CD and telechiric device
Technical field
The present invention relates to CD and telechiric device.
Background technology
In recent years, the importance of id information increases.To comprise the experiment that the IC of id information is built in the extensive stock is also attempting.Expecting that this is applied in from now on further develops (for example patent documentation 1).In the past, do not propose the CD that the IC that comprises id information is arranged on the removable CD is carried out the method that physical property is explored.
Patent documentation 1: the spy opens the 2002-83482 communique.
Moving CD utilizes its movably performance, is distributed to everywhere after recorded content again.Therefore, need retrieval to be recorded in the method for the content on the moving CD.The object of the present invention is to provide a kind of CD and telechiric device, carry the IC that comprises id information, can retrieve the content of video disc recording by making CD.
Summary of the invention
In the present invention, transmitting antenna and receiving antenna are set, the transmitting-receiving IC of the id information of this CD of storage is connected on these antenna in the interior perimembranous of CD.
Utilize this CD, can constitute the system of retrieving the id information of each CD with wireless mode from record regenerator.
Description of drawings
Fig. 1 is the top view of the CD of one embodiment of the present invention.
Fig. 2 (a) is the top view of the CD of one embodiment of the present invention, and Fig. 2 (b) is the top view of chip section of the CD of one embodiment of the present invention.
Fig. 3 (a) is the electrolysis distribution plan of the directivity of expression antenna A, and Fig. 3 (b) is the electrolysis distribution plan of the directivity of expression antenna B, and Fig. 3 (c) is the electrolysis distribution plan of the directivity of expression antenna A+B.
Fig. 4 (a) is the top view of the CD of one embodiment of the present invention, and Fig. 4 (b) is the top view of chip section of the CD of one embodiment of the present invention.
Fig. 5 is the figure of the system appearance of expression an embodiment of the invention.
Fig. 6 is the block scheme of formation of CD, telepilot and the record regenerator of expression an embodiment of the invention.
Fig. 7 is the received signal of an embodiment of the invention and the sequential chart of detection signal.
Fig. 8 is the received signal of an embodiment of the invention and the histogram of detection signal.
Fig. 9 is the figure of data structure of the dish message file of expression an embodiment of the invention.
Figure 10 is the figure of data structure of the dish message file of expression an embodiment of the invention.
Figure 11 is the process flow diagram of the processing sequence of expression an embodiment of the invention.
Figure 12 is the process flow diagram of the processing sequence of expression an embodiment of the invention.
Figure 13 is the CD of an embodiment of the invention and the action synoptic diagram of telepilot.
Figure 14 is the figure of the workflow of expression CD of an embodiment of the invention and telepilot.
Figure 15 (a)~(c) is the action synoptic diagram of pallet of the record regenerator of an embodiment of the invention.
Figure 16 is the top view of the CD of one embodiment of the present invention.
Figure 17 (a)~(d) is the synoptic diagram of installation action of the dish of an embodiment of the invention.
Figure 18 is the process flow diagram of the processing sequence of expression an embodiment of the invention.
Figure 19 is the process flow diagram of the processing sequence of expression an embodiment of the invention.
Figure 20 is the process flow diagram of the processing sequence of expression an embodiment of the invention.
Figure 21 is the block scheme of formation of the record regenerator of expression an embodiment of the invention.
Figure 22 is the process flow diagram of the processing sequence of expression an embodiment of the invention.
Figure 23 is the process flow diagram of the processing sequence of expression an embodiment of the invention.
Figure 24 (a)~(c) is the figure of detection method of the id information of expression an embodiment of the invention.
Figure 25 is the top view of the CD of one embodiment of the present invention.
Figure 26 is the process flow diagram of the processing sequence of expression an embodiment of the invention.
Figure 27 (a)~(c) is sectional view expression an embodiment of the invention, that form the operation that has the substrate of imbedding the hole.
Figure 28 is the sectional view that the formation of expression an embodiment of the invention has the operation of the substrate of imbedding the hole.
Figure 29 (a)~(e) is the IC module on the substrate of expression an embodiment of the invention and the figure of the position between Information Level relation.
Figure 30 (a)~(e) is the figure of operation of the angulation identification marking of expression an embodiment of the invention.
Figure 31 (a) is the top view of antenna part of the CD of one embodiment of the present invention, and Figure 31 (b) is the sectional view of antenna part of the CD of one embodiment of the present invention.
Figure 32 is the sectional view of IC module operation of antenna part of the CD of one embodiment of the present invention.
Figure 33 (a) and (b) are sectional views of stickup operation of antenna part of the CD of one embodiment of the present invention.
Figure 34 (a) and (b) are sectional views of formation operation of interior perimembranous of the CD of one embodiment of the present invention.
Figure 35 is the figure of manufacturing process of the IC module of expression one embodiment of the present invention.
Figure 36 (a)~(f) is the figure of manufacturing process of the IC module of expression one embodiment of the present invention.
Figure 37 is the figure of efficient of the antenna of expression an embodiment of the invention.
Figure 38 (a) is the figure of the direct formation antenna of expression an embodiment of the invention,
Figure 38 (b) is the figure of operation of the Direct Bonding IC of expression an embodiment of the invention,
Figure 38 (c) is that the secondary substrate of use (sub-substrate) of expression an embodiment of the invention is installed the figure of the operation of IC.
Figure 39 (a)~(d) is installation single turn antenna of expression one embodiment of the present invention and the process chart of IC.
Figure 40 (a)~(e) is installation multiturn antenna of expression one embodiment of the present invention and the process chart of IC.
Figure 41 is the figure of formation of the Information Level of expression one embodiment of the present invention.
Figure 42 is the figure that forms the operation of antenna lead and capacitor in the Information Level film formation process of expression one embodiment of the present invention.
Figure 43 (a)~(c) is the figure of formation operation of IC, antenna and the capacitor of expression an embodiment of the invention.
Figure 44 (a)~(c) is the figure of the resonant circuit of expression an embodiment of the invention.
Figure 45 (a) is the figure of the mask shape of one embodiment of the present invention, and Figure 45 (b) is 4 of one embodiment of the present invention figure of the operation of film forming simultaneously.
Figure 46 (a) is the manufacturing procedure picture of the IC piece of expression an embodiment of the invention, and Figure 46 (b) is the manufacturing procedure picture of the dish of expression an embodiment of the invention, and Figure 46 (c) is the figure of the equivalent resonant circuit of expression an embodiment of the invention.
Figure 47 (a) is the figure of the mask shape of one embodiment of the present invention, and Figure 47 (b) is antenna one embodiment of the present invention, after forming and the top view of reflectance coating.
Figure 48 (a) is the figure of the mask shape of one embodiment of the present invention, and Figure 48 (b) is antenna one embodiment of the present invention, after forming and the top view of reflectance coating.
Figure 49 (a) is the rear view of the antenna of one embodiment of the present invention, Figure 49 (b) is the top view of the antenna of one embodiment of the present invention, Figure 49 (c) is the rear view of the antenna of one embodiment of the present invention, Figure 49 (d) is the sectional view of the antenna of one embodiment of the present invention, and Figure 49 (e) is the cross section enlarged drawing of the antenna of one embodiment of the present invention.
Figure 50 (a) is the top view of the telepilot of one embodiment of the present invention, and Figure 50 (b) is the side view of the telepilot of one embodiment of the present invention, and Figure 50 (c) is the rear view of the telepilot of one embodiment of the present invention.
Figure 51 is the figure of the communication flows of expression telepilot of one embodiment of the present invention and regenerating unit.
Figure 52 is the figure of the communication flows of expression telepilot of one embodiment of the present invention and record regenerator.
Embodiment
Below, with reference to the description of drawings embodiments of the present invention.
(formation of CD)
Below, the embodiment when the present invention is used for disc-shaped recording medium is described.
Fig. 1 illustrates a routine structure of the CD 1 of embodiment of the present invention.
Interior perimembranous at CD 1 is provided with transmitting antenna 2 and receiving antenna 3.Transmitting antenna 2 and receiving antenna 3 form along the circumferencial direction of CD 1.In this embodiment, transmitting antenna 2 and receiving antenna 3 all are dipole antennas.
In the interior perimembranous of CD 1, and then the transmitting-receiving IC4 that is connected on transmitting antenna 2 and the receiving antenna 3 is set.Transmitting-receiving IC4 receives radiowave through receiving antenna 3, sends radiowave through transmitting antenna 2.In this embodiment, transmitting-receiving IC4 forms on chip.This chip is called the RFID chip.
Central part at CD 1 is provided with the hole 5 that is used to be installed on the rotating part that makes CD 1 rotation.
Can write down or the Information Level 6 of regenerating information in the peripheral part setting of CD 1.Information Level 6 forms between substrate 7 and hyaline layer 8.Between substrate 7 and Information Level 6, form adhesive linkage 9.
Fig. 2 (a) is with the figure after near the amplification of transmitting antenna shown in Figure 12 and receiving antenna 3.
Transmitting antenna 2 has the 2a of transmitting antenna portion, 2b.Receiving antenna 3 has the 3a of receiving antenna portion, 3b.The 90 ° of configurations of staggering of the direction of the 2a of transmitting antenna portion, 2b and the 3a of receiving antenna portion, 3b.
Fig. 2 (b) is with the figure after near the amplification of transmitting-receiving IC4 shown in Figure 1.
The 3a of receiving antenna portion, 3b are connected on the transmitting-receiving IC4 through relay substrate 11.The 2a of transmitting antenna portion, 2b are connected on the transmitting-receiving IC4 through lead-in wire 10a, 10b and relay substrate 11.Lead-in wire 10a is used for prolonging the 2a of transmitting antenna portion, and lead-in wire 10b is used for prolonging the 2b of transmitting antenna portion.Lead-in wire 10a, 10b are parallel to each other.
Shown in the B-B ' section of Fig. 2 (a), the degree of depth of digging under the part of the substrate 7 of configuration relay substrate 11 is d.Depth d is designed to make when being installed in CD 1 on the record regenerator transmitting-receiving IC4 not contact with record regenerator.Here, record regenerator is to carry out wherein one device at least in writing task on recording the information in CD 1 and the reproduction operation that the information that is recorded in CD 1 is regenerated.
If the length of establishing the 2a of transmitting antenna portion, the 2b (or the 3a of receiving antenna portion, 3b) of dipole antenna is L, wavelength is λ, and then because of L=λ/4, so λ=300/f is for the frequency of 2.4GHz, λ=125mm, L=31.3mm.Therefore, can be that the interior perimembranous of the standard optical disc of 120mm is provided with transmitting antenna 2 and receiving antenna 3 at diameter.
The directivity of dipole antenna is described with reference to Fig. 3.
Fig. 3 (a) illustrates the directivity of dipole antenna A.As seen from the figure, the length direction of the dipole of antenna A (Y direction) does not have sensitivity.
Fig. 3 (b) illustrates the relative dipole antenna A directivity of dipole antenna B of 90 ° of configurations that staggers.As seen from the figure, the length direction of the dipole of antenna B (directions X) does not have sensitivity.
The directivity of antenna when Fig. 3 (c) illustrates dipole antenna A and dipole antenna B combining and configuring.As seen from the figure, the relative dipole antenna A of the dipole antenna B 90 ° of configurations of staggering.Make the blind area of antenna A and the blind area quadrature of antenna B, thus, can realize the antenna of non-blind area.
Transmitting antenna 2 (Fig. 1) and receiving antenna 3 (Fig. 1) are configured to make the blind area of transmitting antenna 2 and the blind area quadrature of receiving antenna 3.Therefore, shown in Fig. 3 (c), can realize the antenna of non-blind area.As a result, even no matter which direction CD 1 is placed on, the transmitting-receiving IC4 that can detect CD 1 goes up the id information (RFID) of storage.
Fig. 4 (a) illustrates another example of structure of the CD 1 of embodiment of the present invention.In this embodiment, replace dipole antenna and use tours antenna.
Interior perimembranous at CD 1 is provided with transmitting antenna 2 and receiving antenna 3.Transmitting antenna 2 and receiving antenna 3 form along the circumferencial direction of CD 1.In this embodiment, transmitting antenna 2 and receiving antenna 3 all are tours antennas, and receiving antenna 3 is configured in outer Monday of the side of transmitting antenna 2.
And then be connected in transmitting-receiving IC4 (with reference to Fig. 4 (b)) on transmitting antenna 2 and the receiving antenna 3 in the interior perimembranous setting of CD 1.Transmitting-receiving IC4 receives radiowave through receiving antenna 3, and sends radiowave through transmitting antenna 2.
Fig. 4 (b) is the figure after the part of the A shown in Fig. 4 (a) is amplified.Terminal 2a, the 2b of transmitting antenna 2 and terminal 3a, the 3b of receiving antenna 3 are connected on the transmitting-receiving IC4 through relay substrate 11.
If establishing the length of tours antenna circumference is L, wavelength is λ, and antenna is arranged to L=λ.Because of λ=300/f, so L=125mm.The thickness of antenna if frequency is fGHz, then is 2/ √ f μ m rule of thumb.Therefore, when f=2.45GHz, as long as the thickness of antenna is more than or equal to 1.5 μ m.
Like this, the CD 1 that comprises the antenna that forms along the circumferencial direction of CD 1 and the transmitting-receiving IC4 by this antenna receiving-sending radiowave is within the scope of the invention.The antenna that forms on the CD 1 is not limited to above-mentioned 2 kinds of antennas (dipole antenna, tours antenna).
(utilizing telepilot to obtain the method for ID)
Fig. 5 illustrates the outward appearance of CD 1, telepilot 15, record regenerator 35 and display part 100.The example that Fig. 6 illustrates CD 1, telepilot 15 and record regenerator 35 constitutes.
When push telepilot 15 check button 16 time, shown in arrow 19a, like that, 1 irradiation has characteristic frequency (for example, electric wave 2.45GHz) to CD shown in arrow 19a for sending part 17 and transmitting antenna 18.This electric wave is received by the receiving antenna 3 of CD 1, and detection section 21 detections by receiving circuit 20 obtain electric power 22 and signal.Electric power 22 is sent to signal generation 23, temporarily is stored in the electrical power storage portions 24 such as capacitor.Utilize this faint electric power, from id number storage part 26, read ID25, generate the modulation signal that comprises id number by id number generating unit 27 and modulation portion 28.Modulation signal is postponed and time constant 30 time corresponding by time adjustment part 29.Time constant 30 preestablishes when making transmitting-receiving IC4, and each transmitting-receiving IC4 is different.
ID25 is the information that is used for discerning CD 1.ID25 is called id information again.ID25 is not limited to number (also can be the combination of letter, numbers and symbols etc.).Signal generation 23 responses produce the signal that comprises id information from the signal of receiving circuit (acceptance division) 20 outputs.
Fig. 7 illustrate the received signal that receives from telepilot 15, from a plurality of CDs 1 (#1~#4) come to the response signal of this received signal and by a routine waveform of telepilot 15 detected detection signals.
In CD #1, #2, #3, #4, the response time from the received signal of telepilot 15 is had nothing in common with each other, be respectively t1, t2, t3, t4.This is to have nothing in common with each other because be installed in the time constant 30 of the transmitting-receiving IC4 among CD #1, #2, #3, the #4 respectively.Therefore, from the waveform of the response signal of CD #1, #2, #3, #4 as shown in Figure 7, have nothing in common with each other.
By the waveform of telepilot 15 detected detection signals as shown in Figure 7.Because of separated in time from the response signal of CD #1, #2, #3, #4, even so have a plurality of CDs 1 in the scope that the electric wave from telepilot 15 can arrive, telepilot 15 also can separate the signal that sends from a plurality of CDs 1 and detect in time.Thus, can prevent to conflict mutually from the response signal of a plurality of CDs 1.
In telepilot 15, utilize time tripping device 32 (Fig. 6) to separating in time from the response signal of a plurality of CDs 1.Thus, can stably specify the ID of each CD 1.
Have, if in advance each transmitting-receiving IC4 is not set mutually different time constant 30, and random number generating unit 34 is set, the generation time constant also can obtain same effect at random.
Fig. 8 illustrate the received signal that receives from telepilot 15, from a plurality of CDs 1 (#1~#4) come to the response signal of this received signal and by another routine waveforms of telepilot 15 detected detection signals.
In CD #1, #2, #3, #4, the bias from the centre frequency of the response signal of the received signal (for example, having the pumping signal of specific centre frequency) of telepilot 15 is had nothing in common with each other, be respectively f1, f2, f3, f4.This is because the cause that the frequency of being set by the frequency setting portion in the transmitting-receiving IC4 that is installed in respectively among CD #1, #2, #3, the #4 31 has nothing in common with each other.Therefore, from the waveform of the response signal of CD #1, #2, #3, #4 as shown in Figure 8, have nothing in common with each other.
By the waveform of telepilot 15 detected detection signals as shown in Figure 8.Because of separated in time from the response signal of CD #1, #2, #3, #4, even so in the scope that the electric wave from telepilot 15 can arrive, have a plurality of CDs 1, telepilot 15 also can with from the signal of a plurality of CDs 1 transmissions in the frequency separation and detect.Thus, can prevent to conflict mutually from the response signal of a plurality of CDs 1.
In telepilot 15, utilize frequency separating device 33 (Fig. 6) on frequency, separating from the response signal of a plurality of CDs 1.Thus, even also can stably specify the ID of each CD 1 in the identical time period.
Have, in Fig. 7 and example shown in Figure 8, the quantity of the CD 1 of response received signal is not limited to 4 again.Can there be n CD 1 to go to respond received signal.Here, n is the arbitrary integer more than or equal to 1.
In addition, in example shown in Figure 6, time adjustment part 29 and 31 boths of frequency setting portion are included in the signal generation 23.This is well for the response signal that can separate from a plurality of CDs 1 from frequency again from the time, still, the side in time adjustment part 29 and the frequency setting portion 31 is included in the signal generation 23.At this moment, the acceptance division of telepilot 15 also can only comprise the side in time tripping device 32 and the frequency separating device 33.
(the dish information management of record regenerator)
Secondly, the exchanges data of telepilot 15 and record regenerator 35 is described with reference to Fig. 6.
ID reproducing unit 36 receives the received signal that comprises ID, generates id information 37.Id information 37 is to handling part 38 outputs.Handling part 38 shows id information 37 on the display part 39 of telepilot 15, simultaneously, send id informations 37 from the sending part 42 of Department of Communication Force 40 to the acceptance division 44 of the Department of Communication Force 41 of record regenerator 35.Communication means between Department of Communication Force 40 and the Department of Communication Force 41 can be optical communication, also can be radio communication.
When utilizing optical communication to communicate communication between portion 40 and the Department of Communication Force 41, standard facility sends the illuminating part used up and sending part 42 in the remote signal of telepilot 15 can dual-purpose, and standard facility receives light accepting part and the acceptance division 44 used up in the remote signal of record regenerator 35 also can dual-purpose.At this moment, because of sending part 42 and acceptance division 44 needn't newly be set, so can cut down 1 group of Transmit-Receive Unit (being subjected to the light luminescence unit).
When utilizing wireless mode to communicate communication between portion 40 and the Department of Communication Force 41, Department of Communication Force 40 is provided with transmitting antenna 46 and receiving antenna 47, Department of Communication Force 41 is provided with transmitting antenna 49 and receiving antenna 48, WLAN modes such as the bluetooth of the electric wave by adopting frequency of utilization 2.4GHz or IEEE802.11b can be carried out two-way communication between Department of Communication Force 40 and Department of Communication Force 41.At this moment, the transmitting antenna 46 of telepilot 15 can with transmitting antenna 18 dual-purposes, receiving antenna 47 can with receiving antenna 50 dual-purposes.Thus, can cut down 1 group of dual-mode antenna.
The id information 37 that the acceptance division 44 of Department of Communication Force 41 has received to handling part 51 outputs.In handling part 37, search part 52 retrieval dish message files are obtained the dish physical attribute information 54 and the dish logical message 55 that meet id information 37.
Fig. 9 illustrates a routine data structure of dish message file 53.
In dish message file 53, to id information 37 distribution plate management number 57.This is that by using the virtual ID of lacking than the data volume of id information 37, promptly management ID can be gone with less data volume in disk management number 57 (for example " 04 ") because id information 37 is the data (for example, 128 bit data) more than at least 100.
Dish message file 53 comprises the dish physical attribute information 54 of each ID and dish logical message 55.
In dish physical attribute information 54, the data such as the number of plies 61 (1 layer still 2 layers etc.) of the residual capacity 59 of the total memory capacity 58 of representing this dish, this dish, the kind 60 of this dish (could write down again, whether can only write down 1 time, whether ROM etc.), this dish have been write down.
Write down and the program-associated information that is recorded in this dish (programme information 70) on the dish logical message 55.Programme attribute data or the information relevant or short-movie of content etc. in programme information 70, have been write down with content.
As an example of the programme information 70 in the dish logical message 55, Figure 10 illustrates programme information 70a, 70b.
Programme information 70a represents the programme information of program 1.Programme information 70a comprises program ID71, attribute data 72 and content-data 86.
Attribute data 72 do not comprise start address 73, end address 74, summary journal time 75, be connected on time (writing time) 77, the source of record or the contents attribute information 80 (personage's who appears on the scene in the kind 81 of program, the program name 82, area 83, programme content 84) of TV channel number 78, program title 79 and program of ID (link destination program ID) 76, start-of-record and the end of the program behind this program.In addition, when being the program that links with Web, attribute data 72 and then comprise the address (URL) 85 of the Web that links the destination.
Content-data 86 comprises still image 87 (for example, the still images such as JPEG of the initial picture of program 1), the beginning dynamic image data 88 (exemplary picture (short-movie (thumbnail)) such as high resolving power dynamic image 90 of two-forties such as low resolution dynamic image 89, MPEG2 such as MPEG4 in several seconds.Content-data 86 also comprises the short-movie data 91 that short-movie is pooled together.
With reference to Figure 11,12 process flow diagram, illustrate to obtain ID and use this ID to show the attribute information of the dish that meets with it or the method for content short-movie.
In step 95a, the id information that record regenerator 35 acquisitions are sent here from telepilot 15.In step 95b, when record regenerator 35 obtained different with the current id information that obtains new id information, in step 95c, handling part 51 was defined as n id information (that is ID (n)) with new id information.In step 95d, handling part 51 uses search part 52 retrieval dish message files 53 (Fig. 9, Figure 10).In step 95e, whether the relevant data with ID (n) are arranged in the handling part 51 judgement dish message files 53.When judgement is " Yes " in step 95e (, when in dish message file 53, the data relevant with ID (n) being arranged), in step 95f, handling part 51 judges whether telepilot 15 has the ability of display image, or whether telepilot 15 has the request of display image.When judgement is " Yes " in step 95f, in step 95g, establish m=0, in step 95h, make m add 1.In step 95j, the view data (dynamic image data 89,90 or static image data 87 or short-movie data 91 (Figure 10)) that handling part 51 uses search part 52 to read m the programme information 72 (program m) corresponding with ID (n) from dish message file 53.In step 95k, handling part 51 through communication line (sending part 45, transmitting antenna 49) to telepilot 15 transmitted image data.In step 95m, the acceptance division 43 of telepilot 15 receives view data, and in step 95n, handling part 38 uses the view data of 100 pairs of receptions of picture decoder to expand, and shows image expanding data (Figure 13 (d)) on display part 39.Thus, even CD 1 is not contained in the record regenerator 35, as long as telepilot 15 near CD 1, just can be confirmed the short-movie of the content of record in each CD 1 by dynamic image or still image.In step 95p, handling part 38 process decision charts finish not as data presentation, and continue to show that this view data finishes up to this view data demonstration.Even after this view data shows end, in step 95q, handling part 38 also continues the demonstration of this view data till the request that has next new image to show or having passed through the regular hour.The request that next new image shows is for example undertaken by the next picture button 101 (Fig. 5) that the user pushes telepilot 15.When request that the new image of the next one shows, result of determination becomes " Yes " in step 95q, handles to enter step 95y.In step 95y, judge whether last m is, as m when not being last, handle entering step 95h.In step 95h, make m add 1.In step 95j, handling part 38 shows next new image on display part 39.
For example, on using the display part 39 of dynamic image, during the short-movie of display program, send dynamic images to telepilot 15 from record regenerator 35 (server) at telepilot 15.Handling part 51 is read the dynamic image data (for example, the dynamic image data in initial 5 seconds of program 1) of the short-movie of expression program 1 from dish message file 53, and sends to telepilot 15.Dynamic image data for example is the low resolution dynamic image data 89 of MPEG4 level.Handling part 38 receiving dynamic image datas, and make it on display part 39, show (Figure 13 (d)).When the user pushed the next picture button 101 of telepilot 15, handling part 51 was read the dynamic image data (for example, the dynamic image data in 5 seconds of beginning of program 2) of the short-movie of expression program 2 from dish message file 53, and sent to telepilot 15.Handling part 38 receiving dynamic image datas, and make it on display part 39, show (Figure 13 (d)).
In step 95q, when request that next image shows, perhaps, when the user asks the demonstration of previous picture by the previous picture button 102 of pushing telepilot 15, in step 95y,, obtain next id information if m then turns back to initial step 95a at last.Then, carry out the work identical with the explanation of front.
In the present embodiment, be that example is illustrated with the situation that the image of common image quality and low resolution dynamic image 89 both sides are recorded in the dish message file 53, also can be the image of common image quality but be recorded in the dish message file 53.At this moment; when the output of common image quality image, carry out speed conversion by image (for example, the MPEG2 image of 6Mbps) to common image quality; also can obtain low resolution dynamic image 89 (for example MPEG4 image of 384kbps), again this low resolution dynamic image 89 be sent to telepilot 15.
(telepilot is the action during display image not)
When in step 95f, judging when being " No " when display image (, telepilot 15 not), handle the step 96a~96c that enters Figure 12, then enter step 96d when being " No " if in step 96c, judge.In step 96d, handling part 51 uses search part 52 to read the attribute data 72 of m the programme information 72 (program m) corresponding with ID (n), in step 96e, finally transmits to telepilot 15 through communication line.In step 96f, the acceptance division 43 of telepilot 15 receives attribute data, and in step 96g, handling part 38 is display properties data (for example, residual capacity) or listing on display part 39.When user under the state of display part 39 display program tables pushes the downward button 104 (Figure 14) of telepilot 15, select the program of the following direction of picture.
For display program table on the display part 39 of telepilot 15, as shown in figure 14, near CDs 1, what (2) user pushed telepilot 15 checks button 16 to (1) user with telepilot 15.The result, (3) telepilot 15 reads the ID of CD 1, (4) telepilot 15 sends the ID that reads to record regenerator 35, and (5) record regenerator 35 searching databases are obtained the listing data, and (6) record regenerator 35 sends the listing data to telepilot 15.So, listing shows on the display part 39 of telepilot 15.(7) when the user pushes the downward button 104 of telepilot 15, select the program of the following direction of picture.
The order that shows with reference to the flowchart text listing of Figure 12.
In step 96h, handling part 38 judges whether the demonstration of attribute data or listing finishes, and continues to show that this attribute data or listing finish (Figure 14) up to the demonstration of this attribute data or listing.In step 96i, handling part 38 judges that whether display part 39 is just at the display program table.If judge it is " Yes " in step 96i, then handling part 38 judges whether pushed scroll button 101~104 (Figure 14) in step 96k.As if judging in step 96k is " Yes ", then the program marker in the handling part 38 change listings in step 96m.Secondly, when pushing selection key 105 or image button 106 (Figure 14), in step 96p, handling part 38 judges that could carry out image shows.If judge it is " Yes " in step 96p, then handling part 38 shows short-movie image, dynamic image or the still image of the program of having selected on display part 39 in step 96q.Handling part 38 judges whether listing finishes in step 96r, if judge it is " Yes " in step 96r, then enters step 96j.If in step 96p, judge it is " No " (that is, when can not image showing), then enter step 96s.In step 96s, handling part 38 shows the detailed attributes data of tagged program on display part 39.This attribute data is read from dish message file 53, and sends to telepilot 15, shows on the display part 39 of telepilot 15.Attribute data for example as shown in figure 10, the kind 81, name 82, area 83, content 84 and the expression that are this program see whether this program needs the charging identifier 85a that charges, or are used to decipher and the address of the Web that charges or the link destination-address 85 of expression URL.In step 96f, handling part 38 judges whether listing finishes, if judge it is " Yes " in step 96f, then enters step 96j.Handling part 38 is judged the demonstration request whether next attribute data is arranged in step 96j.If in step 96j, judge it is " Yes ", then return step 96b, make m add 1, from dish message file 53, read m attribute data, and repeat on display part 39, to show the action of this attribute data of reading.
(link with other machines after work)
In step 95r, handling part 51 is judged and could be connected with other machines or server, if judge it is " No " in step 95r, then enters step 95u.Handling part 51 sends the message of " data that do not meet " or represents the information of this message to telepilot 15 through communication line in step 96u.And make this message or represent that the information of this message shows on the display part 39 of telepilot 15.If judge it is " Yes " in step 95r, then in step 95s, handling part 51 is connected with other handset devices 35a through Department of Communication Force 41, communication line 283 and Department of Communication Force 41a.Communication line 283 can be wired, also can be wireless, also can be the Internet 284 as shown in Figure 6.In step 95s, the handling part 51a retrieval dish message file 53a of handset device 35a.In step 95t, in the handling part 51a judgement dish message file whether the data that meet ID (n) are arranged.If in step 95t, judge it is " Yes ", then enter step 95v.Handling part 51 is judged telepilots 15 display image of whether having the ability in step 95v, and perhaps, whether telepilot 15 has the request of display image.If judge it is " Yes " in step 95v, then in step 95w, handling part 51 is read the corresponding view data with ID (n) from dish message file 53.In step 95x, handling part 51 is given master machine (that is, the record regenerator 35 of Fig. 6) through Department of Communication Force 41a, communication line 283 and Department of Communication Force 41 with the image data transmission of reading, and returns step 95k.
If in step 95v, judge it is " No " (that is, when telepilot 15 can not display image), then enter the step 96j of Figure 12, handling part 51 is read m the attribute data corresponding with ID (n) from dish message file 53.In step 95k, handling part 51 sends to master machine (that is, the record regenerator 35 of Fig. 6) through Department of Communication Force 41a, communication line 283 and Department of Communication Force 41 with the attribute data of reading, and enters step 96e.In step 96e, attribute data finally sends to telepilot 15 from master machine.As a result, display properties data on the display part 39 of telepilot 15.
(method of the loss of time when in record regenerator, reducing record regenerating)
Secondly, with reference to the genesis sequence of the dish message file of the flowchart text record regenerator 35 of Figure 18.
As Figure 15 (a) with (b), near the pallet 113 of placing CD 1, main body antenna 110 is set, in the inside of pallet 113 pallet antenna 112 is set.
Main body antenna 110 sends electric wave (step I11a) termly or when pallet 113 is pulled out.Therefore,, utilize the electric wave that sends from main body antenna 110, read the id information of CD 1 when the CD 1 that the ID chip is housed during near pallet 113 (step 111b).Judge whether the reading of id information of CD 1 finishes (step 111c).
When CD 1 is put into pallet 113, place signal and become ON (step 111d).When the placement signal became ON, pallet antenna 112 sent electric waves (step 111e).Utilization is read the id information of CD 1 from the electric wave that pallet antenna 112 sends.Judge whether the reading of id information of CD 1 finishes (step 111f).
Because of just knowing that in this stage what CD of back 1 can be inserted into record regenerator 35 and regenerates or record, so the data in can the dish message file 53 of service recorder regenerating unit 35 begin to regenerate or record.
After id information has read, as shown in figure 17, withdrawal pallet 113 (step 111g), CD 1 is contained in the electric rotating machine portion 121, and CD 1 begins rotation (step 111h).
As shown in figure 16, be in the inner ring portion of CD 1 and form the bar code 114 that is known as BCA circle-shapedly.Each Zhang Guangpan 1 of bar code 114 record are different ID number.In factory, will be stored in the corresponding BCA information of id information among the IC4 that CD 1 installs (below, be called the id information of IC) and be recorded on the BCA.Certainly, also can make BCA information comprise the information same with the id information of IC.Below, the id information that comprises in the BCA information is called the id information of BCA.In regular CD, the id information of IC is consistent with the id information of BCA.Record regenerator 35 reads the id information (step 111j) of BCA, makes the id information contrast (step 111j) of the id information of BCA and IC, judges that both are whether consistent or a certain specific relation (step 111k) is arranged.When judgement is " No " in step 111k, record regenerator 35 is thought illegal disk and is ended record or regeneration (step 111m), pallet 113 stretches out (step 111n) to the outside, and display part 151 (Figure 21) shows " id information mistake " (step 111p).Thus, can prevent the illegal use of CDs such as bootlegging or illegal regeneration.
Here, when record regenerator 35 is brought into use this CD 1, as shown in Figure 9, be recorded in the dish message file 53 with the id information 37 that utilizes radiowave to read from CD 1 with from the optically read optics id information 115 of BCA.Medium ID116 and cryptographic key piece 117 are recorded in the dish message file 53 (step 111q) as shown in Figure 9.In addition; when CD 1 is recording type optical disc; from being used for limiting so-called MKB (the Media Key Block: the key of selecting to be suitable for machine the cryptographic key piece 117 key media key block) that the copyright protection of repeatedly duplicating is used; use this cryptographic key and the medium ID116 corresponding with optics id information 115; internally perhaps corresponding with content information encryption records the recording areas (step 111r) of CD 1 again.
In step 111s, still image coding device 131 (Figure 21) compresses the initial still image from each scene of the content of input part 130 input, and short-movie handling part 135 will be recorded in the dish message file 53 through the still image after 131 compressions of still image coding device.Low image quality image encoder 132 (Figure 21) makes the short-movie of the such low image quality image of MPEG4 according to the content from input part 130 inputs in the specific time (for example 20 seconds), and short-movie handling part 135 will be recorded in by the short-movie of the low image quality image that hangs down 132 generations of image quality image encoder in the dish message file 53.In addition, the image of image quality is recorded in the dish message file 53 after being compressed by image encoder 133 usually.In step 111t, when copyright protection was labeled as ON, the content record after will being encrypted by cryptography device 134 was in dish message file 53 (step 111u).
Continuation with reference to the flowchart text flow process shown in Figure 180 of Figure 19.In step 119a, if with CD 1 near pallet 113, then, be provided with proximity transducer 150 in the front of pallet 113, so detection signal becomes ON because of or as shown in Figure 21 as Figure 15.In step 119b, antenna 110 emission detection ripples.In step 119c, return the response signal that comprises id information from CD 1, this id information read end.In step 119d, when CD 1 is put into pallet 113, place signal and become ON, send electric wave (step 119e) from antenna 112 to CD 1.When reading of id information in step 119f finished, in step 119g, on display part 151, show the attribute information (for example, the residual capacity of CD 1) of id information or this CD 1.In step 119o, when having the dish message file 53 relevant, in the time of can shortening regeneration or the stand-by period when writing down with this CD 1.In step 119h, when pushing the regeneration initiating key, regain pallet 113, make CD 1 rotation (step 119j).In step 119k, from the dish message file 53 of record regenerator 35 records, read cryptographic key pieces such as medium ID, MKB, in step 119m, the content information of record among the HDD of playback record regenerating unit 35 etc.When content is encrypted, enter step 119p, use medium ID and cryptographic key piece to generate decoding and uses cryptographic key, the plain code that the content after obtaining will encrypting has been deciphered.In step 119q, use the AV code translator that plain code is deciphered, the video-audio signal of output numeral again.These data are read by the content record portion of dish message file.
Secondly, export the data of reading from CD 1.Says in detail a bit, in step 119r, regain pallet 113, the regeneration of beginning CD 1, from the optics id information of CD 1 optically read CD 1, in step 119t, whether judgement optics id information and wireless id information be consistent or specific relation is not arranged.When judgement is " No " in step 119t, coil message file accordingly if having, then output short-movie wherein with priority processing optics id information.If do not coil message file accordingly with the optics id information, then standby (step 119u) before obtaining from the signal of CD 1.In step 119v, judge whether to have begun the regeneration of CD 1, and in step 119w, prepare output signal is switched to regenerated signal from CD 1 from the signal of being read by the dish message file.The switching of output signal makes from the time mark of the signal read of dish message file and conforms to time mark from the regenerated signal of CD 1.In step 119x, at one time and the interval of pressing GOP switch output signal (step 119y), under common regeneration mode, regenerate (step 119z).
When judgement among the step 119h at Figure 19 is " No " (, when not pushing the regeneration initiating key), in step 119i, judge and whether pushed recorder run key.If in step 119i, judge when being " Yes " step 120 that then enters Figure 20.
In step 120, judge and whether carried out the record more than at least 1 time, and judge the dish message file that whether has this CD 1.When judgement is " Yes " in step 120, in step 120a, regain pallet 113, begin the program that CD 1 is write down again.In step 120b, from the dish message file, read medium ID corresponding and cryptographic key piece with ID, in step 120c, medium ID and cryptographic key piece that use is read from the dish message file, generation has been carried out the password of encrypting to coded message, and wherein, this coded message is that content information has been carried out information encoded, in step 120d, in the storer of this password placeholder record outside CDs such as IC.That is, for CD 1 is carried out record, (normally 30 seconds~1 minute) are recorded in it among IC or the HDD between the preparatory stage.In step 120e, the id information of optically read CD 1 (being called the optics id information) in step 120f, is judged whether the optics id information is consistent with wireless id information, or is had specific relation.When judgement is " No " in step 120f, enter step 120g, preferentially use the optics id information.Pallet 113 is outwards pulled out and read wireless id information again, make the contrast of optics id information and wireless id information.If results of comparison is that OK then makes password get back to original coded message, use the medium ID and the cryptographic key piece that coil message file 53 with the optics id information accordingly, the coded message of content is encrypted once more, generate password.When judgement is " Yes " in step 120f, in step 120h, judge whether the record of CD is prepared OK, when judgement is " Yes " in step 120h, in step 120i, the rotational speed that makes CD 1 is more than or equal to 1 times of speed, in step 120j, constantly beginning initial, the password that is recorded in the storer such as IC is recorded on the CD 1.
(the generation method of dish message file short-movie)
In step 120k, be recorded in the dish message file as short-movie with image or still image than the certain hour of the low precision encoding information of the low bit rate of above-mentioned coded message after with content encoding.In step 120m, if the writing speed of establishing CD 1 is S
R, the speed of input signal is S
I, then keep S
R>S
IAnd record certain hour.In step 120n, with the temporal information t of the content of CD 1 current record
RTemporal information t with the content of current input
ICompare.In step 120p if t
I>t
RThen return step 120m, in step 120p if t
I=t
R(that is t,
IAnd t
RDifference be 1~2 frame), then in step 120q, content directly is recorded on the CD 1, in step 120r, if the writing speed of establishing CD 1 is S
R, the speed of input signal is S
I, S then
R S
IThen, in step 120s, carry out common record.
(method of the corresponding dish of retrieval ID)
Secondly, illustrate that desired dish id information is retrieved and found out to the attribute information of use dish message file, and then from physically searching the method for dish.
At first, the attribute information of input content in the step 135a of Figure 22.Act the leading role the attribute information of performer's contents such as name, trade name or place name according to the capacity of dish or the physical message input program of residual capacity.In step 135b, the attribute information of the content of input made as key word be used for retrieval dish message file.In step 135c, when ID that the attribute information that finds with content meets, judge in step 135d whether the CD of this ID is desired CD.When judgement was " Yes " in step 135d, (that is, when the CD of this ID is desired CD) entered step 135k, in this end process.When in step 135d, judging when being " No ", the attribute information of input disc in step 135e (for example residual capacity etc.).In step 135f, the attribute information of the dish of input made as key word be used for retrieval dish message file.In step 135g, when ID that the attribute information that finds with content meets, judge in step 135h whether the CD of this ID is desired CD.When judgement is " Yes " in step 135g, enter step 135k, in this end process.When judgement is " No " in step 135g, enter step 135i, use communicator that other machines (for example, being connected in the server on the network) is conducted interviews retrieval dish message file.At this moment, when in step 135j, the ID that meets being arranged, enter step 135k, show the ID that meets at the display part of record regenerator and the display part of telepilot.When judgement is " No " in step 135j, enter step 135m, show " not meeting " at display part, end.
(method of physical isolation CD)
Accept the flow process of Figure 22 with reference to the flowchart text of Figure 23.In step 135k, can specify ID number that wants the CD that finds.Secondly, the method for searching the CD with specific I D number is described.
In step 136a, on display part, show " will search dish? " enquirement.In the time will searching dish (when the judgement of step 136b is " Yes "), in step 136c, send the electric wave of retrieval usefulness.For example, shown in Figure 24 (a), send the electric wave of retrieval usefulness from transmitting antenna 18a, 18b, 18c in the mode of timesharing in 3 directions.Shown in Figure 24 (b), be A, B, C time slot from the response signal of CD because of timesharing, so separate easily.In step 136d, from each received signal 139a, 139b, 139c, read ID, in step 136e, judge whether be the ID that meets.If the ID that meets is arranged, then in step 136f, show this ID that meets.For example, shown in Figure 24 (c), the display part 39 of telepilot 15 shows arrow 140a.Arrow 140a is illustrated in this direction of arrow and has found CD.Sound gives a warning in step 136g.Sound also can give a warning in the ID that demonstration meets in 136f.Whether in step 136h, judge all information of the CD that finds has been finished retrieval, when retrieval finishes, show whole ID (step 136i) and finish (step 136j).When not finishing as yet, show remaining ID number (step 136k) and return step 136c.
(update method of dish message file)
The update method of the dish message file when a plurality of record regenerator is arranged in the family is described.
As shown in figure 25, the interior perimembranous at recording type optical disc 1 of the present invention is provided with dish message file district 144.Each record regenerator is visited this part, compares with one's own dish message file, only upgrades new information.
In detail a bit say that record regenerator reads the data in dish message file district 144 shown in Figure 25 in the step 143b of Figure 26, in step 143c, judge whether the data relevant with the CD that inserts are recorded in the dish message file of record regenerator inside.When judgement is " No " in step 143c, in step 143k, generates the dish message file of this CD, and be appended in the dish message file 53 of record regenerator (main frame).When judgement is " Yes " in step 143c, enter step 143d, whether the update time 141 (Fig. 9) of the dish message file of judgement main frame is more Zao than the update time of the dish message file in the CD.When being morning (judgement of step 143d is " Yes "), these data of main frame are replaced to the corresponding data (step 143e) of dish.At this moment, the reliability height of factor certificate is so put 1 (height) (step 143f) with data reliability mark 142 (Fig. 9).
In step 143g, whether the data of the dish message file that the CD of judgement ID and insertion is different are recorded in the dish message file district 144.When judgement is " Yes " in step 143g, whether judgement and the relevant dish message file of each dish be than the dish message file new (step 143h) of main frame, when judgement is " Yes " in step 143h, only to the dish message file of the dish of specific ID, with the data (step 143i) of the data rewriting main frame of dish.In step 143i, the data reliability mark of the dish message file of other dishes of having rewritten is put 0 (low) (step 143j).So, whenever coiling when inserting other device, the data of new building message file more just.
(manufacture method of antenna)
The manufacture method of antenna of the present invention comprises following 2 kinds, generates parts such as making IC, antenna and capacitor and the incorporate IC module and utilize the 1st method that is fixed on the dish substrate such as bonding of going between that is:; With the 2nd method that on the dish substrate, directly forms antenna or lead-in wire or capacitor.At first, specification module method.
(manufacture method of modular antenna part)
The skin depth of antenna (Skin depth) is respectively 8 μ m, 0.6 μ m when the sending and receiving frequency is 13.5MHz or 2.5GHz.In order to receive the electric wave of 13.5MHz effectively, the thickness of antenna must be more than or equal to 8 μ m.Therefore, utilize the thick film operation resemble the metallide that uses in the manufacturing process of common printed circuit board (PCB) to form the purposes that antenna part needing to be suitable for sensitivity.This operation at first generates and is provided with the substrate of imbedding the hole 7 that is used for imbedding the IC module.This substrate 7 can be as the substrate of CD.In addition, generate IC module 201, imbed IC module 210 in the hole imbedding of substrate 7.If with the binding type CD of 2 substrate bondings, then, carry out the printing of label again with after 2 substrate bondings, CD has just been finished like this.
Use Figure 27 is described in detail.Figure 27 (a) illustrates the shape of the IC module 201 that is added with adhesive linkage.On stamper (stamper) 206, be provided with and imbed, be used in the hole 202 of imbedding of imbedding IC module 201 and form in substrate 7 one sides with protuberance 212.To imbedding a end distance with protuberance 212 from for the interval of Lg is provided with buffer zone, in its outer rim protuberance 206 is set, be used for forming the Information Level 6 that can carry out information record or regeneration.Thereby buffer zone 203 is to influence Information Level 6 for the adhesive linkage that prevents to produce because of the existence of imbedding hole 202 is mobile in a jumble to be provided with in the bonding operation of back.Therefore,, then set the width of buffer zone 203, make Lg 〉=1mm if the width of the protecting band 203 of setting up defences is Lg.Thus, for the bonding dish, because of on Information Level 6, stably forming adhesive linkage, so the deterioration of the optical characteristics of adhesive linkage can prevent 2 layers of dish the time.In addition, for 1 layer of dish, because of there not being the gap of binding part, so can prevent to make the Information Level deterioration through the influence because of environment after long-time.
Figure 27 (b) illustrates whole operations of injection mo(u)lding operation.At first, stamper 206 is installed on the stamper support 204, makes itself and fixed mould 205 fixing face-to-face.Penetrate the direction of hole 207 from resin, after fixed mould 205 penetrates resin 208, utilizes puncher 210 to get center pit, utilize displacer 211 that it is separated from stamper 206 along arrow 209.So, can take out the substrate 7 that forms by resin 208.Imbed hole 202 because of on this substrate 7, forming annular, so the IC module 201 resembling shown in Figure 27 (a) of can seamlessly packing into.
Figure 27 (c) be not form IC module 201 at stamper 206 but on stamper support 204 imbed protuberance 212.At this moment, as long as on stamper 206, form the hole 213 of Information Level 6 or the protuberance of track 214, so, have the stamper of making and make the simple effect that becomes.
The side with Information Level 6 at substrate 7 forms IC module 201.
Shown in Figure 29 (a), be pasted together with the substrate 7 that has formed Information Level 6 by the substrate 215 that utilizes adhesive linkage 216 will not form Information Level, finish 1 CD 217.At this moment, because of IC module 201 is subjected to the protection of adhesive linkage 216, so have the remarkable result that can omit the operation that forms protective seam.
Figure 29 (c) in this substrate 7, is reading side formation Information Level and IC module 201 forming substrate 7 away from a side that reads side.At this moment, because of preventing to see the IC portion of IC module 201, so have configuration design effect preferably from label-side.
Figure 29 (d) is illustrated in the situation that side is provided with substrate 7 that reads.At this moment, the thickness of 2 substrates is set in respectively in the scope of 0.55~0.64mm, the thickness setting of adhesive linkage 216 is 0.055 ± 0.015mm, thus, can obtain the effect that can regenerate with the player of dvd standard.
Figure 29 (e) illustrates the situation of using blue laser.The thickness of substrate 7 is smaller or equal to 1.1mm, and the thickness setting of adhesive linkage is 0.025mm.
In binding type CD,, do not form Information Level 6 on another piece substrate 215 for having only the CD that has formed Information Level 6 on 1 substrate with 2 substrate bondings.At this moment, shown in Figure 29 (b), form substrate 215a, simultaneously, form IC module 201 in the opposite side of side that reads with CD 217.Because of the content difference of the Information Level under each title, so if the mode of Figure 27 (b) or Figure 27 (c), then the bad of the bad and Information Level 6 of IC module all can cause the bad of CD 217, total substandard products number increases.But if the mode of Figure 29 (b), then the bad of the bad and substrate 7 of substrate 215a can be separate.Owing to only certified products and the substrate 7 of substrate 215a are pasted, therefore, are had the effect of the substandard products number that can reduce finished product CD 217.
Secondly, use Figure 28 that the manufacture method of substrate 215a is described.At first, be fixed on the fixed mould 205, secondly, penetrate resin 208 and form substrate 7 being provided with the stamper support 204a that imbeds protuberance 212.
(formation of angle identification marking)
The CD of existing mode there is no need to specify the angle of optical disc substrate.For this reason, do not discern the mark of operation above, only such as the literal of identification substrate or the device of mark with angle.Therefore, can not obtain higher angular position detection precision.When being installed in IC, antenna or parts on the substrate resembling the present invention, be necessary to adjust accurately the angle position.Therefore, at the A-A ' face of the storage liquid protuberance 222 of stamper support 204, the mechanical angle identification recess 220 high precision setting resembles shown in Figure 30 (a), mechanical angle identification recess 220 is that the degree of depth is the notch 220 of dmm.By notch 220 is set like this, can be shown in Figure 30 (b) like that, in the ditch of the circumferential of the substrate 7 of CD, form the angle identification marking 223 that constitutes by the projection that highly is d.By use angle identification marking 223, in the assembly process or direct film formation process of antenna described later or IC installation procedure of the IC of back module 201 grades, can carry out high precision and install or film forming.
In addition, at the C-C ' of stamper support 204 section, on the position of the angle θ resembling shown in Figure 30 (c), angle identification protuberance 221 is set.Shown in Figure 30 (d), because of the angle identification recess corresponding with imbedding protuberance 224 is set, so, can on substrate 7, imbed hole 202 and angle identification marking 223 with the positional precision formation of high angle by both are cooperated.Figure 30 (e) is expression stamper support 204 and the sectional view of imbedding protuberance 224.
(explanation of IC module)
Figure 31 (a) has two circle antennas 231, IC230, insulation course 232 and the top view of 233 the IC module 201 of going between.Figure 31 (b) is the A-A ' sectional view of Figure 31 (a).
The manufacturing process of IC module 201 is described with reference to Figure 31 (b).
Prepare the laminar lead-in wire substrate 234 of 10~20 μ m such as flexible substrate.Specifically, on large-area thin slice, generate many lead-in wires, after finishing, by being cut to such ring segment shown in Figure 31 (a), thereby can produce in enormous quantities.On the special angle position of interior week or periphery, otch is set, form same angle identification marking 223a, thus, when on the substrate 7 that in the operation in the back IC module 201 is bonded to CD, by making angle identification marking 223 correspondences of angle identification marking 223a and substrate 7, can accurately adjust relative angular position each other, so, have and can on angle direction, IC module 201 be embedded to the effect of imbedding in the hole with very high precision.Have, the precision of original circumferencial direction is just very high during because of disc making again, so needn't append the special device of the installation accuracy that is used for improving circumferencial direction.
With reference to Figure 31 (b), in operation 1, form antenna 231 (231a, 231b, 231c).When antenna 231 is thick film, for example, can utilize electroless plating or print process to make.In operation 2, form insulation course 232.In operation 3, forming bridge formation lead-in wire 233 on the insulation course 232 and antenna 231b is connected across on this bridge formation lead-in wire.In operation 4, utilize bonding that IC230 is installed on two terminals of antenna 231.As bonding method, for example, use anisotropic conductive sheet etc. is installed.If this mode because of the dorsal part of lead-in wire substrate 234 is smooth, can not hinder flowing of adhesive resin, so optical characteristics can not degenerate in the stickup operation of substrate.Though not shown among Figure 31, use Figure 44 as illustrated in the back, by the capacitor of resonance usefulness is installed, sensitivity that can actual raising antenna.In addition, also can replace and form insulation course 232 and form the lead-in wire 233 of building bridge, and on lead-in wire substrate 234,2 through holes are set and connect at the dorsal part of lead-in wire substrate 234.
(installation method of IC module)
Explanation is installed in IC module 201 the method in the hole 202 imbedded of the substrate 7 of the CD shown in the operation 1 of Figure 32.Shown in the operation 2 of Figure 32, are d4 if establish the maximum height of the IC portion etc. of IC module 201, then can use the thickness of sheet as the adhesive sheet 235 of d4 it to be installed on the substrate 7 as d2, depth capacity.In operation 3, utilize heating or ultraviolet ray irradiation to wait adhesive sheet is solidified, thus the fixing of substrate 7 of finishing 201 pairs of CDs of IC module.Shown in figure 32, the surface of the substrate 7 of the completed relatively CD of IC module 201 is smooth.In addition, between IC module 201 and Information Level 6, be provided with distance and be the buffer zone of Lg.When being the CD of 2 substrate binding types (for example, CD shown in Figure 29 (c)), shown in Figure 33 (a), make substrate 7 and another piece substrate 218 of the CD of having made opposed, the space of 0.025mm~0.05mm is left in the centre, encloses the bonding agent 236 with light transmission in the space.Bonding agent 236 flows along the direction of arrow 237.At this moment, when when having the IC module 201 of structure shown in Figure 32, because of height and substrate 7 surperficial identical, form smooth plane, so bonding agent 236 is mobile like that shown in arrow 237a, 237b, 237c, even the installation portion of IC module 201 is also very smooth, so the mobile confusion of bonding agent 236 can not take place.Therefore, can improve the spacing accuracy in space, simultaneously, that can not give bonding agent 236 mobilely brings influence, so, can obtain the remarkable result that optical characteristics such as birefraction after bonding agent 236 solidifies can deterioration.Shown in the operation 3 of Figure 32, by the flatness d5 with the discrepancy in elevation of IC module 201 and substrate surface be controlled at ± 0.015mm in, can satisfy the standard of DVD etc.When using ultraviolet curable resin as bonding agent 236, by utilizing the ultraviolet ray irradiation bonding agent 236 is solidified, form adhesive linkage 216 (Figure 33 (b)).So, just finish the CD of 2 substrate binding types.Width Lg by making buffer zone more than 1mm, can not can be affected the optical characteristics of the adhesive linkage of Information Level 6 because of increasing IC module 201 at least.
(installation method of uneven IC module)
The front has illustrated that, otherwise explanation forms the smooth method of imbedding hole 238 at substrate 7 by making the smooth method of substrate surface after imbedding in the default concavo-convex hole of imbedding of substrate 7 one sides here.Shown in Figure 34 (a),, can obtain having the smooth substrate of imbedding hole 238 7 that the degree of depth is d7 by in stamper 206, being provided with highly to the protuberance 212 of imbedding of d7 carries out injection mo(u)lding again.At this moment, by at Information Level 6 with imbed the buffer zone that satisfies Lg 〉=1mm is set between the hole 238, can obtain to prevent the effect of the optical characteristics deteriorations such as birefraction of the transparent substrates 7 of Information Level 6 or adhesive linkage 216.In addition, shown in Figure 34 (b), in stamper 206, be not provided with and imbed protuberance 212, imbed protuberance 212, therefore, have the effect of the Production Time that can shorten stamper 206 and in stamper support 204, be provided with.
Figure 35 is that expression is installed to method on the substrate with the IC module.By adhesive sheet 235, lead-in wire substrate 234 sides from a side opposite with the side that IC230 is installed are installed in imbedding in the hole 238 of above-mentioned substrate 7 with IC module 201 in operation 1.Operation 2 illustrates IC module 201 is embedded to the state of imbedding hole 238.At this moment, if it is d11 that IC230 exposes the height of substrate surface, the height of lead-in wire substrate 234 and substrate surface is d12, by with d11+d12's be controlled at ± 0.015mm, be in the scope of 0.03mm, can have the effect that has interchangeability because of the standard that satisfies CD.
In addition, on lead-in wire substrate 234, form IC230 and antenna 231, the volume that makes the IC module 201 in the d11 scope (promptly, the relative volume summation of outstanding IC module 201 parts of the stickup face of substrate 7) and the volume (that is the summation of the volume of the sunk space part of stickup face of relative substrate 7) of the space part of removing antenna or IC in the d12 scope roughly the same.Constitute according to this, in the stickup operation of substrate shown in the operation 37 and substrate 218, when enclosing bonding agent 236, if volume is averaged, the result who then offsets is 0.Therefore, can regard the embedding part of IC module portion 201 and the stickup face of substrate 7 equivalently as is on identical height.Because of equivalent height is identical, so the part of IC block region, substrate portion and Information Level 6 is all enclosed the bonding agent of equal volume, so the thickness distribution of bonding agent 236 is even.Therefore, the thickness effect of uniform that has adhesive linkage 216.In addition, if because of this formation then need not position at angle direction, so have the effect that operation is adjusted in the position that does not only need the angle identification marking but also can omit angle direction.
(IC being installed in the method for dish substrate one side of IC module)
Hole one side of imbedding that Figure 36 is illustrated in substrate is provided with IC230 and bridge formation lead-in wire 233, the embodiment when an opposite side of imbedding the hole of substrate 7 is provided with antenna 231 simultaneously.
Shown in Figure 36 (a), (surface) forms two circle antennas 231 on lead-in wire substrate 234.Shown in Figure 36 (b), form build bridge lead-in wire 233, lead-in wire 239 and IC230 at the back side of lead-in wire substrate 234.Like this, make the IC module by surface and back side formation parts at lead-in wire substrate 234.
Figure 36 (c) illustrates the A-A ' section of the IC module shown in Figure 36 (b).The thickness d 17 of antenna 231 as previously mentioned, under the frequency of 13.5MHz, its skin depth is 8 μ m.If the thickness d 13 of lead-in wire substrate 234 is 15~20 μ m, the thickness d 14 of lead-in wire 239 is 8 μ m, the thickness d 19 of IC230 is 50 μ m, the thickness d 16 of adhesive linkage is 15 μ m, then maximum ga(u)ge d22 becomes 100 μ m, if do not imbed the hole, then the scope of the adhesive linkage 216 of paste section can not be controlled within 55 ± 15 μ m.
Figure 36 (e) illustrates the section of substrate 7.The depth capacity d20 that imbeds hole 202 of substrate 7 approximately is 90 μ m, and minimum-depth d21 approximately is 30 μ m.
Figure 36 (f) illustrates through adhesive linkage (Figure 36 (d)) IC module (Figure 36 (c)) is bonded in state on the substrate 7 (Figure 36 (e)).Shown in Figure 36 (e), through adhesive linkage the IC module is bonded on the substrate 7, make antenna 231 substrate 7 imbed the opposite side in hole, the lead-in wire 233 of building bridge, lead-in wire 239 and IC230 imbed hole one side substrate 7.By Figure 36 (f) as can be known, lead-in wire substrate 234 or IC230 are placed in the below on substrate 7 surfaces well, have only antenna 231 from substrate 7 surperficial outstanding.Because of the projecting height d22 of antenna 231 is 8 μ m, can utilize the effect of imbedding within the scope that the hole is controlled at the thickness range of adhesive linkage 216 55 ± 15 μ m so have under the situation of 13.5MHz.
Have again, as illustrated in the operation 2 of Figure 35, nuzzle IC module 201 darker, make the height of IC module 201 be equivalent to the height of substrate surface, therefore, have the good fluidity that in pasting operation, makes bonding agent 236, optical characteristics not deterioration, the thickness effect of uniform more of adhesive linkage 216 simultaneously.In addition, because of the IC module is provided with angle identification marking 223a, so have the effect that hole and IC module can be installed with very high precision of imbedding of substrate on angle direction.
Resemble and generate the IC module above-mentioned, and this IC module is installed on the imbedding in the hole of stickup face one side that is located at substrate pastes again.Therefore, at first, even generate operation because of protective seam is not set especially, the IC module also can be protected by adhesive linkage, can reduce the process number that protective seam forms so have, and improves the effect of the reliability aspect anti-environment simultaneously.In addition, because of the IC module is present in the paste section of the inside of the about 0.6mm that is positioned at dish or 1.1mm,, the IC module can prevent because from the Mechanical Contact of completed stickup dish outside and ruined effect so having.These effects can obtain in the direct forming method of following antenna equally.
(the direct forming method of antenna: the single turn line style)
In the above description, the method that generates the IC module and this IC module is contained in the embedding part of substrate mainly has been described.Here, the method that antenna is formed is described on the dish substrate.Under the situation of 13.5MHz and 2.5GHz, skin depth is respectively 8 μ m and 0.6 μ m.Therefore, under the situation of 2.5GHz, can utilize thin film techniques such as sputter fully to form.In addition, under the situation of 13.5MHz, the electric field intensity of antenna is index with the increase of the metal film degree of depth and reduces as shown in figure 37.Because of energy is the integrated square value of electric field, so even the thickness about 1 μ m, how much sensitivity do not reduce yet, and only receiving range is short.Therefore, if select purposes, then the thin film technique both can adopt.In addition, though under the situation of 2.5GHz too, also work about 0.07~0.1 μ m.Therefore, carry out year in year out in batch process factory in the operation that forms silver alloy or aluminium alloy on the optical disc substrate of polycarbonate, its reliability beyond the question.Can this technology of dual-purpose.
The method that forms the single turn linear antenna is described with reference to Figure 38.
In the operation 1 of Figure 38 (a), along the circumferencial direction formation antenna 231 of optical disc substrate 7.
With reference to Figure 38 (b), the operation that naked IC chip directly is installed is described on substrate 7.In operation 1, utilize injection mo(u)lding on substrate 7, along the circumferential direction to generate the long hole 240 of imbedding in advance.In operation 2, utilize sputter to form antenna 231, this antenna 231 utilizes mask 241 to be formed with notch 242 in the local area.In operation 3, IC230 is bonded in the part of the notch 242 of antenna 231.The bonding of utilization lead-in wire bonding or anisotropic conductive sheet etc. is fixed IC230.Then, for the CD of 2 substrate adhesive types, shown in the operation 3 of Figure 35, by making in addition 1 substrate, thereby finish the making of CD with substrate is opposed and inclosure bonding agent 236.At this moment, enclose bonding agent 236 because of IC230 so the operation of the layer that do not need protection.After the bonding IC chip to the process of pasting operation, if implemented the sputtering process of recording layer etc., then as the operation 4 of Figure 38 (b) shown in,, can get rid of sputter in the back operation thus on IC230 to the influence of IC by protective seam 243 is set.
In the operation 3 of Figure 38 (c), generate secondary substrate 244, in the operation 4, IC230 is installed on the secondary substrate 244, generate small IC module 247, in operation 5, adhesive sheet 235 is installed, in operation 6, small IC module 247 is installed in imbedding in the hole 240 of substrate.In this operation, IC230 is subjected to the protection of secondary substrate 244.Therefore, has the effect that after this operation, can implement sputtering process.As hereinafter described, when the film formation process of utilizing recording layer generates capacitor etc., can prevent because of must sputter by the influence of sputter, so effect is fine to the IC generation.
Have, in utilizing the forming thin film operation of sputter etc., because of forming the antenna conductor of thin sub-micron degree of thickness, so when the use low frequency, the thickness of antenna conductor does not reach skin depth, the sending and receiving efficient of antenna can descend sometimes again.When using such low frequency, for example, can apply metallide or not have the electroless plating of electrode antenna conductor.Metallide for example can cover in addition metal part or record membranous part with diaphragm by antenna conductor is added electrode, is immersed in the electrolytic solution and puts in the metallide groove and carry out.By antenna conductor being applied metallide or not having the electroless plating of electrode, can increase the thickness of antenna conductor, and the thickness that can make antenna conductor is near skin depth.By after film forms operation, appending such electroplating work procedure, can increase the thickness of antenna conductor.As a result, can improve the sending and receiving efficient of antenna.
(after IC is installed, forming the method for antenna again)
Figure 38 illustrates and forms the order that IC is installed in antenna 231 backs, and Figure 39 narrates IC230 the method that the back forms antenna 231 is installed.
Shown in Figure 39 (a), the same with Figure 38, in operation 1, the long rectangle of length that forms when injection molded on the circumferencial direction is imbedded hole 240.In the operation 2 of Figure 39 (b), generating thickness is the secondary substrate 244 of d25, in operation 3, with being divided into 2 parts around the secondary substrate 244, forms electrode 245,246.In operation 4, IC230 is installed.Adhesive sheet 235 is installed in operation 5, in operation 6, secondary substrate 244 is installed in and imbeds in the hole 240.Shown in top view, expose electrode 245 and electrode 246.In the operation 7 of Figure 39 (c), utilize terminal 231a, the 231b of formation antennas 231 such as sputter, thus, make antenna 231 and IC230 realize being electrically connected.At this moment, because of IC230 is subjected to the protection of secondary substrate 244, so in the operation of back, can implement sputtering process.In addition, because of electrode 245,246 and substrate surface on sustained height continuously, so even utilizing the film operation to form antenna 231 connects again, the possibility that is damaged is also very low, and has the effect of raising reliability.In addition, the electroded secondary substrate in the operation 3 is provided with 2 electrodes at the two ends of the laminar substrate of 1 block length bar shaped, as long as be cut into strip, can make for 1 time large quantities of, so, can produce 1 secondary substrate with extremely low cost.The operation of utilizing sputter to form the metal film of aluminium alloy or silver alloy is implemented in the manufacturing process of RAM type or ROM type CD.The present invention utilizes the formation operation of this metal film to form antenna, thus, can not increase film formation process and form antenna and lead-in wire in the interior perimembranous of CD, so, have the cost that can not increase outside the IC cost and in CD, form the IC of RF-ID and the significant effect of antenna.
(the direct forming method of multiturn antenna)
Under the situation of the 2.5GHz of the embodiment of the single turn antenna that has illustrated in front, the single turn antenna is no problem, but under the situation of 13.5MHz, the sensitivity meeting reduces.For the application that sensitivity is had relatively high expectations, must be the multiturn antenna that twines the n circle.
Figure 40 (a) illustrates the top view of the CD that is provided with multiturn type antenna.The rectangle that the front uses IC piece 247 rectangle IC piece 247 that Figure 39 (b) illustrate, that electrode position is staggered to be embedded to substrate 7 is imbedded in the hole 240, and utilization sputters at two terminals that its both ends form 3 circle antennas 231.
Use the sectional view of Figure 40 (b) to be described in detail, in operation 1, IC piece 247 is fixed on and imbeds in the hole 240 with adhesive sheet 235.Electrode 245,246 exposes from substrate surface.In operation 2, utilize to sputter at the two ends that form antenna 231 on this electrode that exposes 245,246.So, make terminal 231a, the 231d at electrode 245,246 and antenna 231 two ends realize being electrically connected.
Figure 40 (c) is the figure that sees above-mentioned operation 1 and operation 2 from above.Sectional view when Figure 40 (d) uses liquid adhesive bonding.Between the electrode 245,246 of substrate 7 and IC module 247, can see the protuberance that some bonding agents are arranged, but combination between the two is very firm.Therefore, shown in operation 2, when utilizing sputter to form the terminal of antenna 231, the possibility that can reduce to break.
Figure 40 (e) is illustrated on the lead-in wire of antenna 231 of Figure 40 (a) the 4 bend 248a of place, 248b, 248c, 248d is set.In this example, on the lead-in wire of the spiral helicine antenna 231 that the inside perimembranous radius from the peripheral part of CD reduces gradually, from the inside perimembranous of the peripheral part of CD,, form the bend of the lead-in wire of antenna 231 successively according to the order of bend 248b, 248a, 248d, 248c.In each bend 248b, 248a, 248d, 248c, the radius of the lead-in wire of antenna 231 (wrap wire) changes.In the example shown in Figure 40 (e), in interval from outer circumference end to bend 248b, it is big that the radius of the lead-in wire of antenna 231 (wrap wire) becomes, in interval from bend 248b to bend 248a, the radius of the lead-in wire of antenna 231 (wrap wire) temporarily diminishes, in interval from bend 248a to bend 248d, it is big that the radius of the lead-in wire of antenna 231 (wrap wire) becomes, in interval from bend 248d to bend 248c, the radius of the lead-in wire of antenna 231 (wrap wire) temporarily diminishes, in the interval from bend 248c to interior Zhou Duan, it is big that the radius of the lead-in wire of antenna 231 (wrap wire) becomes.Be provided with the lead-in wire that strides across the antenna 231 between bend 248b, the bend 248a and stride across the bridge portion (IC piece 247 or plain conductor) of the lead-in wire of the antenna 231 between bend 248d, the bend 248c.Bridge portion is connected the outer circumference end of the interior Zhou Duan and antenna 231 lead-in wires of antenna 231 lead-in wires.
Like this, the wrap wire by the configuration antenna can hold antenna in less circumference.Under the situation of CD, because of recording areas from about the radius 23mm, so have only in the very narrow zone from perimembranous in it to center pit, can be used as antenna field.Under the situation that is CD,, can hold the more antenna of multiturn number by forming this bend.Thereby effect is fine.
(utilizing the film formation process of indicator to form the method for a part of circuit or parts)
Under the situation of record type disk, posting field utilizes 6~8 layers film formation process to form.Wherein, the metal level that makes the light reflection is arranged, conductance is higher.In addition, have multilayer to be used for adjusting the dielectric layer of the absorption of light, they all are the very low insulators of conductance.In addition, also has semiconductor layer.This utilizes sputtering method to form.Also can utilize evaporation to form.In the present invention, utilize above-mentioned metal level, dielectric, semi-conductive film formation process, in same operation, form antenna, capacitor, resistance and lead-in wire.Thus, by reducing operations such as part or all of antenna, lead-in wire, therefore, can realize short time and low cost.
For example, utilization can be carried out the film formation process of the metallic reflective coating that comprises in the Information Level of information record or regeneration, can form at least a portion antenna.At this moment, when forming metallic reflective coating and antenna, the thickness of the thickness of metallic reflective coating and composition and at least a portion antenna comes down to identical with composition.
The configuration example of the Information Level of existing recorded type dish is described with reference to Figure 41.The orlop of Figure 41 is a substrate 7, is formed by the hyaline layer of polycarbonate, and when being the bonding dish, thickness is 0.6mm, 1.1mm, 0.075mm, and when being single-deck, thickness is 0.8mm or 1.2mm.It is the dielectric layer 251 of 100nm that thickness is arranged on substrate 7, forms the reflection horizon 257 that is made of Ag alloy or aluminium alloy of the contact bed 252 that is made of the thick dielectric of several nm, recording layer 253, contact bed 254, the dielectric layer 255 of thick 30nm, the light absorbing zone 256 of thick 10nm, thick 100nm on dielectric layer 251.When substrate 7 sides read, by top order film forming.But, when the reflection side from substrate 7 reads, certainly,, promptly on substrate 7, form reflection horizon 257 earlier by opposite order film forming, form light absorbing zone 256 or the like more thereon.At this moment, also can realize by putting upside down process sequence of the present invention.
(manufacturing process of multiturn antenna and capacitor)
With reference to Figure 42 and Figure 43, narration utilizes the film formation process of the Information Level of CD to make the method for antenna and capacitor etc.
Shown in Figure 42 or Figure 43 (a), in operation 1, on substrate 7, be provided with and imbed hole 202, IC piece 247 is installed in operation 2, shown in the operation 3 of Figure 42, use mask 260a to utilize metallic target 261a to carry out sputter, form the such antenna 231 of Figure 43.In operation 4, utilize dielectric target 261b to carry out sputter and utilize mask 260b, form dielectric layer 255 in recording areas and capacitor area.Shown in the operation 4 of Figure 43 is top view.In operation 5, with mask 260c the zone at antenna 231 or capacitor 263 places is covered, utilize sputter, form as shown in Figure 41 contact bed 254 or recording layer 253 successively in recording areas.In operation 6, on a part of antenna 231, add mask 260d, utilize the metallic target 261d of aluminium or silver alloy to carry out sputter again, form reflection horizon 257 and electrode 262.
So, utilize the film formation process that is included in the metallic reflective coating in the Information Level, can form at least a portion antenna 231.At this moment, when forming metallic reflective coating and antenna, the thickness of metallic reflective coating comes down to identical with composition with the thickness and the composition of at least a portion antenna.In addition, utilize the film formation process that is included in the dielectric film in the Information Level, can form at least a portion capacitor 263.At this moment, when forming dielectric film and capacitor 263, the thickness of dielectric film comes down to identical with composition with the thickness and the composition of at least a portion capacitor 263.
(electric capacity of capacitor)
Here, form capacitor 263 and be for when with the inductance of antenna during, such resonant circuit shown in formation Figure 44 (a) and (b), (c) as L.By f=1/2 π √ LC being set at the frequency of transceiver, can improve the total sensitivity of antenna thus.
(manufacture method of antenna part)
Figure 45 (a) is the top view of the mask 260b that uses in the operation 3 of Figure 42.Use this mask 260b to carry out sputter, form antenna 231 thus.In the batch process of CD, the reflectance coating that forms 0.05 μ m of Ag alloy needed for 1 second.Therefore, in order to improve sensitivity, for the skin depth 0.6 μ m of film forming 2.5GHz, even cooling also needs nearly 10 seconds.In order to shorten factory's sputter cycle, by resembling shown in Figure 45 (b), 4 dishes are put into chamber sputter simultaneously, it is original 1/4 that the cycle is become, average 1 2~3 second of dish.Therefore, from the angle of production cycle, can introduce production line of batch.Will realize 8 μ m skin depths under 1 3.5MHz in the film operation, it is very difficult to introduce production line of batch.If the thickness about 1~2 μ m, then antenna sensitivity can descend, and by introducing capacitor resonant circuit of the present invention, has improved sensitivity in fact, thereby, can realize producing in batches.
(manufacture methods of other resonant circuits)
Can realize the resonant circuit of Figure 44 (a) from the formation of Figure 43.Here, use Figure 46 to narrate the manufacture method of antenna part of the resonant circuit of Figure 44 (b) form.With Figure 43 at first is that the structure of IC piece 247 is different.Shown in Figure 46 (a), in operation 1, electrode on one side is divided into electrode 246a and electrode 246b.In operation 2, IC230 is connected on the electrode 246a.In operation 3, IC piece 247 is installed, in operation 4, form antenna 231, terminal 231b of antenna and electrode 246b are electrically connected.In operation 5, form dielectric layer 251, in operation 6, utilize sputter to form reflection horizon 257, electrode 262 is electrically connected with the terminal 231b of antenna 231.So, can in the film formation process of carrying out recording film, make antenna and IC portion with resonant circuit such shown in Figure 46 (c).
(in same operation, making the method for antenna and reflectance coating)
In Figure 42, narrated the example of in same operation, making antenna 231 and reflectance coating, but, can in same film formation process, generate such antenna 231 of Figure 47 (b) and reflection horizon 257 by using the such mask 260e of Figure 47 (a).Under the situation of ROM dish, because of having only 2 operations of reflectance coating and diaphragm, so the efficient of this method is very high.
Resemble mask 260f Figure 48 (a) by use,, then can form such single turn antenna 231 of Figure 48 (b) and reflectance coating 257 if utilize the target 260 of Al or Ag to carry out sputter.Only imbed hole 240 and bonding IC 230, just can form the dish of band antenna and IC by setting.Because of as long as increase this 1 operation of IC bonding, so have the effect that to make simply with the low-cost utmost point.This method goes for ram disc, also goes for the ROM dish.In addition, 2 dishes are pasted, made IC230 side within it, can make 1 dish, so the protection that is subjected to external environment condition because of antenna or IC makes its influence of avoiding external environment condition, so can obtain very high reliability.The simplest method is to use the IC of the band antenna that RF-ID uses, and with its imbedding in the hole 240 of substrate 7 that is embedded to dish, pastes again, makes this IC side within it.If can reduce the cost of this IC, then can produce the high dish of reliability simply by this method.
(manufacture method of film antenna)
Figure 49 (a) is the rear view of film antenna 231g.On the antenna 231h of interior perimembranous, be provided with through hole 271a, 271b.Figure 49 (b) is a top view, is formed with antenna 231d.Use the manufacturing process of Figure 49 (e) narration through hole.In operation 1, use metallic target 261 to begin from the surface through hole 271 of substrate 7 is carried out sputter, at the first half formation metal level 272a of through hole 271.Because of the Lower Half to through hole 271 forms metal level 272b from the back side in operation 2, so the metal level 272b at the metal level 272a on surface and the back side realizes being electrically connected.In operation 3,, finish antenna and IC portion by bonding IC 230.Shown in Figure 49 (d), paste by making this dish and another dish, thereby finish 1 dish.At this moment, because of the bonding agent 236 of pasting usefulness flows into through holes and with hole plug, so external environment condition can not exert an influence to inner IC etc.In order to protect top antenna 231c, form protective seam 272.This antenna is pretended to dipole antenna and is worked because of surface and 2 utmost points in the back side are arranged.
(formation of telepilot and work)
Describe in detail to use the formation of the telepilot 15 that Fig. 5 illustrated.
Figure 50 (a) illustrates the top view of telepilot 15, and Figure 50 (b) illustrates side view.Antenna 282, starting switch 280 and loudspeaker 281 are equipped with in telepilot 15 inside.Shown in Figure 50 (b), under common state, because of not pushing starting switch 280, so inoperative with telepilot 15 horizontal positioned.If as Figure 50 (d) shown in, push CD 1 like that sideling, then as 1 or Figure 52 of Figure 51 1 shown in, starting switch 280 becomes 0N, power connection, and send the RF signal is received by the antenna 231 of CD 1, IC230 comprises the response signal of ID by antenna 231 transmissions.This signal is received by antenna 282, sends affirmation sound by loudspeaker 281, tells the operator.Through behind the certain hour, stop to the transtation mission circuit supply power.
Because of on the telepilot 15 small-capacity cells being installed, so must reduce the work of RF signal sending circuit as far as possible.If the method for Figure 50 then when making switch 280 push CD 1 with energized, because of the RF signal sends and ID detects and carries out within a certain period of time, so electrical source consumption is few, has the effect that can prolong the telepilot life-span.
At least following each clause is within the scope of the present invention.
A1. CD has the antenna that forms along the circumferencial direction of CD and through the IC of above-mentioned antenna receiving-sending radiowave.
A2. the CD of putting down in writing among the above-mentioned A1, and then have the Information Level that can carry out recording of information or regeneration.
A3. the CD of putting down in writing among the above-mentioned A2, above-mentioned antenna and above-mentioned IC are located at the interior perimembranous of above-mentioned CD, and above-mentioned Information Level is located at the peripheral part of above-mentioned CD.
A4. the CD of putting down in writing among the above-mentioned A1, above-mentioned IC comprise id information storage part that the acceptance division that receives above-mentioned radiowave, storage be used for discerning the id information of above-mentioned CD, response from the signal of above-mentioned acceptance division output and produce the signal generation of the signal that comprises above-mentioned id information and send the sending part of above-mentioned signal.
A5. telechiric device, be with above-mentioned A4 in the CD put down in writing carry out the telechiric device of radio communication, have to above-mentioned CD send radiowave sending part, receive from the acceptance division of the response signal of above-mentioned CD with ID reproducing unit corresponding from the output of above-mentioned acceptance division and the regeneration id information.
A6. the telechiric device of putting down in writing among the above-mentioned A5, and then has a sending part that sends above-mentioned id information to record regenerator, at least a action in the regeneration action that above-mentioned record regenerator carries out regenerating to the operation of recording of above-mentioned cd-rom recording of information with to the information that writes down in the above-mentioned CD.
And then following at least each clause is within the scope of the present invention.
B1. plate-like substrate forms the hole of imbedding that is used for imbedding lead-in wire substrate that IC is housed.
B2. a CD has the 1st substrate that comprises the plate-like of imbedding the hole and the lead-in wire substrate that IC is housed, and above-mentioned lead-in wire substrate is embedded to the above-mentioned of above-mentioned the 1st substrate and imbeds in the hole.
B3. the CD of putting down in writing among the above-mentioned B2, and then have the 2nd substrate of the plate-like relative and the adhesive linkage that above-mentioned the 1st substrate and above-mentioned the 2nd substrate are pasted with above-mentioned the 1st substrate.
B4. the CD of putting down in writing among the above-mentioned B2, the angle identification marking of the angle of formation expression regulation on above-mentioned the 1st substrate.
B5. the CD of putting down in writing among the above-mentioned B2, above-mentioned IC and above-mentioned lead-in wire substrate are included in the IC module, above-mentioned IC module is imbedded the above-mentioned of above-mentioned the 1st substrate and is imbedded in the hole, the height of above-mentioned the 1st substrate surface and to imbed the height of the above-mentioned face of imbedding the above-mentioned IC module in the hole roughly the same.
B6. the CD of putting down in writing among the above-mentioned B2, above-mentioned IC and above-mentioned lead-in wire substrate are included in the IC module, the part of above-mentioned IC module is outstanding from above-mentioned the 1st substrate surface, and the summation of the volume of above-mentioned relatively the 1st substrate surface outshot is roughly the same with the summation of the volume of the sunk space part of relative above-mentioned the 1st substrate surface.
B7. the CD of putting down in writing among the above-mentioned B2, and then have the antenna that is connected on the above-mentioned IC, above-mentioned IC is through above-mentioned antenna receiving-sending radiowave.
B8. the CD of putting down in writing among the above-mentioned B7, above-mentioned IC, above-mentioned lead-in wire substrate and above-mentioned antenna package are contained in the IC module, above-mentioned antenna is at the face of above-mentioned lead-in wire substrate, promptly with on the face of the opposite side of above-mentioned the 1st substrate form, above-mentioned IC forms on the face of promptly above-mentioned the 1st substrate one side at the face of above-mentioned lead-in wire substrate.
B9. the CD of putting down in writing among the above-mentioned B7, above-mentioned antenna has spiral helicine antenna lead, and its radius of spin diminishes from the inside perimembranous of the peripheral part of above-mentioned CD, and above-mentioned antenna lead is provided with a plurality of bends that the radius of above-mentioned antenna lead changes.
B10. the CD of putting down in writing among the above-mentioned B7, and then have and to write down or the Information Level of regenerating information, above-mentioned Information Level comprises metallic reflective coating, form above-mentioned metallic reflective coating and above-mentioned antenna, make the thickness of above-mentioned metallic reflective coating identical in fact with the thickness of above-mentioned at least a portion antenna with composition with composition.
B11. the manufacture method of a CD, the lead-in wire substrate that comprises the operation that forms the 1st substrate with plate-like of imbedding the hole and IC will be housed is embedded to the above-mentioned operation of imbedding in the hole.
B12. the optic disc producing mehtod of putting down in writing among the above-mentioned B11, and then comprise the operation of the 2nd substrate that forms the plate-like relative and through the operation of bonding agent with above-mentioned the 1st substrate and the stickup of above-mentioned the 2nd substrate with above-mentioned the 1st substrate.
As mentioned above, by dish is installed the wireless receiving and dispatching IC with id information, can carry out the ID management of each dish.
As mentioned above, utilize manufacture method of the present invention, the CD of the wireless receiving and dispatching IC with id information is housed on the manufacturing dish easily.