CN1673413A - Anti-discolouring technology for copper alloy coin blank and special preparation for anti-discolouring thereof - Google Patents
Anti-discolouring technology for copper alloy coin blank and special preparation for anti-discolouring thereof Download PDFInfo
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- CN1673413A CN1673413A CN200410021461.3A CN200410021461A CN1673413A CN 1673413 A CN1673413 A CN 1673413A CN 200410021461 A CN200410021461 A CN 200410021461A CN 1673413 A CN1673413 A CN 1673413A
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- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 61
- 238000002360 preparation method Methods 0.000 title claims description 26
- 238000005516 engineering process Methods 0.000 title abstract description 4
- 238000006243 chemical reaction Methods 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 16
- 238000005498 polishing Methods 0.000 claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000002253 acid Substances 0.000 claims abstract description 8
- 238000000137 annealing Methods 0.000 claims abstract description 8
- 238000001035 drying Methods 0.000 claims abstract description 5
- 238000005494 tarnishing Methods 0.000 claims description 25
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 18
- -1 polyoxyethylene nonyl phenyl ether Benzoic acid Polymers 0.000 claims description 17
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 claims description 14
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 claims description 14
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 claims description 14
- 239000001488 sodium phosphate Substances 0.000 claims description 11
- 229910000162 sodium phosphate Inorganic materials 0.000 claims description 11
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 11
- 239000005711 Benzoic acid Substances 0.000 claims description 9
- 235000010233 benzoic acid Nutrition 0.000 claims description 9
- 238000005406 washing Methods 0.000 claims description 8
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 239000008367 deionised water Substances 0.000 claims description 5
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- 230000003670 easy-to-clean Effects 0.000 claims description 4
- 239000005416 organic matter Substances 0.000 claims description 4
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 3
- 239000011259 mixed solution Substances 0.000 claims description 3
- 239000003755 preservative agent Substances 0.000 claims description 2
- 230000002335 preservative effect Effects 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 238000005260 corrosion Methods 0.000 abstract description 19
- 230000007797 corrosion Effects 0.000 abstract description 18
- 150000001875 compounds Chemical class 0.000 abstract description 6
- 239000003153 chemical reaction reagent Substances 0.000 abstract description 3
- 238000006056 electrooxidation reaction Methods 0.000 abstract description 2
- 238000005554 pickling Methods 0.000 abstract description 2
- 238000013329 compounding Methods 0.000 abstract 1
- 230000002401 inhibitory effect Effects 0.000 abstract 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 13
- 239000012964 benzotriazole Substances 0.000 description 13
- 239000010949 copper Substances 0.000 description 11
- 238000002845 discoloration Methods 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- 239000000203 mixture Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 238000012512 characterization method Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 230000002421 anti-septic effect Effects 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000001179 sorption measurement Methods 0.000 description 5
- 235000015895 biscuits Nutrition 0.000 description 4
- 238000000026 X-ray photoelectron spectrum Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229910003110 Mg K Inorganic materials 0.000 description 1
- 230000005260 alpha ray Effects 0.000 description 1
- 238000011001 backwashing Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000007739 conversion coating Methods 0.000 description 1
- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
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- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Chemical Treatment Of Metals (AREA)
Abstract
The color change resisting process for copper alloy coin butt includes the steps of annealing, acid pickling, the first rinsing, polishing, the second rinsing, anticorrosion treating, the third rinsing and drying. The cleaned and smoothed coin butt is set inside color change resisting solution to produce chemical reaction forming organic conversion film on the surface. The present invention has copper alloy re-compounding corrosion inhibiting technology, and in the reagent with BTA and other compounds as effective components, the copper alloy butt produces chemical reaction to form compact organic conversion film and has inorganic molecule filling the gaps in complex compound, so as to isolate the butt from air and water and avoid electrochemical corrosion and color change.
Description
Technical Field
The invention relates to a copper alloy coin blank anti-tarnishing process and an anti-tarnishing special preparation thereof, belonging to the surface treatment process technology of copper alloy.
Background
With the global development of economy, the cooperation between the world coinage industries is increasingly close. Southeast Asia and western developed countries tend to buy currency biscuits for printing at the home country's coinage factory. Copper and copper alloys are popular with the coinage industry for their beautiful colors and good machinability. However, the problem of color change of the blank cakes always troubles the coinage industry, and the blank cakes can not be stored for a long time after the surface treatment is finished, so that the international supply of the blank cakes is limited to a certain extent.
Shenyang coin making factory is the base for producing copper alloy coins in China and undertakes the production task of most of the copper alloy coins in China. However, in high-temperature seasons of each year, the blank cakes change color rapidly, and obvious color change happens only in a few hours, so that a large amount of manpower and material resources have to be invested for backwashing treatment, which not only causes low production efficiency, but also affects the surface quality of finished coins.
At present, the anti-discoloration protection of the blank cake is realized by utilizing a chemical adsorption film formed on the surface of the blank cake by the individual components of the polishing liquid in the blank cake polishing stage, which is widely adopted in the coinage industry. The protective film and the substrate are combined by chemical adsorption force, and the film body is not very compact, so the protective effect is poor.
Disclosure of Invention
The invention provides a copper alloy coin blank anti-tarnishing process and a special anti-tarnishing preparation thereof aiming at the problems. The invention makes the prepared special anti-tarnishing agent and the copper alloy coin blank cake generate chemical reaction to produce compact organic conversion coating on the surface of the copper alloy blank cake, thereby delaying the discoloring time of the copper alloy blank cake, and solving the problems of color change among working procedures and storage and transportation.
The invention discloses a copper alloy coin blank anti-tarnishing process which comprises the following steps:
1. annealing the blank cake: annealing the copper alloy coin blank cake to enable the copper alloy coin blank cake to reach the required hardness index;
2. acid washing: removing oxides on the surface of the copper alloy coin blank cake by using a mixed solution of sulfuric acid and phosphoric acid for 24-25 minutes;
3. rinsing 1: rinsing the copper alloy coin blank cake for the first time by using clear water for 9-10 minutes;
4. polishing: polishing and flattening the copper alloy coin blank cake for 25-27 minutes by using SC-880 which is easy to clean;
5. rinsing 2: rinsing the copper alloy coin blank cake for the second time by using clear water for 8-10 minutes;
6. and (3) antiseptic treatment: completely immersing the copper alloy coin blank cake with clean surface and no oxidation in the anti-tarnishing special preparation for 4-10 minutes, and enabling the copper alloy coin blank cake and the anti-tarnishing preparation to quickly generate chemical reaction to generate an organic matter conversion film, namely Cu- (-C)6H5N3) A surface polymer, the chemical reaction of which is: ；
7. rinsing 3: rinsing the copper alloy coin blank cake for the third time by using clear water;
8. and (5) drying.
The invention relates to a special anti-tarnishing preparation for copper alloy coin blank cakes, which comprises the following components in percentage by weight:
BTA：1-3g/l
nonylphenol polyoxyethylene lauryl ether: 3-5g/l
Benzoic acid: 0.1-1g/l
Sodium phosphate: 6-10g/l
The preparation method of the anti-tarnish special preparation comprises the following steps:
1. heating deionized water to 40-50 ℃, adding nonylphenol polyoxyethylene lauryl ether according to the component ratio, and adding BTA after the nonylphenol polyoxyethylene lauryl ether is completely dissolved;
2. adding benzoic acid according to the proportion;
3. adding sodium phosphate according to the proportion;
4. and (4) stirring uniformly.
The invention has the beneficial effects that:
the invention changes the traditional protection mode of the blank cake, namely, SiO is generated on the surface of the blank cake2And the protection mode of the organic polymer chemical adsorption film. But adopts a copper alloy compound corrosion inhibition technology, in a reagent taking BTA and other compounds as effective components, a copper alloy blank cake and the reagent undergo a chemical reaction to generate a compact organic conversion film, and inorganic molecules fill up gaps among complex molecules, so that air and water which are necessary for electrochemical corrosion on the surface of the blank cake are isolated, the electrochemical reaction lacks necessary conditions, and the purpose of discoloration resistance is achieved.
The organic conversion film is colorless and transparent, and is bonded with the metal substrate by chemical bonds, so that the bonding force is stronger than the chemical adsorption force. The film layer is continuous, and the wear resistance is good, so the protection effect of the film layer on the blank cake is obviously better than that of a chemical adsorption film.
The invention is suitable for a BAK blank cake finishing machine and can finish acid cleaning, polishing and corrosion prevention treatment of copper alloy coin blank cakes at one time. The copper alloy coin blank cake produced by the process has the advantages of bright surface, good product consistency and remarkable discoloration resistance, and can meet the requirement of coinage production.
Drawings
Figure 1 is a XPS characterization survey of the briquettes with and without preservation.
FIG. 2 is a Cu2pXPS spectrum of cake samples with and without preservation.
FIG. 3 is an XPS spectrum of N1s for copper alloy billets with and without corrosion protection.
Fig. 4A is a photograph of a neutral salt spray versus accelerated corrosion test.
FIG. 4B is SO2Gas vs. accelerated corrosion test photographs.
Fig. 4C is a photograph of a damp heat versus accelerated corrosion test.
Fig. 4D is a photograph of an artificial sweat versus accelerated corrosion test.
In fig. 1-3; a is an anti-discoloration treatment blank cake, and b is a polishing blank cake.
In fig. 4A-4D: no. 0 is a polished blank cake, and No. 1 is an anti-discoloration treatment blank cake.
The invention is described in detail below with reference to the following figures and examples:
XPS characterization of the present invention for color change resistant and finished compacts
XPS characterization the surface composition of the briquettes was measured on a photoelectron spectrometer model VGESCALAB 210, uk. Basic vacuum of main vacuum chamber is 4.5X 10-11300wat Mg K α ray is used as an excitation source, the Energy Pass (Pass Energy) is 20eV, the step size is 0.08eV, the charge correction is carried out by C1s ═ 285.00 binding Energy, and VG Eclipse Data System version V1.7t is adopted for spectrum acquisition and Data processing.
One of the green compacts was treated according to the present invention-the green compact was treated with discoloration resistance, and the other was treated with a finishing liquid-the green compact was finished.
Characterization results and discussion:
figure 1 is an XPS characterization survey of two biscuits. Fig. 1 shows that the surfaces of the two compacts differ mainly in the binding energy of 399.8eV, which corresponds to the binding energy of N1s, indicating that the sample treated for discoloration has nitrogen (N) element present on the surface.
Figure 2 shows the XPS spectra of Cu2p for two copper alloy biscuits. As can be seen from FIG. 2, the binding energy value of the glazed green cake Cu2p3/2 is 932.90eV, the binding energy value of Cu2p1/2 is 952.7eV, and the existence form of Cu on the surface cannot be determined from the point that the two peaks of +2, +1 and Cu in the zero valence state are very close to each other. In addition to the two peaks at the binding energy positions, the tarnish resistant briquettes showed two shoulders at 954.79 and 934.97, indicating that the surface copper acted with the tarnish resistant agent to form a new species.
FIG. 3 shows the XPS spectra of N1s for two copper alloy compacts, and from FIG. 3 it can be seen that the gloss compact showed no significant binding energy signal in the binding energy range examined, whereas the tarnish resistant compact showed a peak at 399.8eV, corresponding to the binding energy of N1s, indicating the presence of a nitrogen-containing compound in the tarnish resistant solution on the sample surface in combination with copper.
For ease of reference, Table 1 lists the United statesCu2p and N1s in NIST XPS database and the sameBinding energy value of the compound. Table 2 shows the experimentally measured values of the combined energy of Cu2p and N1s for two copper alloy billets. As can be seen by comparing the binding energy values in tables 1 and 2, the Cu2p3/2 and N1s binding energy values of the tarnish resistant briquettes are compared with the Cu- (-C) reported in the NIST XPS database in the United states6H5N3) The binding energy values of the Cu2p3/2 and the N1s are consistent, which fully indicates the action of the copper after the anti-tarnish treatment and the benzotriazole in the anti-tarnish agent, and generates Cu- (-C)6H5N3) A surface polymer.
Table 1: binding energy values of Cu2p and N1s and some of their compounds in the NIST XPS database, USA
| SPECIES | Binding energy(ev) | |
| 2p1/2 | 2p3/2 | |
| Cu | -- | 932.67 |
| CuO | 952.70 | 933.20 |
| Cu2O | 952.50 | 932.70 |
| [Cu-(-C6H5N3)] | -- | 934.90 |
| [Cu-(-C6H5N3)] | 399.70 | |
Table 2: experimentally measured values of the binding energy of Cu2p and N1s for two copper alloy billets treated with and without corrosion protection
| SPECIES | Binding energy(ev) | |
| 2p1/2 | 2p3/2 | |
| Cu(b) | 952.70 | 932.90 |
| Cu(a) | 952.70 954.79 | 932.90 934.97 |
| N1s | 399.80 | |
And (4) conclusion:
in conclusion, the XPS characterization result shows that after antiseptic treatment, copper and BTA in the antiseptic treatment react to generate Cu- (-C)6H5N3) The surface polymer plays the roles of corrosion resistance and discoloration resistance, and prevents the copper on the surface of the biscuit from being oxidized.
Accelerated corrosion test:
based on theoretical evaluation, accelerated corrosion tests are carried out on the corrosion resistance and the discoloration resistance of the two blank cakes. The tests are carried out according to the national standards and the enterprise standards of each test, and the specific conditions are as follows:
neutral salt fog accelerated corrosion test-GB/T10125-1997
SO2Gas accelerated corrosion test-GB/T9789-1988
Humid heat accelerated corrosion test-GB 2423.4-81
Accelerated corrosion test for artificial sweat-QJ/SYB 07.02-1997
As can be seen from the photographs of the accelerated corrosion tests in fig. 4A to 4D, the tarnish resistant green compact has significantly better corrosion resistance and discoloration resistance than the glazed green compact.
Detailed Description
Example 1
The invention discloses a copper alloy coin blank anti-tarnishing process which comprises the following steps:
1. annealing: annealing the copper alloy coin blank cake to enable the copper alloy coin blank cake to reach the required hardness index;
2. acid washing: removing oxides on the surface of the copper alloy coin blank cake by using a mixed solution of sulfuric acid and phosphoric acid for 25 minutes;
3. rinsing 1: carrying out first rinsing treatment on the copper alloy coin blank cake by using clear water for 8 minutes;
4. polishing: polishing and flattening the copper alloy coin blank cake for 26 minutes by using SC-880 which is easy to clean;
5. rinsing 2: rinsing the copper alloy coin blank cake for the second time by using clear water for 9 minutes;
6. and (3) antiseptic treatment: completely immersing the copper alloy coin blank cake with clean surface and no oxidation in the anti-tarnishing special preparation for 6 minutes, and enabling the copper alloy coin blank cake and the anti-tarnishing special preparation to quickly generate chemical reaction to generate an organic matter conversion film, namely Cu- (-C)6H5N3) A surface polymer, the chemical reaction of which is: ；
7. rinsing 3: rinsing the copper alloy coin blank cake for the third time by using clear water for 6 minutes;
8. and (5) drying.
The process is suitable for a BAK coin blank cake finishing machine. The grinding material and the coin blank are loaded according to the weight ratio of 1: 1, and polishing medium SC880 which is easy to clean is adopted to replace polishing liquid, so that the surface deposition of the coin blank and the chemical reaction influence are avoided Is carried out.
The invention relates to a special anti-tarnishing preparation for copper alloy coin blank cakes, which comprises the following components in percentage by weight:
BTA (benzotriazole): 1g/l
Nonyl phenol polyoxyethylene lauryl ether 3g/l
Benzoic acid: 0.1g/l
Sodium phosphate: 6g/l
The preparation method of the anti-tarnish special preparation comprises the following steps:
1. heating deionized water to 40 ℃, adding 1g/l of nonylphenol polyoxyethylene lauryl ether according to the mixture ratio of the components, and adding BTA3g/l after the nonylphenol polyoxyethylene lauryl ether is completely dissolved;
2. adding 0.1g/l of benzoic acid according to the mixture ratio;
3. adding 6g/l of sodium phosphate according to the mixture ratio;
4. and (4) stirring uniformly.
Example 2
The invention discloses a copper alloy coin blank anti-tarnishing process which comprises the following steps:
annealing → acid washing → rinsing 1 → polishing → rinsing 2 → antiseptic treatment → rinsing 3 → drying
After the copper alloy blank cake is annealed to reach the required hardness index, the surface oxide is washed away by acid liquor. After the surface is leveled, the surface is clean, the metal surface is not oxidized, and then enters an anti-tarnishing preparation to quickly generate chemical reaction, and an organic matter conversion film is generated on the surface.
The anti-tarnish preparation can be prepared from commercial products.
Example 3
The anti-tarnishing process of the copper alloy coin blank of the present invention was the same as in example 1.
The anti-tarnishing special preparation is prepared from the following components in parts by weight:
BTA (benzotriazole): 3g/l
Nonylphenol polyoxyethylene lauryl ether: 5g/l
Benzoic acid: 1g/l
Sodium phosphate: 10g/l
The preparation method of the anti-tarnish special preparation comprises the following steps:
1. heating deionized water to 45 ℃, adding 3g/l of nonylphenol polyoxyethylene lauryl ether according to the component ratio, and adding 5g/l of BTA after the nonylphenol polyoxyethylene lauryl ether is completely dissolved;
2. adding 1g/l of benzoic acid according to the mixture ratio;
3. adding 10g/l of sodium phosphate according to the mixture ratio;
4. and (4) stirring uniformly.
Example 4
The anti-tarnishing process of the copper alloy coin blank of the present invention was the same as in example 1.
The anti-tarnishing special preparation is prepared from the following components in parts by weight:
BTA (benzotriazole): 2g/l
Nonylphenol polyoxyethylene lauryl ether: 4g/l
Benzoic acid: 0.5g/l
Sodium phosphate: 8g/l
The preparation method of the anti-tarnish special preparation comprises the following steps:
1. heating deionized water to 50 ℃, adding 2g/l of nonylphenol polyoxyethylene lauryl ether according to the component ratio, and adding 4g/l of BTA after the nonylphenol polyoxyethylene lauryl ether is completely dissolved;
2. adding 0.5g/l of benzoic acid according to the mixture ratio;
3. adding 8g/l of sodium phosphate according to the mixture ratio;
4. and (4) stirring uniformly.
The process schedules of the above examples are shown in Table 3 below:
TABLE 3
| Name of procedure | Time (min) | Remarks for note | ||
| Acid pickling | 24-26 | Setting the excess forward rotation time | ||
|
Float for angling
| Rinsing | 1 | 7-9 | Washing off surface residual liquid |
| Rinsing 2 | 8-10 | Washing off surface residual liquid | ||
| Rinsing 3 | 7-8 | Washing off surface residual liquid | ||
| Polishing of | 25-27 | As much use reversal as possible | ||
| Anti-corrosion treatment | 4-8 | Ensure that the preservative solution completely soaks the blank cake | ||
Claims (3)
1. The anti-tarnishing process of the copper alloy coin blank cake is characterized by comprising the following steps of:
(1) annealing: annealing the copper alloy coin blank cake to enable the copper alloy coin blank cake to reach the required hardness index;
(2) acid washing: removing oxides on the surface of the copper alloy coin blank cake by using a mixed solution of sulfuric acid and phosphoric acid for 24-25 minutes;
(3) rinsing 1: rinsing the copper alloy coin blank cake for the first time by using clear water for 9-10 minutes;
(4) polishing: polishing and flattening the copper alloy coin blank cake by adopting a polishing medium easy to clean for 25-27 minutes;
(5) rinsing 2: rinsing the copper alloy coin blank cake for the second time by using clear water for 8-10 minutes;
(6) preservative treatment: clean the surface, and completely free of oxidized copperThe blank cake of gold coin is completely immersed in the anti-tarnishing agent for 4-10 min, the copper alloy coin blank cake and the anti-tarnishing agent rapidly react chemically to generate an organic matter conversion film, namely Cu- (-C)6H5N3) A surface polymer, the chemical reaction of which is: ；
(7) rinsing 3: rinsing the copper alloy coin blank cake for the third time by using clear water for 5-7 minutes;
(8) drying.
2. The preparation special for resisting the tarnish of the copper alloy coin blank cake is characterized by comprising the following components in parts by weight:
BTA：1-3g/l
3-5g/l of polyoxyethylene nonyl phenyl ether
Benzoic acid: 0.1-1g/l
Sodium phosphate: 6-10 g/l.
3. The preparation method of the anti-tarnishing special preparation for the copper alloy coin blank cake is characterized by comprising the following components in parts by weight:
BTA：1-3g/l
3-5g/l of polyoxyethylene nonyl phenyl ether
Benzoic acid: 0.1-1g/l
Sodium phosphate: 6-10 g/l;
the preparation method comprises the following steps:
1. heating deionized water to 40-50 ℃, adding nonylphenol polyoxyethylene lauryl ether according to the component ratio, and adding BTA after the nonylphenol polyoxyethylene lauryl ether is completely dissolved;
2. adding benzoic acid according to the proportion;
3. adding sodium phosphate according to the proportion;
4. and (4) stirring uniformly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100214613A CN100400709C (en) | 2004-03-25 | 2004-03-25 | Anti-discolouring technology for copper alloy coin blank and special preparation for anti-discolouring thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100214613A CN100400709C (en) | 2004-03-25 | 2004-03-25 | Anti-discolouring technology for copper alloy coin blank and special preparation for anti-discolouring thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1673413A true CN1673413A (en) | 2005-09-28 |
| CN100400709C CN100400709C (en) | 2008-07-09 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114437635A (en) * | 2022-02-22 | 2022-05-06 | 沈阳帕卡濑精有限总公司 | Polishing agent for copper and copper alloy polishing process |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2550436B2 (en) * | 1990-10-23 | 1996-11-06 | 株式会社ジャパンエナジー | Anti-tarnish solution for copper |
| AU5561696A (en) * | 1996-04-18 | 1997-11-07 | International Business Machines Corporation | Organic-metallic composite coating for copper surface protection |
| JP3373356B2 (en) * | 1996-04-19 | 2003-02-04 | 株式会社ジャパンエナジー | Discoloration preventing liquid and method for preventing discoloration of copper or copper alloy, and electronic component material using the same |
| CN1139675C (en) * | 1999-09-03 | 2004-02-25 | 中国科学院金属研究所 | Anticorrosion modifier for the surface of copper and copper alloy |
| JP4642255B2 (en) * | 2000-09-04 | 2011-03-02 | Ｊｘ日鉱日石金属株式会社 | Sputtering target made of copper or copper alloy with oxidation discoloration inhibitor and its processing method |
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2004
- 2004-03-25 CN CNB2004100214613A patent/CN100400709C/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114437635A (en) * | 2022-02-22 | 2022-05-06 | 沈阳帕卡濑精有限总公司 | Polishing agent for copper and copper alloy polishing process |
| CN114437635B (en) * | 2022-02-22 | 2024-01-26 | 沈阳帕卡濑精有限总公司 | Polishing agent for copper and copper alloy polishing process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100400709C (en) | 2008-07-09 |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Shenyang Mint Assignor: CHINA BANKNOTE PRINTING AND MINTING Corp. Contract fulfillment period: 2008.7.29 to 2013.7.28 Contract record no.: 2009210000083 Denomination of invention: Anti-discolouring technology for copper alloy coin blank and special preparation for anti-discolouring thereof Granted publication date: 20080709 License type: Exclusive license Record date: 20090407 |
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| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.7.29 TO 2013.7.28; CHANGE OF CONTRACT Name of requester: SHENYANG MINT FACTORY Effective date: 20090407 |
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| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 100044 Beijing city Xicheng District Xizhimen Street No. 143 triumph building Patentee after: China Banknote Printing and Minting Group Co.,Ltd. Address before: 100044 Beijing city Xicheng District Xizhimen Street No. 143 Patentee before: CHINA BANKNOTE PRINTING AND MINTING Corp. |
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| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20080709 |