CN1709788A - Method for preparing nano carbon tube micro structure - Google Patents
Method for preparing nano carbon tube micro structure Download PDFInfo
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- CN1709788A CN1709788A CN 200510027570 CN200510027570A CN1709788A CN 1709788 A CN1709788 A CN 1709788A CN 200510027570 CN200510027570 CN 200510027570 CN 200510027570 A CN200510027570 A CN 200510027570A CN 1709788 A CN1709788 A CN 1709788A
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Abstract
One carbon nanometer tube's microstructure preparation method, the step includes: Substrate preparation; Carbon nano tube pulp preparation; The microstructure becomes the mold: the process processing substrate on the surface, makes the photoetching rubber level, and pass through the exposure, the development and the firm mold craft later form which needs the graph and highly micro graph structure; Carbon nanometer's tube compression casting: Uses the compression casting method which presses in the carbon nanometer tube pulp in the microstructure model for solidification and shape: Through heating up with heat preservation processing, stably solidifies the carbon nanometer tube microstructure; Drawing of patterns: Through will pass through the above step substrate and full sunk in which is suitable for inside dissolved microstructure model solution, and form the carbon nanometer tube microstructure on the substrate surface. The preparation process is simple, the structure graph boundary was clear, the graph deep width was bigger , the graph precision was high, the craft serviceability was strong and such characteristic, especially suitable for the graph structure preparation with carbon deposition nanometer tube .
Description
Technical field
That the present invention relates to is a kind of preparation method of micro-nano technical field, relates in particular to a kind of preparation method of nano carbon tube micro structure.
Background technology
CNT is a kind of very nano material of property that has, and its application in the micro-nano electronic device mainly is the process technology that adopts microelectronic component, realizes by various micrographics structures.At present, processing method commonly used generally all is the combination of film-forming process and graphical technology, and its mainstream technology comprises the chemical vapor deposition (CVD) technology or based on the pattern technology of CNT slurry.
The CVD pattern technology at first carries out graphically on-chip catalyst layer, and then utilizes technology such as chemical vapour deposition (CVD) carbon nano-tube on patterned catalyst layer.Adopt CVD technology institute carbon nanotubes grown film to have the high advantage of configuration of surface control accuracy, but this technology is difficult to low temperature, large tracts of land, low-cost preparation CNT graphic structure, and the resolution ratio of CNT figure is relevant with thickness, the thick more then figure of thickness spacing is big more, otherwise causes graphics resolution to reduce or component failure easily.Pattern technology based on the CNT slurry generally is will evenly to mix with some organic solvents through the CNT that PROCESS FOR TREATMENT such as dispersion, purification are crossed earlier, forms the CNT slurry; Utilize screen printing technique that slurry evenly is coated on certain substrate then, to form specific figure.This technology film-forming temperature is relatively low, and the range of choice of base material is big, and processing technology is little to the influence of device material or structure, is convenient to carry out low cost, large tracts of land, large batch of graphical processing.This shows, can solve CVD technology existing problems to a certain extent based on the pattern technology of CNT slurry, but still there is graphical low precision in this technology, the physical property that is difficult to behind compatibility and the carbon tube nanometer tube figuring with the technology of other micro fabrication is difficult to problems such as maintenance.Certainly, also can adopt and form carbon nano-tube film, and then adopt other method to realize the graphical of CNT such as some conventional film build methods such as spin-coating method, cured resin methods.But owing to lack graphic method with the compatible mutually maturation of said method at present, so be difficult to satisfy the preparation processing request of high accuracy, large scale and scale CNT.
Find through literature search prior art, Young-Rae Cho is at vacuum science and technical journal (J.Vac.Sci.Technol.B 19.3., May/Jun 2001) on propose in " being applied to the carbon tube nanometer tube figuring technology of FED " (Patterning technology of carbon nanotubes forfield emission display) literary composition of delivering: in the CNT slurry, add the proper proportion photosensitive material, form the CNT pasty film with the scraper forming method, use ultraviolet (UV) light source to carry out photoetching and development then, thereby obtain the figure of required CNT.Adopt that minimum clearance is about 20～30 microns between the obtainable figure of this method.Obviously, owing in the CNT slurry, add a certain proportion of photosensitive material, not only increased the preparing process complexity, and may produce adverse influence, therefore be unfavorable for being applied as basic technology cheaply to the inherent characteristic of CNT and function.
Summary of the invention
The present invention is directed to the above-mentioned deficiency of existing in prior technology, a kind of preparation method of nano carbon tube micro structure is proposed, make it gather the feature of conventional graphical photoetching technique in the microelectronic component processing technology and three-dimensional microstructures one minute-pressure casting manufacturing technology, it is simple to have preparation process, figure machining accuracy height, the distinguishing feature that the technology applicability is strong is particularly useful for the preparation of large tracts of land carbon tube nanometer tube figuring structure.
The present invention is achieved by the following technical solutions, and concrete steps are as follows:
(1) substrate is prepared: the substrate to the preparation micro-structural carries out preliminary treatment, this substrate comprises silicon wafer, glass plate, micro-crystalline ceramic substrate, organic polymer body substrate, and comprise by one or more sandwich constructions that are combined in metal material, dielectric material, the semi-conducting material dry for standby after the employing standard microelectronics clean process.If electronic device need be to applying electrode and drawing lead accordingly on the nano carbon tube micro structure, can on substrate, prepare by advanced row metal electrode structure, as, with sputtering method plated metal conductive film, the method with photoetching and etching obtains required metal electrode graphic structure then.
(2) CNT pulp preparation: required CNT slurry is provided, the CNT slurry comprises: CNT, volatilizable organic solvent and ethyl cellulose or functional interpolation material, the mass percent of CNT and organic solvent is 9-14: 1, the composition of organic solvent is that mass percent is 100: the terpinol of 0.5-3.5 and ethyl cellulose, wherein, described CNT passes through purification processes before use, and the ball milling by CNT and organic solvent stirs, and fully is mixed and made into uniform CNT slurry.Described functional interpolation material is a metal particle, and as silver powder, the mass percent of CNT, silver powder and organic solvent is 10: 0.2: 1.
(3) micro-structural Cheng Mo: the substrate upper surface after handling through step (1), spin coating photoresist or other photoresist organic compounds are made photoresist layer.This photoresist layer has the micrographics structure of desired height in formation after exposure, development and post bake technology, as the processing model of follow-up die casting nano carbon tube micro structure.
(4) CNT die casting: adopt pressure casting method, for example, method for printing screen, gravity extrusion etc., the CNT slurry that step (2) is prepared is pressed in the prepared microstructure model of step (3), and make the CNT slurry fully inject the inside of microstructure model, and be coated in the surface of microstructure model fully.
(5) curing molding: above-mentioned sample is put into heating furnace, furnace temperature to 50～130 degree centigrade then progressively raise, and continue insulation 2～5 hours, make the organic solvent composition that is comprised in the CNT slurry fully volatilize, and the stable curing nano carbon tube micro structure.
(6) demoulding: will be through the substrate of above-mentioned steps, that is, die casting nano carbon tube micro structure and be immersed in the solution that is applicable to the dissolving microstructure model through the substrate of heat treated; That is to say, be immersed in the solution that is applicable to the dissolving photoresist layer.This solution comprises: acetone, alcohol, organic solvent and deionized water; The ratio of solution composition depends on the composition of the photoresist that adopted and CNT slurry and to the pattern precision requirement of nano carbon tube micro structure.In whole dissolving knockout course, can not influence the performance of CNT graphic structure and CNT.When photoresist dissolves fully fully, after the removal, cleaning, drying, obtain the nano carbon tube micro structure opposite with the microstructure model figure.
Preparation technology of the present invention is very simple, utilize conventional microfabrication photoetching technique just can be easy to make the photoresist microstructure model of various required yardsticks, the CNT slurry coating in the photoresist model and through after curing molding and the demoulding processing, can be formed CNT micrographics structure.Compare with other nano carbon tube micro structure technology of preparing, major advantage of the present invention is: do not experience high-temperature technology in the preparation process, can not cause harmful effect to other structure and material, the photoetching technique and the three-dimensional microstructures casting film technology of existing maturation have been made full use of, in conjunction with the various pressure casting methods that comprise method for printing screen, the working ability and the precision of figure have been improved greatly, it is very simple to have formed a kind of technology, easy to operate, good with existing micromachining technology compatibility, can be efficient, large tracts of land, the low-cost preparation method who realizes various CNT three-dimensional microstructures is fit to be applied to various opto-electronic devices such as gas sensor based on CNT very much, ion transducer, flat-panel screens etc.
The specific embodiment
Following according to describing the features and advantages of the present invention in detail in conjunction with technical solution of the present invention.
Embodiment one
(1) substrate is prepared: the substrate of preparation micro-structural, and this substrate is a glass plate, its thickness is 1.2mm.Substrate also can adopt the substrate of other material, comprises, for example, silicon wafer, glass plate, micro-crystalline ceramic sheet, organic polymer materials, etc.Cleaning and drying process in the microelectronic technique of substrate employing standard are handled.
(2) CNT pulp preparation: this CNT slurry comprises: CNT, volatilizable organic solvent and ethyl cellulose, especially, in the composition in this slurry, CNT and organic solvent mass percent are 14: 1, and wherein the composition of organic solvent is that mass percent is 100: 0.5 terpinol and an ethyl cellulose.CNT is about 50 nanometers of diameter, the about 15 microns multi-walled carbon nano-tubes of length, passed through purification processes before use, the purity of CNT＞97.5%, organic solvent and CNT mix the back and are modulated into slurry with the ball milling stirring, the rotating speed of ball milling is 400 rev/mins, and the ball milling time is 40 minutes.
(3) micro-structural Cheng Mo: spin coating positive photoresist layer on the composite conducting layer, thickness is 25 microns.After photoresists such as overexposure, development and post bake processing treatment process, just forming positive shape micro-structural, as the processing model of follow-up die casting nano carbon tube micro structure with desired height.
When forming positive shape microstructure model, can also be after the positive photoresist layer have formed, in its surface, the composite conducting of sputter layer of metal again layer, it comprises the chromium layer of 300 Ethylmercurichlorendimides and the gold of 1000 Ethylmercurichlorendimides, and wherein carat (measure of the purity of gold) is above chromium, and the chromium layer contacts with the gold layer.After having formed the metal composite conductive layer, prepared CNT will be formed directly into the surface of this metal composite conductive layer in the later stage, but not directly be formed at the surface of above-mentioned substrate.
(4) CNT die casting: present embodiment adopts the serigraphy pressure casting method, the CNT slurry that step (2) is prepared is pressed in the prepared microstructure model of step (3), and the inside that makes the CNT slurry fully inject microstructure model also applies the surface of microstructure model fully, forms the CNT pulp layer.As everyone knows, method for printing screen can be controlled thickness easily by control mesh number, slurry fluidity and applied pressure, also is convenient to large tracts of land, even film forming simultaneously.In this preferred embodiment, the mesh number of employed screen printing forme is 200 orders, and the height of silk-screen layer is 21 microns.Along with the increase of the mesh number of silk screen printing forme, can further improve the precision of control thickness.
(5) curing molding: above-mentioned sample is put into heating furnace heat, make the organic solvent composition that is comprised in the CNT slurry fully volatilize.In the present embodiment, heating-up temperature is 60 degrees centigrade, and lasting insulation is 5 hours.
(6) demoulding: will comprise the substrate through above-mentioned steps, that is, die casting nano carbon tube micro structure and be immersed in fully in the solution that is applicable to the dissolving microstructure model through the substrate of heat treated; That is to say, be immersed in the solution that is applicable to the dissolving photoresist.This solvent soln comprises: acetone, alcohol, organic solvent and deionized water; The ratio of solution composition depends on photoresist and the composition of CNT slurry and the figure control accuracy of nano carbon tube micro structure that is adopted.In whole dissolving knockout course, the demoulding can not influence the performance of CNT graphic structure and CNT.After photoresist dissolves fully fully, removes,, on substrate, form the nano carbon tube micro structure opposite with the microstructure model figure through washed with de-ionized water, drying.In the present embodiment, whole substrate is immersed in the mixed solution that percent by volume is 40% acetone and 60% alcohol, soak time is 3 minutes, CNT slurry above the photoresist is all along with the dissolving of photoresist breaks away from substrate, the CNT slurry that is in contact with one another with conductive layer then remains, thereby has finished the overall process of whole carbon tube nanometer tube figuring technologies.
Adopt the present invention can form the negative shape CNT opposite with the photoresist figure, the negative shape here is meant that the minimum feature in the micro-structural is to differentiate interval width by the minimum between the adjacent nano carbon tube micro structure to embody.The minimum feature of the CNT micrographics that obtains in the present embodiment is 35 microns, highly is 10 microns.
Embodiment two
Embodiment two comprises the step identical with embodiment one, and its main difference is: what (1) substrate adopted is the sandwich construction of silicon chip/polyimides.In this sandwich construction, lower floor is a low resistance silicon chip, is the polyimide layer of crossing through 270 degrees centigrade of amination treatment above the low-resistance silicon layer, and its thickness is 10 microns.Cleaning and drying process in the microelectronic technique of substrate employing standard are handled.
(2) in the CNT slurry preparation step, prepared CNT slurry comprises: CNT, silver powder and organic solvent.Especially, in the composition of this slurry, the mass percent of CNT, silver powder and organic solvent is 10: 0.2: 1.Wherein, the granularity of silver powder is 500 nanometers, and the composition of organic solvent is that mass percent is 100: 1.5 terpinol and an ethyl cellulose.In the CNT slurry, add the electric conductivity that silver powder helps further improving the CNT slurry.
(3) become in the mould step in micro-structural, photoresist layer is formed after exposure, development, post bake are handled to be negative shape.
(4) in the curing molding step: present embodiment, heating-up temperature are 80 degrees centigrade, and lasting insulation is 3 hours.
(5) in CNT die casting step, adopt the gravity pressure casting method, replace the method for printing screen among the embodiment one, the CNT slurry that above-mentioned steps (1) is prepared is pressed in the microstructure model; Specifically, the first identical CNT slurry of coating one deck composition and embodiment one on positive rubber moulding type, glass plate with surfacing covers on slurry then, progressively weight application pushes downwards, the inside that makes the CNT slurry fully inject microstructure model also applies the surface of microstructure model fully, forms the CNT pulp layer.
(6) owing to adopt the sandwich construction substrate of silicon chip/polyimides, in the demoulding process, soak whole substrate with acetone, after the photoresist microscopic model was removed, the polyimide layer that is arranged in the sandwich construction substrate under the microscopic model was also gradually by acetone solution.
Adopting the formed CNT figure of the present invention is the positive shape opposite with the photoresist figure, and the positive shape here is meant that the minimum feature in the micro-structural is that minimum widith by nano carbon tube micro structure itself embodies.
Adopt the preparation method of the embodiment of the invention, the minimum feature of prepared nano carbon tube micro structure figure is 5.5 microns, highly is 26 microns, and the maximum depth-to-width ratio of CNT figure is about 5: 1.This shows, adopt this method can form the nano carbon tube micro structure figure that the structure graph live width is little, depth-to-width ratio is big.
Embodiment three
Embodiment three comprises the step identical with embodiment one, and its main difference is:
(1) in the substrate preparation process: depositing conducting layer has also carried out graphically in advance on substrate, and this conductive layer can be used as the electrode outlet line of nano carbon tube micro structure.Concrete steps are: the substrate upper surface sputtering sedimentation chromium after processing/golden composition metal conductive layer, and its thickness is 0.3 micron; Wherein, the thickness of chromium layer is 0.03 micron, and its effect is to strengthen combining of gold and glass plate.Equally, the composite conducting layer also can comprise the employing composite conducting layer that other metal material constituted.Method with photoetching and etching obtains required metal electrode graphic structure then.
(2) in the step of micro-structural Cheng Mo, passed through the mercury lamp ultraviolet photoetching through the photosensitive material after the photoetching film forming, exposure machine power is 275 watts, the time for exposure is 600 seconds.
(3) in the CNT slurry preparation step, prepared CNT slurry comprises: CNT and organic solvent.Especially, in the composition in this slurry, the mass percent of CNT and organic solvent is 9: 1.Wherein, the composition of organic solvent is that mass percent is 100: 3.5 terpinol and an ethyl cellulose.
(4) in the curing molding step: present embodiment, heating-up temperature are 130 degrees centigrade, and continue insulation 2 hours.
(5) in demoulding step, employed mold release solution is the standard developer of photoresist.
In the present embodiment, because nano carbon tube micro structure is arranged on the patterned metal electrode layer, metal electrode layer can be used as circuit connection, and this has important practical value in the application of CNT as the Core Feature material of electronic device.Adopt the final CNT pattern edge that forms of this technology neat, highly be 13 microns, minimum feature is 20 microns.
Claims (10)
1. the preparation method of a nano carbon tube micro structure is characterized in that, comprises the following steps:
(1) substrate is prepared: the substrate that is used to prepare micro-structural is carried out preliminary treatment, adopt dry for standby after the standard microelectronics clean process;
(2) CNT pulp preparation: provide micro-structural required CNT slurry;
(3) micro-structural Cheng Mo: be used for the substrate upper surface after handling through step (1), spin coating photoresist organic compound is made photoresist layer, and forms the micrographics structure with required figure and height after exposure, development and post bake technology;
(4) CNT die casting: adopt the pressure casting method CNT slurry that step (2) is prepared to be pressed in the made microstructure model of step (3), and make the CNT slurry fully inject the inside of microstructure model and the surface that is coated in microstructure model fully;
(5) curing molding: handle the stable curing nano carbon tube micro structure by heating and insulation;
(6) demoulding: by will fully being immersed in through the substrate of above-mentioned steps in the solution that is applicable to the dissolving microstructure model, when the made photoresist layer of step (2) dissolves fully fully, after the removal, cleaning, drying, form nano carbon tube micro structure on substrate surface.
2. the preparation method of nano carbon tube micro structure as claimed in claim 1, it is characterized in that, in the step (1), described substrate comprises silicon wafer, glass plate, micro-crystalline ceramic substrate, organic polymer body substrate, and comprises by one or more sandwich constructions that are combined in metal material, dielectric material, the semi-conducting material.
3. the preparation method of nano carbon tube micro structure as claimed in claim 1, it is characterized in that, in the step (1), also comprise on the described substrate and adopt sputter or the made metal conducting layer of electroplating deposition method, be used to constitute required metal electrode graphic structure, metal conducting layer is a single layer structure, or multi-layer compound structure.
4. the preparation method of nano carbon tube micro structure as claimed in claim 3 is characterized in that, described metal composite conductive layer comprises chromium/golden composition metal conductive film, and its thickness is 0.3 micron, and wherein, the thickness of chromium layer is 0.03 micron.
5. the preparation method of nano carbon tube micro structure as claimed in claim 1, it is characterized in that, in the step (2), described CNT slurry comprises: CNT, volatilizable organic solvent and ethyl cellulose or functional interpolation material, the mass percent of CNT and organic solvent is 9-14: 1, the composition of organic solvent is that mass percent is 100: the terpinol of 0.5-3.5 and ethyl cellulose, wherein, described CNT passes through purification processes before use, and the ball milling by CNT and organic solvent stirs, and fully is mixed and made into uniform CNT slurry.
6. the preparation method of nano carbon tube micro structure as claimed in claim 5 is characterized in that, described functional interpolation material is a metal particle, and as silver powder, the mass percent of CNT, silver powder and organic solvent is 10: 0.2: 1.
7. nano carbon tube micro structure preparation method as claimed in claim 1 is characterized in that, in the step (4), described pressure casting method comprises method for printing screen and gravity pressure casting method.
8. the preparation method of nano carbon tube micro structure as claimed in claim 1, it is characterized in that, in the step (5), described heating and insulation are treated to: sample is put into heating furnace, furnace temperature to 60～130 degree centigrade then progressively raise, and continue insulation 2～5 hours, make the organic solvent composition that is comprised in the CNT slurry fully volatilize.
9. the preparation method of nano carbon tube micro structure as claimed in claim 1 is characterized in that, in the step (6), the solution of described dissolving photoresist layer comprises: one or several mixing in acetone, alcohol, photoresist standard developer and the deionized water.
10. the preparation method of nano carbon tube micro structure as claimed in claim 1 is characterized in that, described nano carbon tube micro structure comprises negative shape or positive shape.
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Cited By (4)
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| CN102135729A (en) * | 2011-03-18 | 2011-07-27 | 华中科技大学 | Preparation method of carbon micro-nano integrated structure |
| CN102820093A (en) * | 2011-06-09 | 2012-12-12 | 天津富纳源创科技有限公司 | Method for preparing patterned conducting element |
| CN103073192A (en) * | 2013-01-28 | 2013-05-01 | 上海交通大学 | Method for allowing CNT/CNF to be implanted into glass surface |
| CN104209489A (en) * | 2014-08-26 | 2014-12-17 | 中国科学院力学研究所 | Device for implementing moving and micro die-casting molding of metal component |
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| CN1287007C (en) * | 2002-11-01 | 2006-11-29 | 中国科学院理化技术研究所 | Preparation method of carbon nano tube/silver composite functional material |
| JP4379002B2 (en) * | 2003-05-30 | 2009-12-09 | 富士ゼロックス株式会社 | Carbon nanotube device manufacturing method and carbon nanotube transfer body |
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| CN1628927A (en) * | 2003-12-19 | 2005-06-22 | 鸿富锦精密工业（深圳）有限公司 | Process for preparing nanoparticle |
| CN1293649C (en) * | 2004-01-08 | 2007-01-03 | 西安交通大学 | Preparation method of large surface area carbon nano pipe film for field emitting display cathode |
| CN1622272A (en) * | 2004-12-16 | 2005-06-01 | 中原工学院 | Three-pole carbon nano tube field emission flat display with ballast resistor structure and fabrication process thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102135729A (en) * | 2011-03-18 | 2011-07-27 | 华中科技大学 | Preparation method of carbon micro-nano integrated structure |
| CN102135729B (en) * | 2011-03-18 | 2012-07-04 | 华中科技大学 | Preparation method of carbon micro-nano integrated structure |
| CN102820093A (en) * | 2011-06-09 | 2012-12-12 | 天津富纳源创科技有限公司 | Method for preparing patterned conducting element |
| CN102820093B (en) * | 2011-06-09 | 2014-05-28 | 天津富纳源创科技有限公司 | Method for preparing patterned conducting element |
| CN103073192A (en) * | 2013-01-28 | 2013-05-01 | 上海交通大学 | Method for allowing CNT/CNF to be implanted into glass surface |
| CN103073192B (en) * | 2013-01-28 | 2016-01-13 | 上海交通大学 | Carbon nano-tube/carbon nano fabric implants the method for glass surface |
| CN104209489A (en) * | 2014-08-26 | 2014-12-17 | 中国科学院力学研究所 | Device for implementing moving and micro die-casting molding of metal component |
| CN104209489B (en) * | 2014-08-26 | 2016-06-08 | 中国科学院力学研究所 | A kind of hardware that realizes moves the device of minute-pressure type casting moulding |
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| CN100395171C (en) | 2008-06-18 |
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