CN1706229A - Method and device for coating printed boards with solder stop lacquers and galvanoresists that can be laser-structured and thermally hardened - Google Patents
Method and device for coating printed boards with solder stop lacquers and galvanoresists that can be laser-structured and thermally hardened Download PDFInfo
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- CN1706229A CN1706229A CN 200380101360 CN200380101360A CN1706229A CN 1706229 A CN1706229 A CN 1706229A CN 200380101360 CN200380101360 CN 200380101360 CN 200380101360 A CN200380101360 A CN 200380101360A CN 1706229 A CN1706229 A CN 1706229A
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- Prior art keywords
- solder stop
- roll
- printed circuit
- circuit board
- stop lacquers
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- 239000004922 lacquer Substances 0.000 title claims abstract description 116
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 62
- 239000011248 coating agent Substances 0.000 title claims abstract description 59
- 238000000576 coating method Methods 0.000 title claims abstract description 59
- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000003973 paint Substances 0.000 claims description 14
- 239000000843 powder Substances 0.000 claims description 11
- 238000009998 heat setting Methods 0.000 claims description 8
- 229910052736 halogen Inorganic materials 0.000 claims description 4
- 150000002367 halogens Chemical class 0.000 claims description 4
- 238000009835 boiling Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 238000003847 radiation curing Methods 0.000 claims description 2
- 230000007935 neutral effect Effects 0.000 claims 1
- 239000002985 plastic film Substances 0.000 claims 1
- 229920006255 plastic film Polymers 0.000 claims 1
- 238000001035 drying Methods 0.000 abstract description 6
- 238000003860 storage Methods 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 description 34
- 229920001971 elastomer Polymers 0.000 description 8
- 238000005476 soldering Methods 0.000 description 7
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 6
- 239000012764 mineral filler Substances 0.000 description 6
- 235000002918 Fraxinus excelsior Nutrition 0.000 description 5
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical compound ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 5
- 239000002956 ash Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 description 3
- 239000001569 carbon dioxide Substances 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- 235000001674 Agaricus brunnescens Nutrition 0.000 description 2
- 206010034960 Photophobia Diseases 0.000 description 2
- 208000034189 Sclerosis Diseases 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- 208000013469 light sensitivity Diseases 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
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- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- 239000002699 waste material Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Disclosed are a method and a device for coating printed boards (1) with solder stop lacquers and galvanoresists that can be laser-structured and thermally hardened. The device used for carrying out said method comprises at least one roller-type coating plant (2) with an application roller (4), a dosing roller (5) that embodies a dosing gap along with the application roller (4), a storage container (6) for the solder stop lacquer or galvanoresist, which is disposed above the roller-type coating plant (2), means for conveying the printed boards (7), means for drying the solder stop lacquer (11), and an apparatus (13) for turning the coated printed boards. Said roller-type coating plant (2) is provided with only one coating unit for coating the bottom side of the printed boards.
Description
Technical field
The present invention relates to a kind of method and a kind of device that utilizes available laser formation solder stop lacquers structure, thermal curable/sclerosis and non-conductive thing (Galvanoresist) that printed circuit board (PCB) is applied.
Background technology
Utilize solder stop lacquers particularly the light sensitivity solder stop lacquers printed circuit board (PCB) is applied, with the protection conductor, and only expose the hole of wanting soldering and the welded disc (Lotpad) that is used for solder system.Before 1975, silk screen printing is just enough, from that time, just begins to adopt the light sensitivity solder stop lacquers.In the circuit that becomes increasingly complex, desired precision can only guarantee by using up the structurized technology of formation.For example at the described lacquer of one-sided coating in curtain (Vorhang) casting method.This is described in European patent application EP 0002040A1.
This paint-on technique causes some problems.Particularly to having width and highly being the covering at edge of the high thin conductor of 10 μ m.The lacquer that viscosity with 500 to 1200mPas applies particularly when drying since the viscosity that causes thus reduce under the marginal flow of conductor.This problem solves by solvent that uses easy volatilization and the high thixotropic of being realized by the interpolation filler.In a chain bucket elevator formula stove, the printed circuit board (PCB) through coating is carried out aeration-drying at first at low temperatures.At this moment, the lacquer on the conductor is dried.Then, the circulating air by heat carries out actual drying.
The coating problem of high conductor solves by spraying especially.But, the common ground of all coating process is also the hole to be applied simultaneously.The lacquer that flows into place, described hole is being used up formation structure (Fotostrukturierung) back molten going in developing bath.This and the welded disc of freely developing cause very high waste water burden together.Particularly because alkaline development technology has reduced the quality of lacquer, this be because, the carboxyl that this technology then must use makes the moisture compatibility degenerate accordingly.Use up and form the softened zone that the needed acrylates of structure can damage solder stop lacquers, this is unfavorable especially during soldering under high brazing temperature with lead-free solder.
The microminiaturization that further develops has proposed new problem to the solder stop lacquers of this generation.Unreliability when wherein developing has disadvantageous effect especially.All these problems all can solve by the solder stop lacquers that adopts a kind of section to utilize laser to form structure.Thus, only to the remaining annulus in welded disc and hole with laser (CO for example
2Laser, Ultra-Violet Laser) carries out paint removal.No longer need developing process.Thus, also no longer produce polymer waste.Laser can very accurately be located.Problem as the film skew can not occur.The application of the heat-setting solder stop lacquers of non-photosensitivity at present fail be because, do not have available guaranteed hole not have the applying method that coats with lacquer.
In EP0766908, the two-sided method of roll coating of having described a kind of coating material that is used for photopolymerization wherein, can be heated to doctor roll 25 to 60 ℃, and applicator roll is cooled to 5 to 20 ℃ to make multi-chip module.The heating of lacquer causes not being transferred to enamelled coating volatilization on the rubber surface of applicator roll and dry.Cooling causes coagulative deposition.Resulting conductor edge covering part is 13 μ m when the thickness of paint layer of the conductor height of 50 μ m and 5 μ m.The hole is not have lacquer.Coating viscosity is up to 20000 to 100000mPas, so that has only with format roll and could work when coating layer thickness is 50 to 200 μ m.For the coating of tape welding material stop lacquers, 5 to 20m/min coating speed is too high, and this is because can not obtain good edges cover portion.
This high coating speed also is called " method and apparatus that is used for applying at a high speed wooden/frosting and metal surface " in name DE10131027A1 is described.Herein, the powder paints of preferably from a powder paints holder, carrying radiation-hardenable by a fusion roller.Utilize simple hot curing lacquer this be to realize because curing reaction and aggegation/agglomeration can occur like this.In order to apply the bottom side, the fusion roller immersed in the powder paints container and do not carry out quantitative Treatment.This can cause the curing of storage container under the situation of heat-setting lacquer.
To the method described in patent documentation EP069823B1, above-mentioned situation is suitable equally, and this method has been described the coating by the coating agent of the radiation-hardenable of bath component.There is not a kind of known method to realize according to purpose of the present invention.They only relate to the lacquer system of radiation-hardenable.Printed circuit board (PCB) transports needed nothing lacquer edge and can not realize equally.The solder stop lacquers of selling on the market contains the mineral filler to improve viscosity, especially in order to prevent that lacquer from flowing down from the conductor side.Usually in solder stop lacquers, comprise percentage by weight and be 20% to 50% described mineral filler.If make the solder stop lacquers of selling on the described market form structure with laser, then on welded disc, just leave the mushroom ashes residue of formation.This has just hindered flawless soldering, in addition, also makes the cleaning difficulty.
Utilize current applying method can not guarantee that the hole do not have lacquer.
Summary of the invention
The objective of the invention is, solve the foregoing problems that occurs when prior art is punched in the application to printed circuit board.Purpose of the present invention particularly, a kind of preferred heat-setting solder stop lacquers and non-conductive layer are provided, and a kind of method and apparatus, they make and can realize that no residue ground forms structure by laser, and wherein when conductor is narrow and high, guarantee good edges cover portion with thin thickness of paint layer, guarantee lacquer surface flawless, sealing, and guarantee that simultaneously hole and printed circuit board edge do not have lacquer.
Content of the present invention is one to be used for solder stop lacquers or non-conductive thing printed circuit board (PCB) being carried out coated apparatus, it comprises at least one roll-type coating unit, this device has a rubbery/the be surrounded by last guide roller of rubber, the following applicator roll of one rubbery, one forms the doctor roll in a certain amount of gap with described applicator roll, a reservoir vessel that is used for solder stop lacquers or non-conductive thing that is arranged in described roll-type coating unit top, be used to transport the device of printed circuit board (PCB), the device and one that is used for the dried solder stop lacquers be used to the overturn device of the printed circuit board (PCB) that applied, wherein said roll-type plater only has a coating unit that is used for the downside of application to printed circuit board.
Preferred form of implementation according to device of the present invention is the content of claim 2 to 6.
The invention still further relates to a kind of method that is used for solder stop lacquers or non-conductive thing application to printed circuit board in addition, it comprises the following steps:
(i) printed circuit board (PCB) is delivered to a roll-type coating unit, wherein said roller coating device only has a coating unit that is used for the coated substrates downside,
(ii) weight feed has solder stop lacquers or the non-conductive thing or the powder paints of 4000 to 15000mPas viscosity in the time of 25 ℃,
(iii) on the downside of printed circuit board (PCB), apply described lacquer,
(iv) one be enough to will lacquer viscosity be reduced to below the 300mPas or the viscosity of powder paints be reduced under the temperature below the 500mPas and the printed circuit board (PCB) of time period inner drying through applying, described lacquer is solidified and inviscid, and
(printed circuit board (PCB) and carry out step (i) to (iv) on same or another roll-type coating unit v) overturns.
Preferred form of implementation according to method of the present invention is the content of claim 8 to 10.
At last, the present invention relates to a kind of solder stop lacquers and non-conductive thing that can form structure by laser, it is characterized by, it has a percentage by weight is that 50% to 100% solid constituent and is 5000 to 15000mPas viscosity in the time of 25 ℃.
The preferred form of implementation of solder stop lacquers or non-conductive thing is the content of claim 11 to 17.
Description of drawings
Fig. 1 schematically illustrates according to device of the present invention.
Fig. 2 illustrates another form of implementation according to device of the present invention that is used to use powder paints.
Fig. 3 schematically illustrates the printed circuit board (PCB) that applies according to the known method of prior art.
Fig. 4 illustrates and uses the printed circuit board (PCB) that applies according to method of the present invention.
What represent among the figure is:
(1) printed circuit board (PCB); (2) roll-type coating unit; (3) guide roller of rubbery; (4) applicator roll of rubbery; (5) doctor roll; (6) reservoir vessel; (7) be used to transport the device of printed circuit board (PCB); (8) scraper; (9) doctor roll; (10) copper conductor; (11) be used for the device of dried solder stop lacquers; (12) screened hour (Siebkasten); (13) turner; (14) conductor edge covering part
Embodiment
Below the present invention will be described in more detail: the coating of lacquer can be carried out as the method for well known to a person skilled in the art according to this, as long as this moment, used plater had only a coated elements that is used for the coated substrate downside.
When the device that adopts according to claim 1, the printed circuit board (PCB) 1 that solder stop lacquers and both sides all can be provided with conductor and (for example being used to admit the member of wiring) hole flows to for example one first roll-type coating unit 2 together, described lacquer has be preferably 5000 to 15000mPas viscosity and one 50% to 100% solids content in the time of 25 ℃, and can hot curing, also can radiation curing, simultaneously preferably do not contain or only contain a spot of mineral filler, described roll-type coating unit comprises the last guide roller 3 of a rubbery, the following applicator roll 4 of one rubbery and one and applicator roll form the doctor roll 15 in a certain amount of gap, can arrange between applicator roll and doctor roll that in case of necessity one is used for the wedge shape scraper 8 to the paint removal of printed circuit edge.Between doctor roll 5 and applicator roll 4 from one be arranged on the roll-type coating unit above reservoir vessel 6 the full-bodied solder stop lacquers of rationing.Now, the rubber surface of soft (Durometer A hardness is 20 to 40) has the solder stop lacquers that is preferably 5000 to 15000mPas viscosity and preferably is coated on the downside of printed circuit board (PCB) 1 with a bed thickness that is preferably 10 to 70 μ m with one 1 to 4m/min speed described by smooth (Rz=5 to 10 μ m).
When carrying out described full-bodied coating, because the high-adhesiveness of lacquer on rubber, only some enamelled coating that is positioned on the applicator roll can shift.The prerequisite of the transfer of lacquer is to stick on the printed circuit board surface to be coated.Because described adhesiveness is maximum on copper conductor 10, so also can apply the thickest enamelled coating here.The hole can not form adhesive surface, thereby lacquer here can not shift yet.In the roll-type painting method that uses so far, the rubber parts by with groove applies lacquer like this, so that lacquer is forced out from groove, this moment, lacquer also was pressed in the hole.In according to method of the present invention, apply with the characteristic on surface to be coated and irrespectively carry out.Thus, the solder stop lacquers of Tu Fuing covers conductor well like this, and makes hole and printed circuit board edge keep not having lacquer, thereby has guaranteed the good soldering and the transportation of printed circuit board (PCB) in drier of wired member.By rubber being set,, can avoid rubber surface owing to the incision of high conductor damages in conjunction with high coating viscosity according to the present invention.
After described coating, device 7 by being used for transporting printed circuit board (PCB) for example one have the chain conveyor of carrying folder with printed circuit board (PCB) 1 be transported to a drier one for example an infrared dryer-, described drier only is provided with below transportation route and is used for dry device, and for example infrared radiator 11.Described infrared radiator is provided with the medium wave radiator that wavelength is 2 to 4 μ m.Up to now, in the volatilization route that in chain bucket elevator formula stove, adopts usually, lacquer is carried out drying and do not reduce viscosity, thereby described lacquer can not flow down from conductor edge owing to viscosity reduces, and in contrast, pursues reverse effect in according to method of the present invention.Lacquer should be as quickly as possible be reduced to from 5000 to 15000mPas on its viscosity and be lower than 500mPas.Thus, be originally that undulatory lacquer surface becomes smooth, and lacquer flows on the conductor side.There is not mineral filler to help this flow process.The temperature of lacquer should become 100 to 120 ℃ in 10 to 60 seconds.Because used dried and associated viscosity increase can be avoided drippage.Hole and edge keep not having lacquer.So after this dried that is adopted causes the curing of coating with lacquer.After the no adhesiveness that becomes by dry and sclerosis, upset printed circuit board (PCB) 1 in a turner 13, and it is carried out applying or delivering in the second identical roll-type coating unit of a structure second time in same device.As shown in Figure 3, conductor 10 has the edges cover portion of one 5 to 10 μ m usually when thickness of paint layer is 30 μ m.As shown in Figure 4, in according to method of the present invention, obtain a conductor edge covering part 14 greater than 10 μ m.
According to the present invention, this can accomplish thus, and promptly to contain a kind of its amount be 5 to 20% the composition greater than the high boiling solvent of 120 ℃ boiling point of having to lacquer by weight percentage, and do not add mineral filler.In powder shape solder stop lacquers, this by viscosity is reduced to be lower than 2000mPas, preferably be lower than 1000mPas, most preferably be lower than 500mPas and realize.Do not have mineral filler also to make and to utilize laser formation structure and on the copper surface, not form mushroom ashes residue.
According to another form of implementation, the device that is used to implement according to method of the present invention has another doctor roll 9.Between doctor roll 5 and 9, the full-bodied solder stop lacquers of rationing from the reservoir vessel 6 of the top that is arranged in roll-type coating unit 2.When adopting heat-setting powder shape solder stop lacquers, described lacquer is coated on the doctor roll 5 that rotates on the contrary with applicator roll 4 by a screened hour 12.Described doctor roll accepts to be retained in the lacquer on the applicator roll 4, the pulverous solder stop lacquers of spreading on applicator roll then.In this way, can avoid initial solidification and make available roller apply heat-setting Powdered solder stop lacquers.After carrying out the adjusting of coating layer thickness by doctor roll 5 and 9, can stick on the film that thickness on the fixing doctor roll 9 is about about 30 to 150 μ m by one and realize making the edge not have lacquer, saved coated area thus.After, the doctor roll 5 that utilizes reverse rotation is transferred to described lacquer on the rubber surface of smooth (Rz=5 to the 10 μ m) of applicator roll 4 and soft (Durometer A hardness is 20 to 40), and be preferably 5000 to 15000mPas viscosity, speed by 1 to 4m/min is coated on the downside of printed circuit board (PCB) 1 with the coating layer thickness of 20 to 70 μ m.When applying with heat-setting Powdered solder stop lacquers, all rollers and want the printed circuit board (PCB) of coating all to be heated to a temperature that can reach desired coating viscosity.
Illustrate in greater detail the present invention by the following examples now.
Example 1
Printed circuit board (PCB): 300 * 420 * 1.5mm is according to the NEMA FR4 type of (national electronics is united manufacturing association), the maximum 100 μ m of conductor height, conductor width 150 μ m.
Solder stop lacquers: the gamma-butyrolacton of the Probimer 65 Fa.Vantico AG+5 weight portions of 100 weight portions.
Roll-type coating unit: RC Fa.B ü rkle, rubbery: 100mm, Durometer A hardness 30, Rz 5 μ m;
Roll-gap width: 100 μ m;
The wet coating: 50 μ m.
Speed: 2m/min;
Infrared radiator: the first radiator wavelength, 2 μ m, the second radiator wavelength, 4 μ m;
Circulating air temperature: 120 ℃;
Drier length: 4m.
The result:
Dry film thickness: 30 μ m;
When the conductor height of 100 μ m, edges cover portion: 11 μ m;
Diameter 300 to the 1000 μ m in hole: do not have lacquer.
Example 2
Printed circuit board (PCB) (2): 300 * 420 * 1.5mm, according to FR 4 types of NEMA, conductor height maximum 100 μ m, conductor width 150 μ m;
Solder stop lacquers (1): the percentage by weight with 80% of 125 weight portions is included in the R ü tapox VE3746 in the glycol monomethyl ether, Fa.Bakelite AG; 0.5 the 2-ethyl-4-methylimidazole Fa.BASF of weight portion.
Viscosity: in the time of 25 ℃, be 9500mPas;
In the time of 160 ℃, solidify TG:155 ℃ after a hour.
Roll-type coating unit: RC Fa.B ü rtle, rubbery: 100mm;
Hardness: Shore A 30, Rz 5 μ m;
Roll-gap width: 100 μ m;
The wet coating: 50 μ m.
Speed: 2m/min.Infrared radiator: the first radiator wavelength, 2 μ m, the second radiator wavelength, 4 μ m.
Circulating air temperature: 120 ℃;
Drier length: 4m;
160 ℃ solidified 1 hour down.
Coating result:
Dry film thickness: 30 μ m;
When the conductor height of 100 μ m, edges cover portion: 11 μ m;
Diameter 300 to the 1000 μ m in hole: do not have lacquer.
Utilize laser to form the result of structure:
Carbon dioxide laser: welded disc does not have the ashes residue;
The soldering result:
Hole and welded disc zero defect ground are moistening with scolder.
Example 3
Printed circuit board (PCB): 300 * 420 * 1.5mm.According to the FR4 type of NEMA, the maximum 100 μ m of conductor height, conductor width 10 μ m.
Solder stop lacquers: the EPOSID VP868-2 of 80.0 weight portions, by weight 70%, Duroplast-Chemie;
19.5 HAT 9490 Kresolnovolak of weight portion, percentage by weight 100%, Fa.Vantico;
0.5 the 2-ethyl-4-methylimidazole Fa.BASF of weight portion;
Add up to 100 parts by weight, by weight 75%.
Viscosity: in the time of 25 ℃, be 7500mPas; In the time of 160 ℃, solidify TG:150 ℃ after 1 hour.
Roll-type coating unit: RC Fa.Robert B ü rkle GmbH Freudenstadt;
Rubbery: 100mm;
Hardness: Shore A 30, Rz 5 μ m;
Roll-gap width: 120 μ m;
The wet coating: 50 μ m;
Shift: percent by volume 42%.
Speed: 2m/min;
Infrared radiator: the first radiator wavelength, 2 μ m, the second radiator wavelength, 4 μ m;
Circulating air temperature: 120 ℃;
Drier length: 4m.
The result:
Dry film thickness: 30 μ m;
Edges cover portion during the conductor height of 100 μ m: 11 μ m;
Diameter 300 to the 1000 μ m in hole: do not have lacquer;
Printed circuit board edge: 5mm does not have lacquer.
Utilize laser to form the result of structure:
Carbon dioxide laser: welded disc does not have the ashes residue;
Burning gases: halogen.
The soldering result:
Hole and welded disc zero defect ground are moistening with scolder.
Example 4
Printed circuit board (PCB): 300 * 420 * 1.5mm, according to FR 4 types of NEMA, the maximum 100 μ m of conductor height, conductor width 100 μ m.
Solder stop lacquers: the EPOSID VP 868-2 of 80.0 weight portions, percentage by weight 70%,
Durplast-Chemie；
19.5 HAT 9490 Kresolnovolak of weight portion, percentage by weight 100%, Fa.Vantico;
0.5 the 2-ethyl-4-methylimidazole Fa.BASE of weight portion.
Add up to 100 weight portions, by weight 75%.
Viscosity: in the time of 25 ° for 500mPas.
Roll-type coating unit: RC Fa.Robert B ü rkle GmbH Freudenstadt;
Rubbery thickness: 100mm;
Hardness: Shore A 30, Rz 5 μ m;
Roll-gap width between the doctor roll 5 and 9: 120 μ m;
The wet coating: 50 μ m;
Shift: percent by volume 42%;
Teflon film on the doctor roll 9, the opening of edge: 410mm on the right;
Speed: 2m/min;
Infrared radiator: the first radiator wavelength, 2 μ m, the second radiator wavelength, 4 μ m;
Circulating air temperature: 120 ℃;
Drier length: 4m.
Example 5
Printed circuit board (PCB): 300 * 420 * 1.5mm, according to the FR4 type of NEMA, the maximum 100 μ m of conductor height, conductor width 100 μ m;
The powder-type solder stop lacquers:
95.00 parts by weight of epoxy resin DER 671 Fa.Dow Chemical;
4.5 the dicyandiamide of weight portion;
0.5 the glyoxal ethyline Fa.BASF of weight portion;
The Powdered solder stop lacquers that adds up to 100 weight portions.
Fusion range: 65 to 78 ℃;
Viscosity: in the time of 110 ℃, be 1400mPas;
Granularity/particle size: 10 to 20 μ m;
In the time of 160 ℃, solidify TG:160 ℃ after 1 hour.
Roll-type coating unit: H RC Fa.Rokert B ü rkle GmbH Freudenstadt;
Rubbery: 10mm;
Hardness: Shore A 30, Rz 5 μ m;
The temperature of applicator roll 4 and doctor roll 5 and 9: 110 ℃;
The temperature of printed circuit board (PCB): 110 ℃;
Teflon film on the doctor roll 9, the opening of edge: 410mm on the right;
Roll-gap width between the doctor roll 5 and 9: 50 μ m;
Dry type applies: 30 μ m;
Shift: percent by volume 60%;
Speed: 3m/min;
Infrared radiator: the first radiator wavelength, 2 μ m, the second radiator wavelength, 4 μ m;
Circulating air temperature: 140 ℃;
Drier length: 4m.
The result:
First coating:
Dry film thickness: 30 μ m;
Edges cover portion when the conductor height of 100 μ m: 11 μ m;
Diameter 300 to the 1000 μ m in hole: do not have lacquer;
Printed circuit board edge: 5mm does not have lacquer.
The result:
Second coating:
Dry film thickness: 30 μ m;
Edges cover portion when the conductor height of 100 μ m: 12 μ m;
Diameter 300 to the 1000 μ m in hole: do not have lacquer;
Printed circuit board edge: 5mm does not have lacquer.
Utilize laser to form the result of structure:
Carbon dioxide laser: welded disc does not have the ashes residue;
Burning gases: halogen.
The soldering result:
Hole and welded disc zero defect ground are moistening with scolder.
Claims (18)
1. be used to utilize the device of a kind of solder stop lacquers or non-conductive thing application to printed circuit board (1), comprise at least one roll-type coating unit (2), this device has the last guide roller (3) of a rubbery, the following applicator roll (4) of one rubbery, one forms the doctor roll (5) in a certain amount of gap with described applicator roll (4), a reservoir vessel that is used for solder stop lacquers or non-conductive thing (6) that is arranged in roll-type coating unit (2) top, be used to transport the device (7) of printed circuit board (PCB), the device (11) and one that is used for the dried solder stop lacquers be used to the overturn device of the printed circuit board (PCB) that applied, wherein, described roll-type plater (2) only has a coating unit that is used for the downside of application to printed circuit board.
2. device as claimed in claim 1 is characterized by: it is the hardness of 20 to 40 Shore A and the roughness Rz of one 5 to 10 μ m that described applicator roll (4) has one.
3. device as claimed in claim 1 is characterized by: described device has a wedge shape scraper (8) between described applicator roll (4) and doctor roll (5).
4. device as claimed in claim 1, it is characterized by, described device has another doctor roll (9), and described doctor roll (9) forms a certain amount of gap with first doctor roll (5), has a reservoir vessel (6) or to be used for the screened hour (12) of powder paints above described quantitative gap.
5. as the device of claim 1 or 4, it is characterized by, described doctor roll (5,9) can heat.
6. as the device of claim 4 or 5, it is characterized by, the doctor roll that described doctor roll (9) is designed to fix wraps up described doctor roll in this wise with a plastic film, can expose the coating scope of requirement by the film of tearing.
7. be used for method, comprise the following steps: with solder stop lacquers or non-conductive thing application to printed circuit board (1)
(i) printed circuit board (PCB) (1) is delivered to a roll-type coating unit, wherein said roll-type plater only has a coating unit that is used for the coated substrates downside,
(ii) weight feed has solder stop lacquers or the non-conductive thing or the powder paints of 4000 to 15000mPas viscosity in the time of 25 ℃,
(iii) on the downside of printed circuit board (PCB) (1), apply described lacquer,
(iv) be enough to that viscosity with described lacquer is reduced to below the 300mPas or the viscosity of powder paints be reduced to dry printed circuit board (PCB) (1) under the time period neutral temperature below the 500mPas, lacquer is solidified and make its no adhesiveness through applying one, and
(printed circuit board (PCB) and carry out step (i) to (iv) on same or another roll-type coating unit v) overturns.
8. method as claimed in claim 7 is characterized by, and carries out step (iv) under 100 to 120 ℃ temperature in 10 seconds to 1 minute period.
9. method as claimed in claim 7 is characterized by, and 0.2 to 4m/s, be preferably 0.5 to 4m/s, most preferably be under 1 to 4m/s the roller speed, applies lacquer with the bed thickness of 10 to 100 μ m.
10. method as claimed in claim 7 is characterized by, and adopts according to the described lacquer of claim 11 to 16 or non-conductive thing as lacquer or non-conductive thing.
11. can form the solder stop lacquers and the non-conductive thing of structure by laser, it is characterized by, it is 50% to 100% solids content and one 5000 to 15000mPas viscosity that described solder stop lacquers and non-conductive thing have a percentage by weight.
12. solder stop lacquers and non-conductive thing as claim 11 is characterized by, described solder stop lacquers and non-conductive thing do not have filler basically.
13. solder stop lacquers and non-conductive thing as claim 11 or 12 is characterized by, described solder stop lacquers and non-conductive thing thermal curable or radiation curing.
14. solder stop lacquers and non-conductive thing as claim 11 to 13 is characterized by, described solder stop lacquers and non-conductive thing are not halogen-containing.
15. solder stop lacquers and non-conductive thing as claim 11 is characterized by, it is that 50% to 20% boiling point surpasses 120 ℃ solvent composition that described enamel-cover contains percentage by weight.
16. solder stop lacquers and non-conductive thing as claim 11 is characterized by, described solder stop lacquers and non-conductive thing comprise a kind of epoxy resin of halogen.
17. solder stop lacquers or non-conductive thing as claim 11 is characterized by, solder stop lacquers is a kind of heat-setting Powdered solder stop lacquers that has 10000 to 15000mPas viscosity under 80 to 120 ℃ temperature.
18. the printed circuit board (PCB) that obtains according to method according to claim 7 to 10.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10247861 | 2002-10-14 | ||
| DE10247861.9 | 2002-10-14 | ||
| DE10250485.7 | 2002-10-29 | ||
| DE10252897.7 | 2002-11-12 | ||
| DE10300344.4 | 2003-01-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1706229A true CN1706229A (en) | 2005-12-07 |
| CN100525586C CN100525586C (en) | 2009-08-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003801013600A Expired - Fee Related CN100525586C (en) | 2002-10-14 | 2003-10-14 | Method and device for coating printed boards with solder stop lacquers and galvanoresists that can be laser-structured and thermally hardened |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100525586C (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102280218A (en) * | 2011-05-19 | 2011-12-14 | 江苏句容联合铜材有限公司 | Single side paint technology equipment of enameled lead |
| CN104169454A (en) * | 2012-03-15 | 2014-11-26 | 罗伯特·博世有限公司 | Powder-coating apparatus and powder-coating method |
| CN106098274A (en) * | 2016-06-20 | 2016-11-09 | 河南省亚安绝缘材料厂有限公司 | A kind of Moistureproof insulation material and production method thereof |
| CN116967091A (en) * | 2023-08-10 | 2023-10-31 | 江苏中金玛泰医药包装有限公司 | Aluminum foil gradient coating device and working method thereof |
-
2003
- 2003-10-14 CN CNB2003801013600A patent/CN100525586C/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102280218A (en) * | 2011-05-19 | 2011-12-14 | 江苏句容联合铜材有限公司 | Single side paint technology equipment of enameled lead |
| CN102280218B (en) * | 2011-05-19 | 2012-10-03 | 江苏句容联合铜材有限公司 | Single side paint technology equipment of enameled lead |
| CN104169454A (en) * | 2012-03-15 | 2014-11-26 | 罗伯特·博世有限公司 | Powder-coating apparatus and powder-coating method |
| CN104169454B (en) * | 2012-03-15 | 2017-09-19 | 罗伯特·博世有限公司 | Powder coating equipment and powder coating methods |
| CN106098274A (en) * | 2016-06-20 | 2016-11-09 | 河南省亚安绝缘材料厂有限公司 | A kind of Moistureproof insulation material and production method thereof |
| CN116967091A (en) * | 2023-08-10 | 2023-10-31 | 江苏中金玛泰医药包装有限公司 | Aluminum foil gradient coating device and working method thereof |
| CN116967091B (en) * | 2023-08-10 | 2024-02-20 | 江苏中金玛泰医药包装有限公司 | Aluminum foil gradient coating device and working method thereof |
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| Publication number | Publication date |
|---|---|
| CN100525586C (en) | 2009-08-05 |
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