CN1704783A - Optical module, optical module substrate and optical coupling structure - Google Patents
Optical module, optical module substrate and optical coupling structure Download PDFInfo
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- CN1704783A CN1704783A CN 200510074217 CN200510074217A CN1704783A CN 1704783 A CN1704783 A CN 1704783A CN 200510074217 CN200510074217 CN 200510074217 CN 200510074217 A CN200510074217 A CN 200510074217A CN 1704783 A CN1704783 A CN 1704783A
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Abstract
There is provided an optical module for coupling with a fiber optic cable through an optical connector, including a module body connectable with a plug of the optical connector by a dedicated guide pin, with a side surface of the module body being opposed to a mating surface of the connector plug at which an end face of the fiber optic cable is exposed, and an optical element mounted to the module body and having an optical axis brought into alignment with an optical axis of the fiber optic cable upon fitting of the guide pin into the module body and the connector plug.
Description
Invention field
The present invention relates to a kind of have photoelectric converting function in case implement optical communication optical module.The invention still further relates to the substrate that is used for this optical module and optical coupling structure.
Background technology
Along with the development of recent information and communication technology (ICT) (comprising the Internet) and significantly improving of recent messaging device performance, constantly need transmission and receive large-capacity data for example graphical data or video data.In order freely to implement large-capacity data communication, it is desirable to wish that information network system has several bit rates or higher data signaling rate by information network system.Wish that optical communication technique is particularly useful for obtaining the high-speed data communication environment.Need between the terminal block of quickening messaging device and the short-range signal communication between the LSI chip of terminal block nor break.For those reasons, it is desirable changing into light transmission from traditional data communication that utilizes metallic cable and/or metal wire.
In light transmission, optical element (for example photocell and light receiving element) generally is used for light signal is changed into electric signal and electric signal is changed into light signal.In addition, optical waveguide (for example optical fiber) is used as data communication medium in light transmission.About photoelectric conversion module, also the application of promptly so-called " optical module " had many, wherein optical element be supported on the module substrate and optical element and optical cable between optical coupling structure on.
For example, publication number be the Jap.P. of NO.2003-207694 proposed a kind of on terminal block optical element and the optical coupling structure between the multifiber cable.The optical coupling structure that is proposed comprises flat-cable connector, flat package (as gang socket), jump ring and the pilot pin that is fixed on fiber optic cable one end, optical element and LSI chip one in described flat package.The cable connector storehouse is on the surface that encapsulates, and then, connector is tightened to vertical direction cooperation and the releasing cooperation of these links of permission along terminal block with encapsulation by means of jump ring and pilot pin.In case described encapsulation and cable connector cooperate, optical element just is coupled with optical fiber cables.
Also propose simultaneously the optics web member 903 of type shown in Figure 26 in the summary of the 86th page (bottom) of " about the 5th forum of electronics SI research " on February 26th, 2004, it is designed to cooperate between optical element 902 and multifiber cable 905 with so-called MT (but mechanical transmission) thereby connector especially provides optically-coupled.Being characterized as of the optics web member 903 that is proposed has right angle light path conversion photoconduction.Optical element 902 is installed on the terminal block 901 faceup via piece shape contact, and the MT connector has the plug 906 that is fixed on fiber optic cable 905 1 ends.Utilize bonding agent 904 to be linked on the optical surface of optical element below the optics web member 903.Optics web member 903 and plug 906 along with the end face of optics web member 903 near the end face of plug 906 and be set up.Then, thus optics web member 903 and plug 906 tighten together by means of jump ring 907 and allow these web members 903 and 906 along the horizontal cooperation of terminal block 901 with remove and cooperate.
Publication number is that the Jap.P. of NO.2002-170965 has proposed a kind of optical module, and it is installed on the printed circuit board (PCB) and has optical element on the silicon base of being supported on.Silicon base has two opposed major surfaces: one of them first type surface supporting optical element, another first type surface has positioning convex portion and the recess that engages with the positioning convex portion and the recess of printed circuit board (PCB), thereby allows optical element and optical waveguide (for example optical cable) optical axis alignment.
Though publication number is the Jap.P. of NO.2004-31743 is not directly to relate to a kind of optical module, has proposed a kind of electronic installation, wherein electronic component is installed on the ceramic bases.Ceramic bases has two multi-layered ceramic base members, and they combine and make the stack direction of the ceramic insulating layer in one of them base members hang down as for the stack direction of the ceramic insulating layer in another base members.Ceramic bases also has shielding (shield) element that is inserted between described two lamination base members, and electricity is independent each other for base members like this.It should be noted that publication number is that the Jap.P. of NO.2004-31743 had not both had disclosure not have hint to arrange optical element in this multi-layered ceramic substrate yet.
Summary of the invention
Yet in optical coupling structure proposed above, flat package can not be connected with fiber optic cable in normal way by the commercially available joints of optical fibre such as MT type connector.For flat package and fiber optic cable are coupled together, must make plug special respectively according to the shape and size of shell.Also pilot pin and jump ring must be used for the optical coupling structure that proposed.Like this, do not have useful universal component, the optical coupling structure that is proposed just lacks versatility, and can not reduce cost.
In optical module proposed above, silicon base has three-dimensional crisscross shape, and wherein positioning convex portion and recess are limited by a plurality of planes that comprise the inclined-plane.The ad hoc approach that needs to obtain a kind of advanced person is processed into this crisscross shape with silicon base.Therefore the difficulty of machine silicon substrate and cost increase.In addition, the optical module that is proposed can not satisfy the needs of low profile and high precision optical axis alignment.
Optical element can be installed in the multi-layered ceramic substrate proposed above, form optical module thus.But the multi-layered ceramic substrate that is proposed does not have the structure that optical axis alignment is used, so the optical axis alignment of optical element and optical waveguide can not easily be finished with high precision.This just causes optically-coupled invalid.In addition, when two base members of ceramic bases keep electric when independent each other, circuit can not form in the whole multi-layered ceramic substrate that proposes.
Correspondingly, the purpose of this invention is to provide a kind of optical module that can cooperate with the commercially available joints of optical fibre, and do not use special-purpose link, thus high coupling efficiency, versatility and cost efficiency obtained, and a kind of substrate that is suitable for use in this optical module is provided.
Another object of the present invention provides and a kind ofly is used to connect optical module and fiber optic cable optical coupling structure, thereby obtains high coupling efficiency, versatility and cost efficiency.
A further object of the present invention provides a kind of optical module that has low profile and can cooperate another optical device, thereby obtain high coupling efficiency, versatility and cost efficiency, and a kind of lamination substrate of using in this optical module of being suitable for is provided.
According to a first aspect of the invention, a kind of optical module by optical conenctor and fiber optic cable coupling is provided, this optical module comprises: module bodies, it can link to each other with the plug of optical conenctor by special-purpose pilot pin, the side surface of this module bodies is relative with the mating surface of connector plug, and fiber optic cable end face exposes at this mating surface place; Be installed in optical element on the module bodies and that have optical axis, in case pilot pin is assemblied in module bodies and the connector plug this optical axis and fiber optic cable optical axis alignment.
According to a second aspect of the invention, a kind of ceramic bases that is used for optical module is provided, in case pilot pin is assemblied in optical module and the connector plug, this optical module is suitable for cooperating the optical conenctor plug, this ceramic bases comprises: ceramic bases main body, the opposite side surfaces that it has main substrate surface, extend perpendicular to this main substrate surface and be formed at groove on one of them side surface; Filling material with machining property better than ceramic bases main body, it is received in the described groove and by Precision Machining at least a portion with the formation guide hole, wherein pilot pin inserts in this guide hole.
According to a third aspect of the invention we, provide a kind of optical coupling structure, it comprises: fiber optic cable; Optical conenctor, it has the plug that is fixed in fiber optic cable one end; Pilot pin; And optical module, it comprises the module bodies that links to each other with connector plug by pilot pin and is installed in optical element on this module bodies and that have optical axis, the side surface of this module bodies is relative with the mating surface of connector plug, fiber optic cable end face exposes at this mating surface, in case pilot pin is assemblied in module bodies and the connector plug described optical axis and fiber optic cable optical axis alignment.
According to a forth aspect of the invention, a kind of optical module is provided, it comprises: comprise the substrate of first base members and second base members, this first base members has a plurality of insulation courses that stack along first stack direction, this second base members has a plurality of insulation courses that stack along second stack direction, thereby first and second base members allow electrical connection therebetween and be connected on to make first and second stack directions orthogonal substantially together; Be installed on the optical element on first base members; With the coupling element that is arranged on first base members, in order to the positioning reference that provides optical element and corresponding optical device optical alignment to use.
According to a fifth aspect of the invention, a kind of substrate that is used for optical module is provided, optical module has optical element and coupling element, described substrate comprises: the first ceramic bases element, and it has a plurality of ceramic insulating layers of stacking along first stack direction, installation portion that optical element is mounted thereon and coupling element is received in the hole that the Precision Machining in it forms; The second ceramic bases element, it has a plurality of ceramic insulating layers that stack along second stack direction; Thereby the first and second ceramic bases elements allow electrical connection therebetween and are connected on to make first and second stack directions orthogonal substantially together.
According to following description, also will be understood that other purpose of the present invention and feature.
Brief description of drawings
Fig. 1 is the front view according to the optical coupling structure of first embodiment of the invention, and wherein optical module is installed on the printed circuit board (PCB) and via the MT connector and connects fiber optic cable;
Fig. 2 is the exploded view according to the optical coupling structure of first embodiment of the invention;
Fig. 3 is the front view according to the optical module of first embodiment of the invention and connector cooperation;
Fig. 4 is the skeleton view according to the ceramic bases of the optical module of first embodiment of the invention;
Fig. 5 is the planimetric map according to the optical module of first embodiment of the invention;
Fig. 6 for according to the first embodiment of the present invention, when the line A-A along Fig. 5 cuts open the cut-open view of optical module;
Fig. 7 for according to the first embodiment of the present invention, when the line B-B along Fig. 5 cuts open the cut-open view of optical module;
Fig. 8 is the planimetric map according to the optical module of second embodiment of the invention;
Fig. 9 for according to second embodiment of the invention, when the line C-C along Fig. 8 cuts open the cut-open view of optical module;
Figure 10 is the planimetric map according to the optical module of third embodiment of the invention;
Figure 11 for according to third embodiment of the invention, when the line D-D along Figure 10 cuts open the cut-open view of optical module;
Figure 12 is the planimetric map according to the optical module of fourth embodiment of the invention;
Figure 13 is the front view according to the optical coupling structure of fifth embodiment of the invention, and wherein optical module is installed on the printed circuit board (PCB) and via the MT connector and connects fiber optic cable;
Figure 14 is the skeleton view according to the optical module of fifth embodiment of the invention;
Figure 15 for according to fifth embodiment of the invention, when the line E-E along Figure 14 cuts open the cut-open view of optical module;
Figure 16 for according to fifth embodiment of the invention, when the line F-F along Figure 14 cuts open the cut-open view of optical module;
Figure 17-21 is the cut-open view according to fifth embodiment of the invention, and how it makes optical module if showing;
Figure 22 is the cut-open view according to the optical module of sixth embodiment of the invention;
Figure 23 is the skeleton view according to the optical module of sixth embodiment of the invention;
Figure 24 is the cut-open view according to the optical module of seventh embodiment of the invention;
Figure 25 is the cut-open view according to the optical module of eighth embodiment of the invention;
Shown in Figure 26 is the optical coupling structure between optical fiber and optical element of prior art.
Embodiment
Describe the present invention hereinafter with reference to following first to the 8th one exemplary embodiment, wherein identical parts and part are denoted by like references.
Here be noted that first to fourth embodiment is designed to use with the commercially available joints of optical fibre; And the 5th to the 8th embodiment is designed to use with optical device.
The joints of optical fibre are defined as a kind of interconnection fabric or fiber optic cable parts of being used for.The representative instance of commercially available optical conenctor comprises according to the F12 type optical conenctor of JIS C 5981 (1993 set up, 1998 revision) interconnection multifiber cable, be called again " MT (but mechanical transmission) connector ".In JIS C 5981, the specification with MT connector of rectangular insert (or lasso) stipulates that according to JIS C 5962 wherein pilot pin is as the registration mechanism and the jump ring coupling mechanism that connect optical cable.International standard IEC 60874-16 (revision in 1994) is equivalent to JIS C 5981.
According to JIS C 5981, the plug that is used for the MT connector is a rectangular shape, this plug is of a size of the 8.0mm tolerance for ± 0.1mm, be of a size of 6.4-7.0mm along the fiber ranks direction (hereinafter referred to as " Y-direction of principal axis ") of multifiber cable along pilot pin direction of insertion (following be called for convenience " X-direction of principal axis "), along being of a size of 2.5-3.0mm with the X-axle direction (hereinafter referred to as " Z-direction of principal axis ") vertical with the Y-axle.
The pilot pin that is used for the MT connector is defined as a kind of parts of two MT connector plugs being in alignment with each other in the process of pilot pin being inserted the guide hole of each MT connector plug of being used for.According to JIS C 5981, the length of MT connector pilot pin is 10.8mm or longer, and diameter is about 0.7mm.In addition, according to JIS C 5981, the diameter of the guide hole of MT connector plug is 0.7mm ± 0.001mm, and the pitch of Kong Yukong is 4.6 ± 0.003mm.
The jump ring that is used for the MT connector is defined as a kind of parts that two MT connector plugs are kept together of being used for.According to JIS C 5981, has the drift of 15.7mm between two clamping sections of MT connector jump ring.
Optical device has at least a in light transmission function, light-focusing function and the reflection function.Whether the example with optical device of light transmission function has optical conenctor (plug) all comprises optical waveguide and fiber optic cable.Example with optical device of reflection function comprises the light path conversion equipment.These optical devices can be used singly or in combination.
First embodiment
Now with reference to Fig. 1-7 first embodiment is described.
As shown in Figure 1, in first embodiment, two optical modules 41 and IC chip 16 are installed on the printed circuit board (PCB) 11.Printed circuit board (PCB) 11 has a plurality of insulation courses 15 and the conductive layer that alternately is superimposed, to limit two opposed major surfaces 12 and 13.Though do not illustrate in the accompanying drawing, liner is arranged on the top major surface 12 of printed circuit board (PCB) 11, is used to be electrically connected optical module 41 and is used for being electrically connected IC chip 16 via piece shape contact.
In addition, in first embodiment, two optical modules 41 are connected with each other via multifiber cable 26 and MT connector, as shown in Figure 1.More particularly, each optical module 41 utilizes connector plug 21 and fiber optic cable 26 optically-coupled, and two pilot pins 31 and jump ring 36 are designed to the MT connector according to JIS C 5981.MT connector plug 21 is fixed in an end of fiber optic cable 26.MT connector pilot pin 31 adapts in the guide hole 22 of connector plug 21 and in the guide hole 80 of optical module 41, optical cable 26 is in alignment with each other with optical module 41 and links to each other.MT connector jump ring 36 is assemblied on connector plug 21 and the optical module 41 so that connector plug 21 and optical module 41 are tightened together.
In addition, each optical module 41 has module bodies 42 and the optical element 81 that is installed on the module bodies 42, shown in Fig. 2,3,5 and 6.
Here be noted that, in first embodiment, one of them optical module 41 (being arranged on the right side of Fig. 1) is a surface-emitting type, wherein optical element 81 is vertical surface emitting laser: VCSEL, another optical module 41 (being arranged on the left side of Fig. 1) is surperficial reception type, and wherein optical element 81 receives photodiode for vertical surface.
, preferably make in the optical element 81 merge module main bodys 42 and on any surface of optical module 41, do not expose so that improve reliability in order to protect optical element 81 safely.
, further preferably make in the IC element 82 merge module main bodys 42 and do not expose so that improve reliability in order to protect IC element 82 safely on any surface of optical module 41.
In operating process, optical element 81, IC element 82 and electronics or circuit component 83 produce heat.Because the thermal conductivity of the connector plug 21 that resin is done is not very high, can not diffuse to the outside of optical module 41 via connector plug 21 effectively from the heat of these elements 81,82 and 83.This can cause fluctuation of service in optical module 41.Therefore; it is desirable to; module bodies 42 mainly is made up of the higher material of heat conductance of the connector plug 21 that has good thermal conductivity, also promptly does than resin, so that heat is diffused to the outside of optical module 41 effectively and protects the operational stability of optical module 41 from element 81,82 and 83.The example of the high thermal conductivity material of module bodies 42 comprises the inorganic material such as metal material and stupalith.
In first embodiment, module bodies 42 preferably includes ceramic bases 51, and its critical piece as module bodies supports optical element 81.Especially it is desirable to, shown in Fig. 4,6 and 7, ceramic bases 51 is the ceramic bases of lamination, has the base body that a plurality of ceramic insulating layers 52 that alternately stack and conductive layer 57 form it.Insulation course 52 can be made by any stupalith, for example aluminium oxide, beryllia, mullite, aluminium nitride, silicon nitride, boron nitride or silit with good thermal conductivity.The ceramic bases 51 of lamination also comprises the via conductors 58 that is formed between the conductive layer 57.In multi-layered ceramic substrate 51, arrange and this conductive layer 57 and via conductors 58 make optical element 81 for example IC element 81, electronic component or circuit component 83 and printed circuit board (PCB) 11 are electrically connected with any miscellaneous equipment easily.
Thereby two holes 62 are formed at least a portion that constitutes the guide hole 80 of optical module 41 on the side surface 53 of ceramic bases 51.It is desirable to, the groove 61 of cutting rectangular parallelepiped is inserted filling material 63 in the groove 61 in the side surface 53 of the base body of ceramic bases 51, forms two holes 62 in the position corresponding to the guide hole 22 of connector plug 21 by Precision Machining filling material 63 then.Shown in Fig. 2-7, the section of PRECISION HOLE 62 is for circular and have the diameter identical with guide hole 22 and Kong Yukong pitch (also promptly, diameter is 0.7mm ± 0.001mm, and the Kong Yukong pitch is 4.6 ± 0.003mm).When small part guide hole 80 forms by Precision Machining, by pilot pin 31 is inserted the optical axis alignment that can easier and correctly realize in the precision machined like this hole 80 between optical element 81 and the fiber optic cable 26.This has guaranteed the raising of coupling efficiency.
In addition, preferably, filling material 63 has hardness and the better machining property lower than the base body of ceramic bases 51.Because ceramic bases 51 not only has the advantage of good thermal conductivity and high-dimensional stability, also have the shortcoming of high rigidity and bad machining property, so directly on ceramic bases 51 Precision Machining form the hole difficulty and expensive that will become.On the contrary, hole 62 can easily form on the filling material 63 of good mechanical processability at lower cost, and these holes 62 can form by the precise machining process such as boring, punching or Laser Processing.Consider cost, hole 62 preferred use precision drilling device borings form.Wherein, resinous material is preferably used as filling material 63.Resinous material generally hardness and the price than stupalith is lower, like this with this soft, at a low price resinous material as filling material 63, not only reduced the manufacturing human cost but also reduced material cost.
In first embodiment, cavity 59 is formed at the first type surface 55 and 56 of ceramic bases 51, and IC element 82 and capacitor 83 are separately positioned in the cavity 59 of first type surface 55 and 56 like this.Slit between each cavity 59 can be filled with organic siliconresin or hot consistent lubricant 84, so that improve heat conductance.
As Fig. 2,3 and 5-7 shown in, module bodies 42 also can comprise flex substrate 76, sheet metal 72, microlens array 73, pad 74 and electric terminal 75.
As shown in Figure 3, optical module 41 and fiber optic cable 26 are arranged on the printed circuit board (PCB) 11, and wherein the mating surface 23 of connector plug 21 is relative and parallel with the side surface 43 of module bodies 42.Under this state, the opposite end of each pilot pin 31 inserts and is fitted in the guide hole 22 of connector plug 21 and in the guide hole 80 of optical module 41, thereby makes optical module 41 and plug 21 carry out mechanical connection in plug-pin-plug configuration.The optical element 81 of optical module 41 and the optical axis alignment between the fiber optic cable 26 also can be at pilot pin 31 once inserting guide hole 22 and realizing in 80 o'clock.So, by optical module 41 and plug 21 are remained between the clamping section 37 of jump ring 36, optical module 41 and plug 21 are fixedly secured, thereby clamping section 37 are pressed in respectively on the side surface of the side surface 44 of optical module 41 and plug 21.
Below with the operation of brief description optical module 41.
The power supply of response from printed circuit board (PCB) 11 to surface-emitting type optical module 41, light emission type optical element 81 and driver IC element 82 become active.When printed circuit board (PCB) 11 when this active state produces electric signal, electric signal at first is transfused to driver IC element 82, is sent to photocell 81 from driver IC element 82 via the wiring diagram of flex substrate 76 then.Photocell 81 changes into light signal with electric signal and this light signal is exported to an end of fiber optic cable 26.Thereby light signal passes transparent or semitransparent flex substrate 76 and the lenticule by microlens array 73 and becomes the core that enters fiber optic cable 26 of convergence and march to thus in the surperficial reception type optical module 41.
Next will explain the manufacture method of optical module 41.
At first, for example prepare to give birth to the ceramic bases main body, this base body has two grooves 61 that are formed on its side surface; Sintering should be given birth to base body; Filling material 63 is inserted in the groove 61; Then, filling material 63 Precision Machining are formed two holes 62, so just make ceramic bases 51.The step that the preparatory technology of living ceramic bases main body comprises has: a plurality of living potsherds are provided, and each is given birth to two otch of marginal portion manufacturing of potsherd and described living potsherd is stacked at this, and groove 61 is limited by described otch like this.Adopt this method, groove 61 can easily form on ceramic bases 51 at lower cost, and is unprocessed because ceramic bases 51 is still in groove formation technology.
For example, ceramic bases 51 can be made through the following steps.
Prepare the mud raw material by the various components of mixing equably and knead such as calcined bauxite in powder, organic binder bond, solvent and plastifier.Utilize scraper that the mud raw material of being prepared is carried out sheet forming and handle, produce a plurality of green sheets of given thickness thus.Form through hole by carrying out punching press, the metal paste such as the tungsten paste is inserted in the described through hole in the specific location of green sheet.Otch is made in marginal portion at green sheet.In addition, the metal paste such as the tungsten paste is printed on the surface of green sheet.Green sheet is superimposed makes otch superpose each other, obtains the green sheet lamination thereby under the setting pressure effect it is pushed then.With green sheet lamination drying and degreasing, and with its sintering, form ceramic bases 51 thus by known technology with the temperature (for example 1650-1950 ℃) that is enough to sintered alumina.In the ceramic bases that forms like this, insulation course 52, conductive layer 57, via conductors 58 and groove 61 respectively by green sheet, be printed on metal paste on the green sheet, fill out the metal paste in through hole and the otch that is formed in the green sheet is formed.
On the other hand, (can use JERCo. by for example bisphenol F epoxy resin of 80 weight portions, the commodity of Ltd. " EPICOAT 807 " by name), the cresol novolak epoxy of 20 weight portions (can use the commodity of " EPICOAT 152 " by name of Shikoku company), the hardening agent of 5 weight portions (can use the commodity of Shikoku Corp. " 2P4MZ-CN " by name), the silica filled thing of 200 weight portions of handling with silane coupling agent (can use the commodity of by name " KBM-403 " of Shin-Etsu chemical company) (can use being called of Tatsumori Ltd. " TSS-6 " commodity), and the defoamer of effective dose (can use the commodity of San Nopco Limited " BERENOL S-4 " by name) mixes, pinch the potpourri of rubbing acquisition like this with three roller kneading machines then, so just be ready to filling material 63.After the processes well known of utilization such as typography inserted filling material 63 each groove 61 of ceramic bases 51,120 ℃ of heating 1 hour, filling material 63 became semi-harden like this with ceramic bases 51.At this moment filling material 63 is not hardened fully is to be easy to carry out in order to make following hole form technology.
Utilize the precision drilling machine that hole 62 is formed at respectively in the semi-harden filling material 63.By this precise machining process, thereby hole 62 can be made at least a portion that constitutes guide hole 80 easily and correctly, the accurate positioning reference of using as optical axis alignment.In addition, PRECISION HOLE 62 is formed at and makes manufacturing and human cost reduce in the resene filling material 63, with this measure that reduces as optical module 41 costs.Afterwards, ceramic bases 51 usable surface buffing machines are removed the 62 excessive filling materials 63 that stretch out from the hole thus with side surface 53 polishings of ceramic bases 51.
The ceramic bases 63 that so obtains was heated 5 hours at 150 ℃, and filling material 63 hardens fully like this.Then, by processes well known ceramic bases 51 finishing are accurate to ± 0.001mm the diameter of PRECISION HOLE 62 is finely tuned to 0.700mm.
Next, through the following steps ceramic bases 51 and other element are assembled into optical module 41.
In the process of preparing flex substrate 76, optical element 81 and IC element 82 are installed on one of them first type surface of flex substrate 76.Flex substrate 76, pad 74 and the microlens array 73 of ceramic bases 51, supporting optical element 81 and IC element 82 are all according to the order setting of mentioning.Pilot pin 31 inserts and is assemblied in hole 62,70 and 85 so that correctly locate flex substrate 76 and microlens array 73 on the ceramic bases 51.The surface portion of flex substrate 76 utilizes anisotropic conducting film that described surface portion is bonded on the first type surface 55 of ceramic bases 51 with respect to crooked 90 degree of the end parts of flex substrate 76 then.In addition, utilize silver-epoxy adhesive that sheet metal 72 is bonded on the surface portion of flex substrate 76.Electricity between the conducting element of ceramic bases 51 and the flex substrate 76 is led and can be set up via conductive extractum, conducting film or pad.As a result, obtain the subassembly of optical module 41 and pilot pin 31 (as shown in Figure 2), wherein pilot pin 31 has the part of stretching out from module bodies 42 separately.By optical module 41 being welded on the first type surface 12 of printed circuit board (PCB) 11, the subassembly that so obtains is arranged on the first type surface 12 of printed circuit board (PCB) 11.Selectively, ceramic bases 51 can be welded on the first type surface 12 of printed circuit board (PCB) 11, then, utilize pilot pin 31 that flex substrate 76, pad 74 and microlens array 73 are connected on the ceramic bases 51.
At last, with pilot pin 31 and jump ring 36 optical module 41 and connector plug 21 are kept together.Here, MT connector plug 21 has been fixed on an end of fiber optic cable 26.Connector plug 21 is arranged on the printed circuit board (PCB) 11, the mating surface 23 of connector plug 21 is relative with the side surface 43 of optical module 41, then, more close optical module 41, the extension of pilot pin 31 is packed in the guide hole 22 of connector plug 21 till the side surface 43 of the mating surface 23 of connector plug 21 and optical module 41 contacts with each other like this.When in advance optical module 41 and pilot pin 31 being made subassembly, optical module 41 and connector plug 21 easier connection in plug-pin-plug configuration.Then jump ring 36 is installed on optical module 41 and the connector plug 21 so that optical module 41 and connector plug 21 are clipped between the clamping section 37 of jump ring 36.Like this, optical module 41 and connector plug 21 tightly keep together under the pressure effect of jump ring 36.
As mentioned above, pilot pin 31 packed into not only to make in connector plug 21 and the module bodies 42 and forms mechanical connection between these connecting portions 21 and 42, but also makes and form optical axis alignment between optical element 81 and the fiber optic cable 22.In other words, optical element 81 can be by simple relatively method and optical fiber 26 optically-coupled accurately.When module bodies 42 and MT connector plug 21 have essentially identical shape and size, can in first embodiment, be adopted as and use designed pilot pin 31 and the jump ring 36 of MT connector, so that module bodies 41 and connector plug 21 are tightened together.Like this, optical module 41 can obtain high coupling efficiency, versatility and cost efficiency.
In addition, optical element 81 and IC element 82 are arranged in the optical module 41, have reduced the conductive lengths between optical element 81 and the IC element 82, quicken the operation of optical module 41 thus.
Optical element and IC element 82 are embedded in the module bodies 42 and do not expose on any surface of optical module 41.Like this, can provide safeguard protection for optical element 81 and IC element 82, and compare with the situation that IC element 82 exposes on the surface of optical module 41, can improve reliability with optical element 81.
Owing to be provided with optical element 81, IC element 82 and electronic component or circuit component 83, the heat total amount that is produced in the optical module 41 is relatively large.In addition, optical element 81, IC element 82 and electronic component or circuit component 83 all embed in the optical module 41.Therefore optical module 41 structurally may accumulate heat therein.Yet, except being set, also adopted sheet metal 72 critical piece of the ceramic bases 51 of high thermal conductance as module bodies, and this can effectively carry out thermal diffusion.What some welding blocks 75 also played the heat path is used for promoting effective thermal diffusion.
Second embodiment
Explain the second embodiment of the present invention with reference to Fig. 8 and 9 below.
The optical module 141 of second embodiment structurally is similar to the optical module 41 of first embodiment, shown in Fig. 8 and 9, except optical element 81 and IC element 82 are unfavorable be used as these elements 81 and 82 support flex substrate 76 and with ceramic bases 51 directly bonding.More particularly, optical element 81 is arranged on the side surface 53 of ceramic bases 51 and via bonding wire 191 and is electrically connected conductive layers 57, and IC element 82 is arranged in the cavity 59 of first type surface 55 of ceramic bases 51 and with conductive layer 57 or via conductors 58 and is electrically connected.
Correspondingly can obtain the effect identical with first embodiment in a second embodiment, optical module 141 can obtain high coupling efficiency, versatility and cost efficiency like this.In addition, by removing the part sum that flex substrate 76 can reduce optical module 141.This makes the manufacturing cost of optical module 141 reduce.When the thermal conductivity between ceramic bases 51 and the sheet metal 72 was increased by removing flex substrate 76, optical module 141 can also further improve heat conductance.
The 3rd embodiment
Hereinafter with reference to Figure 10 and 11 the 3rd embodiment is described.
The optical module 241 of the 3rd embodiment structurally is similar to the optical module 41 of first embodiment, shown in Figure 10 and 11, except optical module 81 and IC element 82 are unfavorable be used as these elements 81 and 82 support flex substrate 76 and with ceramic bases 51 directly bonding.More particularly, IC element 82 is arranged in the cavity 59 of first type surface 55 of ceramic bases 51 and with conductive layer 57 or via conductors 58 and is electrically connected.At the 3rd embodiment, ceramic bases 51 has the thin portion 244 of stretching out along the bottom major surface 56 of ceramic bases 51 on the X-direction of principal axis.Optical element 81 is arranged on the extension 244 of ceramic bases 51 and with conductive layer 57 or via conductors 58 and is electrically connected, and its light emission or acceptance point point to Z-direction of principal axis (upside of Figure 11 also promptly).In addition, optical module 241 comprises pad 245 and the microlens array 247 with optical frames 246.Pad 245 has L shaped section and is arranged on the extension 244 of ceramic bases 51.Microlens array 247 is arranged on the pad 245, makes the minute surface of optical frames 246 with respect to optical axis angle at 45 like this.Guide hole 251 and 252 is formed at respectively in the extension 244 of microlens array 247 and ceramic bases 51 along the Z-direction of principal axis, and by pilot pin 31 is inserted in the guide hole 251 and 252, optical element 81 and microlens array 247 enter the state of optical axis alignment each other like this.
Can obtain the effect identical with first embodiment in the 3rd embodiment, optical module 241 can obtain high coupling efficiency, versatility and cost efficiency like this.When optical element 81 and IC element 82 directed equidirectionals, comprise that the various modular units of optical element 81 and IC element 82 can be more easily and be installed in effectively on the ceramic bases 51.When the thermal conductivity between ceramic bases 51 and the sheet metal 72 was increased by removing flex substrate 76, optical module 241 can also further improve heat conductance.
The 4th embodiment
With reference to Figure 12 the 4th embodiment is described below.
The optical module 341 of the 4th embodiment structurally is similar to the optical module 41 of first embodiment, as shown in figure 12, have two kinds of different optical elements except optical module 341: light emission and light receiving element 81a and 81b and two kinds of different IC elements: driver IC 82a and the receiver IC82b.In the 4th embodiment, light emission and light receiving element 81a and 81b are respectively VCSEL and photodiode.Photocell 81a and driver IC 82a are electrically connected to each other via one of them wiring diagram of flex substrate 76, and light receiving element 81b and receiver IC82b are electrically connected to each other via another wiring diagram of flex substrate 76.Module bodies 42 also comprises the shielding element 361 that is arranged between optical element 81a and the 81b, and electromagnetism separates so that optical element 81a keeps each other with 81b.In this case, conductive material is plated in be plated on the pad 74 on arbitrary base members or with conductive material and can forms shielding element 361.Two each cavitys 59 are formed on the top major surface 55 of ceramic bases 51, thereby IC element 82a and 82b are arranged in each cavity 59.Electromagnetism separates so that make driver IC 82a and receiver IC82b keep each other to leave a partition wall 362 between two cavitys 59.
Therefore, can obtain the effect identical with first embodiment in the 4th embodiment, optical module 341 can obtain high coupling efficiency, versatility and cost efficiency and high added value like this.
The modification of first to fourth embodiment
First to fourth embodiment above can carry out multiple modification.
For example, module bodies 42 and connector plug 21 can also only utilize pilot pin 31 (also to be in plug-pin-plug configuration, do not adopt jump ring 36) connect together, though in first to fourth embodiment these connecting portions 42 and 21 by utilizing 36 couplings of pilot pin 31 and jump ring.
In first, second or the 3rd embodiment, can remove pad 74 or 245 to reduce the part sums of optical module 41,141 or 241.
Though ceramic bases 51, microlens array 247 and sheet metal 72 are via pilot pin 31 alignment and fixing in the 3rd embodiment, ceramic bases 51, microlens array 247 and sheet metal 247 can also not adopt pilot pin 31 to align by for example bonding agent and fix.
A plurality of sheet metals 72 can be arranged in the module bodies 42, though be that single sheet metal 72 is arranged on the first type surface of module bodies 42 in first to fourth embodiment.
In first to fourth embodiment, do not form protuberance or recess on the inside surface of groove 61, the diameter of each circular groove 61 substantially constant on entire depth.But, form protuberance on also can the inside surface of groove 61 and recess makes the diameter of each groove 61 change along with the degree of depth.In this case, thereby the surface of contact between groove 61 and the filling material 63 becomes and increase to improve the bonding of filling material 63 and groove 61, prevents to occur between groove 61 and the filling material 63 slit and because thermal stress is concentrated splits, improves reliability thus.
In first embodiment, by filling material 63 is inserted in the groove 61, in 120 ℃ of filling material is 63 semi-harden, precision drillings, surface finish, at 150 ℃ filling material 63 is hardened fully then, so just form PRECISION HOLE 62.Selectively, by another kind of technology for example filling material 63 is inserted in the groove 61,120 ℃ with filling material 63 semi-harden, surface finish, then 150 ℃ with filling material 63 harden fully, precision drilling and form hole 62 then.
The 5th embodiment
Hereinafter with reference to Figure 13-21 fifth embodiment of the present invention is described.
As shown in figure 13, two optical modules 441 are installed on the printed circuit board (PCB) 11 and by fiber optic cable 26 via piece shape contact 475 and are connected with each other.Notice that fiber cable 26 is as corresponding optical device in the 5th embodiment.Printed circuit board (PCB) 11 has a plurality of insulation courses 15 and the conductive layer that alternately is superimposed, to limit two opposed major surfaces 12 and 13.Though not shown in the accompanying drawing, solder joint is arranged in and is used to be electrically connected optical module 441 on the first type surface 12 of printed circuit board (PCB) 11.IC chip 16 also is installed on the printed circuit board (PCB) 11 via piece shape contact.
Each optical module 441 is anchored on the connector plug 21 of fiber optic cable 26, and comprise module bodies 439 and optical element 481, this module bodies 439 has the substrate 440 as this module bodies critical piece, this optical element 481 is installed on the installation portion 466 of this substrate 440, and wherein the optical surface of this optical element 481 points to the mating surface of connector plug 21 shown in Figure 13-15.
These lamination base members 448 and 451 stack direction that makes the insulation course 449 in the base members 448 of winning that connects together each other hangs down substantially as for the stack direction of the insulation course 452 in second base members 451.Preferably, one of them substrate surface that the size of first base members 448 makes less than second base members 451 and this first base members 448 links to each other with the side of second base members 451, and base members 448 and 451 insulation course 449 and 452 are respectively in the in-plane and the thickness direction stack of substrate 440 like this.(hereinafter, make the substrate surface of first base members 448 that base members 448 and 451 connects together and the side of second base members 451 can be described as joint face sometimes.) it should be noted that base members 448 and 451 stack direction can not form just in time 90 ° of angles, are 90 ° of angles substantially but can form.
Each insulation course 449 and 452 is made by the electrically insulating material such as resin or pottery.
Make the cost of substrate 440 reduce as insulation course 449 and 452 resinous material.The example that can be used as insulation course 449 and 452 comprises epoxy (EP) resin, polyimide (PI) resin, bismaleimides-triazine system's (BT) resin and polyphenylene oxide (PPE) resin.The core base material of these resene insulation courses can be used in combination with one or more combination layers (build-uplayer).
Stupalith obtains good light transmissioning efficiency as insulation course 449 and 452, can not make optically-coupled impaired owing to the heat that optical element 481 produces, because stupalith not only has high rigidity and dimensional stability, also have good with the heat conductance of heat diffusion to the outside.Therefore the substrate 440 that the multi-layered ceramic material makes can be particularly useful as the support of optical element 481.The example that can be used as the pottery of insulation course 449 and 452 comprises aluminium oxide, beryllia, mullite, aluminium nitride, boron nitride and silit.These stupaliths have outstanding heat conductance.
In the 5th embodiment, especially when insulation course 449 and 452 is made by the pottery of for example aluminium oxide and so on, can preferably make base members 448 with 451 each other not direct surface contact.Thereby substrate 440 can preferably include the heat insulation layer 450 between base members 448 and 451, via this heat insulation layer 450 base members 448 and 451 is connected together.In order to prevent that the transmission heat also protects optical element 481 to be used for the operational stability of optical module 441 from heat thus between base members 448 and 451, heat insulation layer 450 is made by having insulation course 449 and the lower material of 452 thermal conductivities made than stupalith.In the 5th embodiment, insulation course 450 is made by anisotropic conductive material, and base material 448 and 451 is via mechanical connection and the electrical connection each other of this anisotropic band 450 like this.
When one of them substrate surface of first base members 448 links to each other shown in Figure 14-16 with the side of second base members 451, preferably optical element 481 is installed on another substrate surface of first base members 448, also on the side surface 444 of the substrate 440 that promptly limits (or module bodies 439) by first base members 448, thereby between optical element 481 and optical cable 26, form optically-coupled, and need not the light path conversion equipment.(hereinafter, the substrate surface 444 of first base members 448 that is mounted thereon of optical element 481 can be described as the optical element installed surface sometimes.) this advantageously makes the cost of optical module 441 reduce and hangs down profileization.
Note, in the 5th embodiment, one of them optical module 441 (being arranged on the right side of Figure 13) is a surface-emitting type, wherein optical element 481 is surface emitting laser: VCSEL, and another optical module 441 (being arranged on the left side of Figure 13) is surperficial reception type, and wherein optical element 481 is that the surface receives photodiode.
Though IC element 482 can be installed on first base members 448 or on second base members 451, when one of them substrate surface of first base members 448 is connected in the side of second base members 451, can preferably IC element 482 be installed on one of them substrate surface of second base members 451 (first type surface of the substrate 440 that limits by second base members 451 also promptly).(hereinafter, the substrate surface of second base members 451 that is mounted thereon of IC element 482 can be described as IC element installed surface sometimes.) in other words, be installed in first and second base members 448 and 451 another on one of them of can be preferably optical element 481 being installed in first and second base members 448 and 451 and with IC element 482.If optical element 481 and 482 all is installed in first and second base members 448 and 451 any, these elements 481 and 482 just physically close mutually, optical element 481 is easy to be subjected to heat and the electromagnetic effect from IC element 482 like this.In addition, if optical element 481 and IC element 482 all are installed in base members 448 and 451 any, very difficult protection is used to install the space of two elements 481 and 482, is difficult to reduce the overall dimensions of optical module 441 thus.
The insulation course 450 that connection pads 486 is formed on base members 448 and 451 the relative joint face and makes via the anisotropic conductive material shown in Figure 15 and 16 and each other electricity lead.Shown in Figure 14 and 15, pad 487 is formed on the optical element installed surface 444 (relative with the connection substrate surface of base members) of first base members 448 around optical element installation portion 466, is used for connecting via bonding wire 491 terminal of optical element 481.And pad 488 is formed on the IC element installed surface of second base members 451 around IC element installation portion 467, is used for being connected with the bonding wire 491 shown in 15 via Figure 14 the terminal of IC element 482.Therefore, even these elements 481 and 482 are installed in independently on the base members 448 and 451, optical element 481 and IC element 482 via conductive layer 457, path hole conductor 458a, pad 486,487 and 488 and bonding wire 491 also be electrically connected each other.
In addition, thermal path diffuses to the outside of optical module 441 with heat from optical element 481 and IC element 482 thereby can preferably provide independently on base members 448 and 451, and can not cause conducting heat between part first base members 448 and part second base members 451.In the 5th embodiment, thereby path hole conductor 458b diffuses to heat the outside of optical module 441 from these elements 481 and 482 as heat passage.Ground plane 465 is because its solid-state form also has the function that heat effectively is passed to optical module 441 outsides from optical element 481.In the 5th embodiment, each optical element installation portion 466 here and IC element installation portion 467 are made by conductive material.Therefore heat can be diffused to printed circuit board (PCB) 11 from optical element 481 via optical element installation portion 466, path hole conductor 458b, ground plane 465, piece shape pad 489 and piece shape contact 475, and heat diffused to printed circuit board (PCB) 11 from IC element 482 via IC element installation portion 467, path hole conductor 458b, piece shape pad 489 and piece shape contact 475, when for example the heat that produces when IC element 482 is greater than optical element 481, can not conduct heat between part first base members 448 and part second base members 451.
As shown in figure 14, for the ease of aiming at, alignment mark 495 is formed on the optical element installed surface 444 of first base members 448.In the 5th embodiment, alignment mark 495 is a cruciform.
In the 5th embodiment, two pilot pins 431 are as optical coupling element, shown in Figure 13-16.Thereby these pilot pins 431 are inserted into and are assemblied in the guide hole of first base members 448 from the side surface of substrate 440 and stretch out and extend at in-plane, and not increasing of optical module 441 thickness just can obtain low profile thus.
Can be preferably, for in the aligned hole that pilot pin 431 is correctly engaged into corresponding optical device 26 and engage in the guide hole of substrate 440, each pilot pin 431 of substrate 440 and the diameter of each guide hole pin-and-hole that aligns with the connector plug 21 of corresponding optical device 26 substantially are identical.
Consider versatility, connector plug 21 and pilot pin 431 can be to be MT connector designed plug and pilot pin.In this case, according to JIS C 5981, it is 0.7 ± 0.001mm that the guide hole of the aligned hole of connector plug 21 and substrate 440 is made diameter, and the Kong Yukong pitch is 4.6 ± 0.003mm.In addition, also can adopt diameter according to JIS C 5981 is the pilot pin 431 " CNF125A-21 " of 0.699mm.
The guide hole of substrate 440 preferably forms by Precision Machining.It is special when first base members 448 is the multi-layered ceramic base members, can be preferably, on base members 448 incising circular groove 461, thereby filling material 463 is inserted in the groove 461, is the guide hole that constitutes of opening by Precision Machining making hole 462 on the filling material 463 and making these holes 462 then that guide hole just is formed in first base members 448 like this on the substrate surface of first base members 448.When Precision Machining forms guide hole, by pilot pin 431 being inserted the easier and realization correctly of the optical axis alignment that makes in the precision machined hole like this between optical element 481 and the fiber optic cable 26.This has guaranteed the raising of coupling efficiency.
Preferably, filling material 463 is lower than the hardness of ceramic bases element 448, machining property is better.Because ceramic bases element 448 not only has the advantage of good thermal conductivity and high-dimensional stability, also has the shortcoming of high rigidity and bad machining property, so direct Precision Machining and to form the hole be very difficult and expensive in ceramic bases element 448.On the contrary, guide hole 462 can easily be formed in the filling material 463 of good workability with low cost.These holes 462 can form by for example boring of any precision machining method, punching press or Laser Processing.Consider the cost problem, the 462 preferred precision drilling machine drill holes of adopting, hole form.The example of filling material 463 comprises resinous material, metal material and glass material.Wherein, resinous material is preferably used as filling material 463.The hardness of resinous material and price generally are lower than stupalith, and the resinous material with this soft, low price makes not only that as filling material 463 making the human cost reduction also makes material cost reduce like this.
To introduce the manufacture method of optical module 441 below.
Prepare the mud raw material by the various components of mixing equably and knead such as calcined bauxite in powder, organic binder bond, solvent and plastifier.Utilize scraper that the mud raw material of being prepared is carried out sheet forming and handle, produce a plurality of green sheets of given thickness thus.Form the hole by carrying out punching press, will insert in each hole such as the metal paste the tungsten paste in the specific location of green sheet.To be printed on the surface of green sheet such as the metal paste the tungsten paste.Thereby green sheet is superimposed and under the setting pressure effect, it pushed and obtain the green sheet lamination.In addition, will be printed on the surface of green sheet lamination such as the metal paste the tungsten paste.Then, the green sheet lamination is holed to utilize this green sheet lamination cut-in groove 461.Because at this moment sheet stack remains unprocessed, so groove 461 can easily form with low cost.The green sheet lamination drying and the degreasing that will so obtain by known technology, and with the temperature (for example 1650-1950 ℃) that is enough to sintered alumina with its sintering, form the ceramic bases element 448 of lamination thus.In the ceramic bases element 448 that forms like this, insulation course 449, ground plane 465 and conductive layer, optical element installation portion 466 and pad 486 and 487, piece shape pad 489, path hole conductor 458a and 458b respectively by green sheet, be printed on metal paste on the green sheet, be printed on the metal paste on the green sheet lamination and the metal paste filled out in the hole is formed.
By blending epoxy, hardening agent and silica filled thing etc., utilize three roller kneading machines to pinch the potpourri of rubbing acquisition like this then, thereby be ready to filling material 463.Filling material 463 is inserted in each groove 461 of first base members 448 by the processes well known such as typography, at 120 ℃ first base members 448 was heated 1 hour, filling material 463 becomes semi-harden like this.At this moment filling material 463 not fully the sclerosis be in order to be easy to carry out following hole manufacturing process.
Utilize the precision drilling machine that hole 462 is formed at respectively on the semi-harden filling material 463.By this precise machining process, hole (guide hole) 462 can make easily and correctly as the accurate positioning reference that is used for optical axis alignment.In addition, PRECISION HOLE 462 is formed at and makes manufacturing and human cost reduce in the resene filling material 463, with this measure that reduces as optical module 441 costs.
150 ℃ of base members that will so obtain, 448 heating 5 hours, thereby filling material 463 is hardened fully.Then, base members 448 is polished so that the diameter of PRECISION HOLE 462 is finely tuned to 0.700mm, be accurate to ± 0.001mm by known technology.
Next make second base members 451 by the following step for example shown in Figure 17.
Preparation is employed identical mud materials in making first base members 448, and utilizes scraper that it is carried out sheet forming and handle, and produces a plurality of green sheets of given thickness thus.Form the hole by carrying out punching press, will insert in each hole such as the metal paste the tungsten paste in the specific location of green sheet.To be printed on the surface of green sheet such as the metal paste the tungsten paste.Thereby green sheet is superimposed and under the setting pressure effect, it pushed and obtain the green sheet lamination.In addition, will be printed on the surface of green sheet lamination such as the metal paste the tungsten paste.By green sheet lamination drying, degreasing and the sintering that known technology will so obtain, form the ceramic bases element 451 of lamination thus.In the ceramic bases element 451 that forms like this, conductive layer 457, IC element installation portion 467 and pad 486 and 488, piece shape pad 489, path hole conductor 458a and 458b respectively by green sheet, be printed on the lip-deep metal paste of green sheet, be printed on the metal paste on the green sheet lamination and the metal paste filled out in the hole is formed.
Then, so that the optical element installed surface 444 of base members 448 keeps supine state, utilizes bonding agent that optical element 481 is bonded on the optical element installation portion 466 then, optical element 481 is installed in first base members 448 as illustrated in fig. 20 like this by base members 448 being set in the chip mounter.Alignment mark 495 can be used for the parts alignment.In case base members 448 is set in the binding appts so that the optical element installed surface of base members 448 444 keeps supine state, bonding wire 491 just is provided is electrically connected so that make to form between optical element 481 and conducting element 458b and 487.
Then, be set in the chip mounter so that the IC element installed surface of base members 451 keeps supine state, utilizes bonding agent that IC element 482 is bonded on the IC element installation portion 467 then by base members 451, IC element 482 is installed in second base members 451 as illustrated in fig. 18 like this.In case base members 451 is set in the stamping device so that the IC element installed surface of base members 451 keeps supine state, bonding wire 491 just is provided is electrically connected so that make to form between IC element 482 and conducting element 458b and 488.
Like this, in the IC element installed surface of the optical element installed surface 444 of first base members 448 and second base members 451 each be connected and the wire bonding technique process in be in supine state, thereby these adhere to and wire bonding technique finish relatively easy.
By arranging between base members 448 and 451 that film 450, applying pressure that anisotropic conductive material is made make this anisotropic membrane 450 remain between base members 448 and 451, then this anisotropic membrane 450 is heated to fixed temperature, such first and second base members 448 and 451 just mechanical connection and electrical connections each other, as shown in figure 21.In the connection substrate 440 that forms like this, the stack direction of the insulation course 449 in first base members 448 is basically perpendicular to the stack direction of the insulation course 452 in second base members 451.
At last, with connector plug 21 couplings of optical module 441 with fiber optic cable 26.In case the extension of pilot pin 431 is inserted in the aligned hole of plug 21, and the optical axis alignment between optical module 441 and the fiber optic cable 26 just can easily realize.
As mentioned above, pilot pin 431 is made as the positioning reference in the optical module 441 carry out optical axis alignment between optical element 481 and the optical device 26 easily.Therefore, optical element 481 can with optical device 26 with the high precision optically-coupled, allow to carry out effective optically-coupled thus.
The first and second lamination base members 448 structurally are suitable for optical element 481 and pilot pin 431 are supported on the side surface of substrate 440 with 451 the substrate 440 that is connected, and IC element 482 are supported on the first type surface of substrate 440.Therefore, the gauge of optical module 441 can be minimized, be used for the optical module 441 of low profile.
For the manufacturing process of substrate 440, base members 448 and 451 is prepared with independent step, and need not in former technology substrate 440 is processed into the 3D shape of complexity.Substrate 440 can relatively easily be made with low cost.
First and second base members 448 and 451 are electrically connected to each other in substrate 440, optical element 481 and IC element 482 can be supported on so independently in the base members 448 and 451.And circuit pattern can be advantageously formed in the whole substrate 440.So, can utilize whole substrate 440 fully and can wasting space.This makes the size of optical module 441 reduce.
Because first and second base members 448 and 451 mainly are made of pottery, optical module 441 can obtain high rigidity and dimensional stability and good heat conductance.Therefore, can prevent to go wrong in the optical module 441 (for example, making the optically-coupled precision impaired) and can obtain effective light transmission owing to heat effects to optical element 481.
The 6th embodiment
Hereinafter with reference to Figure 22 and 23 the 6th embodiment is described.
The optical module 541 of the 6th embodiment structurally is similar to the optical module 441 of the 5th embodiment, shown in Figure 22 and 23, except the setting of optical element 481 and IC element 482.More particularly, cavity 559 and 560 is formed on the optical element installed surface 444 of first base members 448 and on the IC element installed surface of second base members 451, optical element 481 and IC element 482 are arranged on the cavity 559 and 560 of base members 448 and 451 like this.This layout makes that optical element 481 and IC element 481 are less and stretches out substrate 440 that optical module 541 obtains low profiles thus.And, from optical element 481 to pad 487 and from IC element 482 to pad 488 bonding wire 491 can shorten so that quicken the operation of optical module 541.
The 7th embodiment
With reference to Figure 24 the 7th embodiment is described below.
The optical module 641 of the 7th embodiment structurally is similar to the optical module 441 of the 5th embodiment, as shown in figure 24, and except first and second base members 448 and 451 utilize bonding coat 650 connects together.Bonding coat 650 is the organic binder resins such as epoxy adhesive and has thermal insulation that bonding coat 650 is as heat insulation layer like this.In the 6th embodiment, connection pads 486 is not arranged on the joint face of base members 448 and 451.The substitute is, pad 690 is arranged on the upper surface of base members 448 and 451, thereby bonding wire 691 is arranged on and allows between the pad 690 between first and second base members 448 and 451 to be electrically connected.Even in a kind of like this layout, first and second base members 448 and 451 are mechanical connection and electrical connection each other also.
The 8th embodiment
At last, with reference to Figure 25 the 8th embodiment is described.
The optical module 741 of the 8th embodiment structurally is similar to the optical module 441 of the 5th embodiment, as shown in figure 25, and the connection between first and second base members 448 and 451.More particularly, connection pads 791 is formed on base members 448 and 451 the relative joint face, and welding block 792 is arranged between any two relative connection pads 791.In addition, the packing layer (underfill layer) 750 that make with for example epoxy resin in the space between the base members 448 and 451 is filled, and packing layer 750 is as heat insulation layer like this.Therefore base members 448 and 451 can pass through connection pads 791, welding block 792 and packing layer 750 and mechanical connection each other, and is electrically connected to each other by connection pads 791 and welding block 792.Selectively, packing layer 750 is not set.In this case, thereby the air between first and second base members 448 and 451 improves adiabatic efficiency as heat insulation layer, though the mechanical connection between base members 448 and 451 can weaken.
As long as used here the direction term " on ", D score, " vertically " and " laterally ", they with regard to all the time with the application " brief description of drawings " partly in employed direction consistent.
The full content of Japanese patent application NO.2004-162244 (submission on May 31st, 2004) and NO.2004-248486 (submission on August 27th, 2004) is hereby incorporated by.
Though the present invention is described with reference to above-mentioned specific embodiment of the present invention, the invention is not restricted to these embodiment.Those skilled in the art can carry out various modification and variation to the above embodiments according to instruction above.Scope of the present invention is defined in the subsidiary claim.
Claims (21)
1. optical module by the coupling of optical conenctor and fiber optic cable comprises:
Module bodies, but its link to each other with the plug of optical conenctor by special-purpose pilot pin, the side surface of this module bodies is relative with the mating surface of connector plug, fiber optic cable end face exposes at this mating surface place; With
Be installed in optical element on the module bodies and that have optical axis, when pilot pin being assemblied in module bodies and the connector plug, this optical axis and fiber optic cable optical axis alignment.
2. optical module according to claim 1, it is characterized in that, optical conenctor is the MT connector, and module bodies has the shape and size that cooperate with connector plug, utilizes the pilot pin be in particular the design of MT connector and jump ring module bodies and connector plug to tighten together like this.
3. optical module according to claim 2 is characterized in that, module bodies has the first and second relative side surfaces, is formed with on first side surface pilot pin is received in wherein guide hole, maintains the clamping section of jump ring on second side surface.
4. optical module according to claim 1 is characterized in that connector plug is made by resinous material, and module bodies mainly is made of the thermal conductivity material higher than resinous material.
5. optical module according to claim 4 is characterized in that module bodies comprises the ceramic bases as critical piece.
6. optical module according to claim 5 is characterized in that ceramic bases comprises: ceramic bases main body, the side surface that it has main substrate surface, extend perpendicular to this main substrate surface and be formed at groove in this side surface; Filling material with machining property better than ceramic bases main body, it is received in the described groove and by Precision Machining at least a portion with the formation guide hole, wherein pilot pin inserts in this guide hole.
7. optical module according to claim 1, also comprise at least one in first and second semiconductor elements that are arranged in the module bodies, wherein first semiconductor element can drive optical element, and second semiconductor element can amplify the signal from optical element.
8. optical module according to claim 7, it is characterized in that, module bodies comprises ceramic bases, this ceramic bases has main substrate surface and extends and limit the side surface of at least a portion of guide hole perpendicular to this main substrate surface within it, wherein pilot pin inserts in this guide hole, optical element is installed on the side surface of ceramic bases, and semiconductor element mounting is on the main substrate surface of ceramic bases.
9. optical module according to claim 3, module bodies comprises sheet metal, this sheet metal is arranged in the surface of the module bodies except the opposite flank of module bodies.
10. optical module according to claim 1 is characterized in that, module bodies also comprises layout a plurality of electric terminals thereon.
11. optical module according to claim 1, it is characterized in that, module bodies comprises first base members and second base members, this first base members has a plurality of insulation courses that stack along first stack direction, installation portion that optical element is installed on it and pilot pin insert guide hole wherein, this second base members has a plurality of insulation courses that stack along second stack direction, this first and second base members allows to be electrically connected betwixt, thereby this first and second base members is joined together and makes first and second stack directions orthogonal substantially.
12. a ceramic bases that is used for optical module, when pilot pin being assemblied in optical module and the connector plug, this optical module is suitable for cooperating with the optical conenctor plug, and this ceramic bases comprises:
The ceramic bases main body, the opposite side surfaces that it has main substrate surface, extend perpendicular to this main substrate surface and be formed at groove in one of them side surface; And
Filling material with machining property better than ceramic bases main body, it is received in the described groove and by Precision Machining at least a portion with the formation guide hole, wherein pilot pin inserts in this guide hole.
13. ceramic bases according to claim 12 also comprises sheet metal, it is arranged on the surface of the base body except the opposite flank of base body.
14. ceramic bases according to claim 12 also comprises a plurality of electric terminals that are arranged on the base body.
15. an optical coupling structure comprises:
Fiber optic cable;
Optical conenctor, it has the plug that is fixed in a fiber optic cable end;
Pilot pin; With
Optical module, it comprises the module bodies that links to each other with connector plug by pilot pin and is installed in optical element on this module bodies and that have optical axis, the side surface of this module bodies is relative with the mating surface of connector plug, fiber optic cable end face exposes at this mating surface place, when pilot pin being assemblied in module bodies and the connector plug, described optical axis and fiber optic cable optical axis alignment.
16. an optical module comprises:
Comprise the substrate of first base members and second base members, this first base members has a plurality of insulation courses that stack along first stack direction, this second base members has a plurality of insulation courses that stack along second stack direction, first and second base members allow to be electrically connected betwixt, thereby this first and second base members is joined together and makes first and second stack directions orthogonal substantially;
Be installed on the optical element on first base members; With
Be arranged in the coupling element on first base members, in order to be provided for the positioning reference that optical element and corresponding optical device carry out optical axis alignment.
17. optical module according to claim 16, also comprise at least one in first and second semiconductor elements that are installed on second base members, wherein first semiconductor element can drive optical element, and second semiconductor element can amplify the signal from optical element.
18. optical module according to claim 17 is characterized in that, each in first and second base members has the cavity that is formed at wherein, and optical element and semiconductor element are arranged in the cavity of first and second base members.
19. a substrate that is used for optical module, this optical module has optical element and coupling element, and described substrate comprises:
The first ceramic bases element, it has a plurality of ceramic insulating layers of stacking along first stack direction, installation portion that optical element is mounted thereon and coupling element is received in the hole that the Precision Machining in it forms;
The second ceramic bases element, it has a plurality of ceramic insulating layers that stack along second stack direction;
The first and second ceramic bases elements allow to be electrically connected betwixt, thereby this first and second ceramic bases element is joined together and makes first and second stack directions orthogonal substantially.
20. substrate according to claim 19 also comprises the heat insulation layer between first and second base members, this heat insulation layer is made by the thermal conductivity material lower than insulation course.
21. substrate according to claim 20 is characterized in that, heat insulation layer is made by anisotropic conductive material.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004162244A JP4397735B2 (en) | 2004-05-31 | 2004-05-31 | Optical module, optical module ceramic substrate, coupling structure between optical module and optical fiber connector plug |
| JP2004162244 | 2004-05-31 | ||
| JP2004248486 | 2004-08-27 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910001366XA Division CN101446675B (en) | 2004-05-31 | 2005-05-31 | Optical module, ceramic substrate for optical module and coupling structure of the optical module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1704783A true CN1704783A (en) | 2005-12-07 |
| CN100456069C CN100456069C (en) | 2009-01-28 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100742178A Expired - Fee Related CN100456069C (en) | 2004-05-31 | 2005-05-31 | Optical module, optical module substrate and optical coupling structure |
| CN200910001366XA Expired - Fee Related CN101446675B (en) | 2004-05-31 | 2005-05-31 | Optical module, ceramic substrate for optical module and coupling structure of the optical module |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910001366XA Expired - Fee Related CN101446675B (en) | 2004-05-31 | 2005-05-31 | Optical module, ceramic substrate for optical module and coupling structure of the optical module |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4397735B2 (en) |
| CN (2) | CN100456069C (en) |
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| CN102455469A (en) * | 2010-10-27 | 2012-05-16 | 日本航空电子工业株式会社 | Optical module |
| CN101442183B (en) * | 2007-11-20 | 2012-10-31 | 富士施乐株式会社 | VCSEL array device and manufacturing method thereof |
| CN101819304B (en) * | 2007-06-15 | 2013-01-23 | 日立电线株式会社 | Combined optical and electrical transmission module |
| CN105339826A (en) * | 2013-04-29 | 2016-02-17 | 菲尼萨公司 | Connector clip for use with an optoelectronic module and cable management structure |
| CN105431756A (en) * | 2013-05-29 | 2016-03-23 | 富加宜（亚洲）私人有限公司 | On board transceiver |
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| JP2009147046A (en) * | 2007-12-13 | 2009-07-02 | Rohm Co Ltd | Electronic component module |
| JP5090261B2 (en) * | 2008-06-12 | 2012-12-05 | 日本特殊陶業株式会社 | Optical module |
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| CN105408790A (en) * | 2013-07-31 | 2016-03-16 | 惠普发展公司，有限责任合伙企业 | Optical connector alignment |
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| JP2610487B2 (en) * | 1988-06-10 | 1997-05-14 | 株式会社日立製作所 | Ceramic laminated circuit board |
| CN1154745A (en) * | 1994-06-14 | 1997-07-16 | 艾利森电话股份有限公司 | Optical miniature capsul |
| JP3936010B2 (en) * | 1997-02-14 | 2007-06-27 | 古河電気工業株式会社 | Optical module |
| US20030034438A1 (en) * | 1998-11-25 | 2003-02-20 | Sherrer David W. | Optoelectronic device-optical fiber connector having micromachined pit for passive alignment of the optoelectronic device |
| DE19917554C2 (en) * | 1999-04-19 | 2001-07-12 | Siemens Ag | Position fixation in printed circuit boards |
| CN2514561Y (en) * | 2001-11-13 | 2002-10-02 | 洪祯宏 | Light receiving emitting module |
-
2004
- 2004-05-31 JP JP2004162244A patent/JP4397735B2/en not_active Expired - Fee Related
-
2005
- 2005-05-31 CN CNB2005100742178A patent/CN100456069C/en not_active Expired - Fee Related
- 2005-05-31 CN CN200910001366XA patent/CN101446675B/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101819304B (en) * | 2007-06-15 | 2013-01-23 | 日立电线株式会社 | Combined optical and electrical transmission module |
| CN101442183B (en) * | 2007-11-20 | 2012-10-31 | 富士施乐株式会社 | VCSEL array device and manufacturing method thereof |
| CN102455469A (en) * | 2010-10-27 | 2012-05-16 | 日本航空电子工业株式会社 | Optical module |
| CN102455469B (en) * | 2010-10-27 | 2014-12-03 | 日本航空电子工业株式会社 | Optical module |
| CN105339826A (en) * | 2013-04-29 | 2016-02-17 | 菲尼萨公司 | Connector clip for use with an optoelectronic module and cable management structure |
| CN105431756A (en) * | 2013-05-29 | 2016-03-23 | 富加宜（亚洲）私人有限公司 | On board transceiver |
| US9843395B2 (en) | 2013-05-29 | 2017-12-12 | FCI Asia Pte. Ltd. | On board transceiver |
| CN105431756B (en) * | 2013-05-29 | 2018-01-12 | 安费诺富加宜（亚洲）私人有限公司 | Onboard transceiver |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100456069C (en) | 2009-01-28 |
| JP2005345560A (en) | 2005-12-15 |
| JP4397735B2 (en) | 2010-01-13 |
| CN101446675B (en) | 2010-12-01 |
| CN101446675A (en) | 2009-06-03 |
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