CN1737812A - Method for establishing electronic volume mark of electronic package - Google Patents
Method for establishing electronic volume mark of electronic package Download PDFInfo
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- CN1737812A CN1737812A CN 200410058282 CN200410058282A CN1737812A CN 1737812 A CN1737812 A CN 1737812A CN 200410058282 CN200410058282 CN 200410058282 CN 200410058282 A CN200410058282 A CN 200410058282A CN 1737812 A CN1737812 A CN 1737812A
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- electric label
- electronic package
- chip
- loop
- building
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Abstract
This invention relates to one electrical element label establishing method, which comprises the following steps: establishing one chip area and one identification area on one base body; fixing one IC chip set on the chip area; planting or fixing the resonance circuit and memory IC chip electrical label circuit composed of antenna and capacitor onto the identification area; editing the electrical element relative goods information into electrical signals; bursting the electrical label circuit for memory; accomplishing electrical label circuit electrical elements through sealing process.
Description
Technical field
The present invention relates to a kind of electric label method for building up of electronic package, the technical field that belongs to electric label and IC chips incorporate encapsulation one, relate in particular to and a kind ofly will be assembled in matrix with the IC chip by the electric label loop (RFID label) that memory IC chip is formed with the resonant circuit with antenna, and finish electronic package through routing and package fabrication process, the merchandise news interpretation and the tracking of described electronic package are provided.
Background technology
The manufacturing of product and sale all must utilize label to write down and identify the various information of setting up for administrative institute such as manufacturer, name of product, build date, product specification or applicable specification, lot number or other each manufacturer such as data discrimination.And electronic package, as IC assembly or its various electronic component products, more needing to carry out manufacturer, name of product, build date, product specification or applicable specification, lot number or other each manufacturer is that quite a lot of recording of information identification signs such as data discrimination that administrative institute sets up are set up, and be based upon on the electronic package, for selling management, warehousing management and selling management and use with user's demands such as identification.
Known commodity identification label is normally with the described various data that need sign, be printed on the label paper by mode of printing, one by one this Xiao Zhang's label paper is sticked on the product surface again, and because the relation of this label paper size can't be accomplished usually the sign of complete various demand informations is printed thereon.And such as the little various electronic packages of IC assembly equal-volume, more not allowing maybe to provide enough spaces to paste many labels, and this just causes some puzzlement that is marked with and choices; In addition, also there is a shortcoming that is removed easily or changes in the stationery label, and is printed on data on the label also easily because of external immesurable reason, as makes moist, rains or friction etc. causes and prints lossing or fuzzy and effectively identification of data.
Continuous progress and development along with electronic technology, the so-called electric label that those skilled in the art develop has appearred, this label comprises the resonant circuit of being made up of antenna and capacitor, cooperate the IC chip to constitute the electric label loop, it specifically is exactly the electronic data that utilizes radiofrequency signal to come wireless transmit to write down, this electronic data is the various label data or the Identification Data of described product, and electronics interpretation device can long-rangely directly read the signal of being launched, and is used for carrying out interpretation, management and tracking with these quick and a large amount of record product data.But this kind electric label only remains and directly sticks on the product surface at present, be not combined as a whole with product, and this mode that directly sticks on the surface, will inevitably cause damages such as it directly is collided with extraneous the contact, or there is the people intentionally electric label to be removed, deliberately destroy, so, can lose the effect of its sign equally.
Content of the present invention
Fundamental purpose of the present invention is to provide a kind of electric label method for building up of electronic package, it mainly is arranged on the matrix of an electronic package with an IC chip in the lump in the electric label loop (RFID label) that will have emission radio-frequency information function, and this IC chip includes a pin, this pin is electrically connected with the antenna in described electric label loop, then cooperates routing and packaging operation to finish the electronic package that includes this electric label loop.Thereby the various identifying informations of electronic package can be recorded in a large number, and be easier to carry out interpretation, management and tracking; Be difficult for simultaneously being damaged or damaging.
The invention provides a kind of electric label method for building up of electronic package, may further comprise the steps:
Provide an electronic package to make matrix;
On described matrix, set up a chip region and a cog region;
One IC chip is arranged on the chip region of described matrix;
Comprise that with one the electric label loop (RFID label) of the resonant circuit be made up of antenna and capacitor and memory IC chip implants or be fixedly mounted on described cog region;
The dependent merchandise information editing of described electronic package is the electronic signal coding;
The described electronic signal coding of burning also is stored in the electric label loop;
Carry out the routing manufacture process in IC chip and electric label loop;
Carry out the package fabrication process of electronic package;
Finish the electronic package that includes electric label loop and IC chip merging encapsulation.
In a preferred embodiment, the antenna of described electric label is electrically connected with a pin of described IC chip.
The electric label method for building up of electronic package of the present invention can make the various identifying informations of electronic package be recorded in a large number, and is easier to carry out interpretation, management and tracking; Be difficult for simultaneously being damaged or damaging.
Brief description of drawings
Fig. 1 is the process flow diagram of electric label method for building up of the electronic package of the embodiment of the invention;
Fig. 2 is the three-dimensional appearance synoptic diagram that electric label loop and IC chip merge the electronic package manufactured goods of encapsulation that contains that utilizes that method of the present invention makes.
In the accompanying drawing, the list of parts of each label representative is as follows:
1-electronic package 3-matrix
4-IC chip 5-electric label loop
31-chip region 32-cog region
10～20-step
Embodiment
Fig. 1 is the process flow diagram of electric label method for building up one preferred embodiment of electronic package of the present invention; Fig. 2 is the three-dimensional appearance synoptic diagram that electric label loop and IC chip merge the electronic package manufactured goods of encapsulation that includes that utilizes that this method makes.The electric label method for building up of this electronic package may further comprise the steps at least:
Step 10: a matrix 3 is provided, and matrix 3 is made the substrate that electronic package 1 uses for the assembling of IC chip generally is provided in the specific embodiment of the invention.
Step 11: on matrix 3, set up a chip region 31 and a cog region 32; In the present embodiment, the position of setting up of chip region 31 and cog region 32 can be arbitrary appropriate location of matrix 3 one end faces, and as shown in Figure 2, and the positional alignment mode of chip region 31 and cog region 32 also can freely design foundation.
Step 12: an IC chip 4 is provided.
Step 13: the IC chip 4 that step 12 provided is directly implanted or is fixedly mounted on the chip region 31 that matrix 3 provided.
Step 14: an electric label loop 5 (RFID label) is provided; The resonant circuit that electric label loop 5 is made up of antenna and capacitor constitutes with memory IC chip.
Step 15: the electric label loop 5 that step 14 provided is directly implanted or is fixedly mounted on the cog region 32 that matrix 3 provided.
Step 16: the electronic signal coding that carries out electronic package 1 dependent merchandise information; The electronic signal coding of electronic package 1 dependent merchandise information comprises: the manufacturer that electronic package 1 will write down, name of product, build date, product specification or applicable specification, lot number, or other each manufacturer is the various information such as data discrimination that administrative institute sets up.
Step 17: the burning of electronic signal coding is stored in electric label loop 5;
Step 18: the routing processing procedure that carries out IC chip 4 and electric label loop 5;
Step 19: carry out the electronic package encapsulation procedure; To be positioned at the IC chip 4 of chip region 31,, carry out encapsulation procedure in the lump and be packaged as a whole with the electric label loop 5 that is positioned at cog region 32;
Step 20: finish the electronic package 1 that contains electric label loop 5 and the 4 merging encapsulation of IC chip.
Utilize the electric label method for building up of electronic package of the present invention, carry out, can directly electric label loop 5 and IC chip 4 be encapsulated in the lump an endface position of the matrix 3 of electronic package 1, as shown in Figure 2 through respectively making sequence of steps; Compare with the known method that directly electric label of making is fixed on the electronic package, paste one by one no longer needing or the step of combination; Thus, on manufacture process, will more simplify, relatively also shortening system group time and cost; Be encapsulated in the electric label loop 5 in the electronic package 1 in addition, also be difficult for being damaged or being subjected to the damage that improper external force causes.
In addition, in the step 15 electric label loop 5 is implanted or is fixedly mounted on the matrix 3 of electronic package 1, in the specific embodiment of the invention, will directly finish the resonant circuit formed of antenna and capacitor, and the manufactured goods in the electric label loop 5 that is electrically connected with memory IC chip are directly located on the cog region 32 that the matrix 3 that is arranged on electronic package 1 provides.
In addition, the electric label loop 5 of implanting or being fixedly mounted on matrix 3 further includes the antenna in electric label loop 5, it is electrically connected with a pin of IC chip 3, sets up being electrically connected of electric label loop 5 and IC chip 3, thereby carries out the emission of radio frequency signal.
Above-mentioned accompanying drawing and explanation are embodiments of the invention only, but are not to be the restriction embodiments of the invention, and other equivalent transformation that every those skilled in the art do according to technical characterictic of the present invention includes in claim of the present invention.
Claims (10)
1. the electric label method for building up of an electronic package is characterized in that, described method comprises:
Provide an electronic package to make matrix;
On described matrix, set up a chip region and a cog region;
One IC chip is arranged on the chip region of described matrix;
One electric label loop is arranged on the cog region of described matrix;
The dependent merchandise information editing of described electronic package is the electronic signal coding;
The described electronic signal coding of burning also is stored in the electric label loop;
Carry out the routing manufacture process in IC chip and electric label loop;
Carry out the package fabrication process of electronic package;
Finish the electronic package that includes electric label loop and IC chip merging encapsulation.
2. the electric label method for building up of electronic package as claimed in claim 1 is characterized in that described chip region and cog region are based upon arbitrary appropriate location of arbitrary end face of described matrix.
3. the electric label method for building up of electronic package as claimed in claim 1 is characterized in that described chip region and cog region freely design arbitrary end face that arrangement is based upon described matrix.
4. the electric label method for building up of electronic package as claimed in claim 1 is characterized in that described electric label loop comprises resonant circuit of being made up of antenna and capacitor and the memory IC chip that is electrically connected with described resonant circuit.
5. the electric label method for building up of electronic package as claimed in claim 1 is characterized in that described electric label loop is arranged on described cog region, is that direct manufactured goods with the electric label loop are fixedly mounted on the cog region of described matrix.
6. the electric label method for building up of electronic package as claimed in claim 1 is characterized in that the antenna in described electric label loop is electrically connected with a pin of described IC chip.
7. the electric label method for building up of electronic package as claimed in claim 1 is characterized in that the electronic signal coding editor of described electronic package dependent merchandise information, the coding editor of the extensive stock information that will write down for electronic package.
8. the electric label method for building up of an electronic package is characterized in that, described method comprises:
Provide an electronic package to make matrix;
One IC chip is arranged on the described matrix;
One electric label loop is arranged on the described matrix;
The dependent merchandise information editing of electronic package is the electronic signal coding;
The described electronic signal coding of burning also is stored in the electric label loop;
Carry out the routing processing procedure in IC chip and electric label loop;
Carry out the electronic package encapsulation procedure;
Finish the electronic package that contains electric label loop and IC chip merging encapsulation.
9. the electric label method for building up of electronic package as claimed in claim 8 is characterized in that described IC chip and electric label loop, is to be on arbitrary end face that adjacent Rankine-Hugoniot relations is fixedly mounted on described matrix.
10. the electric label method for building up of electronic package as claimed in claim 8 is characterized in that described IC chip and electric label loop are freely to design to arrange to be fixedly mounted on arbitrary end face of described matrix.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410058282 CN1737812A (en) | 2004-08-20 | 2004-08-20 | Method for establishing electronic volume mark of electronic package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410058282 CN1737812A (en) | 2004-08-20 | 2004-08-20 | Method for establishing electronic volume mark of electronic package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1737812A true CN1737812A (en) | 2006-02-22 |
Family
ID=36080603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410058282 Pending CN1737812A (en) | 2004-08-20 | 2004-08-20 | Method for establishing electronic volume mark of electronic package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1737812A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103538788A (en) * | 2012-07-12 | 2014-01-29 | 陈志权 | Plug assembling method and structure of electronic seal |
| CN106124812A (en) * | 2016-06-12 | 2016-11-16 | 宁波迦南电子有限公司 | A kind of single-phase charge-controlled intelligent electric meter production management system |
| CN106124813A (en) * | 2016-06-12 | 2016-11-16 | 宁波迦南电子有限公司 | A kind of single-phase charge-controlled intelligent electric meter production management method |
-
2004
- 2004-08-20 CN CN 200410058282 patent/CN1737812A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103538788A (en) * | 2012-07-12 | 2014-01-29 | 陈志权 | Plug assembling method and structure of electronic seal |
| CN103538788B (en) * | 2012-07-12 | 2015-09-30 | 陈志权 | The plug assemble method of e-seals and structure thereof |
| CN106124812A (en) * | 2016-06-12 | 2016-11-16 | 宁波迦南电子有限公司 | A kind of single-phase charge-controlled intelligent electric meter production management system |
| CN106124813A (en) * | 2016-06-12 | 2016-11-16 | 宁波迦南电子有限公司 | A kind of single-phase charge-controlled intelligent electric meter production management method |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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