CN1694574A - Loudspeaker device - Google Patents
Loudspeaker device Download PDFInfo
- Publication number
- CN1694574A CN1694574A CN 200510055840 CN200510055840A CN1694574A CN 1694574 A CN1694574 A CN 1694574A CN 200510055840 CN200510055840 CN 200510055840 CN 200510055840 A CN200510055840 A CN 200510055840A CN 1694574 A CN1694574 A CN 1694574A
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- voice coil
- lead
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- resin system
- framework
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- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
Provided is a speaker apparatus maintaining positioning accuracy of spring terminals to a resin-made frame with high accuracy wherein a danger of melting the resin-made frame with the spring terminals loaded thereto is avoided by heat caused when lead wires from a voice coil are soldered to the spring terminals. The metal-made spring terminals 41 fixed to the resin-made frame 31 accommodating a speaker unit 14 are configured such that a lead connection part 44 is extended to one side of a frame joining part 42 adhered to the surface of the resin-made frame 31 in a way that a prescribed radiation spaces is ensured between the surface of the resin-made frame 31 and the lead connection part 44 soldered to the voice coil 11 of the speaker unit 14, thereby preventing the resin-made frame 31 from being molten by heat caused at soldering.
Description
Technical field
The present invention relates to a kind of loudspeaker arrangement that is equipped on the information equipments such as portable phone
Background technology
In recent years, be accompanied by the miniaturization of portable phone and PDA information equipments such as (Personal Digital Assistans) and the development of cost degradation, also require its cost degradation, save spaceization as the loudspeaker arrangement of the structural element of information equipment.
Proposed various schemes based on such background: the loudspeaker arrangement in the small information equipment of packing into comprises: speaker unit, and it utilizes voice coil loudspeaker voice coil to drive oscillating plate; Resin system framework, it forms the installing frame of installing to apparatus casing, is used to accommodate described speaker unit; The spring terminal of pair of metal system, it is fixedly mounted on the above-mentioned resin system framework.The lead-out terminal that will be installed on the equipment side circuit substrate on the said equipment housing by above-mentioned a pair of spring terminal is electrically connected with above-mentioned voice coil loudspeaker voice coil.(for example, with reference to patent documentation 1,2).
In loudspeaker arrangement as described above, the spring terminal that is fixed on the resin system framework utilizes metallic plate and following parts to form one usually: the framework adhesive portion, and it is bonded on the above-mentioned resin system framework; The lead-in wire connecting portion, its connection is arranged on the said frame adhesive portion and welds the lead-in wire of above-mentioned voice coil loudspeaker voice coil; Flexible connection piece, its connection be arranged on the said frame adhesive portion and with the state of strain be assembled in the said equipment housing on the equipment side circuit substrate on lead-out terminal be connected.
Patent documentation 1: the spy opens flat 10-224879 communique
Patent documentation 2: the spy opens flat 11-282473 communique
Yet in the past, the spring terminal of loudspeaker arrangement as described above stably was fixed on the framework with the bigger contact-making surface of framework by guaranteeing, framework adhesive portion and lead-in wire connecting portion are processed into and the direct continuous tabular that contacts of face in the surface of said frame.
The spring terminal of this structure is on the lead-in wire connecting portion that will be installed on the spring terminal on the framework from the wire bonds of voice coil loudspeaker voice coil the time, easily the heat transferred of welding is arrived framework by the lead-in wire connecting portion, the heat of welding makes resinous framework surface melting, the installation site of spring terminal produces skew, as a result, meeting produces bad connection etc. aspect the electrical connection of the lead-out terminal of elastic contact chip on the equipment side circuit substrate of spring terminal.
Summary of the invention
The problem that the present invention will solve provides a kind of loudspeaker arrangement, it does not have the danger of melting resin system framework that spring terminal be installed owing to the heat that will produce when the wire bonds of voice coil loudspeaker voice coil is on spring terminal, positioning accuracy to the resin system framework installing and locating of spring terminal can be maintained high accuracy, prevent to produce the bad connection that the flexible terminal offset causes when lead-out terminal on the equipment side circuit substrate is electrically connected at the flexible connection piece of spring terminal.
The invention provides a kind of loudspeaker arrangement, it comprises: speaker unit, and it utilizes voice coil loudspeaker voice coil to drive oscillating plate; Resin system framework, it forms the installing frame of installing to equipment side, is used to accommodate above-mentioned speaker unit; The spring terminal of pair of metal system, it is fixed on the above-mentioned resin system frame; The lead-out terminal that will be installed on by above-mentioned a pair of spring terminal on the apparatus casing circuit substrate of the said equipment side is electrically connected with above-mentioned voice coil loudspeaker voice coil.Wherein, above-mentioned each spring terminal makes the framework adhesive portion that is bonded on the above-mentioned resin system framework, be arranged on this framework adhesive portion and weld above-mentioned voice coil loudspeaker voice coil lead-in wire the lead-in wire connecting portion and be arranged on the said frame adhesive portion and with elastic deformation be installed in the said equipment housing on the equipment side circuit substrate on the flexible connection piece that is connected of lead-out terminal form one, simultaneously, above-mentioned lead-in wire connecting portion is extended setting in a side of said frame adhesive portion, to have the heat release space of regulation between the surface of guaranteeing above-mentioned lead-in wire connecting portion and above-mentioned resin system framework.
Description of drawings
Fig. 1 is the stereogram of the loudspeaker arrangement of the embodiment of the invention;
Fig. 2 is the side view that loudspeaker arrangement shown in Figure 1 is installed in the state on the apparatus casings such as information equipment;
Fig. 3 is the A-A alignment view of Fig. 1;
Fig. 4 is the B-B line profile of Fig. 3;
Fig. 5 is the stereogram of the employed spring terminal of loudspeaker arrangement shown in Figure 1.
Embodiment
Below, the embodiment of the loudspeaker arrangement that present invention will be described in detail with reference to the accompanying.
Fig. 1 to Fig. 5 represents an embodiment of loudspeaker arrangement of the present invention.Fig. 1 is the stereogram of the loudspeaker arrangement of the embodiment of the invention; Fig. 2 is the side view that loudspeaker arrangement shown in Figure 1 is installed in the state on the apparatus casings such as information equipment; Fig. 3 is the A-A alignment view of Fig. 1; Fig. 4 is the B-B line profile of Fig. 3; Fig. 5 is the stereogram of the employed spring terminal of loudspeaker arrangement shown in Figure 1.
The loudspeaker arrangement 1 of the embodiment of the invention is because be installed in the information equipments such as portable phone and PDA, thus comprise by voice coil loudspeaker voice coil 11 drive oscillating plates 12 speaker unit 14, accommodate above-mentioned speaker unit 14 and form to the resin system framework 31 of the installing frame of apparatus casing 21 installations and be fixedly mounted on pair of metal system spring terminal 41,41 on this resin system framework 31.The lead-out terminal 53,53 that is assembled on the equipment side circuit substrate 51 on the apparatus casing 21 is electrically connected with above-mentioned voice coil loudspeaker voice coil 11 by above-mentioned a pair of spring terminal 41.
As shown in Figure 4, magnetic circuit 16 comprises the cylindric central magnetic pole 16a of the rear side that is configured in speaker unit 14, the cardinal extremity periphery of this central magnetic pole 16a is expanded into the brim of a hat shape and the first plate 16b that forms, be configured in the ringshaped magnet 16c on this first plate 16b and cover the second plate 16d of the ring-type on the magnet 16c opposite to each other with the first plate 16b, and the gap between the outer peripheral face of the inner peripheral surface of the second plate 16d and central magnetic pole 16a forms the magnetic gap 15 of accommodating voice coil loudspeaker voice coil 11.
Above-mentioned magnetic circuit 16 forms the external magnetic type magnetic circuit that makes flux concentrate on magnetic gap 15, drives voice coil loudspeaker voice coil 11 according to the signal of telecommunication of importing voice coil loudspeaker voice coil 11 to the central axis direction that arrow mark C represents.
As shown in Figure 4, resin system framework 31 utilize synthetic resin make speaker unit framework 17 chimeric big footpath first cylindrical portion 32, from an end of this first cylindrical portion 32 extend radially inner side and push the annulus 33 at the first plate 16b back side, second cylindrical portion 34 of the paths that oppositely extend to first cylindrical portion 32 from the inner peripheral of annulus 33 forms one.
First cylindrical portion 32 and second cylindrical portion 34 form with one heart, and the concave space that first cylindrical portion 32 and annulus 33 surround forms the resettlement section of magnetic circuit 16.
As shown in Figure 2, on the part of annulus 33, be formed with the stage portion 36 of depression in order to assemble a pair of spring terminal 41,41.
As shown in Figures 2 and 3, on this stage portion 36 equipment with the par 37 of surface contact state mounting spring terminal 41 be configured in terminal connecting hole 38a, the 38b that snap- latch piece 42a, 42b on the spring terminal 41 are engaged.
As Fig. 2 and shown in Figure 5, each spring terminal 41 utilizes the drawing of metallic plate to make following part form one: framework adhesive portion 42, and it is positioned on the par 37 of resin system framework 31, utilizes suitable bonding agent to be adhesively fixed on the par 37; Lead-in wire connecting portion 44, its connection is arranged on a side of said frame adhesive portion 42 and welds the voice coil loudspeaker voice coil of voice coil loudspeaker voice coil 11; Flexible connection piece 46, its connection be arranged on framework adhesive portion 42 opposite side and with elastic deformation be installed in apparatus casing 21 on equipment side circuit substrate 51 on lead-out terminal 53 contact and form electrical connection.
Form the sheet metal that the metallic plate preference of above-mentioned spring terminal 41 such as phosphor bronze, spring steel, stainless steel, beryllium copper, titanium copper etc. have elasticity and corrosion resistance.
As shown in Figure 5, will by be inserted in par 37 around the terminal connecting hole 38a, snap-latch piece 42a, the 42b bending that 38b engages that form be formed on the framework adhesive portion 42.
Engaging power when spring terminal 41 utilizes above-mentioned snap- latch piece 42a, 42b be fastened on terminal connecting hole 38a, the 38b of resin system framework 31 and be coated in framework adhesive portion 42 and par 37 between after the bonding agent generation bonding force and on the resin system of the being fixed on framework 31.
As Fig. 2 and shown in Figure 5, the lead-in wire connecting portion 44 of the spring terminal 41 of present embodiment continues to extend to form after step 44a is installed in framework adhesive portion 42 1 sides, guarantees the regulation heat release space S between the surface of lead-in wire connecting portion 44 and resin system framework 31.
In addition, flexible connection piece 46 is in order to afford at front end from strain swimmingly behind the pressing force of equipment side circuit substrate 51, will form circular-arc flexure plane 46a with the continuous position of framework adhesive portion 42.This flexure plane 46a is not to select the size of stage portion 36 and par 37 with the surperficial way of contact of resin system framework 31.
As shown in Figure 2, equipment side circuit substrate 51 with loudspeaker arrangement 1 after apparatus casing 21 is installed, on the substrate of loudspeaker arrangement 1 upside of packing into, under the state that suitably is fixed on apparatus casing 21 sides, make flexible connection piece 46 strains shown in Fig. 2 solid line to the position shown in the dotted line, and can press and be electrically connected a pair of spring terminal 41,41 and lead-out terminal 53,53 with the Elastic Contact of this moment.
On this equipment side circuit substrate 51, except above-mentioned lead- out terminal 53,53, for example can also carry and control necessary control circuit etc. to the amplifying circuit of lead-out terminal 53,53 output tone signal and the action of information equipment side.
More than in Shuo Ming the loudspeaker arrangement 1, welding has the heat release space S from the lead-in wire connecting portion 44 of the spring terminal 41 of the lead-in wire of voice coil loudspeaker voice coil 11 between the surface with resin system framework 31, directly do not contact with the surface of resin system framework 31.Therefore, heat with wire bonds to lead-in wire connecting portion 44 time is difficult to be delivered on the resin system framework 31, the heat melts resin system framework 31 in the time of can preventing wire bonds to spring terminal 41 and undesirable condition that the installation site of spring terminal 41 is offset.
Therefore, can be with spring terminal 41 to the positioning accuracy position of resin system framework 31 location in degree of precision, and can prevent to be electrically connected between flexible connection piece 46, the lead-out terminal on the equipment side circuit substrate 51 53,53 and the spring terminal 41 of spring terminal 41 time to produce spring terminal 41 offsets and the bad connection that causes.
In addition, the speaker unit of using among the present invention is not limited to vaulted shown in the foregoing description.Taper can be adopted as speaker unit, also oblong shape can be adopted.
The magnetic circuit of speaker unit is not limited to the external magnetic type shown in the foregoing description, also can be internal magnetic type.
The each several part size shape of spring terminal etc. can suitably carry out design alteration in the scope that does not break away from purport of the present invention.
Claims (1)
1. loudspeaker arrangement, it comprises the speaker unit that is driven oscillating plate by voice coil loudspeaker voice coil, accommodate above-mentioned speaker unit and form the resin system framework of the installing frame of installing to apparatus casing and be fixedly mounted on pair of metal system spring terminal on the above-mentioned resin system framework, the lead-out terminal that is assembled on the equipment side circuit substrate of the said equipment housing utilizes above-mentioned a pair of spring terminal to be electrically connected with above-mentioned voice coil loudspeaker voice coil, it is characterized in that, above-mentioned each spring terminal makes the framework adhesive portion that is bonded on the above-mentioned resin system framework, connect be arranged on the said frame adhesive portion and weld the lead-in wire connecting portion of lead-in wire of above-mentioned voice coil loudspeaker voice coil and connection is arranged on the said frame connecting portion and with elastic deformation be assembled in the said equipment housing on the equipment side circuit substrate on the flexible connection piece formation one that is connected of lead-out terminal, simultaneously, lead-in wire is provided with above-mentioned lead-in wire connecting portion in the side extension of said frame adhesive portion, guarantees the heat release space that has regulation between above-mentioned lead-in wire connecting portion and above-mentioned resin system framework surface.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP071952/04 | 2004-03-15 | ||
| JP2004071952A JP4293542B2 (en) | 2004-03-15 | 2004-03-15 | Speaker device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1694574A true CN1694574A (en) | 2005-11-09 |
Family
ID=35086046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510055840 Pending CN1694574A (en) | 2004-03-15 | 2005-03-15 | Loudspeaker device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4293542B2 (en) |
| CN (1) | CN1694574A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104581567A (en) * | 2015-01-20 | 2015-04-29 | 音品电子（深圳）有限公司 | Ultra-thin loudspeaker and assembling method thereof |
| WO2017045465A1 (en) * | 2015-09-15 | 2017-03-23 | 歌尔股份有限公司 | Receiver |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4671236B2 (en) * | 2006-05-29 | 2011-04-13 | パイオニア株式会社 | Speaker |
| JP5125799B2 (en) * | 2008-06-20 | 2013-01-23 | ソニー株式会社 | Lens barrel and manufacturing method thereof |
| KR101166727B1 (en) | 2010-06-17 | 2012-07-19 | 주식회사 이엠텍 | A sound converting apparatus |
| JP7248881B2 (en) * | 2018-10-17 | 2023-03-30 | アイコム株式会社 | SPEAKER TERMINAL CONNECTION STRUCTURE AND PORTABLE WIRELESS COMMUNICATION DEVICE INCLUDING THE SAME |
-
2004
- 2004-03-15 JP JP2004071952A patent/JP4293542B2/en not_active Expired - Fee Related
-
2005
- 2005-03-15 CN CN 200510055840 patent/CN1694574A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104581567A (en) * | 2015-01-20 | 2015-04-29 | 音品电子（深圳）有限公司 | Ultra-thin loudspeaker and assembling method thereof |
| WO2017045465A1 (en) * | 2015-09-15 | 2017-03-23 | 歌尔股份有限公司 | Receiver |
| US10244329B2 (en) | 2015-09-15 | 2019-03-26 | GoeItek Inc. | Receiver |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4293542B2 (en) | 2009-07-08 |
| JP2005260771A (en) | 2005-09-22 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20051109 |