CN1703778A - Method of manufacturing a data carrier - Google Patents

Method of manufacturing a data carrier Download PDF

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Publication number
CN1703778A
CN1703778A CN 200380101329 CN200380101329A CN1703778A CN 1703778 A CN1703778 A CN 1703778A CN 200380101329 CN200380101329 CN 200380101329 CN 200380101329 A CN200380101329 A CN 200380101329A CN 1703778 A CN1703778 A CN 1703778A
Authority
CN
China
Prior art keywords
supporting
supporting member
strap
data medium
supporting strap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN 200380101329
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Chinese (zh)
Other versions
CN100371948C (en
Inventor
多罗西·尼罗特
伊维斯·赖格诺克斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Axalto SA
Original Assignee
Axalto SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Axalto SA filed Critical Axalto SA
Publication of CN1703778A publication Critical patent/CN1703778A/en
Application granted granted Critical
Publication of CN100371948C publication Critical patent/CN100371948C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49171Fan-out arrangements

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  • Credit Cards Or The Like (AREA)

Abstract

The abstract concerns a support strip comprising roughly parallel gripping areas (10), the support strip comprising in addition a number of support elements (1a, 1b, 1c), a support element comprising conducting elements, a conducting element comprising a contact pad and a wiring pad, the support strip being characterised in that a support element (1a) is connected to a gripping area (10) using a snap-off junction area (11).

Description

Make the method for data medium
Technical field
The present invention relates to make the method for the data medium that is provided with microcircuit.This data medium can be for for example inserting a plug-in unit of mobile phone.Described data medium identification user is with the entry communication network.This plug-in unit can be for for example about a GSM plug-in unit of GSM 11.11 standards (2G plug-in unit) or third generation design (3G plug-in unit).This GSM plug-in unit is called user identity module card (SubscriberIdentity Module Card, SIM card) again.The invention still further relates to a kind of supporting strap of the clamping zone that comprises almost parallel.
Background technology
Fig. 1 represents the manufacture method of the plug-in unit that can use in mobile phone.This plug-in unit comprises a card body and a module.This module comprises a microcircuit and protection resin, and general, this module and this card body are made independently, and test separately.If it is satisfactory to be somebody's turn to do test, this module is embedded in the card body of ISO card.To block the form that body is cut into the GSM plug-in unit in advance then.In second testing procedure, test this microcircuit again.This second time of test can be after embedding, but carried out before cutting.Like this, obtain being provided with the ISO card of the pre-cut profile of this card format.Before use, by final user this plug-in unit is separated with this ISO card.Like this, can make the GSM plug-in unit in discontinuous mode
Summary of the invention
An object of the present invention is and to reduce cost.
According to an aspect of the present invention, a kind of method of making a plurality of data mediums by a supporting strap (support strip), this data medium comprises the data medium body that is provided with a microcircuit, this supporting strap comprises a plurality of supporting members, a supporting member comprises the wiring weld pad, and this method comprises the following steps:
-Overmolded (overmoulding) step, wherein the supporting member of this supporting strap is overmolding to type, to obtain a plurality of data medium bodies; With
-microcircuit Connection Step wherein is electrically connected microcircuit, to obtain a plurality of data mediums with the wiring weld pad of this data medium body.
For example, this data medium can be a GSM plug-in unit.According to the present invention, do not need to make a pre-cut ISO card, can directly obtain the GSM plug-in unit.Need less plastic material.In addition, only need a testing procedure and in manufacture process, only need supporting strap of control.The present invention can reduce cost.
Description of drawings
Fig. 1 is the figure of a kind of known manufacture method of the expression plug-in unit that can use in mobile phone;
Fig. 2 represents the cross-sectional view and the top view of a data medium;
Fig. 3 represents to make the method for a plurality of GSM plug-in units; With
Fig. 4 represents to insert a GSM plug-in unit in the ISO card.
Embodiment
Fig. 2 represents to comprise the GSM plug-in unit of the card body that is provided with a microcircuit.This card body comprises first side and second side.The metallic grid of a cutting (1) embeds in this card body.The metallic grid of this cutting comprises contact weld pad (2), wiring weld pad (3) and control area (index hole, supporting etc.).This contact weld pad flushes with this first side.This card body is preferably made by thermoplastics (4).This GSM plug-in unit also comprises the supporting of a metallic grid (1), the reference edge of plug-in unit (5), the cavity (7) that 2G (6b) and 3G (6a) ensure safety the zone really and be used to receive this microcircuit and mark coating.This cavity (7) preferably is placed on this first side, and making can be easily with this second side graphical personalisation (personalization).This plug-in unit illustrates that in International Patent Application WO 0245010 it is for reference to introduce this application here.
Fig. 3 represents to make the method for a plurality of GSM plug-in units, and this method comprises uses a supporting strap.This supporting strap comprises calibration and guarantees safe hole (9), the chucking that is used to support or by the zone of control system (10) clamping, with the join domain (11) of snap-off junction.This supporting strap also comprise several metallic grids (1a, 1b, 1c).This metallic grid (1a) comprises contact weld pad (2), wiring weld pad (3) and control area (index hole, supporting etc.).The join domain of this snap-off junction (11) is used for metallic grid (1a) is connected with the clamping zone (10) of this supporting strap.
In Overmolded step, (1a, 1b 1c) are overmolding to type to the various metallic grids of this supporting strap, to obtain a plurality of card bodies.The Overmolded thermoplastics that utilizes carries out.
In the microcircuit inserting step, microcircuit is inserted in the cavity (7) of this card body.Then, this microcircuit is electrically connected with this wiring weld pad (3), and with the protection resinous coat, to obtain the GSM plug-in unit.In test and personalization step, should block the volume graphic personalization.In this step, test this microcircuit and make its personalization.In cutting step, cut this GSM plug-in unit, they are separated with the remainder of this supporting.
Make the GSM plug-in unit like this, serially.
A kind of method of being made a plurality of data mediums by a supporting strap is represented in above explanation, this data medium comprises the data medium body that is provided with a microcircuit, this supporting strap comprises a plurality of supporting members (1), and a supporting member comprises the wiring weld pad, and this method comprises the following steps:
-Overmolded step, wherein the supporting member of this supporting strap is overmolding to type, to obtain a plurality of data medium bodies; With
-microcircuit Connection Step wherein is electrically connected microcircuit, to obtain a plurality of data mediums with the wiring weld pad (3) of this data medium body.
According to another aspect of the present invention, a supporting strap that comprises generally parallel clamping zone (10), this supporting strap also comprises a plurality of supporting members (1), a supporting member comprises conducting element, a conducting element comprises a contact weld pad and a wiring weld pad, and supporting member (1) utilizes snap-off junction join domain (11) to be connected with clamping zone (10).
This data carrier element is the GSM plug-in unit.More generally, this data carrier element can be for comprising any data medium of body (for example plastic body) that can be molded.
This supporting member be for example metallic grid (1a, 1b, 1c).More generally, this supporting member can be enough by rigidity, can be Overmolded and any material that do not damage is made.
The element 9,10 of this supporting strap and 11 can be enough to allow the other materials of good clamping to be made by metal or rigidity.For example, can use plastics.
In addition, in Overmolded step process, can obtain different shape.The control area that is used for controlling separately a data medium can be Overmolded.This control area can be recess and/or the hole that is used to aim at and be orientated.
As shown in Figure 4, can Overmolded this metallic grid, make and the GSM plug-in unit that obtains like this can be inserted in the receiving card.Like this, a holder can be molded in the GSM plug body.
As shown in Figure 2, by adding a molded snap-off junction zone (8), the body of a 3G plug-in unit and 2G plug-in unit is become one.This molded snap-off junction zone (8) forms a main region (MA) and an auxiliary area (AA).
Preferably, with this auxiliary area (AA) accordingly the part of this metallic grid can receive an electronic component (for example, a memory component, particularly a flash memory).Utilize the DSI bus, this memory component is connected with this microcircuit.This electronic component also can be a cipher processor or any other electronic component.
Preferably, before the microcircuit inserting step, can add a printing step, to print various card bodies.

Claims (9)

1. make the method for a plurality of data mediums by a supporting strap for one kind, this data medium comprises the data medium body that is provided with a microcircuit, and this supporting strap comprises that (1c), a supporting member comprises the wiring weld pad to a plurality of supporting members for 1a, 1b, and this method comprises the following steps:
-Overmolded step, wherein the supporting member of this supporting strap is overmolding to type, to obtain a plurality of data medium bodies; With
-microcircuit Connection Step wherein is electrically connected microcircuit, to obtain a plurality of data mediums with the wiring weld pad (3) of this data medium body.
2. the method for claim 1 is characterized by, and this method also comprises a cutting step that cuts off this data medium.
3. supporting strap that comprises generally parallel clamping zone (10), this supporting strap also comprises a plurality of supporting member (1a, 1b, 1c), one supporting member comprises conducting element, one conducting element comprises a contact weld pad and a wiring weld pad, and wherein, supporting member (1a) utilizes snap-off junction join domain (11) to be connected with clamping zone (10).
4. supporting strap as claimed in claim 3 is characterized by, and this supporting member (1a) is a support grid.
5. supporting strap as claimed in claim 3 is characterized by, and this supporting member (1a) comprises guarantees safe edge (6a).
6. supporting strap as claimed in claim 4 is characterized by, and this supporting member (1a) comprises that one second guarantees safe edge (6b).
7. supporting strap as claimed in claim 3 is characterized by, and this supporting member (1a) is a metalwork.
8. supporting strap as claimed in claim 4 is characterized by, and the profile geometries of this supporting member (1a) is conformance with standard GSM11.11 roughly.
9. supporting strap as claimed in claim 3 is characterized by, and this supporting member can receive an electronic component.
CNB2003801013297A 2002-10-15 2003-10-15 Method of manufacturing a data carrier Expired - Fee Related CN100371948C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP02292545.7 2002-10-15
EP02292545 2002-10-15
EP03290338.7 2003-02-11

Publications (2)

Publication Number Publication Date
CN1703778A true CN1703778A (en) 2005-11-30
CN100371948C CN100371948C (en) 2008-02-27

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2003801013297A Expired - Fee Related CN100371948C (en) 2002-10-15 2003-10-15 Method of manufacturing a data carrier

Country Status (1)

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CN (1) CN100371948C (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013044459A1 (en) * 2011-09-28 2013-04-04 Gemalto Technologies Asia Ltd Method of manufacturing a data carrier provided with a microcircuit

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3123198C2 (en) * 1980-12-08 1993-10-07 Gao Ges Automation Org Carrier elements for an IC chip
FR2645680B1 (en) * 1989-04-07 1994-04-29 Thomson Microelectronics Sa Sg ENCAPSULATION OF ELECTRONIC MODULES AND MANUFACTURING METHOD
FR2817374B1 (en) * 2000-11-28 2003-02-21 Schlumberger Systems & Service ELECTRONIC INFORMATION SUPPORT

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013044459A1 (en) * 2011-09-28 2013-04-04 Gemalto Technologies Asia Ltd Method of manufacturing a data carrier provided with a microcircuit
CN103827893A (en) * 2011-09-28 2014-05-28 金雅拓技术亚洲有限公司 Method of manufacturing a data carrier provided with a microcircuit

Also Published As

Publication number Publication date
CN100371948C (en) 2008-02-27

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Granted publication date: 20080227

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