CN1707714A - Thin sheet with laminated spring and switch device using the same - Google Patents
Thin sheet with laminated spring and switch device using the same Download PDFInfo
- Publication number
- CN1707714A CN1707714A CNA200510075802XA CN200510075802A CN1707714A CN 1707714 A CN1707714 A CN 1707714A CN A200510075802X A CNA200510075802X A CN A200510075802XA CN 200510075802 A CN200510075802 A CN 200510075802A CN 1707714 A CN1707714 A CN 1707714A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- thin slice
- heat insulating
- leaf spring
- insulating lamella
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
- H01H13/705—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches characterised by construction, mounting or arrangement of operating parts, e.g. push-buttons or keys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/02—Details
- H01H13/023—Light-emitting indicators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/02—Details
- H01H13/26—Snap-action arrangements depending upon deformation of elastic members
- H01H13/48—Snap-action arrangements depending upon deformation of elastic members using buckling of disc springs
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/23—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2239/00—Miscellaneous
- H01H2239/008—Static electricity considerations
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Push-Button Switches (AREA)
- Switch Cases, Indication, And Locking (AREA)
- Elimination Of Static Electricity (AREA)
Abstract
The invention provides a sheet with a plate spring capable of being illuminated, without causing breakage of electronic components due to static electricity, and to provide a switch device that uses the sheet having a plate spring. This sheet with a plate spring is provided with the plate spring (4) for forming a moving contact and an insulating sheet (1) for housing the plate spring (4). A conductive film (5) is formed on one surface of the insulating sheet (1). First translucent parts (2d) for transmitting light from a luminescent member (7) are formed in the insulating sheet (1). Second translucent parts (5a) facing to the first translucent parts (2d) are formed in the conductive film (5). Since the plate spring (4) is stuck to the insulating sheet (1) or the conductive film (5), when the sheet with the plate spring is incorporated in the switch device, the conductive film (5) can be brought into a grounded state, and breakages or malfunctions of the electronic components are prevented from being produced due to static electricity, even if static electricity flies into in the insulating sheet (1) side.
Description
Technical field
The present invention relates to the thin slice of the band plate spring of a kind of suitable use on electronic equipments such as pocket telephone and the switching device that has used the thin slice of this band plate spring.
Background technology
Fig. 9 be the thin slice of band plate spring in the past and the thin slice that has used this band plate spring switching device in the past in the past want portion's cutaway view, the formation of the thin slice of band plate spring in the past is described based on Fig. 9 below, and the flat heat insulating lamella 51 that is made of insulating material has flat part 51a, be arranged on a plurality of recess 51b on this flat part 51a, link to each other with flat part 51a and be located at by embossing processing the paste section 51c of the position of recess 51b.
Constitute by metallic plate, the leaf spring 52 that is used to form by pushing deformable travelling contact is the dome-type while, central portion in inside is provided with the outstanding 52a of contact portion downwards, this leaf spring 52 is assemblied on the heat insulating lamella 51 with the state that is positioned at recess 51b, and pastes with the following adhesive 53 of the paste section 51c that is located at heat insulating lamella 51 above it.
And the thin slice S of band plate spring in the past is made of heat insulating lamella 51, the leaf spring 52 that is secured on this heat insulating lamella 51.(for example, with reference to patent documentation 1)
Below, formation based on Fig. 9 explanation switching device in the past, switching device SW in the past is made of thin slice S, circuit substrate 55, the panel 56 of above-mentioned band plate spring and the pressing component 57 that is assembled on this panel 56, wherein circuit substrate 55 has fixed contact 54a, 54b and the electronic unit (not shown) of lift-launch on wiring figure (not shown), and pressing component 57 is pushed the leaf spring 52 as travelling contact.
Peripheral part at leaf spring 52 contacts with fixed contact 54a, the 52a of contact portion relative with fixed contact 54b to state under, the heat insulating lamella 51 of the thin slice S of band plate spring is layered on the circuit substrate 55, and stick on the circuit substrate 55 by adhesive 53, pressing component 57 is configured on the 51c of paste section.
And, switching device SW in the past is by the push action of pressing component 57, can make paste section 51c and leaf spring 52 distortion, the 52a of contact portion contacts with fixed contact 54b and carries out contact and switch, in addition, after the push action of removing pressing component 57, leaf spring 52 is returned to original state with paste section 51c by self resetting, and the 52a of contact portion leaves fixed contact 54b and carries out the contact switching.
But, the thin slice S of band plate spring in the past, owing to only form the heat insulating lamella 51 that is equipped with as the leaf spring 52 of travelling contact by flat insulating material, so when going into 51 groups of this heat insulating lamellas among the switching device SW, static moves on to heat insulating lamella 51 1 sides by the gap between pressing component 57 and the panel 56, pass to wiring figure or electronic unit again, meeting is because of the electrostatic breakdown electronic unit, and the generation misoperation.
In addition, used the switching device SW in the past of the thin slice S of band plate spring, owing to only form the heat insulating lamella 51 that is equipped with as the leaf spring 52 of travelling contact by flat insulating material, so static moves on to heat insulating lamella 51 1 sides by the gap between pressing component 57 and the panel 56, pass to wiring figure or electronic unit again, meeting is because of the electrostatic breakdown electronic unit, and the generation misoperation.
Patent documentation 1: the Japan Patent spy opens the 2001-160334 communique
The thin slice S of band plate spring in the past, owing to only form the heat insulating lamella 51 that is equipped with as the leaf spring 52 of travelling contact by flat insulating material, so when going into 51 groups of this heat insulating lamellas among the switching device SW, static moves on to heat insulating lamella 51 1 sides by the gap between pressing component 57 and the panel 56, pass to wiring figure or electronic unit again, meeting is because of the electrostatic breakdown electronic unit, and the generation misoperation.
In addition, used the switching device SW in the past of the thin slice S of band plate spring, owing to only form the heat insulating lamella 51 that is equipped with as the leaf spring 52 of travelling contact by flat insulating material, so static moves on to heat insulating lamella 51 1 sides by the gap between pressing component 57 and the panel 56, pass to wiring figure or electronic unit again, meeting is because of the electrostatic breakdown electronic unit, and the generation misoperation.
Summary of the invention
For this reason, its purpose of the present invention is to provide a kind of destruction and the thin slice of band plate spring that can irradiation and switching device that has used the thin slice of this band plate spring that can cause electronic unit because of static that do not have.
Thin slice as the band plate spring that is used to realize above-mentioned purpose the 1st solution, possess and be used to form by the leaf spring of pushing deformable travelling contact and the heat insulating lamella of accommodating this leaf spring, on a face of above-mentioned heat insulating lamella, be provided with conducting film, on above-mentioned heat insulating lamella, be provided with in the 1st transmittance section that sees through from the light of luminous component, on above-mentioned conducting film, be provided with see through from the light of above-mentioned luminous component and relative with above-mentioned the 1st transmittance section to the 2nd transmittance section, above-mentioned leaf spring is secured on above-mentioned heat insulating lamella or the above-mentioned conducting film.
In addition, as the 2nd solution, above-mentioned conducting film forms by electric conducting material being printed on the above-mentioned heat insulating lamella or conductive foil being bonded on the above-mentioned heat insulating lamella.
In addition, as the 3rd solution, the outer peripheral edges of above-mentioned conducting film form forr a short time than the outer peripheral edges of above-mentioned heat insulating lamella.
And as the 4th solution, above-mentioned the 1st, the 2nd transmittance section is formed by through hole respectively, and the above-mentioned through hole that forms above-mentioned the 1st transmittance section is littler than the above-mentioned through hole that forms above-mentioned the 2nd transmittance section.
In addition, as the 5th solution, above-mentioned the 2nd transmittance section is formed by through hole, above-mentioned heat insulating lamella is formed by light transmissive material, simultaneously, above-mentioned the 1st transmittance section with as the above-mentioned through hole subtend of above-mentioned the 2nd transmittance section, and, form by the above-mentioned light transmissive material that stops up above-mentioned through hole.
And, as the 6th solution, above-mentioned heat insulating lamella by be used to cover above-mentioned leaf spring above the stickup thin slice pasted form, on this stickup thin slice, be provided with the paste section of pasting leaf spring, on above-mentioned paste section, be provided with above-mentioned conducting film.
In addition, as the 7th solution, above-mentioned heat insulating lamella is formed by the stickup thin slice that is used to paste above-mentioned leaf spring, is provided with on this stickup thin slice and covers the paste section of pasting above the above-mentioned leaf spring, and above-mentioned conducting film is not set on above-mentioned paste section.
In addition, as the 8th solution, above-mentioned heat insulating lamella is formed by above-mentioned stickup thin slice and the pad that is secured at the another side side of this stickup thin slice.
In addition, as the 9th solution, above-mentioned heat insulating lamella is formed by the pad with the recess that can accommodate above-mentioned leaf spring, is pasted with above-mentioned leaf spring on the above-mentioned conducting film that stops up above-mentioned recess formation.
In addition, switching device as the 10th solution, the thin slice that possesses any described band plate spring in the claim 1～3, be provided with the circuit substrate of fixed contact, with the above-mentioned luminous component that is installed on this circuit substrate, in above-mentioned the 1st transmittance section relative with above-mentioned luminous component to, and the above-mentioned leaf spring that becomes above-mentioned travelling contact relative with the said fixing contact to state under, above-mentioned heat insulating lamella is layered in the one side side of foregoing circuit substrate, simultaneously, become the state that above-mentioned conducting film is grounded, carry out the switching of contact by the push action of above-mentioned leaf spring, and above-mentioned luminous component is via the above-mentioned the 1st, the 2nd light transparent member is come irradiation parts irradiation.
In addition, as the 11st solution, when above-mentioned irradiation parts are formed by the pressing component of pushing above-mentioned leaf spring, with the configuration of above-mentioned conducting film subtend, this switching device also has panel that above-mentioned pressing component is installed and contacts the ground strip that is used for ground connection with above-mentioned conducting film.
In addition, as the 12nd solution, above-mentioned the 1st, the 2nd transmittance section is formed by through hole respectively, the above-mentioned through hole that forms above-mentioned the 1st transmittance section is littler than the above-mentioned through hole that forms above-mentioned the 2nd transmittance section, simultaneously, above-mentioned luminous component is installed in the above-mentioned one side side of foregoing circuit substrate or is installed in the another side side of foregoing circuit substrate with the state that is positioned at hole set on the foregoing circuit substrate.
And, as the 13rd solution, above-mentioned the 2nd transmittance section is formed by through hole, above-mentioned heat insulating lamella is formed by light transmissive material, simultaneously, above-mentioned the 1st transmittance section with as the above-mentioned through hole subtend of above-mentioned the 2nd transmittance section, and, formed by the above-mentioned light transmissive material that stops up above-mentioned through hole, above-mentioned luminous component is installed in the above-mentioned one side side of foregoing circuit substrate or is installed in the another side side of foregoing circuit substrate with the state that is positioned at hole set on the foregoing circuit substrate.
In addition, as the 14th solution, above-mentioned heat insulating lamella is formed by the stickup thin slice that is used to paste above-mentioned leaf spring, on this stickup thin slice, be provided with and cover the paste section of pasting above the above-mentioned leaf spring, on above-mentioned paste section, be provided with above-mentioned conducting film, simultaneously, above-mentioned stickup thin slice is laminated in the above-mentioned one side side of foregoing circuit substrate.
In addition, as the 15th solution, above-mentioned heat insulating lamella is formed by the stickup thin slice that is used to paste above-mentioned leaf spring, on this stickup thin slice, be provided with and cover the paste section of pasting above the above-mentioned leaf spring, above-mentioned conducting film is not set on above-mentioned paste section, simultaneously, above-mentioned stickup thin slice is laminated in the above-mentioned one side side of foregoing circuit substrate.
And as the 16th solution, above-mentioned heat insulating lamella is formed by above-mentioned stickup thin slice and the pad that sticks on the another side side of this stickup thin slice, and above-mentioned pad is laminated in the above-mentioned one side side of foregoing circuit substrate.
In addition, as the 17th solution, above-mentioned heat insulating lamella is formed by the pad with the recess that can accommodate above-mentioned leaf spring, is pasted with above-mentioned leaf spring on the above-mentioned conducting film that stops up above-mentioned recess formation, and above-mentioned pad is laminated in the above-mentioned one side side of foregoing circuit substrate.
The thin slice of band plate spring of the present invention possesses the heat insulating lamella that is used to form the leaf spring by pushing deformable travelling contact and accommodates this leaf spring, on a face of heat insulating lamella, be provided with conducting film, on heat insulating lamella, be provided with in the 1st transmittance section that sees through from the light of luminous component, on conducting film, be provided with see through from the light of luminous component and relative with the 1st transmittance section to the 2nd transmittance section, leaf spring is secured on heat insulating lamella or the conducting film, therefore, when going into the thin slice group of this band plate spring in the switching device, can make conducting film become ground state, thereby, even static moves on to the heat insulating lamella side by the gap between pressing component and the panel, can not pass on wiring figure or the electronic unit yet, and can be because of the destruction or the misoperation of generation of static electricity electronic unit.
In addition, owing on heat insulating lamella and conducting film, be provided with the transmittance section, so can be to irradiation parts irradiation.
In addition, because conducting film forms by electric conducting material being printed on be bonded on the heat insulating lamella on the above-mentioned heat insulating lamella or with conductive foil, therefore, form conducting film easily, productivity is good.
And, because the outer peripheral edges of conducting film form forr a short time than the outer peripheral edges of heat insulating lamella, so when going into the thin slice group of band plate spring in the switching device, conducting film and the beeline that is located at the creeping discharge between the wiring figure on the circuit substrate become big, can reduce the influence that static brings.
In addition, 1st, the 2nd transmittance section is formed by through hole respectively, the above-mentioned through hole that forms the 1st transmittance section is littler than the above-mentioned through hole that forms the 2nd transmittance section, therefore, when going into the thin slice group of band plate spring in the switching device, conducting film and the beeline that is located at the creeping discharge between the wiring figure on the circuit substrate become big, can reduce the influence that static brings, and can reduce the destruction of luminous component.
And, the 2nd transmittance section is formed by through hole, and heat insulating lamella is formed by light transmissive material, simultaneously, the 1st transmittance section with as the through hole subtend of the 2nd transmittance section, and, form by the light transmissive material that stops up through hole, therefore, when going into the thin slice group of band plate spring in the switching device, utilization covers the wiring figure that is positioned at luminous component as the light transmissive material of the 1st transmittance section, and the influence that has not had static to bring does not have the destruction of luminous component.
In addition, heat insulating lamella is formed by the stickup thin slice that is used to paste leaf spring, on this stickup thin slice, be provided with and cover the paste section of pasting above the leaf spring, on the paste section, be provided with conducting film, therefore, when going into the thin slice group of band plate spring in the switching device, cut off leaf spring and conducting film by the paste section, do not have the influence that static brings.
In addition, heat insulating lamella is formed by the stickup thin slice that is used to paste leaf spring, on this stickup thin slice, be provided with and cover the paste section of pasting above the leaf spring, conducting film is not set on the paste section, therefore, when going into the thin slice group of band plate spring in the switching device, can prevent the variation of distortion (upset) action of the leaf spring that conducting film causes, cut off leaf spring and conducting film by the paste section simultaneously, do not have the influence that static brings.
In addition, heat insulating lamella forms with the pad that is secured at the another side side of this stickup thin slice by pasting thin slice, therefore, when going into the thin slice group of band plate spring in the switching device, can further increase conducting film and be located at the beeline of the creeping discharge between the wiring figure on the circuit substrate, can reduce the influence that static brings.
And heat insulating lamella is formed by the pad with the recess that can accommodate leaf spring, is pasted with leaf spring on the conducting film that stops up recess formation, therefore, can make distortion (upset) action of leaf spring good, can obtain good operation sense of touch.
In addition, switching device of the present invention, the thin slice that possesses the band plate spring, be provided with the circuit substrate of fixed contact, with the luminous component that is installed on this circuit substrate, in the 1st transmittance section relative with luminous component to, and the leaf spring that becomes travelling contact relative with fixed contact to state under, heat insulating lamella is layered in the one side side of circuit substrate, simultaneously, become the state that conducting film is grounded, carry out the switching of contact by the push action of leaf spring, and, luminous component is via the 1st, the 2nd light transparent member is come irradiation parts irradiation, therefore, by becoming the conducting film of ground state, even static moves on to the heat insulating lamella side by the gap, can not pass to wiring figure or electronic unit yet, not only can not cause the destruction or the misoperation of electronic unit because of static, and on heat insulating lamella and conducting film, the transmittance section is set, thereby can carry out irradiation to the irradiation parts.
And, when the irradiation parts are formed by the pressing component of pushing leaf spring, with conducting film subtend configuration, also have panel that pressing component is installed and contact the ground strip that is used for ground connection with above-mentioned conducting film, therefore, even static moves on to the heat insulating lamella side by the gap between pressing component and the panel, can not pass to wiring figure or electronic unit yet, not only can not cause the destruction or the misoperation of electronic unit, and can carry out irradiation the irradiation parts because of static.
In addition, 1st, the 2nd transmittance section is formed by through hole respectively, the through hole that forms the 1st transmittance section is littler than the through hole that forms the 2nd transmittance section, simultaneously, luminous component is installed in the one side side of circuit substrate or is installed in the another side side of circuit substrate with the state that is positioned at hole set on the circuit substrate, therefore the beeline of the creeping discharge between conducting film and the wiring figure that is located on the circuit substrate becomes greatly, has reduced the influence that static brings, the destruction that can reduce luminous component.
And, the 2nd transmittance section is formed by through hole, heat insulating lamella is formed by light transmissive material, simultaneously, the 1st transmittance section with as the through hole subtend of the 2nd transmittance section, and, form by the light transmissive material that stops up through hole, luminous component is installed in the one side side of circuit substrate or is installed in the another side side of circuit substrate with the state that is positioned at hole set on the circuit substrate, therefore, utilization covers the wiring figure that is positioned at luminous component as the light transmissive material of the 1st transmittance section, and the influence that has not had static to bring does not have the destruction of luminous component.
In addition, heat insulating lamella is formed by the stickup thin slice that is used to paste leaf spring, on this stickup thin slice, be provided with and cover the paste section of pasting above the leaf spring, on the paste section, be provided with conducting film, simultaneously, paste the one side side that thin slice is laminated in circuit substrate, therefore, cut off leaf spring and conducting film by the paste section, do not have the influence that static brings.
In addition, heat insulating lamella is formed by the stickup thin slice that is used to paste above-mentioned leaf spring, on this stickup thin slice, be provided with and cover the paste section of pasting above the leaf spring, conducting film is not set on the paste section, simultaneously, pastes the one side side that thin slice is laminated in circuit substrate, therefore, can prevent the variation of distortion (upset) action of the leaf spring that conducting film causes, cut off leaf spring and conducting film by the paste section simultaneously, not have the influence that static brings.
And, heat insulating lamella forms with the pad that sticks on the another side side of this stickup thin slice by pasting thin slice, pad is laminated in the one side side of circuit substrate, therefore, can further increase conducting film and be located at the beeline of the creeping discharge between the wiring figure on the circuit substrate, can reduce the influence that static brings.
In addition, heat insulating lamella is formed by the pad with the recess that can accommodate leaf spring, is pasted with leaf spring on the conducting film that stops up recess formation, pad is laminated in the above-mentioned one side side of circuit substrate, therefore, can make distortion (upset) action of leaf spring good, can obtain good operation sense of touch.
Description of drawings
Fig. 1 be the thin slice of expression band plate spring of the present invention and the thin slice that has used this band plate spring switching device of the present invention the 1st embodiment want portion's cutaway view.
Fig. 2 is the vertical view of the 1st embodiment of the thin slice of expression band plate spring of the present invention.
Fig. 3 be the thin slice of expression band plate spring of the present invention and the thin slice that has used this band plate spring switching device of the present invention the 2nd embodiment want portion's cutaway view.
Fig. 4 is the vertical view of the 2nd embodiment of the thin slice of expression band plate spring of the present invention.
Fig. 5 be the thin slice of expression band plate spring of the present invention and the thin slice that has used this band plate spring switching device of the present invention the 3rd embodiment want portion's cutaway view.
Fig. 6 be the thin slice of expression band plate spring of the present invention and the thin slice that has used this band plate spring switching device of the present invention the 4th embodiment want portion's cutaway view.
Fig. 7 be the thin slice of expression band plate spring of the present invention and the thin slice that has used this band plate spring switching device of the present invention the 5th embodiment want portion's cutaway view.
Fig. 8 be the thin slice of expression band plate spring of the present invention and the thin slice that has used this band plate spring switching device of the present invention the 6th embodiment want portion's cutaway view.
Fig. 9 be represent the thin slice of band plate spring in the past and used this band plate spring thin slice switching device in the past in the past want portion's cutaway view.
Among the figure: the 1-heat insulating lamella, 2-pastes thin slice, 2a-flat part, the 2b-resettlement section, 2c-paste section, 2d-the 1st transmittance section, the 2e-outer peripheral edges, 3-pad, 3a-flat part, the 3b-recess, 3c-grooving, 3d-the 1st transmittance section, the 3e-outer peripheral edges, 4-leaf spring (travelling contact), 4a-contact portion, the 5-conducting film, 5a-the 2nd transmittance section, 5b-outer peripheral edges, 6a, 6b-fixed contact, 7-luminous component, 8-circuit substrate, the 8a-hole, the 9-panel, 10-irradiation parts (pressing component), 11-ground strip, the thin slice of S1～S6-band plate spring, SW1～SW6-switching device.
Embodiment
At first, to the thin slice of band plate spring of the present invention and used the drawing of switching device of the present invention of the thin slice of this band plate spring to describe, Fig. 1 be the thin slice of expression band plate spring of the present invention and the thin slice that has used this band plate spring switching device of the present invention the 1st embodiment want portion's cutaway view, Fig. 2 is the vertical view of the 1st embodiment of the thin slice of expression band plate spring of the present invention, Fig. 3 be the thin slice of expression band plate spring of the present invention and the thin slice that has used this band plate spring switching device of the present invention the 2nd embodiment want portion's cutaway view, Fig. 4 is the vertical view of the 2nd embodiment of representing the thin slice of band plate spring of the present invention.
In addition, Fig. 5 be the thin slice of expression band plate spring of the present invention and the thin slice that has used this band plate spring switching device of the present invention the 3rd embodiment want portion's cutaway view, Fig. 6 be the thin slice of expression band plate spring of the present invention and the thin slice that has used this band plate spring switching device of the present invention the 4th embodiment want portion's cutaway view, Fig. 7 be the thin slice of expression band plate spring of the present invention and the thin slice that has used this band plate spring switching device of the present invention the 5th embodiment want portion's cutaway view, Fig. 8 be represent the thin slice of band plate spring of the present invention and used this band plate spring thin slice switching device of the present invention the 6th embodiment want portion's cutaway view.
Below, based on Fig. 1, Fig. 2 the formation of the 1st embodiment of the thin slice of band plate spring of the present invention is described, the heat insulating lamella 1 that is made of insulating material forms by the flat stickup thin slice 2 that is made of insulating material with by the flat pad 3 that insulating material constitutes.
The 1st transmittance section 2d that this stickup thin slice 2 has flat part 2a, be arranged on a plurality of resettlement section 2b on this flat part 2a, link to each other with flat part 2a and be located at the paste section 2c of 2b position, resettlement section, be made of the through hole that is arranged on flat part 2a position by embossing processing.
It should be noted that wherein formed when pasting thin slice 2 by the thin-film material of deformable softness in the shape of copying leaf spring 4 (as described later), this bellying 2c may not carry out preceding processing to thin slice.
In addition, pad 3 has flat part 3a, can accommodate leaf spring described later 4 ground is arranged on the recess 3b that is made of a plurality of through holes on this flat part 3a, links grooving 3c between the recess 3b, is arranged on the 1st transmittance section 3d that is made of through hole of the position of flat part 3a, this pad 3 sticks on following (another side) of pasting thin slice 2 by adhesive (not shown), forms heat insulating lamella 1.
In addition, below pad 3, also be coated with adhesive (not shown).
And, when fitting stickup thin slice 2 and pad 3, paste the resettlement section 2b of thin slice 2 and the recess 3b of pad 3 and be in corresponding to state, simultaneously, the 1st transmittance section 2d, 3d are in corresponding to state.
Constitute and by pushing deformability (upset) by metallic plate, the leaf spring that is used to form travelling contact 4 that can self reset when removing pressing force is dome-shaped, and, central portion in inside is provided with the outstanding 4a of contact portion downwards, this leaf spring 4 is installed on the stickup thin slice 2 with the form that is capped with on the adhesive (not shown) that is attached to following (inner face) of being located at the paste section 2c that pastes thin slice 2 above the state that is positioned at resettlement section 2b and recess 3b.
The conducting film 5 that is made of electric conducting material was arranged on top (simultaneously) of pasting thin slice 2, has the 2nd transmittance section 5a that constitutes by through hole, the 2nd transmittance section 5a forms greatlyyer than the 1st transmittance section 2d, 3d, dispose to surround the 1st transmittance section 2d mode on every side, in the 2nd transmittance section 5a, near the surface of the stickup thin slice 2 the 1st transmittance section 2d is the state that exposes.
This conducting film 5 forms by printing conductive material or the bonding conductive foil that is made of aluminium foil etc., simultaneously, the outer peripheral edges 5b of conducting film 5 forms forr a short time with outer peripheral edges 2e, the 3e of pad 3 than the stickup thin slice 2 that forms heat insulating lamella 1, and the surface of pasting the peripheral part of thin slice 2 is the state that exposes.
And, the thin slice S1 of band plate spring of the present invention by heat insulating lamella 1, stick on the leaf spring 4 on this heat insulating lamella 1 and the conducting film 5 that is arranged on the heat insulating lamella 1 constitutes, and heat insulating lamella 1 constitutes with pad 3 by pasting thin slice 2.
In addition, when transporting or take care of the thin slice of band plate spring,, preferably protected bonding plane to constitute by the barrier film of handling by release coating for the adhesive that does not make pad 3 exposes.
In this case, when covering the contact face of leaf spring 4, can prevent adhering to of foreign matter.
Then, based on Fig. 1 the formation of the 1st embodiment of switching device of the present invention is described, the switching device SW1 of the 1st embodiment of the present invention by the thin slice S1 of above-mentioned band plate spring, have fixed contact 6a, 6b and comprise panel 9 that the luminous components such as LED 7 of lift-launch on wiring figure (not shown) constitute at the circuit substrate 8 of interior electronic unit (not shown), by metal material or insulating material, be installed in passing through on the panel 9 and push irradiation parts 10 that the pressing component as the leaf spring 4 of travelling contact forms and constitute with conducting film 5 contacted ground strips 11.
And; when assembling, peel off guard blocks such as barrier film; peripheral part at leaf spring 4 contacts with fixed contact 6a, in the 4a of contact portion and the fixed contact 6b subtend; luminous component 10 is positioned under the state of the 1st transmittance section 3d, 3d; the pad 3 of thin slice S1 of band plate spring that exposes the contact face of the bonding plane of pad 3 and leaf spring 4 is laminated on the circuit substrate 8, and sticks on the circuit substrate 8 by adhesive (not shown).
In addition, when being configured in circuit substrate 8 in the panel 9, when irradiation parts (pressing component) 10 were configured on the 2c of paste section, ground strip 11 contacted with conducting film 5, and conducting film 5 is grounded.
And, switching device SW1 of the present invention, push action by irradiation parts (pressing component) 10, and paste section 2c and leaf spring 4 are out of shape, the 4a of contact portion contacts with fixed contact 6b and carries out the contact switching, in addition, and after the push action of removing irradiation parts (pressing component) 10, leaf spring 4 turns back to original state with paste section 2c by self resetting, the 4a of contact portion leaves fixed contact 6b and carries out the contact switching.
In addition, when paste section 2c and leaf spring 4 distortion, the air that is present in resettlement section 2b and the recess 3b can flow out in other the resettlement section 2b and recess 3b by grooving 3c, and grooving 3c becomes ventilating part.
And, the light of luminous component 7 shines on the irradiation parts (pressing component) 10 by the 1st transmittance section 2d, 3d and the 2nd transmittance section 5a, when irradiation parts (pressing component) 10 are by irradiation, static moves on to by the gap between panel 9 and the irradiation parts (pressing component) 10 under the situation of pasting thin slice 2 sides, and being situated between from conducting film 5 is grounded by ground strip 11.
In addition, Fig. 3, Fig. 4 represent the thin slice of band plate spring of the present invention and have used the 2nd embodiment of switching device of the present invention of the thin slice of this band plate spring, the thin slice S2 of the band plate spring of the 2nd embodiment and switching device SW2 are not provided with the conducting film 5 on the paste section 2c that pastes thin slice 2, other formation is identical with above-mentioned the 1st embodiment, on same parts, use jack per line, omitted its explanation here.
In addition, Fig. 5 represents the thin slice of band plate spring of the present invention and has used the 3rd embodiment of switching device of the present invention of the thin slice of this band plate spring, the thin slice S3 of the band plate spring of the 3rd embodiment and switching device SW3, by stopping up the 2nd transmittance section 3d is that the light transmissive material of through hole forms the stickup thin slice 2d that is made of light transmissive material, cover the top of luminous component 7 by the 1st transmittance section 2d that constitutes by this light transmissive material, other formation is identical with above-mentioned the 1st embodiment, on same parts, use jack per line, omitted its explanation here.
In addition, Fig. 6 represents the thin slice of band plate spring of the present invention and has used the 4th embodiment of switching device of the present invention of the thin slice of this band plate spring, the thin slice S4 of the band plate spring of the 4th embodiment and switching device SW4, when only forming heat insulating lamella 1 by the stickup thin slice 2 that is made of light transmissive material, the 1st transmittance section 2d is that the light transmissive material of through hole forms by obstruction the 2nd transmittance section 3d.
And, topical application adhesive (not shown) is set as dome-shaped or ribbon below pasting thin slice 2, it is stacked and stick on the circuit substrate 8 to paste thin slice 2, do not exist the position of adhesive to become the ventilating part of resettlement section 2b, and the 1st transmittance section 2d that is made of light transmissive material that heaves by embossing processing covers the top of luminous component 7, and other formation is identical with above-mentioned the 2nd execution mode, on same parts, use jack per line, omitted its explanation here.
In addition, Fig. 7 represents the thin slice of band plate spring of the present invention and has used the 5th embodiment of switching device of the present invention of the thin slice of this band plate spring, the thin slice S5 of the band plate spring of the 5th embodiment and switching device SW5, when only forming heat insulating lamella 1 by the stickup thin slice 2 that constitutes by light transmissive material, the 1st transmittance section 2d is that the light transmissive material of through hole forms by stopping up the 2nd transmittance section 3d, and, be located at the luminous component 7 that is disposing following (another side) that be installed in circuit substrate 8 in the hole 8a on the circuit substrate 8.
And, topical application adhesive (not shown) is set as dome-shaped or ribbon below pasting thin slice 2, it is stacked and stick on the circuit substrate 8 to paste thin slice 2, do not exist the position of adhesive to become the ventilating part of resettlement section 2b, and, by the 1st transmittance section 2d plugging hole 8a that constitutes by light transmissive material, cover the top of luminous component 7, other formation is identical with above-mentioned the 2nd execution mode, uses jack per line on same parts, has omitted its explanation here.
In addition, Fig. 8 represents the thin slice of band plate spring of the present invention and has used the 6th embodiment of switching device of the present invention of the thin slice of this band plate spring, the thin slice S6 of the band plate spring of the 6th embodiment and switching device SW6, when only forming heat insulating lamella 1 by pad 3, form conducting film 5 with the form of stopping up recess 3b, the conducting film 5 that is positioned at this recess 3b is pasted leaf spring 4 by adhesive (not shown).
And, pad 3 is stacked and stick on the circuit substrate 8, become the state that irradiation parts 10 are positioned at the top of the conducting film 5 on the leaf spring 4, other formation is identical with above-mentioned the 1st execution mode, uses jack per line on same parts, has omitted its explanation here.
It should be noted that wherein under the situation of the 6th embodiment, the fixed contact 6a that leaf spring 4 contacts all the time preferably is the state of ground connection, in addition, also can: pad 3 is formed by light transmissive material, and the 1st transmittance section 3d covers the top of luminous component 7 with light transmissive material.
Claims (19)
1. the thin slice of a band plate spring is characterized in that:
Possess and be used to form by the leaf spring of pushing deformable travelling contact and the heat insulating lamella of accommodating this leaf spring, on a face of above-mentioned heat insulating lamella, be provided with conducting film, on above-mentioned heat insulating lamella, be provided with in the 1st transmittance section that sees through from the light of luminous component, on above-mentioned conducting film, be provided with see through from the light of above-mentioned luminous component and relative with above-mentioned the 1st transmittance section to the 2nd transmittance section, above-mentioned leaf spring is secured on above-mentioned heat insulating lamella or the above-mentioned conducting film.
2. the thin slice of band plate spring as claimed in claim 1 is characterized in that: above-mentioned conducting film forms by electric conducting material being printed on the above-mentioned heat insulating lamella or conductive foil being bonded on the above-mentioned heat insulating lamella.
3. the thin slice of band plate spring as claimed in claim 1 or 2 is characterized in that: the outer peripheral edges of above-mentioned conducting film form forr a short time than the outer peripheral edges of above-mentioned heat insulating lamella.
4. the thin slice of band plate spring as claimed in claim 1 is characterized in that: above-mentioned the 1st, the 2nd transmittance section is formed by through hole respectively, and the above-mentioned through hole that forms above-mentioned the 1st transmittance section is littler than the above-mentioned through hole that forms above-mentioned the 2nd transmittance section.
5. the thin slice of band plate spring as claimed in claim 1, it is characterized in that: above-mentioned the 2nd transmittance section is formed by through hole, above-mentioned heat insulating lamella is formed by light transmissive material, simultaneously, above-mentioned the 1st transmittance section with as the above-mentioned through hole subtend of above-mentioned the 2nd transmittance section, and, form by the above-mentioned light transmissive material that stops up above-mentioned through hole.
6. as the thin slice of claim 4 or 5 described band plate springs, it is characterized in that: above-mentioned heat insulating lamella is formed by the stickup thin slice that is used to paste above-mentioned leaf spring, on this stickup thin slice, be provided with and cover the paste section of pasting above the above-mentioned leaf spring, on above-mentioned paste section, be provided with above-mentioned conducting film.
7. as the thin slice of claim 4 or 5 described band plate springs, it is characterized in that: above-mentioned heat insulating lamella is formed by the stickup thin slice that is used to paste above-mentioned leaf spring, on this stickup thin slice, be provided with and cover the paste section of pasting above the above-mentioned leaf spring, above-mentioned conducting film is not set on above-mentioned paste section.
8. the thin slice of band plate spring as claimed in claim 6 is characterized in that: above-mentioned heat insulating lamella is formed by above-mentioned stickup thin slice and the pad that is secured at the another side side of this stickup thin slice.
9. the thin slice of band plate spring as claimed in claim 7 is characterized in that: above-mentioned heat insulating lamella is formed by above-mentioned stickup thin slice and the pad that is secured at the another side side of this stickup thin slice.
10. as the thin slice of claim 4 or 5 described band plate springs, it is characterized in that: above-mentioned heat insulating lamella is formed by the pad with the recess that can accommodate above-mentioned leaf spring, is pasted with above-mentioned leaf spring on the above-mentioned conducting film that stops up above-mentioned recess formation.
11. a switching device is characterized in that:
The thin slice that possesses the described band plate spring of claim 1, be provided with the circuit substrate of fixed contact, with the above-mentioned luminous component that is installed on this circuit substrate, in above-mentioned the 1st transmittance section relative with above-mentioned luminous component to, and the above-mentioned leaf spring that becomes above-mentioned travelling contact relative with the said fixing contact to state under, above-mentioned heat insulating lamella is layered in the one side side of foregoing circuit substrate, simultaneously, become the state that above-mentioned conducting film is grounded, carry out the switching of contact by the push action of above-mentioned leaf spring, and above-mentioned luminous component is via the above-mentioned the 1st, the 2nd light transparent member is come irradiation parts irradiation.
12. switching device as claimed in claim 11, it is characterized in that: when above-mentioned irradiation parts are formed by the pressing component of pushing above-mentioned leaf spring, with the configuration of above-mentioned conducting film subtend, this switching device also has panel that above-mentioned pressing component is installed and contacts the ground strip that is used for ground connection with above-mentioned conducting film.
13. switching device as claimed in claim 11, it is characterized in that: above-mentioned the 1st, the 2nd transmittance section is formed by through hole respectively, the above-mentioned through hole that forms above-mentioned the 1st transmittance section is littler than the above-mentioned through hole that forms above-mentioned the 2nd transmittance section, simultaneously, above-mentioned luminous component is installed in the above-mentioned one side side of foregoing circuit substrate or is installed in the another side side of foregoing circuit substrate with the state that is positioned at hole set on the foregoing circuit substrate.
14. switching device as claimed in claim 11, it is characterized in that: above-mentioned the 2nd transmittance section is formed by through hole, above-mentioned heat insulating lamella is formed by light transmissive material, simultaneously, above-mentioned the 1st transmittance section with as the above-mentioned through hole subtend of above-mentioned the 2nd transmittance section, and, formed by the above-mentioned light transmissive material that stops up above-mentioned through hole, above-mentioned luminous component is installed in the above-mentioned one side side of foregoing circuit substrate or is installed in the another side side of foregoing circuit substrate with the state that is positioned at hole set on the foregoing circuit substrate.
15. as claim 13 or 14 described switching devices, it is characterized in that: above-mentioned heat insulating lamella is formed by the stickup thin slice that is used to paste above-mentioned leaf spring, on this stickup thin slice, be provided with and cover the paste section of pasting above the above-mentioned leaf spring, on above-mentioned paste section, be provided with above-mentioned conducting film, simultaneously, above-mentioned stickup thin slice is laminated in the above-mentioned one side side of foregoing circuit substrate.
16. as claim 13 or 14 described switching devices, it is characterized in that: above-mentioned heat insulating lamella is formed by the stickup thin slice that is used to paste above-mentioned leaf spring, on this stickup thin slice, be provided with and cover the paste section of pasting above the above-mentioned leaf spring, above-mentioned conducting film is not set on above-mentioned paste section, simultaneously, above-mentioned stickup thin slice is laminated in the above-mentioned one side side of foregoing circuit substrate.
17. switching device as claimed in claim 15 is characterized in that: above-mentioned heat insulating lamella is formed by above-mentioned stickup thin slice and the pad that sticks on the another side side of this stickup thin slice, and above-mentioned pad is laminated in the above-mentioned one side side of foregoing circuit substrate.
18. switching device as claimed in claim 16 is characterized in that: above-mentioned heat insulating lamella is formed by above-mentioned stickup thin slice and the pad that is secured at the another side side of this stickup thin slice, and above-mentioned pad is laminated in the above-mentioned one side side of foregoing circuit substrate.
19. as claim 13 or 14 described switching devices, it is characterized in that: above-mentioned heat insulating lamella is formed by the pad with the recess that can accommodate above-mentioned leaf spring, be pasted with above-mentioned leaf spring on the above-mentioned conducting film that stops up above-mentioned recess formation, above-mentioned pad is laminated in the above-mentioned one side side of foregoing circuit substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004172765 | 2004-06-10 | ||
| JP2004172765A JP2005353412A (en) | 2004-06-10 | 2004-06-10 | Sheet with plate spring, and switch device using it |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1707714A true CN1707714A (en) | 2005-12-14 |
| CN100407350C CN100407350C (en) | 2008-07-30 |
Family
ID=35581515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200510075802XA Expired - Fee Related CN100407350C (en) | 2004-06-10 | 2005-06-07 | Thin sheet with laminated spring and switch device using the same |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2005353412A (en) |
| KR (1) | KR100838544B1 (en) |
| CN (1) | CN100407350C (en) |
| TW (1) | TWI291188B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101150020B (en) * | 2006-08-03 | 2012-12-19 | 西铁城电子股份有限公司 | Light emitting sheet module |
| CN101409168B (en) * | 2007-07-13 | 2013-05-01 | 西铁城电子股份有限公司 | Sheet switch module |
| CN101440936B (en) * | 2007-11-22 | 2013-07-17 | 松下电器产业株式会社 | Light guide sheet, movable contact structure using the light guide sheet, method of manufacturing the movable contact structure, and switch using the light guide sheet and the movable contact structur |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007242274A (en) | 2006-03-06 | 2007-09-20 | Alps Electric Co Ltd | Contact sheet with illumination function, and input device using this |
| JP5193463B2 (en) * | 2006-12-26 | 2013-05-08 | 株式会社フジクラ | Switch module |
| JP2008166172A (en) * | 2006-12-28 | 2008-07-17 | Alps Electric Co Ltd | Push-button switch, and sheet with reverse spring for push-button switch fabrication |
| JP5060922B2 (en) * | 2007-11-19 | 2012-10-31 | アルプス電気株式会社 | Seat with movable contact and switch device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0703591A1 (en) * | 1994-09-21 | 1996-03-27 | Hewlett-Packard Company | Input/output device with a lamp and a switch having protection against electrostatic discharge and contamination |
| US5557079A (en) * | 1995-07-03 | 1996-09-17 | Motorola, Inc. | Electronic device with shielded keypad interface |
| JP3988203B2 (en) * | 1996-10-22 | 2007-10-10 | 松下電器産業株式会社 | Movable contact for panel switch |
| SE513069C2 (en) * | 1997-03-03 | 2000-07-03 | Ericsson Telefon Ab L M | Protection against electrostatic discharge in a portable communication device |
| WO1999007198A1 (en) * | 1997-07-31 | 1999-02-11 | Toyotomi Co., Ltd. | Console panel for equipment |
| DE10034771A1 (en) * | 2000-07-18 | 2002-01-31 | Mannesmann Vdo Ag | Switching device for an electrical device |
| KR200325934Y1 (en) * | 2003-06-11 | 2003-09-06 | 한국성전(주) | El dome tape key pad |
-
2004
- 2004-06-10 JP JP2004172765A patent/JP2005353412A/en not_active Withdrawn
-
2005
- 2005-05-20 TW TW094116395A patent/TWI291188B/en not_active IP Right Cessation
- 2005-06-03 KR KR1020050047567A patent/KR100838544B1/en not_active IP Right Cessation
- 2005-06-07 CN CN200510075802XA patent/CN100407350C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101150020B (en) * | 2006-08-03 | 2012-12-19 | 西铁城电子股份有限公司 | Light emitting sheet module |
| CN101409168B (en) * | 2007-07-13 | 2013-05-01 | 西铁城电子股份有限公司 | Sheet switch module |
| CN101440936B (en) * | 2007-11-22 | 2013-07-17 | 松下电器产业株式会社 | Light guide sheet, movable contact structure using the light guide sheet, method of manufacturing the movable contact structure, and switch using the light guide sheet and the movable contact structur |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100838544B1 (en) | 2008-06-17 |
| TWI291188B (en) | 2007-12-11 |
| JP2005353412A (en) | 2005-12-22 |
| TW200618012A (en) | 2006-06-01 |
| CN100407350C (en) | 2008-07-30 |
| KR20060049558A (en) | 2006-05-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1707714A (en) | Thin sheet with laminated spring and switch device using the same | |
| CN1235249C (en) | Illumination type keyboard switch | |
| CN1902989A (en) | Printable electromechanical input means and an electronic device including such input means | |
| CN1138459C (en) | Electroluminescent lighting element, manufacturing method of the same, and illuminated switch unit using the same | |
| CN1259809C (en) | Thin circuit board and method for mfg. same | |
| CN1881499A (en) | Sheet with ratchet spring, and its production method and switch | |
| CN1822642A (en) | Camera module | |
| CN101069291A (en) | Transparent light emitting apparatus and manufacturing method thereof | |
| CN1815650A (en) | Movable contact element and panel switch using the same | |
| CN1515013A (en) | Metal dome sheet, its mfg. method, and metal dome system | |
| CN1222968C (en) | Sheet with leaf spring and switch device with said sheet with leaf spring | |
| CN101080758A (en) | Transparent electric label plate and the chip led therefor | |
| CN1366689A (en) | EL sheet and switch comprising the same | |
| CN1525509A (en) | Keyboard switch mechanism | |
| CN101064223A (en) | Button switch and contact-point sping leaf | |
| CN1129154C (en) | Console panel for equipment | |
| CN1420511A (en) | Moving contact, panel switch using same and electronic apparatus provided with said panel switch | |
| CN1596042A (en) | Light emitting electronic component | |
| CN1166724A (en) | Ladder-type filter | |
| CN111653212A (en) | Micro light-emitting diode display panel, manufacturing method thereof and display device | |
| CN1263057C (en) | Lighting parts and lighting apparatus using said lighting parts | |
| US20100039031A1 (en) | Electroluminescent Lamp | |
| CN1206680C (en) | Base plate with joint and switch unit with the plate | |
| CN100490598C (en) | Dispersion-type EL device and illuminated switch unit using the same | |
| CN1893745A (en) | Movable contact and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080730 Termination date: 20110607 |