CN1693932A - 用于光源和目标元件之间光耦合的扣合光学元件 - Google Patents
用于光源和目标元件之间光耦合的扣合光学元件 Download PDFInfo
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- CN1693932A CN1693932A CNA2005100072890A CN200510007289A CN1693932A CN 1693932 A CN1693932 A CN 1693932A CN A2005100072890 A CNA2005100072890 A CN A2005100072890A CN 200510007289 A CN200510007289 A CN 200510007289A CN 1693932 A CN1693932 A CN 1693932A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 44
- 230000008878 coupling Effects 0.000 title description 3
- 238000010168 coupling process Methods 0.000 title description 3
- 238000005859 coupling reaction Methods 0.000 title description 3
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920004738 ULTEM® Polymers 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/841,896 | 2004-05-06 | ||
US10/841,896 US6978068B2 (en) | 2004-05-06 | 2004-05-06 | Snap-fit optical element for optical coupling between a light source and target element using surface mount technology |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1693932A true CN1693932A (zh) | 2005-11-09 |
CN100419479C CN100419479C (zh) | 2008-09-17 |
Family
ID=35239525
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100072890A Expired - Fee Related CN100419479C (zh) | 2004-05-06 | 2005-02-06 | 用于光源和目标元件之间光耦合的扣合光学元件 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6978068B2 (zh) |
JP (1) | JP2005321772A (zh) |
CN (1) | CN100419479C (zh) |
DE (1) | DE102005007355B4 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103576259A (zh) * | 2012-07-24 | 2014-02-12 | 鸿富锦精密工业(深圳)有限公司 | 光纤连接器及组装方法 |
CN105526569A (zh) * | 2014-10-24 | 2016-04-27 | 集优光电股份有限公司 | 发光二极管灯泡的导电构造 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7313300B1 (en) * | 2002-10-30 | 2007-12-25 | Finisar Corporation | Systems and methods for manufacturing coaxial optical components |
US7302136B2 (en) * | 2003-03-19 | 2007-11-27 | Ahura Corporation | Assembly of optical components and method for assembling same |
KR100580753B1 (ko) | 2004-12-17 | 2006-05-15 | 엘지이노텍 주식회사 | 발광소자 패키지 |
US7324717B2 (en) * | 2005-11-22 | 2008-01-29 | Palo Alto Research Center Incorporated | Photonic device with integrated hybrid microlens array |
US7480432B2 (en) * | 2006-02-28 | 2009-01-20 | Corning Incorporated | Glass-based micropositioning systems and methods |
EP1959505B1 (en) * | 2007-02-14 | 2015-09-09 | Tridonic Jennersdorf GmbH | LED module with lens and its manufacturing |
US7792404B2 (en) * | 2007-11-19 | 2010-09-07 | Corning Incorporated | Glass-based laser ridges for adhesive confinement and related methods |
WO2013179288A1 (en) * | 2012-05-29 | 2013-12-05 | Essence Solar Solutions Ltd. | Self aligning soldering |
JP6087116B2 (ja) * | 2012-11-26 | 2017-03-01 | シチズン電子株式会社 | Led発光ユニット及びled発光装置 |
KR102300558B1 (ko) | 2014-12-26 | 2021-09-14 | 삼성전자주식회사 | 광원 모듈 |
CN105372773B (zh) * | 2015-12-25 | 2017-06-30 | 华进半导体封装先导技术研发中心有限公司 | 透镜载板、透镜载板制备方法和光功率监测模块 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5838703A (en) * | 1996-09-30 | 1998-11-17 | Motorola, Inc. | Semiconductor laser package with power monitoring system and optical element |
US5877560A (en) * | 1997-02-21 | 1999-03-02 | Raytheon Company | Flip chip microwave module and fabrication method |
WO2001054232A2 (en) * | 2000-01-20 | 2001-07-26 | Gryphics, Inc. | Flexible compliant interconnect assembly |
US6759687B1 (en) * | 2000-10-13 | 2004-07-06 | Agilent Technologies, Inc. | Aligning an optical device system with an optical lens system |
US6533391B1 (en) * | 2000-10-24 | 2003-03-18 | Hewlett-Packard Development Company, Llp | Self-aligned modules for a page wide printhead |
JP3682221B2 (ja) * | 2000-11-28 | 2005-08-10 | シャープ株式会社 | 半導体レーザ装置 |
US6754407B2 (en) * | 2001-06-26 | 2004-06-22 | Intel Corporation | Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board |
US6732904B1 (en) * | 2002-10-21 | 2004-05-11 | Feng-Chien Hsu | Solder ball holding terminal in a BGA arrangement |
-
2004
- 2004-05-06 US US10/841,896 patent/US6978068B2/en active Active
-
2005
- 2005-02-06 CN CNB2005100072890A patent/CN100419479C/zh not_active Expired - Fee Related
- 2005-02-17 DE DE102005007355A patent/DE102005007355B4/de not_active Expired - Fee Related
- 2005-04-19 JP JP2005121340A patent/JP2005321772A/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103576259A (zh) * | 2012-07-24 | 2014-02-12 | 鸿富锦精密工业(深圳)有限公司 | 光纤连接器及组装方法 |
CN107643571A (zh) * | 2012-07-24 | 2018-01-30 | 深圳迈辽技术转移中心有限公司 | 光纤连接器 |
CN108061949A (zh) * | 2012-07-24 | 2018-05-22 | 泉州市泉港凯威信息技术咨询有限公司 | 一种组装光纤连接器的工具组合 |
CN105526569A (zh) * | 2014-10-24 | 2016-04-27 | 集优光电股份有限公司 | 发光二极管灯泡的导电构造 |
Also Published As
Publication number | Publication date |
---|---|
US20050249463A1 (en) | 2005-11-10 |
US6978068B2 (en) | 2005-12-20 |
DE102005007355A1 (de) | 2005-12-01 |
JP2005321772A (ja) | 2005-11-17 |
DE102005007355B4 (de) | 2010-08-05 |
CN100419479C (zh) | 2008-09-17 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20061124 Address after: Singapore Singapore Applicant after: AGILENT TECHNOLOGIES, Inc. Address before: Singapore Singapore Applicant before: Avago Technologies General IP (Singapore) Pte. Ltd. |
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SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) CORPORAT Free format text: FORMER OWNER: AVAGO TECHNOLOGIES FIBER Effective date: 20130508 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20130508 Address after: Singapore Singapore Patentee after: Avago Technologies General IP (Singapore) Pte. Ltd. Address before: Singapore Singapore Patentee before: AGILENT TECHNOLOGIES, Inc. |
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TR01 | Transfer of patent right |
Effective date of registration: 20181109 Address after: Singapore Singapore Patentee after: Avago Technologies General IP (Singapore) Pte. Ltd. Address before: Singapore Singapore Patentee before: Avago Technologies General IP (Singapore) Pte. Ltd. |
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TR01 | Transfer of patent right |
Effective date of registration: 20201028 Address after: Singapore City Patentee after: Broadcom International Pte. Ltd. Address before: Singapore City Patentee before: Avago Technologies General IP (Singapore) Pte. Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080917 Termination date: 20220206 |
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CF01 | Termination of patent right due to non-payment of annual fee |