CN1737812A - Method for establishing electronic volume mark of electronic package - Google Patents

Method for establishing electronic volume mark of electronic package Download PDF

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Publication number
CN1737812A
CN1737812A CN 200410058282 CN200410058282A CN1737812A CN 1737812 A CN1737812 A CN 1737812A CN 200410058282 CN200410058282 CN 200410058282 CN 200410058282 A CN200410058282 A CN 200410058282A CN 1737812 A CN1737812 A CN 1737812A
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China
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electronic
electronic tag
circuit
establishing
ic chip
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CN 200410058282
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Chinese (zh)
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陈水来
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玴荣科技股份有限公司
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Priority to CN 200410058282 priority Critical patent/CN1737812A/en
Publication of CN1737812A publication Critical patent/CN1737812A/en

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Abstract

This invention relates to one electrical element label establishing method, which comprises the following steps: establishing one chip area and one identification area on one base body; fixing one IC chip set on the chip area; planting or fixing the resonance circuit and memory IC chip electrical label circuit composed of antenna and capacitor onto the identification area; editing the electrical element relative goods information into electrical signals; bursting the electrical label circuit for memory; accomplishing electrical label circuit electrical elements through sealing process.

Description

电子组件的电子卷标建立方法 Electronic tags electronic component build method

技术领域 FIELD

本发明涉及一种电子组件的电子卷标建立方法,属于电子卷标与IC芯片结合封装一体的技术领域,尤其涉及一种将由记忆IC芯片与具有天线的谐振电路组成的电子卷标回路(RFID卷标)与IC芯片一起组装在基体,并经打线与封装制造过程完成电子组件,来提供所述电子组件的商品信息判读与追踪。 The present invention relates to an electronic assembly method for establishing electronic tags, electronic tags belonging to the technical field in combination with one of the IC chip package, particularly to a memory by the IC chip and the antenna resonant circuit having a circuit composed of electronic tags (RFID assembled label) together with the IC chip substrate, the electronic component and completion of the package by wire manufacturing process, the electronic component provided commodity information interpretation and tracking.

背景技术 Background technique

产品的制造与销售,都必须利用卷标来记录与标识诸如制造厂商、产品名称、制造日期、产品规格或可适用规格、批号或其它各厂商为管理所建立的辨别数据等各种信息。 Manufacture and sale of products, must use to record labels and labeling, such as manufacturers, all kinds of information product name, date of manufacture, product specifications or the applicable specifications, batch number or other manufacturers to establish a management identify data. 而电子组件,如IC组件或其各种电子组件产品,更需要进行制造厂商、产品名称、制造日期、产品规格或可适用规格、批号或其它各厂商为管理所建立的辨别数据等相当多信息的记录辨识标识建立,并建立在电子组件上,供销售管理、仓储管理以及售出管理与使用者的辨识等需求使用。 And electronic components, such as IC package products, or various electronic components, need for manufacturers, considerable information on the product name, date of manufacture, product specifications or applicable specifications, each lot or other manufacturers to build discrimination data management the record identification identity established and built on electronic components, for sales management, warehouse management and sale management and user identification and other needs to use.

公知的商品辨识标签通常是将所述各种需要标识的数据,通过印刷方式印制在标签纸上,再逐一将该小张的卷标纸粘贴在产品表面上,且因为该标签纸大小的关系,通常无法作到将完整的各种需求信息的标识印制在其上。 Known commodity identification tag typically requires the identification of various types of data, printed by printing on the label, the label one by one Zhang the paper pasted on the surface of the product, and because the paper size of the label relationship, usually can not be done to complete the identification of the various needs of information printed on it. 而诸如IC组件等体积小的各种电子组件,更不容许或不能提供足够的空间来粘贴多张标签,这就造成一些标示上的困扰与抉择;另外,纸类标签也存在一个容易被除去或进行变更的缺点,并且印制在卷标上的数据也容易因外来不可测的原因,如受潮、下雨或磨擦等造成印制数据的灭失或模糊而无法有效辨识。 And small size, such as various electronic components like IC package, but does not allow or do not provide enough space to multiple adhesive labels, which causes some problems with the choices on the label; Further, there is a paper label to be easily removed or disadvantages of change, and print data on the label is also vulnerable to foreign unpredictable reasons, such as moisture, rain or friction and other causes of data loss or blurred printing can not be effectively recognized.

随着电子技术的不断进步与发展,出现了本领域技术人员开发出的所谓的电子卷标,该卷标包括由天线与电容器组成的谐振电路,配合IC芯片构成电子卷标回路,具体就是利用射频信号来无线发射所记录的电子数据,该电子数据即为所述产品的各种卷标数据或辨识数据,而电子判读装置可远程直接读取所发射的信号,以此快速且大量的记录产品数据用来进行判读、管理与追踪。 With the continuous progress and development of electronic technology, there have been developed those skilled in the art of so-called electronic tag, the tag comprising an antenna resonant circuit consisting of the capacitor, an IC chip with an electronic tag circuit, is the use of specific electronic data wirelessly transmit RF signals are recorded, the electronic tag data is the data or various data identifying the product, and the interpretation of the electronic device may signal remotely transmitted directly read, thus recording a large number of rapid and product data used for interpretation, management and tracking. 但目前此种电子卷标仍然是仅直接粘贴在产品表面上,并未与产品结合为一体,而这种直接粘贴在表面的方式,必然会导致其直接与外界接触而受到碰撞等损坏,或有人有意将电子卷标去除,故意破坏,如此,同样会失去其标识的作用。 But this is still the only direct electronic tag attached to the surface of the product, and not combined into one product, and this is directly attached to the surface of the way, it will inevitably lead to its direct contact with the outside world from being damaged by collision, or someone interested in the electronic label removal, vandalism, so, it will also lose its role identity.

本发明的内容本发明的主要目的在于提供一种电子组件的电子卷标建立方法,其主要在将具有发射射频信息功能的电子卷标回路(RFID卷标)与一IC芯片一并设置在一电子组件的基体上,且该IC芯片包括有一个接脚,该接脚与所述电子卷标回路的天线电连接,接着配合打线与封装作业完成包括有该电子卷标回路的电子组件。 The main object of the present invention of the present invention to provide a method for establishing an electronic tag of an electronic component, mainly in the electronic tag having a loop function information transmitting radio frequency (RFID tag) disposed together with an IC chip in a the electronic component on the substrate, and the IC chip comprises a pin, the pin electrically connected to the antenna circuit of the electronic tag, and then with the wire package comprising an electronic component job completion of the electronic tag circuit. 从而使电子组件的各种识别信息可大量被记录,且更易于进行判读、管理与追踪;同时不易受到破坏或损坏。 So that the electronic components of large variety of identification information may be recorded more easy interpretation, management and tracking; also less likely to be damaged or destroyed.

本发明提供一种电子组件的电子卷标建立方法,包括以下步骤:提供一电子组件制作基体;在所述基体上建立一芯片区与一识别区;将一IC芯片设置在所述基体的芯片区;将一包括由天线与电容器组成的谐振电路及记忆IC芯片的电子卷标回路(RFID卷标)植入或固定安装在所述识别区;将所述电子组件的相关商品信息编辑为电子信号编码;烧录所述电子信号编码并储存在电子卷标回路;进行IC芯片与电子卷标回路的打线制造过程;进行电子组件的封装制造过程;完成包括有电子卷标回路与IC芯片合并封装的电子组件。 The present invention provides an electronic component of the electronic tag creation method comprising the steps of: providing an electronic component production base; establishing a chip region and a recognition region on the substrate; and an IC chip disposed on the chip substrate region; the electronic tag includes a resonant circuit and memory circuit of the IC chip with an antenna consisting of a capacitor (RFID tag) mounted on said implanted or identification area; merchandise related information editing the electronic component is an electronic signal encoding; programming said electronic signal is encoded and stored in the electronic tag circuit; IC chip and the bonding wire manufacturing process electronic tag circuit; encapsulated electronic component manufacturing process; complete electronic tag comprising an IC chip and circuit the combined package of electronic components.

在一优选实施例中,所述电子卷标的天线与所述IC芯片的一接脚电连接。 In a preferred embodiment, the electrically a pin of the electronic tag antenna and the IC chip is connected.

本发明的电子组件的电子卷标建立方法能够使电子组件的各种识别信息可大量被记录,且更易于进行判读、管理与追踪;同时不易受到破坏或损坏。 Electronic tag electronic component of the present invention to establish a method capable of various electronic component identification information may be a large number of recorded more easy interpretation, management and tracking; also less likely to be damaged or destroyed.

附图的简要说明图1为本发明实施例的电子组件的电子卷标建立方法的流程图;图2为利用本发明的方法制成的含有电子卷标回路与IC芯片合并封装的电子组件制成品的立体外观示意图。 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 electronic tags electronic components of an embodiment of the present invention, a flowchart of a method of establishing; manufactured by an electronic component comprising an electronic circuit and the IC tag chip package of FIG. 2 is a combined method of the present invention is made appearance of the finished three-dimensional schematic diagram.

附图中,各标号所代表的部件列表如下:1-电子组件 3-基体4-IC芯片 5-电子卷标回路31-芯片区 32-识别区10~20-步骤具体实施方式图1为本发明电子组件的电子卷标建立方法一优选实施例的流程图;图2为利用该方法制成的包括有电子卷标回路与IC芯片合并封装的电子组件制成品的立体外观示意图。 In the drawings, a list of members of each numeral represent the following: 1- 3- 4-IC electronic component electronic tag circuit chip 5- 31- 32- chip matrix region identification area 10 to step 20 in FIG. 1 of the present embodiment DETAILED DESCRIPTION the electronic tags flowchart of an electronic assembly method for establishing a preferred embodiment; FIG. 2 is made using this method include the perspective appearance of an electronic circuit assembly manufactures electronic tags combined with the IC chip package. FIG. 该电子组件的电子卷标建立方法至少包括以下步骤:步骤10:提供一基体3,基体3在本发明具体实施例中,为一般提供IC芯片组装制成电子组件1使用的基板。 The electronic component of the electronic tag to establish a method comprising at least the following steps: Step 10: providing a substrate 3, the substrate 3 in the embodiment of the present invention, particular embodiment, the IC chip is generally provided an electronic component assembly made using a matrix.

步骤11:在基体3上建立一芯片区31以及一识别区32;在本实施例中,芯片区31与识别区32的建立位置,可以是基体3一端面的任一适当位置,如图2所示,且芯片区31与识别区32的位置排列方式也可自由设计建立。 Step 11: establishing on the base 3 a chip region 31 and a recognition section 32; in the present embodiment, the establishment of the position of the chip area 31 and identification area 32 may be a suitable location claims 3 an end face of the base body, FIG. 2 shown, and the chip area 31 and the position of arrangement of identification area 32 may also be designed freely established.

步骤12:提供一IC芯片4。 Step 12: providing an IC chip 4.

步骤13:将步骤12所提供的IC芯片4直接植入或固定安装在基体3所提供的芯片区31上。 Step 13: Step 12, the IC chip 4 is provided directly into or fixedly mounted on the chip base region 31 3 provided.

步骤14:提供一电子卷标回路5(RFID卷标);电子卷标回路5是由天线与电容器组成的谐振电路与记忆IC芯片构成。 Step 14: providing an electronic tag circuit 5 (the RFID tag); electronic tag resonant circuit 5 and memory circuit is constituted by an IC chip and an antenna of a capacitor.

步骤15:将步骤14所提供的电子卷标回路5直接植入或固定安装在基体3所提供的识别区32上。 Step 15: The electronic tag circuit 5 provided in step 14 or directly fixedly mounted on the implant 3 provided identification area 32 of the base body.

步骤16:进行电子组件1相关商品信息的电子信号编码;电子组件1相关商品信息的电子信号编码包括:电子组件1所要记录的制造厂商、产品名称、制造日期、产品规格或可适用规格、批号,或其它各厂商为管理所建立的辨别数据等各种信息。 Step 16: electronic signal encoding a relevant product information of the electronic component; electronic signal encoding a relevant product information of the electronic component comprising: a manufacturer of electronic components 1 to be recorded, product name, date of manufacture, product specifications or applicable specifications, Lot , or various other vendors for the management of the establishment to identify data and other information.

步骤17:把电子信号编码烧录在电子卷标回路5中进行储存;步骤18:进行IC芯片4与电子卷标回路5的打线制程;步骤19:进行电子组件封装制程;将定位在芯片区31的IC芯片4,与定位在识别区32的电子卷标回路5,一并进行封装制程而封装为一体;步骤20:完成含有电子卷标回路5与IC芯片4合并封装的电子组件1。 Step 17: The electronic signal is encoded in the electronic tag programming circuit 5 is stored; Step 18: 4 and the IC chip of electronic tag circuit 5 wire process; Step 19: electronic component packaging process; positioning the chip IC 4, and the positioning of the chip regions 31 in the electronic tag circuit 5 recognizes a zone 32, collectively be encapsulated packaging process as a whole; step 20: electronic tag comprising an electronic component is completed circuit 5 and the IC chip 4 combined package 1 .

利用本发明所述的电子组件的电子卷标建立方法,经各制成步骤顺序进行,即可直接将电子卷标回路5与IC芯片4一并封装在电子组件1的基体3的一端面位置,如图2所示;与公知的直接将制成的电子卷标固定在电子组件上的方法相比较,将不再需要进行逐一粘贴或结合的步骤;由此,在制造过程上将更为简化,相对也缩短制组时间与成本;另外封装在电子组件1内的电子卷标回路5,也不易受到破坏或受到不当外力造成的损坏。 Electronic tag using the electronic component of the present invention, the method for establishing, by the order of each step is made, the electronic tag can be directly circuit 5 and the IC chip 4 together with the end surfaces of a package substrate 1, electronic component 3 is , shown in Figure 2; a well-known direct method of an electronic label made of electronic components secured to the comparing step would no longer need to be attached individually or in combination; Accordingly, in the manufacturing process on the others simplified, shortened braking groups relative time and cost; further encapsulated electronic tag within an electronic circuit assembly 5, but also less likely to be damaged or destroyed due to improper force.

另外,步骤15中将电子卷标回路5植入或固定安装在电子组件1的基体3上,在本发明具体实施例中,将直接完成天线与电容器组成的谐振电路,并与记忆IC芯片电连接的电子卷标回路5的制成品直接定位设置在电子组件1的基体3提供的识别区32上。 Further, the step 15 in the electronic tag circuit 5 or implanted electronic component is fixedly mounted on the base 1 is 3, in the particular embodiment of the present invention, the antenna resonance circuit is done directly with a capacitor and an IC chip electrically and memory manufactures electronic tag circuit 5 is connected directly provided on the electronic component is positioned the base 1 of 3 identification area 32 provided.

另外,植入或固定安装在基体3的电子卷标回路5进一步包括有电子卷标回路5的天线,其与IC芯片3的一接脚电连接,来建立电子卷标回路5与IC芯片3的电连接,从而进行无线射频信号的发射。 Further, an implant or fixedly mounted in the base body 53 of the electronic tag circuit further comprising an antenna circuit 5 of the electronic tag, which is connected to a pin of the IC chip 3 electrically, to create an electronic tag circuit 5 and the IC chip 3 electrical connection to transmit radio frequency signals.

上述的附图及说明,仅为本发明的实施例而已,但并非为限制本发明的实施例,凡是本领域技术人员按照本发明的技术特征所作的其它等效变换,均包括在本发明的申请专利范围内。 Drawings and described above are merely embodiments of the invention only, but not for limiting embodiments of the present invention, those skilled in the art who made the technical features of the present invention in accordance with other equivalent transformation are included in the present invention. within the scope of the patent application.

Claims (10)

1.一种电子组件的电子卷标建立方法,其特征在于,所述方法包括:提供一电子组件制作基体;在所述基体上建立一芯片区与一识别区;将一IC芯片设置在所述基体的芯片区;将一电子卷标回路设置在所述基体的识别区;将所述电子组件的相关商品信息编辑为电子信号编码;烧录所述电子信号编码并储存在电子卷标回路;进行IC芯片与电子卷标回路的打线制造过程;进行电子组件的封装制造过程;完成包括有电子卷标回路与IC芯片合并封装的电子组件。 An electronic tag method for establishing an electronic component, wherein, said method comprising: providing an electronic component production base; establishing a chip region and a recognition region on the substrate; and an IC chip disposed on the chip area of ​​said substrate; and an electronic tag identification circuit disposed in the region of the base body; merchandise related information editing the electronic component is an electronic signal encoding; programming said electronic signal is encoded and stored in the electronic tag circuit ; wire manufacturing process with the IC chip of the electronic tag circuit; encapsulated electronic component manufacturing process; complete electronic tag comprising an IC chip circuit combined with encapsulated electronic components.
2.如权利要求1所述的电子组件的电子卷标建立方法,其特征在于所述芯片区与识别区建立在所述基体的任一端面的任一适当位置。 2. The electronic tag according to claim 1 of establishing the electronic component, characterized in that said identification area and the chip area to establish a proper position at any one end of any of the base body.
3.如权利要求1所述的电子组件的电子卷标建立方法,其特征在于所述芯片区与识别区自由设计排列建立在所述基体的任一端面。 The electronic component electronic tag as claimed in claim 1, method for establishing, characterized in that said identification area consisting of the chip region and arranged to establish the design according to any one end surface of the base body.
4.如权利要求1所述的电子组件的电子卷标建立方法,其特征在于所述电子卷标回路包括由天线与电容器组成的谐振电路及与所述谐振电路电连接的记忆IC芯片。 The electronic tag according to claim 1 of establishing the electronic component, characterized in that said electronic tag comprises a loop antenna and the resonant circuit formed by a capacitor and the IC chip memory connected to said electrically resonant circuit.
5.如权利要求1所述的电子组件的电子卷标建立方法,其特征在于所述电子卷标回路设置在所述识别区,是直接将电子卷标回路的制成品固定安装在所述基体的识别区上。 The electronic tag according to claim 1 of establishing the electronic component, characterized in that said electronic tag identification circuit disposed in the area, manufactures electronic tag is directly mounted on said circuit identifying areas on the base body.
6.如权利要求1所述的电子组件的电子卷标建立方法,其特征在于所述电子卷标回路的天线与所述IC芯片的一接脚电连接。 6. The electronic tag according to claim 1 of establishing the electronic component, characterized in that a pin of an electrical circuit of the electronic tag antenna and the IC chip is connected.
7.如权利要求1所述的电子组件的电子卷标建立方法,其特征在于所述电子组件相关商品信息的电子信号编码编辑,为电子组件所要记录的各种商品信息的编码编辑。 7. The electronic tag according to claim 1 of establishing the electronic component, characterized in that the electronic signal encoding edit the electronic component-related product information, product information encoding edit various electronic components to be recorded.
8.一种电子组件的电子卷标建立方法,其特征在于,所述方法包括:提供一电子组件制作基体;将一IC芯片设置在所述基体上;将一电子卷标回路设置在所述基体上;将电子组件的相关商品信息编辑为电子信号编码;烧录所述电子信号编码并储存在电子卷标回路;进行IC芯片与电子卷标回路的打线制程;进行电子组件封装制程;完成含有电子卷标回路与IC芯片合并封装的电子组件。 An electronic tag method for establishing an electronic component, characterized in that, said method comprising: providing an electronic component production base; and an IC chip disposed on the substrate; and a circuit provided in the electronic tag on a substrate; merchandise related information editing the electronic component is an electronic signal encoding; programming said electronic signal is encoded and stored in the electronic tag circuit; IC chip and the electronic tag wire loop process; electronic component package manufacturing process; complete electronic tag comprising electronic components and circuits of the IC chip package combined.
9.如权利要求8所述的电子组件的电子卷标建立方法,其特征在于所述IC芯片与电子卷标回路,是呈相邻排列关系固定安装在所述基体的任一端面上。 9. The electronic assembly of electronic tag according to claim 8 method for establishing, characterized in that said IC chip and the electronic label circuit is arranged adjacent relationship form is fixedly mounted on either end of the base body.
10.如权利要求8所述的电子组件的电子卷标建立方法,其特征在于所述IC芯片与电子卷标回路是自由设计排列固定安装在所述基体的任一端面上。 Electronic label 10. The electronic assembly according to claim 8, wherein the method for establishing, characterized in that said IC chip and is free to design electronic tag circuit arranged fixedly mounted on either end of the base body.
CN 200410058282 2004-08-20 2004-08-20 Method for establishing electronic volume mark of electronic package CN1737812A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103538788A (en) * 2012-07-12 2014-01-29 陈志权 Plug assembling method and structure of electronic seal
CN106124812A (en) * 2016-06-12 2016-11-16 宁波迦南电子有限公司 A kind of single-phase charge-controlled intelligent electric meter production management system
CN106124813A (en) * 2016-06-12 2016-11-16 宁波迦南电子有限公司 A kind of single-phase charge-controlled intelligent electric meter production management method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103538788A (en) * 2012-07-12 2014-01-29 陈志权 Plug assembling method and structure of electronic seal
CN103538788B (en) * 2012-07-12 2015-09-30 陈志权 The plug assemble method of e-seals and structure thereof
CN106124812A (en) * 2016-06-12 2016-11-16 宁波迦南电子有限公司 A kind of single-phase charge-controlled intelligent electric meter production management system
CN106124813A (en) * 2016-06-12 2016-11-16 宁波迦南电子有限公司 A kind of single-phase charge-controlled intelligent electric meter production management method

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