CN1722322A - Solid electrolytic capacitor and method for manufacturing the same - Google Patents
Solid electrolytic capacitor and method for manufacturing the same Download PDFInfo
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- CN1722322A CN1722322A CN 200510083589 CN200510083589A CN1722322A CN 1722322 A CN1722322 A CN 1722322A CN 200510083589 CN200510083589 CN 200510083589 CN 200510083589 A CN200510083589 A CN 200510083589A CN 1722322 A CN1722322 A CN 1722322A
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- exposed division
- lead frame
- solid electrolytic
- anode
- electrolytic capacitor
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Abstract
An anode terminal or a cathode terminal is provided with an exposure portion that extends substantially perpendicularly to an arrangement direction of the two terminals and that have an end face exposed on a side face of a housing. At least the end face on the exposure portion is plated for improving the solder wettability. Furthermore, a front end portion of the exposure portion is bent upwards along a peripheral face of the housing.
Description
Technical field
The present invention relates to Solid electrolytic capacitor And Manufacturing approach.
Background technology
Figure 12 turns upside down to represent the stereogram of existing solid electrolytic capacitor 1.Figure 13 is the profile of Figure 12 being cut open at the face that comprises the A-A line, turn upside down with Figure 12 (speciallyying permit communique No. 3312246 with reference to Japan).
Solid electrolytic capacitor 1 possesses the capacitor element 2 that anode tap 22 protrudes, and this capacitor element 2 is synthesized resinous shell 70 and covers.The lower surface of capacitor element 2 is installed on the cathode side lead frame 90, and anode tap 22 is installed on the anode-side lead frame 9 by occipitalia spare 23.Be provided with insulator (not shown) between anode-side lead frame 9 and the capacitor element 2.
Solid electrolytic capacitor 1 will be got making with following.At first, as shown in figure 14, after the punching processing metallic plate 8, first, second terminal that is set to anode-side and anode-side lead frame 9,90 constitutes sheet 81,82.Two-terminal constitutes sheet the 81, the 82nd, clamps opening 80 and is provided with, and end edge faces one another.Constitute on the sheet 81 at the first terminal that becomes anode-side lead frame 9, anode tap 22 is installed by pillow parts 23; Second terminal at cathode side lead frame 90 constitutes the outer peripheral face that capacitor element 2 is installed on the sheet 82.With the outer peripheral face of shell 70 covering capacitor elements 2, metallic plate 8 is cut off and acquisition solid electrolytic capacitor 1 with the face that comprises D-D line, E-E line.
, there are the following problems for existing solid electrolytic capacitor.
1, in solid electrolytic capacitor shown in Figure 12 1, the end face of anode-side and cathode side lead frame 9,90 is from (face of representing with the C of Figure 12) exposes along the side of the shell 70 of lead frame orientation.Therefore, solid electrolytic capacitor 1 is being welded under the state of tellite (not shown), can not be from horizontal affirmation: whether anode-side or cathode side lead frame 9,90 correctly welding.
2 and, in solid electrolytic capacitor shown in Figure 12 1, end face 91 exposes from shell 70., end face 91 is the so-called sections that cut off the first terminal formation sheet 81, so, bad with the wettability of scolding tin material.Therefore, solid electrolytic capacitor 1 is being welded under the state of tellite, also is being difficult to judge whether to weld success even see end face 91.
3, be necessary to improve: form anode-side or 9,90 o'clock operability of cathode side lead frame from metallic plate 8.
Summary of the invention
The objective of the invention is to, provide a kind of under the state that is welded on the tellite, can easily confirm the solid electrolytic capacitor whether lead frame has correctly welded.And, improve from metallic plate 8 and form anode-side or 9,90 o'clock operability of cathode side lead frame also as purpose.
In solid electrolytic capacitor of the present invention, anode-side or cathode side lead frame 9,90 possess: end face 52 or 51 exposed divisions 5 or 50 that expose from the side of shell 70.Anode-side or cathode side lead frame 9,90 are approximately perpendicular to the orientation and the extension of two lead frames 9,90.On exposed division 5, implement the plating that is used to improve scolding tin material wettability at end face 52 or end face 51 at least.
And the leading section of exposed division 5 or exposed division 50 is bent upwards 53 along the outer peripheral face of shell 70.
Second exposed division, 50, the second exposed divisions, 50 width that 5 connections of first exposed division are extended along the orientation of two lead frames 9,90 are set to also narrower than the width of first exposed division 5, and the end face 51 of at least one second exposed division 50 exposes from shell 70.
(effect of invention)
1, because the end face 52 or the end face 51 of exposed division 5 exposes from the side of shell 70, thus scolding tin material under the state that has welded lead frame 9,90 attached to end face 52 on.Therefore, can easily confirm whether correctly welding of lead frame 9,90.Particularly, if the plating that enforcement is used to improve scolding tin material wettability on end face 52 or end face 51 is then confirmed easily.
2 and, the leading section that makes exposed division 5 is bent upwards along the outer peripheral face of shell 70 and forms bend 53.In this bend 53, the inside of lead frame 9,90 laterally.Because the inside of lead frame 9,90 must be welded, so under the state that has welded lead frame 9,90, the scolding tin material is easily attached to the outside of this bend 53.Therefore, can confirm easily whether lead frame 9,90 is correctly welded.
3, since first exposed division 5 be connected with second exposed division 50, so, fill with the scolding tin material if intersect the place at first exposed division 5 and second exposed division 50, then the scolding tin materials flow is to first exposed division 5 and second exposed division 50.Even also confirm the welded condition of lead frame 9,90 in this easily.
4, the width of second exposed division 50 is set to also narrower than the width of first exposed division 5.As the back narration, form two lead frames 9,90 o'clock at the punching processing metallic plate, though cut off second exposed division 50, narrow by second exposed division 50 being formed width, form 9,90 o'clock operability of two lead frames thereby can improve.
Description of drawings
Fig. 1 turns upside down to represent the stereogram of solid electrolytic capacitor.
Fig. 2 is the profile of the solid electrolytic capacitor of Fig. 1 being decided what is right and what is wrong with the face that comprises the A-A line.
Fig. 3 is the plane graph that becomes the metallic plate of lead frame.
Fig. 4 is the plane graph that becomes the metallic plate of lead frame.
Fig. 5 is the profile of the metallic plate of Fig. 4 being decided what is right and what is wrong with the face that comprises the C-C line.
Fig. 6 is the plane graph of the manufacturing process of expression solid electrolytic capacitor.
Fig. 7 is the stereogram of other solid electrolytic capacitors.
Fig. 8 is the plane graph of the solid electrolytic capacitor manufacturing process of presentation graphs 7.
Fig. 9 is the stereogram of other solid electrolytic capacitors.
Figure 10 is the stereogram of other solid electrolytic capacitors.
Figure 11 is the stereogram of other solid electrolytic capacitors.
Figure 12 is the stereogram of existing solid electrolytic capacitor.
Figure 13 is the profile of the solid electrolytic capacitor of Figure 12 being decided what is right and what is wrong with the face that comprises the A-A line.
Figure 14 is the stereogram of the manufacturing process of the existing solid electrolytic capacitor of expression.
Embodiment
Below, in conjunction with the accompanying drawings, describe an example of the present invention in detail.Fig. 1 turns upside down to represent the stereogram of solid electrolytic capacitor.Fig. 2 is the profile that comes profile 1 with the face that comprises the A-A line, turns upside down with Fig. 1.
In addition, the end edge that opening 80 faces one another is positioned at the position also more inboard than concave surface 4 surrounding edges, and opening 80 connects concave surface 4.By making opening 80 connect concave surfaces 4, thereby the mobile of synthetic resin during shell 70 moulding improves.
(manufacture method of capacitor element)
Though show the manufacture method of capacitor element 2, this method is identical with existing method.At first, the part of the anode bodies 20 of tantalum system is immersed in the phosphate aqueous solution and carries out forming dielectric oxide film thereon 21 at outer peripheral face after electrolytic oxidation handles.Secondly, utilize well-known chemical polymerization, electrolysis polymerization method, form: as the cathode layer 3 that poly electroconductive polymer constituted.On this cathode layer 3, form carbon-coating 30, elargol layer 31 in order.
In this example, the material as anode bodies 20 has adopted tantalum sintered object., as long as adopt valve metals, specific limited can not adopt laminar or board-like material yet.
In addition, in forming the material of cathode layer 3, except above-mentioned polyethylene, can also enumerate: electroconductive polymers such as polythiophene, polyaniline, poly-furans, TCNQ (7,7,8,8-four cyano quino bismethane) complex salt etc.By the little electric conductor macromolecule of employing resistance value in cathode layer 3, thereby ESR is reduced, form the superior capacitor of high frequency characteristics.
As shown in Figure 1, the part of two lead frames 9,90 is exposed, and the resin that other parts are configured shell 70 covers.Two lead frames 9,90 have: first exposed division 5 that extend approximately perpendicular to the direction of the orientation (arrow B of Fig. 1) of two lead frames 9,90 on the edge; With second exposed division 50 that extends along 9,90 orientations of two lead frames.First exposed division 5 is positioned at the middle position of the Width of second exposed division 50, and two exposed divisions 5,50 are connected to each other, and the width of second exposed division 50 is provided with also narrowlyer than the width of first exposed division 5.
On cathode side lead frame 90, that two exposed divisions 5,50 are provided with is a plurality of, be provided with two particularly.That is, solid electrolytic capacitor 1 is welded on the tellite in the exposed division 5,50 at three places.Thus, improve the bond strength of solid electrolytic capacitor 1 and tellite.
On the cathode side lead frame 90 one, be specially the first inboard exposed division 5, end face 52 exposes from the end face of shell 70, the end face 51 of second exposed division 50 of anode-side lead frame 9 exposes from the end face of shell 70.
In two exposed divisions 5,50, comprise that end face 51,52 also can implement to be used to improve the plating of scolding tin material wettability.Electroplate and form palladium and gold in order, but so long as the material of raising scolding tin material wettability also can be other material.
In addition, as long as improve the weld strength of solid electrolytic capacitor 1 and tellite, also can consider to expose: the cathode side lead frame 90 that area is bigger than anode-side lead frame 9 comprehensively., cathode side lead frame 90 is bigger than anode-side lead frame 9, so the scolding tin material that engages is also many.
Therefore, if the lower surface of cathode side lead frame 90 exposes comprehensively, when then two lead frames 9,90 being welded on tellite, the scolding tin material that is bonded on the cathode side lead frame 90 shrinks and pulling solid electrolytic capacitor 1, consequently, cause the installation of solid electrolytic capacitor 1 bad.Therefore, cathode side lead frame 90 constitutes with resin and covers the one part, welds at two places simultaneously.
As mentioned above, the end face 51,52 of first, second exposed division 5,50 exposes from the side of shell 70.Therefore, solid electrolytic capacitor 1 is being welded under the state of tellite,, then can confirming the welded condition of two lead frames 90 if from the end face 52 of first exposed division 5 of laterally seeing cathode side lead frame 90.Particularly on cathode side lead frame 90, first exposed division 5 that end face 52 exposes from the end face of shell 70 leaves the opposing party's first exposed division 5, and is effective to the affirmation of welded condition.
And, because a little less than the wettability of the scolding tin material in the place that is covered by resin on two lead frames 9,90, so the scolding tin material is near the exposed division 5,50 of lead frame 9,90.In Fig. 1, shown in arrow X, the scolding tin material that fills with on the crosspoint of first exposed division 5 and second exposed division 50 is along first, second exposed division 5,50, towards end face 51,52 to outflow.Therefore, even also confirm the welded condition of two lead frames 9,90 in this easily.
In addition, the end face 52 of first exposed division 5 of anode-side lead frame 9 is exposed from shell 70 sides.
(the formation order of solid electrolytic capacitor)
Below, illustrate: the order that forms solid electrolytic capacitor 1.Fig. 3 and Fig. 4 are the plane graphs of metallic plate 8 that becomes the basis material of lead frame 9,90, and this metallic plate 8 is a main component with iron or copper and chromium.At first, on metallic plate 8, implement etching or semi-stamping processing and form concave surface 4.Secondly, as shown in Figure 4, punching processing metallic plate 8 and form macropore 84 in this macropore 84, is clamped opening 80 and the first terminal that becomes anode-side lead frame 9 constitutes sheet 81 and become second terminal formation sheet 82 of cathode side lead frame 90.Concave surface 4 constitutes sheet 81,82 across two-terminal.
At this, as mentioned above, the end edge that faces one another of opening 80 is positioned at the position also more inboard than the surrounding edge of concave surface 4.When forming opening 80 because be difficult to make the end edge of opening 80 consistent with the end edge of concave surface 4, so that the end edge of opening 80 departs from the end edge of concave surface (4).Two-terminal constitutes sheet the 81, the 82nd, is connected with the surrounding edge portion of macropore 84 with becoming the brace 85 of second exposed division 50.
The lower surface that constitutes sheet 82 at second terminal is provided with: the recess 83 that should be formed the resin filling of shell 70.Constitute on the sheet 82 at second terminal, the place beyond the recess 83 becomes first exposed division 5 and second exposed division 50.
Secondly, Fig. 5 and shown in Figure 6 constitutes sheet 81,82 across two-terminal, after mounting capacitor element 2 outer peripheral faces, installs with conductive adhesive on concave surface 4.
The width that becomes the brace 85 of second exposed division 50 is provided with also narrowlyer than the width of first exposed division 5.Therefore, cut off with wafer dicing saw easily, form 9,90 o'clock operability of two lead frames and improve.
Under this state, two lead frames 9,90 are implemented electroless plating, form the thin layer of palladium and gold in order.Electroplate also and on the end face 51,52 of first, second exposed division 5,50, implement.In addition, as long as only the end face 51,52 of first, second exposed division 5,50 is implemented to electroplate, just can finish with a small amount of palladium and gold of electroplating usefulness.
The plating that enforcement is used to improve scolding tin material wettability on the end face 52 of first exposed division 5.Therefore, because under the state that has welded lead frame 90, the scolding tin material is attached on the end face 52, so can confirm from laterally easy: whether lead frame 90 correctly welding.Certainly, also can confirm the welded condition of lead frame 9,90 even see the end face 51 of second exposed division 50.
(second embodiment)
As other examples, as shown in Figure 7, also two second exposed divisions 50,50 can be set in the both sides of first exposed division 5.
In order to form solid electrolytic capacitor shown in Figure 71, as shown in Figure 8, the radicle that constitutes sheet 81,82 in two-terminal is opened rectangular-shaped aperture 86.Constitute on the sheet 81,82 in two-terminal, the both sides of aperture 86 are exactly the brace 85,85 that becomes second exposed division 50,50.After being positioned in the concave surface 4, come covering capacitor element 2 to capacitor element 2 with resin mass 7.As long as to comprise the face of D-D line, E-E line, cut off resin mass 7 and metallic plate 8 with wafer dicing saw, just can obtain solid electrolytic capacitor shown in Figure 71.
In this example, by the brace 85,85 that is set to second exposed division 50,50 at Liang Chu, thereby have: be difficult for producing the advantage that terminal constitutes the position deviation of sheet 81 and capacitor element 2 during resistance welded.
That is, anode tap 22 resistance welded are being constituted in the first terminal under the situation of sheet 81, from upper and lower anode tap 22 and the first terminal formation sheet 81 pushed.At this moment, as shown in Figure 6, if just one of brace 85, then the first terminal constitutes sheet 81 in comprising 8 of metallic plates, deflection arrow F direction.Consequently, the first terminal formation sheet 81 might produce deviation with the relative position of capacitor element 2.Particularly, if brace 85 is thin, then be partial to easily.
In this example, two place's braces 85,85 are set, can reduce the possibility that the first terminal constitutes the relative position generation deviation of sheet 81 and capacitor element 2.In addition, the number of brace 85 is not limited to two.Second exposed division 50 there is no need to be located on two lead frames 9,90, as shown in figure 10, also can only be located on a side the lead frame 90.
In addition, as shown in Figure 9, first exposed division 5,5,5 at three places can be set also on cathode side lead frame 90.
(the 3rd embodiment)
Figure 11 is the stereogram of other solid electrolytic capacitors 1 of expression.In this example, be characterised in that: the leading section of first exposed division 5 is bent upwards along shell 70 outer peripheral faces.In Figure 11, the leading section of first exposed division 5 is reclinate, and still, Figure 11 turns upside down and represents solid electrolytic capacitor 1, and in the user mode of solid electrolytic capacitor 1, the front end of the bend 53 of first exposed division 5 upwards.Certainly, second exposed division, 50 leading sections are bent upwards.
In bend 53, the inside of lead frame 9,90 laterally because the inside of lead frame 9,90 must weld, so under the state that has welded lead frame 9,90, the scolding tin material is easily attached to the outside of this bend 53.Therefore, from laterally confirming easily: whether lead frame 9,90 correctly welding.In addition, also can implement the above-mentioned plating that is used to improve scolding tin material wettability, also can not implement the above-mentioned plating that is used to improve scolding tin material wettability.
Claims (10)
1, a kind of solid electrolytic capacitor is characterized in that,
Possess: capacitor element; Be installed on the capacitor element and the anode-side that lower surface exposes and the lead frame of cathode side; The shell of covering capacitor element;
At least one side of the lead frame of anode-side or anode-side possesses: approximately perpendicular to first exposed division of two lead frame orientations and extension, the end face of at least one first exposed division exposes from the side of shell.
2, solid electrolytic capacitor according to claim 1, it is characterized in that, first exposed division connects second exposed division that extends along the orientation of two lead frames, the width of second exposed division is provided with also narrowlyer than first exposed division, and the end face of at least one second exposed division exposes from the end face of shell.
3, solid electrolytic capacitor according to claim 1 is characterized in that, is provided with a plurality of first or second exposed division on the cathode side lead frame.
4, solid electrolytic capacitor according to claim 1, it is characterized in that, two lead frames are clamped the opening of being filled by the resin that constitutes shell and are faced one another, the outer peripheral face of capacitor element is positioned in the concave surface of society on two lead frames, and the end edge that faces one another of opening is positioned at than on the also inboard position of concave surface surrounding edge.
5, solid electrolytic capacitor according to claim 1 is characterized in that, second extending part is in the both sides of first exposed division.
6, a kind of manufacture method of solid electrolytic capacitor is characterized in that, comprising:
On metallic plate, implement etching or semi-stamping processing and the operation of formation concave surface;
The punching processing metallic plate becomes the first terminal formation sheet of two lead frames and the operation that second terminal constitutes sheet across concave surface;
After second terminal constitutes sheet formation recess, the operation of the place beyond the recess as first and second exposed divisions;
Constitute sheet at the first terminal and constitute between the sheet, form end edge and be positioned at than the surrounding edge of the concave surface operation of the opening of the position of inboard also with second terminal;
The operation of mounting capacitor element in concave surface; With
Coat capacitor element with resin mass,, cut off the operation of this resin mass and metallic plate with resin filling opening and recess.
7, a kind of solid electrolytic capacitor is characterized in that,
Possess: capacitor element, be installed on the capacitor element and anode-side and the lead frame of cathode side and the shell of covering capacitor element that lower surface exposes;
The lead frame of anode-side or anode-side possesses the exposed division that its end face exposes from the side of shell;
On this exposed division, on end face, implement the plating that is used to improve scolding tin material wettability at least.
8, a kind of solid electrolytic capacitor is characterized in that,
Possess: capacitor element, be installed on the capacitor element and anode-side and the lead frame of cathode side and the shell of covering capacitor element that lower surface exposes;
The lead frame of anode-side or anode-side possesses exposed division; The leading section of this exposed division is bent upwards along the outer peripheral face of shell.
9, solid electrolytic capacitor according to claim 7 is characterized in that, expose from shell in a plurality of places of the lower surface of the lead frame of cathode side, and the exposed division that end face exposes is arranged in these a plurality of places, the place of the most close anode-side lead frame.
10, solid electrolytic capacitor according to claim 8 is characterized in that, expose from shell in a plurality of places of the lower surface of cathode side lead frame, and the exposed division that leading section is bent upwards is arranged in these a plurality of places, the place of the most close anode-side lead frame.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004206787A JP4152357B2 (en) | 2004-07-14 | 2004-07-14 | Solid electrolytic capacitor |
| JP2004206787 | 2004-07-14 | ||
| JP2004-206787 | 2004-07-14 | ||
| JP2004210970A JP4152358B2 (en) | 2004-07-20 | 2004-07-20 | Solid electrolytic capacitor |
| JP2004-210970 | 2004-07-20 | ||
| JP2004210970 | 2004-07-20 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101433007A Division CN101783246B (en) | 2004-07-14 | 2005-07-11 | Solid electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1722322A true CN1722322A (en) | 2006-01-18 |
| CN1722322B CN1722322B (en) | 2010-05-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510083589 Active CN1722322B (en) | 2004-07-14 | 2005-07-11 | Solid electrolytic capacitor and method for manufacturing the same |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4152357B2 (en) |
| CN (1) | CN1722322B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4256404B2 (en) | 2006-05-24 | 2009-04-22 | Ｔｄｋ株式会社 | Solid electrolytic capacitor |
| WO2009122981A1 (en) | 2008-03-31 | 2009-10-08 | 住友大阪セメント株式会社 | Optical receiver |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3536722B2 (en) * | 1998-06-18 | 2004-06-14 | 松下電器産業株式会社 | Chip type solid electrolytic capacitor and method of manufacturing the same |
| JP2003068576A (en) * | 2001-08-30 | 2003-03-07 | Rohm Co Ltd | Structure of surface mounted solid electrolytic capacitor and manufacturing method therefor |
-
2004
- 2004-07-14 JP JP2004206787A patent/JP4152357B2/en not_active Expired - Fee Related
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2005
- 2005-07-11 CN CN 200510083589 patent/CN1722322B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN1722322B (en) | 2010-05-05 |
| JP4152357B2 (en) | 2008-09-17 |
| JP2006032514A (en) | 2006-02-02 |
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