, on cover layer 160, for example paste Copper Foil etc. and etching and processing.Thus, form by the 1st bonding land 200 of the position of 120A on the frame portion 120 of supporting member 110 and the 2nd bonding land 210 of preposition on the depressed part 140 and connect the 1st bonding land 200 and the 2nd bonding land 210 between the wiring figure 180 that constitutes of wiring portion 220.At this moment, wiring figure 180 shown in Fig. 6 D, forms corresponding to the position of the electrode 260A of the electronic unit of installing 260.Similarly, on cover layer 170, the wiring figure 190 that is made of the 1st bonding land 230 and the 2nd bonding land 240 and wiring portion 250 is corresponding to the position of the electrode 270A of electronic unit 270 and form.
Also have, the surface of wiring figure it is desirable to, and in order for example to improve fluid-tight engagement power and anti-oxidation, forms gold-plated after nickel plating.
And, in the formation of wiring figure 180,190, much less can so long as do not break, not be defined in these methods especially with silk screen printing, galvanoplastic or laser processing method etc. certainly by being pressed into.
Secondly, shown in Fig. 6 D and Fig. 7 D, make the electrode 260A of electronic unit 260 be connected to the 2nd bonding land 210 of wiring figure 180 and be loaded on the cover layer 160.And, make the electrode 270A of electronic unit 270 be connected to the 2nd bonding land 240 of wiring figure 190 and be loaded on the cover layer 170.Thus, make intermediate structure body 430.
Also have, when the loading of electronic unit, if cover layer is heated to the softening temperature degree, because improve tectal bonding force, and electronic unit is bonded to tectal surface and ideal more strongly.
Secondly, shown in the profile that is pressed into operation of key diagram 8, intermediate structure body 430 is installed between the patrix 440A and counterdie 440B by press 440.
Then, with softening temperature, for example,,, make cover layer 160,170 softening the intermediate structure body 430 that loads electronic unit 260,270 with 80 ℃～200 ℃ heating in the occasion of polyethylene terephthalate more than or equal to cover layer 160,170.
Also having, press the upper die and lower die of press, also can be the flat board that needn't have jut as shown in the figure especially.And, do not break or the ground such as broken string of wiring figure are pressed in the cover layer even shape does not also limit especially as long as can on electronic unit, not produce.Also be same in following embodiment.
Secondly, with such shown in the arrow of Fig. 8, while make patrix 440A keep descending with counterdie 440B parastate.Thus, among the top 120A of the frame portion 120 of self-supporting construction element 110 and the following 120B cover layer 160,170 till the position that enters into depressed part 140,150, with predetermined pressure (for example, 3kgf/cm 2～30kgf/cm 2) electronic unit 260,270 is pressed into.But this plus-pressure depends on the number of pins and the size of electronic unit.
Then, by taking out cooling, obtain three-dimensional circuit module shown in Figure 1 100 from pressing press 440.At this moment, by for example tectal flow etc., under the occasion that the 1st bonding land lining cap rock covers,, also can grind or etching etc. in order to expose on the surface that makes the 1st bonding land.
Also have, by the direction that is pressed into of press, from upper die and lower die which side can, and can be from both sides.This occasion as required, at the intermediate structure body of three-dimensional circuit module with press between the press, in order to realize preventing bonding and uniform pressurization, preferably is provided with from matrix.
And, when being pressed among the cover layer in the depressed part of supporting member by the electronic unit that will be loaded into the intermediate structure body by press, consider that wiring figure is pressed into the occasion of depressed part, preferably by etching and processing or duplicate the good Copper Foil of ductility etc. and form wiring figure.And, if possible, be preferably formed as wiring figure than the profile big (the quite amount of being pressed into) of supporting member.
And, under the occasion of the material supporting member high with softening temperature, be heated to more than or equal to tectal softening temperature, the intermediate structure body is installed between the upper die and lower die by press, even because it is softening not indeformable, better to be pressed into the electronic unit supporting member yet.Above-mentioned method is suitable in following embodiment too.
According to the manufacture method of the 1st embodiment of the present invention, the formation of three-dimensional wiring figure and the installation of electronic unit, integration simultaneously realizes three-dimensional circuit module.And, can stablize and make expeditiously, shape stability and the good three-dimensional circuit module of reliability between electrode is connected.
Below, on one side the manufacture method of the three-dimensional circuit module in the example of other of the 1st embodiment is described with Fig. 9 on one side with reference to Fig. 7.
Fig. 9 is the profile that is pressed into operation of the three-dimensional circuit module in other the example of explanation the 1st embodiment.The formation method of supporting member 110, though identical with the 1st embodiment, with cover layer be emulsion sheet 450,460 these some differences with smooth sheet of preset thickness.At this, so-called preset thickness in the occasion that electronic unit is pressed in the depressed part, is the thickness of degree of face lining cover plate bonding of the electrode side of electronic unit at least.And, the thickness of emulsion sheet, though be desirably the thickness that can bury electronic unit underground, even be that the degree of depth degree of depressed part also is out of question.And, electronic unit and emulsion sheet are pressed into after the depressed part of supporting member simultaneously, as long as can remove the deformations of the emulsion sheet that exceeds periphery, special limited thickness.
At first, on emulsion sheet 450, paste Copper Foil etc.Then, with the corresponding position of electrode 260A of the electronic unit 260 of 120A and loading above the frame portion 120 of supporting member 110, form the wiring figure 470 identical by etching and processing with the wiring figure 180 shown in Fig. 7 C.Similarly, on emulsion sheet 460, the position corresponding at the electrode 270A of the electronic unit 270 of 120B and loading below the frame portion 120 of supporting member 110 forms wiring figure 480.
Next is heated to the softening temperature more than or equal to the resin material that constitutes the emulsion sheet 450,460 that forms wiring figure 470,480.Then, identical with the occasion shown in Fig. 7 D, make the electrode 260A of electronic unit 260 be connected to wiring figure 470 and be loaded on the emulsion sheet 450.Similarly, make the electrode 270A of electronic unit 270 be connected to wiring figure 480 and be loaded on the emulsion sheet 460.
Secondly, on one side emulsion sheet 450,460 is overlapped with the frame portion 120 of supporting member 110 and the position of depressed part 140,150, paste with the cementability of emulsion sheet 450,460 on one side, make the intermediate structure body.At this moment, the electronic unit 260,270 that is connected to wiring figure 470,480 is overlapped in the position corresponding to the depressed part 140,150 of supporting member 110.
Secondly, with loading the emulsion sheet 450 of electronic unit 260 and loading the top and bottom of the emulsion sheet 460 of electronic unit 270, be installed between the patrix 490A and counterdie 490B by press 490 with the intermediate structure body.Then,, be heated to, under the occasion of for example polyethylene terephthalate, 80 ℃～200 ℃, make it softening more than or equal to softening temperature with emulsion sheet 450,460.
Secondly, with such shown in the arrow of Fig. 9, while make patrix 490A keep descending with counterdie 490B parastate.Then, electronic unit 260,270 and emulsion sheet 450,460 are pressed among the depressed part 140,150 of supporting member 110.Thus, emulsion sheet 450,460, when covering the frame portion 120 of supporting member 110, landfill depressed part 140,150 is up to from the hollow a little position of going into of frame portion 120.And, after electronic unit 260,270 is pressed into emulsion sheet 450,460,, make three-dimensional circuit module 100 shown in Figure 1 by taking out cooling from pressing press 490.Also have,, much less can certainly after cooling, three-dimensional circuit module be taken out from pressing press in above-mentioned operation.
At this moment,, use by press 490 to be pressed in the depressed part 140,150 of supporting member 110, guided into a little among the depressed part 140,150 around the emulsion sheet 450,460 by the emulsion sheet 450,460 that will load electronic unit 260,270.Therefore, emulsion sheet 450,460 and wiring figure 470,480 preferably are made into bigger a little than the periphery of the frame portion 120 of supporting member 110.On the other hand, when taking out from pressing press 490, the deformations of emulsion sheet 450,460 exceed supporting member 110 around occasion under, must remove by for example grinding to wait.
According to other the manufacture method of example of the 1st embodiment of the present invention, be in the state of smooth sheet at emulsion sheet, wiring figure can be formed on the emulsion sheet and load electronic unit.Therefore, the loading of the formation of wiring figure and electronic unit becomes easy.
In addition, because the formation of three-dimensional wiring figure and the installation of electronic unit can carry out simultaneously, so can efficiently, stably make three-dimensional circuit module.
Also have, in the 1st embodiment of the present invention, specification be manufactured on supporting member the two sides have depressed part, the occasion of the three-dimensional circuit module of electronic unit is installed in depressed part, but is not limited thereto.For example, as shown in Figure 3, have the three-dimensional circuit module of depressed part etc. for only single side face, also can similarly be suitable at supporting member.
(the 2nd embodiment)
Figure 10 is the profile of lamination three-dimensional circuit module and manufacture method thereof among explanation the 2nd embodiment of the present invention.
As shown in figure 10, lamination three-dimensional circuit module among the 2nd embodiment of the present invention, three-dimensional circuit module shown in Figure 1 is overlapping, by pushing, obtain the lamination three-dimensional circuit module with Fig. 8 or identical heating shown in Figure 9 by press 500.
Below, use Figure 10, the manufacture method about the lamination three-dimensional circuit module of overlapping 3 three-dimensional circuit modules 510,520,530 is described.
At this, 3 three-dimensional circuit modules 510,520,530, on the frame portion 540,550,560 of supporting member separately, by the cover layer 540A, the 540B that are made of resin material, cover layer 550A, 550B and cover layer 560A, 560B cover.And, on each cover layer, form the 1st bonding land 570A, the 570B of each wiring figure that constitutes by Copper Foil etc., the 1st bonding land 580A, 580B and the 1st bonding land 590A, 590B.Also have, these are to have the formation identical with the three-dimensional circuit module that illustrates in the 1st embodiment 100.And, supporting member and tectal resin material also with the 1st embodiment in illustrate identical.
At first, as shown in figure 10,, for example make three-dimensional circuit module 530 below and on the overlapping counterdie 500B that places by press 500 with 3 three-dimensional circuit modules 510,520,530.At this moment, the cover layer 540B of the frame portion 540 of three-dimensional circuit module 510 and the 1st bonding land 570B contact with the 1st bonding land 580A with the cover layer 550A of the frame portion 550 of adjacent three-dimensional circuit module 520 respectively.And the cover layer 550B of the frame portion 550 of three-dimensional circuit module 520 and the 1st bonding land 580B contact like that with the 1st bonding land 590A with the cover layer 560A of the frame portion 560 of adjacent three-dimensional circuit module 530 respectively and place.
Secondly, under above-mentioned state,, be heated to it more than or equal to softening temperature with constituting each tectal resin material of 3 three-dimensional circuit modules 510,520,530.Thus, cover layer 540A, 540B on the frame portion 540,550,560, cover layer 550A, 550B and cover layer 560A, 560B are softening, and its surperficial bonding force improves more.
Then, with such shown in the arrow of Figure 10, while make patrix 500A keep descending with counterdie 500B parastate.At this moment, shown in the profile of Figure 11,3 three-dimensional circuit modules 510,520,530 of configuration between patrix 500A and counterdie 500B are with predetermined pressure (for example, 3kgf/cm 2～30kgf/cm 2) pressurization.This plus-pressure is to depend on the number of pins of electronic unit with big or small.Also have, this occasion as required, by the patrix of press be contacted with between the three-dimensional circuit module of counterdie, in order to realize preventing adhesion and pressurization uniformly, preferably is provided with from matrix.
Thus, the cover layer 550B of the cover layer 540B of the three-dimensional circuit module 510 of contact and the cover layer 550A of three-dimensional circuit module 520 and three-dimensional circuit module 520 and the cover layer 560A of three-dimensional circuit module 530,1 integral body of one-tenth adhered to one another.And the 1st bonding land 580B of the 1st bonding land 570B of this cover layer 540B and the 1st bonding land 580A of cover layer 550A and cover layer 550B and the 1st bonding land 590A of cover layer 560A are electrically connected mutually.
Secondly, take out cooling, the lamination three-dimensional circuit module 600 shown in the stereoscopic figure of making Figure 12 by 3 three-dimensional circuit modules 510,520,530 that will become 1 integral body from pressing press 500.Also have,, much less can certainly after cooling, the lamination three-dimensional circuit module be taken out from pressing press in above-mentioned operation.
And, shrink by the resin material that constitutes cover layer 540B, 550A and cover layer 550B, 560A when this cooling, more positively connect between the 1st bonding land 570B, 580A and between the 1st bonding land 580B, 590A.
Secondly, between the three-dimensional circuit module of lamination, by the through hole (not shown) or as shown in figure 12, connect by interlayer connection electrode 610.And interlayer connection electrode 610 is connected the circumferential lateral surface of frame portion 540,550,560 of the supporting member of three-dimensional circuit module, by for example silk screen print method or paste after the Copper Foil etc. etching and processing etc. and form.
The three-dimensional circuit module 600 of the lamination of Zhi Zuoing like this can utilize with the electronic-circuit device that is combined to the storage card that is electrically connected with outside electronic equipment by the 1st bonding land etc. or portable equipment etc.
Also have, in the 2nd embodiment of the present invention,, be not limited thereto though narrated manufacture method about the lamination three-dimensional circuit module of overlapping 3 three-dimensional circuit modules.For example, by suitable three-dimensional circuit module shown in Figure 3, three-dimensional circuit module of Fig. 4 or a plurality of electronic units of loading shown in Figure 5 etc. can obtain the lamination three-dimensional circuit module that is made of the number of plies arbitrarily.
And, according to the 2nd embodiment of the present invention, engagement member especially, can be easily, expeditiously, the lamination three-dimensional circuit module of the three-dimensional circuit module of stable wiring of making the solid that forms 1 integral body when lamination has with being pressed into of electronic unit.
Also have, in the various embodiments described above, also can between the frame portion of supporting member and depressed part side, form through hole or not establish the part formation groove of the 1st bonding land in frame portion.Thus, at the resin material that for example squeezes the cover layer that or emulsion sheet with electronic unit by compression or shrink under the nonabsorbable occasion, because by through hole or groove, can discharge, so can prevent by the stressed inhomogeneous distortion that causes or bubble etc. residual.
And,, can realize the portable terminal device of miniaturization and more or high capacity by three-dimensional circuit module and lamination three-dimensional circuit module in the various embodiments described above are used for storage card, IC-card, portable equipment or portable terminal device etc.

Claims (10)

1. a three-dimensional circuit module is characterized in that, comprising:
Has the supporting member of frame portion and depressed part on every side;
Be covered on the above-mentioned frame portion of above-mentioned supporting member, set the cover layer that resin material low by the softening temperature than above-mentioned supporting member, that have cementability constitutes the above-mentioned depressed part of landfill;
Above-mentioned supratectal by being arranged at, the 1st bonding land on above-mentioned frame portion top, the 2nd bonding land on above-mentioned depressed part top and the wiring figure that the wiring portion that couples together between above-mentioned the 1st bonding land and above-mentioned the 2nd bonding land is constituted; With
Electronic unit, this electronic unit has the electrode of overshooting shape at single face,
The electrode of above-mentioned overshooting shape is connected in above-mentioned the 2nd bonding land of above-mentioned wiring figure, and above-mentioned electronic unit places in above-mentioned depressed part to be adhered to above-mentioned tectal mode,
Above-mentioned electronic unit is provided with to be pressed into above-mentioned intratectal mode on above-mentioned wiring figure.
2. according to the described three-dimensional circuit module of claim 1, it is characterized in that,
On the two sides of the thickness direction of above-mentioned supporting member, have above-mentioned frame portion and depressed part.
3. according to the described three-dimensional circuit module of claim 1, it is characterized in that,
Above-mentioned depressed part partly is slit into a plurality of by the frame portion of above-mentioned supporting member and spacing frame.
4. according to the described three-dimensional circuit module of claim 1, it is characterized in that,
Above-mentioned resin material is than the low thermoplastic resin of above-mentioned supporting member softening temperature.
5. a lamination three-dimensional circuit module is characterized in that, comprising:
The described three-dimensional circuit module of overlapping a plurality of claim 1, mutually the above-mentioned cover layer in the above-mentioned frame portion of the above-mentioned supporting member that contacts of cementation each other, above-mentioned the 1st bonding land that is thus connected above-mentioned wiring figure forms lamination each other.
6. the manufacture method of a three-dimensional circuit module is characterized in that, comprises following operation:
Formation has the supporting member of frame portion and depressed part on every side;
Be covered on the above-mentioned frame portion of above-mentioned supporting member, the above-mentioned depressed part of landfill ground, resin material low by the softening temperature than above-mentioned supporting member, that have cementability forms cover layer;
On above-mentioned cover layer, form the 1st bonding land, the wiring figure of the 2nd bonding land on above-mentioned depressed part top and the wiring portion formation that will couple together between above-mentioned the 1st bonding land and above-mentioned the 2nd bonding land by above-mentioned frame portion top;
On above-mentioned cover layer, connect above-mentioned the 2nd bonding land of above-mentioned wiring figure and the electrode ground of the overshooting shape of the single face that is formed at electronic unit and load above-mentioned electronic unit; With
Be heated to softening temperature more than or equal to above-mentioned resin material, with predetermined pressure, be pressed in the above-mentioned cover layer in the above-mentioned depressed part being loaded into above-mentioned supratectal above-mentioned electronic unit.
7. the manufacture method of a three-dimensional circuit module is characterized in that, comprises following operation:
Formation has the supporting member of frame portion and depressed part on every side;
Covering on the above-mentioned frame portion of above-mentioned at least supporting member and on the above-mentioned depressed part, on the emulsion sheet that softening temperature than above-mentioned supporting member resin material low, that have cementability constitutes, formation is by the 1st bonding land that is positioned at above-mentioned frame portion, in the 2nd bonding land of above-mentioned depressed part and after the wiring figure of the wiring portion that couples together between with above-mentioned the 1st bonding land and above-mentioned the 2nd bonding land formation, connect the electrode ground of above-mentioned the 2nd bonding land and the overshooting shape of the single face that is formed at electronic unit, load above-mentioned electronic unit;
Make above-mentioned the 1st bonding land of the above-mentioned wiring figure of the above-mentioned emulsion sheet that is mounted with above-mentioned electronic unit be positioned at above-mentioned frame portion, make above-mentioned the 2nd bonding land and above-mentioned electronic unit be positioned at above-mentioned depressed part ground, overlap with above-mentioned supporting member; With
Be heated to softening temperature, pressure, above-mentioned emulsion sheet and above-mentioned electronic unit integrally be pressed in the above-mentioned depressed part in the above-mentioned depressed part position of above-mentioned supporting member to be scheduled to more than or equal to above-mentioned resin material.
8. the manufacture method of a lamination three-dimensional circuit module is characterized in that, comprises following operation:
With the described three-dimensional circuit module of claim 1, overlapping overlappingly a plurality of by the above-mentioned frame portion of above-mentioned supporting member,
Be heated to softening temperature, pressure to be scheduled to more than or equal to above-mentioned resin material, make the above-mentioned cover layer cementation each other of above-mentioned frame portion of the above-mentioned supporting member of above-mentioned three-dimensional circuit module, above-mentioned the 1st bonding land of above-mentioned wiring figure is connected to each other and lamination.
9. a portable terminal device that loads three-dimensional circuit module is characterized in that, above-mentioned three-dimensional circuit module comprises:
Has the supporting member of frame portion and depressed part on every side;
Be covered on the above-mentioned frame portion of above-mentioned supporting member, set the cover layer that resin material low by the softening temperature than above-mentioned supporting member, that have cementability constitutes the above-mentioned depressed part of landfill;
Above-mentioned supratectal by being arranged at, the 1st bonding land on above-mentioned frame portion top, the 2nd bonding land on above-mentioned depressed part top and the wiring figure that the wiring portion that couples together between above-mentioned the 1st bonding land and above-mentioned the 2nd bonding land is constituted; With
Electronic unit, this electronic unit has the electrode of overshooting shape at single face,
The electrode of above-mentioned overshooting shape is connected in above-mentioned the 2nd bonding land of above-mentioned wiring figure, and above-mentioned electronic unit places in above-mentioned depressed part to be adhered to above-mentioned tectal mode,
Above-mentioned electronic unit is provided with to be pressed into above-mentioned intratectal mode on above-mentioned wiring figure.
10. according to the described portable terminal device of claim 9, it is characterized in that, comprising:
Overlapping a plurality of three-dimensional circuit module, the above-mentioned cover layer in the above-mentioned frame portion of the above-mentioned supporting member that contacts bonded to each other each other, above-mentioned the 1st bonding land that is thus connected above-mentioned wiring figure is the lamination three-dimensional circuit module of lamination each other.
CN200510085118XA 2004-08-20 2005-07-20 3d circuit module, multilayer 3d circuit module formed thereof and method for manufacturing the circuit modules Expired - Fee Related CN1738512B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004240466A JP4285364B2 (en) 2004-08-20 2004-08-20 3D circuit module, portable terminal device using the 3D circuit module, and 3D circuit module manufacturing method
JP240466/2004 2004-08-20

Publications (2)

Publication Number Publication Date
CN1738512A CN1738512A (en) 2006-02-22
CN1738512B true CN1738512B (en) 2011-12-21

Family

ID=35908876

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200510085118XA Expired - Fee Related CN1738512B (en) 2004-08-20 2005-07-20 3d circuit module, multilayer 3d circuit module formed thereof and method for manufacturing the circuit modules

Country Status (3)

Country Link
US (1) US7759784B2 (en)
JP (1) JP4285364B2 (en)
CN (1) CN1738512B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5181626B2 (en) * 2007-11-05 2013-04-10 株式会社安川電機 Multilayer printed circuit board and inverter device
JP5172385B2 (en) * 2008-02-25 2013-03-27 株式会社ワコム INPUT DEVICE WITH DISPLAY FUNCTION AND PORTABLE ELECTRONIC DEVICE
US7939369B2 (en) * 2009-05-14 2011-05-10 International Business Machines Corporation 3D integration structure and method using bonded metal planes
US8847376B2 (en) 2010-07-23 2014-09-30 Tessera, Inc. Microelectronic elements with post-assembly planarization
JPWO2012077280A1 (en) * 2010-12-09 2014-05-19 パナソニック株式会社 Design support apparatus and design support method for three-dimensional integrated circuit
US8962392B2 (en) * 2012-03-13 2015-02-24 Taiwan Semiconductor Manufacturing Company, Ltd. Underfill curing method using carrier
JP6358132B2 (en) * 2015-03-03 2018-07-18 オムロン株式会社 3D circuit structure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5710695A (en) * 1995-11-07 1998-01-20 Vlsi Technology, Inc. Leadframe ball grid array package

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5227338A (en) * 1990-04-30 1993-07-13 International Business Machines Corporation Three-dimensional memory card structure with internal direct chip attachment
US5241456A (en) * 1990-07-02 1993-08-31 General Electric Company Compact high density interconnect structure
EP0598914B1 (en) * 1992-06-05 2000-10-11 Mitsui Chemicals, Inc. Three-dimensional printed circuit board, electronic circuit package using this board, and method for manufacturing this board
US5629835A (en) * 1994-07-19 1997-05-13 Olin Corporation Metal ball grid array package with improved thermal conductivity
JPH09107067A (en) 1995-10-09 1997-04-22 Hitachi Ltd Semiconductor device
KR0179921B1 (en) * 1996-05-17 1999-03-20 문정환 Stacked semiconductor package
JPH11289023A (en) * 1998-04-02 1999-10-19 Oki Electric Ind Co Ltd Semiconductor device and manufacture thereof
US6294839B1 (en) * 1999-08-30 2001-09-25 Micron Technology, Inc. Apparatus and methods of packaging and testing die
JP2001250902A (en) 2000-03-08 2001-09-14 Toshiba Corp Semiconductor package and method of manufacturing the same
JP4436582B2 (en) 2000-10-02 2010-03-24 パナソニック株式会社 Card type recording medium and manufacturing method thereof
TW473947B (en) * 2001-02-20 2002-01-21 Siliconware Precision Industries Co Ltd Substrate structure of semiconductor packaging article
JP2002299553A (en) 2001-03-29 2002-10-11 Citizen Watch Co Ltd Module and its manufacturing method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5710695A (en) * 1995-11-07 1998-01-20 Vlsi Technology, Inc. Leadframe ball grid array package

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2001-250902A 2001.09.14

Also Published As

Publication number Publication date
CN1738512A (en) 2006-02-22
US7759784B2 (en) 2010-07-20
JP2006060024A (en) 2006-03-02
JP4285364B2 (en) 2009-06-24
US20060038274A1 (en) 2006-02-23

Similar Documents

Publication Publication Date Title
CN1738512B (en) 3d circuit module, multilayer 3d circuit module formed thereof and method for manufacturing the circuit modules
CN100539135C (en) Three-dimensional circuit device, the e-machine that uses it and manufacture method thereof
JP4504798B2 (en) Multistage semiconductor module
CN104684254B (en) IC built-in substrates and its manufacture method
CN103906372B (en) There is circuit board of embedded element and preparation method thereof
CN1207785C (en) Semiconductor device, method of manufacturing electronic device, electronic device and portable information terminal
US6757967B2 (en) Method of forming a chip assembly
CN100505242C (en) Multi-level semiconductor micro-module
CN101128091A (en) Component-embedded multilayer printed wiring board and manufacturing method thereof
KR20060050893A (en) Multi-layer board manufacturing method
JP4337950B2 (en) Circuit board manufacturing method
CN103906371A (en) Circuit board having embedded components and manufacturing method thereof
CN102105894A (en) Chip card having a plurality of components
JP2021117813A (en) Dual IC card
JP2007335675A (en) Power supply and method for manufacturing power supply
CN109782030A (en) Probe card
US20060061327A1 (en) Battery with embedded circuits
CN105956652B (en) Smart card and manufacturing method thereof
JP5085874B2 (en) Composite circuit component and semiconductor device including the same
CN100505227C (en) Base-plate structure for semiconductor package direct electric-connection
JP2007258635A (en) Method for manufacturing built-in component substrate
CN105956653B (en) Smart card and manufacturing method thereof
WO2010095210A1 (en) Method for manufacturing module with built-in component
JP2009158641A (en) Method of producing module with built-in component
JP4954781B2 (en) 3D electronic circuit equipment

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20111221

Termination date: 20140720

EXPY Termination of patent right or utility model