CN1703778A - Method of manufacturing a data carrier - Google Patents
Method of manufacturing a data carrier Download PDFInfo
- Publication number
- CN1703778A CN1703778A CN 200380101329 CN200380101329A CN1703778A CN 1703778 A CN1703778 A CN 1703778A CN 200380101329 CN200380101329 CN 200380101329 CN 200380101329 A CN200380101329 A CN 200380101329A CN 1703778 A CN1703778 A CN 1703778A
- Authority
- CN
- China
- Prior art keywords
- supporting
- supporting member
- strap
- data medium
- supporting strap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
The abstract concerns a support strip comprising roughly parallel gripping areas (10), the support strip comprising in addition a number of support elements (1a, 1b, 1c), a support element comprising conducting elements, a conducting element comprising a contact pad and a wiring pad, the support strip being characterised in that a support element (1a) is connected to a gripping area (10) using a snap-off junction area (11).
Description
Technical field
The present invention relates to make the method for the data medium that is provided with microcircuit.This data medium can be for for example inserting a plug-in unit of mobile phone.Described data medium identification user is with the entry communication network.This plug-in unit can be for for example about a GSM plug-in unit of GSM 11.11 standards (2G plug-in unit) or third generation design (3G plug-in unit).This GSM plug-in unit is called user identity module card (SubscriberIdentity Module Card, SIM card) again.The invention still further relates to a kind of supporting strap of the clamping zone that comprises almost parallel.
Background technology
Fig. 1 represents the manufacture method of the plug-in unit that can use in mobile phone.This plug-in unit comprises a card body and a module.This module comprises a microcircuit and protection resin, and general, this module and this card body are made independently, and test separately.If it is satisfactory to be somebody's turn to do test, this module is embedded in the card body of ISO card.To block the form that body is cut into the GSM plug-in unit in advance then.In second testing procedure, test this microcircuit again.This second time of test can be after embedding, but carried out before cutting.Like this, obtain being provided with the ISO card of the pre-cut profile of this card format.Before use, by final user this plug-in unit is separated with this ISO card.Like this, can make the GSM plug-in unit in discontinuous mode
Summary of the invention
An object of the present invention is and to reduce cost.
According to an aspect of the present invention, a kind of method of making a plurality of data mediums by a supporting strap (support strip), this data medium comprises the data medium body that is provided with a microcircuit, this supporting strap comprises a plurality of supporting members, a supporting member comprises the wiring weld pad, and this method comprises the following steps:
-Overmolded (overmoulding) step, wherein the supporting member of this supporting strap is overmolding to type, to obtain a plurality of data medium bodies; With
-microcircuit Connection Step wherein is electrically connected microcircuit, to obtain a plurality of data mediums with the wiring weld pad of this data medium body.
For example, this data medium can be a GSM plug-in unit.According to the present invention, do not need to make a pre-cut ISO card, can directly obtain the GSM plug-in unit.Need less plastic material.In addition, only need a testing procedure and in manufacture process, only need supporting strap of control.The present invention can reduce cost.
Description of drawings
Fig. 1 is the figure of a kind of known manufacture method of the expression plug-in unit that can use in mobile phone;
Fig. 2 represents the cross-sectional view and the top view of a data medium;
Fig. 3 represents to make the method for a plurality of GSM plug-in units; With
Fig. 4 represents to insert a GSM plug-in unit in the ISO card.
Embodiment
Fig. 2 represents to comprise the GSM plug-in unit of the card body that is provided with a microcircuit.This card body comprises first side and second side.The metallic grid of a cutting (1) embeds in this card body.The metallic grid of this cutting comprises contact weld pad (2), wiring weld pad (3) and control area (index hole, supporting etc.).This contact weld pad flushes with this first side.This card body is preferably made by thermoplastics (4).This GSM plug-in unit also comprises the supporting of a metallic grid (1), the reference edge of plug-in unit (5), the cavity (7) that 2G (6b) and 3G (6a) ensure safety the zone really and be used to receive this microcircuit and mark coating.This cavity (7) preferably is placed on this first side, and making can be easily with this second side graphical personalisation (personalization).This plug-in unit illustrates that in International Patent Application WO 0245010 it is for reference to introduce this application here.
Fig. 3 represents to make the method for a plurality of GSM plug-in units, and this method comprises uses a supporting strap.This supporting strap comprises calibration and guarantees safe hole (9), the chucking that is used to support or by the zone of control system (10) clamping, with the join domain (11) of snap-off junction.This supporting strap also comprise several metallic grids (1a, 1b, 1c).This metallic grid (1a) comprises contact weld pad (2), wiring weld pad (3) and control area (index hole, supporting etc.).The join domain of this snap-off junction (11) is used for metallic grid (1a) is connected with the clamping zone (10) of this supporting strap.
In Overmolded step, (1a, 1b 1c) are overmolding to type to the various metallic grids of this supporting strap, to obtain a plurality of card bodies.The Overmolded thermoplastics that utilizes carries out.
In the microcircuit inserting step, microcircuit is inserted in the cavity (7) of this card body.Then, this microcircuit is electrically connected with this wiring weld pad (3), and with the protection resinous coat, to obtain the GSM plug-in unit.In test and personalization step, should block the volume graphic personalization.In this step, test this microcircuit and make its personalization.In cutting step, cut this GSM plug-in unit, they are separated with the remainder of this supporting.
Make the GSM plug-in unit like this, serially.
A kind of method of being made a plurality of data mediums by a supporting strap is represented in above explanation, this data medium comprises the data medium body that is provided with a microcircuit, this supporting strap comprises a plurality of supporting members (1), and a supporting member comprises the wiring weld pad, and this method comprises the following steps:
-Overmolded step, wherein the supporting member of this supporting strap is overmolding to type, to obtain a plurality of data medium bodies; With
-microcircuit Connection Step wherein is electrically connected microcircuit, to obtain a plurality of data mediums with the wiring weld pad (3) of this data medium body.
According to another aspect of the present invention, a supporting strap that comprises generally parallel clamping zone (10), this supporting strap also comprises a plurality of supporting members (1), a supporting member comprises conducting element, a conducting element comprises a contact weld pad and a wiring weld pad, and supporting member (1) utilizes snap-off junction join domain (11) to be connected with clamping zone (10).
This data carrier element is the GSM plug-in unit.More generally, this data carrier element can be for comprising any data medium of body (for example plastic body) that can be molded.
This supporting member be for example metallic grid (1a, 1b, 1c).More generally, this supporting member can be enough by rigidity, can be Overmolded and any material that do not damage is made.
The element 9,10 of this supporting strap and 11 can be enough to allow the other materials of good clamping to be made by metal or rigidity.For example, can use plastics.
In addition, in Overmolded step process, can obtain different shape.The control area that is used for controlling separately a data medium can be Overmolded.This control area can be recess and/or the hole that is used to aim at and be orientated.
As shown in Figure 4, can Overmolded this metallic grid, make and the GSM plug-in unit that obtains like this can be inserted in the receiving card.Like this, a holder can be molded in the GSM plug body.
As shown in Figure 2, by adding a molded snap-off junction zone (8), the body of a 3G plug-in unit and 2G plug-in unit is become one.This molded snap-off junction zone (8) forms a main region (MA) and an auxiliary area (AA).
Preferably, with this auxiliary area (AA) accordingly the part of this metallic grid can receive an electronic component (for example, a memory component, particularly a flash memory).Utilize the DSI bus, this memory component is connected with this microcircuit.This electronic component also can be a cipher processor or any other electronic component.
Preferably, before the microcircuit inserting step, can add a printing step, to print various card bodies.
Claims (9)
1. make the method for a plurality of data mediums by a supporting strap for one kind, this data medium comprises the data medium body that is provided with a microcircuit, and this supporting strap comprises that (1c), a supporting member comprises the wiring weld pad to a plurality of supporting members for 1a, 1b, and this method comprises the following steps:
-Overmolded step, wherein the supporting member of this supporting strap is overmolding to type, to obtain a plurality of data medium bodies; With
-microcircuit Connection Step wherein is electrically connected microcircuit, to obtain a plurality of data mediums with the wiring weld pad (3) of this data medium body.
2. the method for claim 1 is characterized by, and this method also comprises a cutting step that cuts off this data medium.
3. supporting strap that comprises generally parallel clamping zone (10), this supporting strap also comprises a plurality of supporting member (1a, 1b, 1c), one supporting member comprises conducting element, one conducting element comprises a contact weld pad and a wiring weld pad, and wherein, supporting member (1a) utilizes snap-off junction join domain (11) to be connected with clamping zone (10).
4. supporting strap as claimed in claim 3 is characterized by, and this supporting member (1a) is a support grid.
5. supporting strap as claimed in claim 3 is characterized by, and this supporting member (1a) comprises guarantees safe edge (6a).
6. supporting strap as claimed in claim 4 is characterized by, and this supporting member (1a) comprises that one second guarantees safe edge (6b).
7. supporting strap as claimed in claim 3 is characterized by, and this supporting member (1a) is a metalwork.
8. supporting strap as claimed in claim 4 is characterized by, and the profile geometries of this supporting member (1a) is conformance with standard GSM11.11 roughly.
9. supporting strap as claimed in claim 3 is characterized by, and this supporting member can receive an electronic component.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP02292545.7 | 2002-10-15 | ||
| EP02292545 | 2002-10-15 | ||
| EP03290338.7 | 2003-02-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1703778A true CN1703778A (en) | 2005-11-30 |
| CN100371948C CN100371948C (en) | 2008-02-27 |
Family
ID=34924257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003801013297A Expired - Fee Related CN100371948C (en) | 2002-10-15 | 2003-10-15 | Method of manufacturing a data carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100371948C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013044459A1 (en) * | 2011-09-28 | 2013-04-04 | Gemalto Technologies Asia Ltd | Method of manufacturing a data carrier provided with a microcircuit |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3123198C2 (en) * | 1980-12-08 | 1993-10-07 | Gao Ges Automation Org | Carrier elements for an IC chip |
| FR2645680B1 (en) * | 1989-04-07 | 1994-04-29 | Thomson Microelectronics Sa Sg | ENCAPSULATION OF ELECTRONIC MODULES AND MANUFACTURING METHOD |
| FR2817374B1 (en) * | 2000-11-28 | 2003-02-21 | Schlumberger Systems & Service | ELECTRONIC INFORMATION SUPPORT |
-
2003
- 2003-10-15 CN CNB2003801013297A patent/CN100371948C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013044459A1 (en) * | 2011-09-28 | 2013-04-04 | Gemalto Technologies Asia Ltd | Method of manufacturing a data carrier provided with a microcircuit |
| CN103827893A (en) * | 2011-09-28 | 2014-05-28 | 金雅拓技术亚洲有限公司 | Method of manufacturing a data carrier provided with a microcircuit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100371948C (en) | 2008-02-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9477921B2 (en) | Electrical connector housing having an RFID transponder | |
| KR101245719B1 (en) | Smart card body, smart card and manufacturing process for same | |
| CN101689249B (en) | Electronic interface apparatus and method and system for manufacturing same | |
| CN1236399C (en) | Adapter for a chip card having a reduced format in comparison with the standard SIM mini-card format | |
| US20040129786A1 (en) | Portable object with chip and antenna | |
| JP2000506653A (en) | Chip card | |
| CN1249047A (en) | Method for making contactless cards with coiled antenna | |
| US20090200381A1 (en) | Chip card for insertion into a holder | |
| CN1200185A (en) | Card-shaped data carrier for contactless applications with a component and a transmission system for the contactless applications method of producing such a card-shaped data carrier, and the module | |
| US7121473B2 (en) | Security memory card and production method | |
| JP3058405B2 (en) | Method of manufacturing plastic material composite component and mold for injection molding of plastic material composite component | |
| CN103827893A (en) | Method of manufacturing a data carrier provided with a microcircuit | |
| US6575375B1 (en) | Portable integrated circuit device and method for the production thereof | |
| CN1178163C (en) | Divisible module card which is resistant to bending stresses | |
| CN1703778A (en) | Method of manufacturing a data carrier | |
| EP3408799A1 (en) | Method for manufacturing a smart card module and a smart card | |
| US20020160630A1 (en) | IC card with plated frame and method for manufacturing the same | |
| US7242079B2 (en) | Method of manufacturing a data carrier | |
| EP1727080A1 (en) | SIM with double sets of contacts protected against short-circuit | |
| MX2012010283A (en) | Electronic device having a chip and method for manufacturing by coils. | |
| WO2000030032A1 (en) | Method for making a hybrid smart card by double face printing | |
| JP2006504207A (en) | Data support with several electronic modules mounted on the same surface | |
| JP3112811B2 (en) | IDC connector and method of manufacturing the same | |
| FR2797977A1 (en) | MANUFACTURING PROCESS OF A PORTABLE ELECTRONIC DEVICE INCLUDING AN OVERMOLDING STEP DIRECTLY ON THE SUPPORT FILM | |
| CN2479710Y (en) | Packaging device of card |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080227 Termination date: 20151015 |
|
| EXPY | Termination of patent right or utility model |