CN1672875A - Chemico-mechanical diamond film polisher and polishing method - Google Patents
Chemico-mechanical diamond film polisher and polishing method Download PDFInfo
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- CN1672875A CN1672875A CNA2005100340235A CN200510034023A CN1672875A CN 1672875 A CN1672875 A CN 1672875A CN A2005100340235 A CNA2005100340235 A CN A2005100340235A CN 200510034023 A CN200510034023 A CN 200510034023A CN 1672875 A CN1672875 A CN 1672875A
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- diamond film
- polishing
- temperature
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Abstract
The present invention discloses one kind of chemico-mechanical diamond film polisher and polishing method. The chemico-mechanical polisher includes motor, transmission assembly, sleeve-sleeve spindle assembly, compression springs, diamond film fixing assembly, polishing base disc, electric insulating and heat insulating material, temperature controller, temperature thermocouple, relay, heating device and elevating stage. The present invention can regulate pressure, rotation speed, temperature and other parameters for polishing, for polishing diamond under different conditions. The polisher can polish diamond film precisely in once operation to obtain high smoothness and flatness. The polisher has simple structure, less covered area, and high polishing precision.
Description
Technical field
The method that the present invention relates to a kind of chemical mechanical pulping diamond film burnishing device and carried out the diamond film polishing.
Background technology
Diamond and diamond film are a kind of outstanding structural timber and the functional materials with favorable mechanical performance and chemical property, have boundless application prospect at numerous areas.But natural diamond is few in the occurring in nature memory space, so manually synthetic CVD diamond film has great application prospect.But can uneven thickness, granular size wait, the excessive problems such as (generally at several microns to tens microns) of surface roughness because crystal along the preferential growth of some crystal face, causes in the deposition process of CVD diamond film.And the hardness height of diamond film, stable chemical performance, thinner thickness, diamond film very easily breaks in smooth processing (polishing), so the polishing problem of diamond film has become one of expansion diamond film key technologies for application.Have the method for much diamond film being polished at present, factors such as still roughness and the flatness that is reached owing to polishing, and cost make each method all desirable not to the utmost.Patent of the present invention has proposed a kind of chemical mechanical polishing apparatus and finishing method, can be implemented under the lower temperature diamond film is carried out the chemical mechanical pulping polishing, roughness and flatness that polishing is reached can reach higher level, and the chemical mechanical pulping polishing before polishing efficiency is also relative improves a lot.And this apparatus structure is simple, and the polishing cost is low, and the occupation of land space is little.Can provide experimental study for polishing a small amount of diamond film, possibility and feasibility are provided also for the polishing and the leveling of extensive diamond film.
Summary of the invention
The purpose of this invention is to provide a novelty simple in structure, it is little to take up an area of the space, simple to operation, can carry out the device of chemically mechanical polishing and carry out the method that diamond film polishes diamond film environmental condition is less demanding, it can precise polished diamond film, obtains low roughness and high surface smoothness at last.
Chemical mechanical pulping diamond film burnishing device of the present invention comprises motor 2, transmission component 1, cooperatively interacts and can connect the jacket casing shaft assembly 8 of transmission and the spring that can compress 9 between them, diamond film clamping assembly 14, polishing chassis 6, insulation heat-barrier material 7, temperature controller 10, temperature thermocouple 13, relay 12, heater element 5 and liftable workbench 15; Above-mentioned motor 2 and transmission component 1 thereof are connected with the upper end of jacket casing shaft assembly 8, diamond film clamping assembly 14 is connected with the lower end of jacket casing shaft assembly 8, be separated with insulation heat-barrier material 7 between polishing chassis 6 and the liftable workbench 15, polishing also is equipped with heater element 5 in the chassis 6, and heater element 5 is crossed lead 16 and is connected with temperature controller 10, relay 12 and temperature thermocouple 13.
Be connected by a kinematic axis 3 between above-mentioned jacket casing shaft assembly 8 and the diamond film clamp device 14.
6 planes, above-mentioned polishing chassis are vertical with diamond film grinding central axial direction.
Above-mentioned motor 2 uses the electrodeless variable-speed motor.
6 surfaces, above-mentioned polishing chassis have even minute groove.
There is the hole of heating usefulness on the next door on above-mentioned polishing chassis 6.
Above-mentioned polishing chassis 6 can select for use cast iron or mild steel also can adopt Al
2O
3Abrasive disk.
Above-mentioned polishing chassis 6 with respect to the axis of rotation movement locus in the horizontal direction of diamond film clamp device 14 should with polishing chassis 6 center line correspondence in the longitudinal direction.
Finishing method of the present invention comprises the steps:
1) on polishing chassis 6, adds an amount of oxidant NaNO
3, KNO
3And LiNO
3, the heating-up temperature on the temperature controller 10 is set, connect power supply polishing chassis 6 is heated, after the oxidant on the polishing chassis is melt into liquid state, starter motor 2;
2) height of adjustment liftable workbench 15, spring 9 is compressed, and 4 pairs of polishings of diamond film chassis 6 produces pressure; Liftable workbench 15 can be done rectilinear motion in the horizontal direction, makes whole polishing chassis 6 to polish diamond film 4 equably;
3) when adding oxidant, can add The addition of C rO
3, SiO
2Deng efficient and the quality of additive with increase polishing diamond film.
Above-mentioned steps 1) heating-up temperature is set in 150 ℃ to 500 ℃ in.
Two kinds of situations are arranged above-mentioned steps 1):
When a) temperature of measuring when thermometric galvanic couple 13 was higher than the temperature of setting before, temperature controller 10 disconnects relays 12 heating to be stopped;
B) when temperature is lower than the temperature of setting before, temperature controller 10 engage relaies 12 begin the heating of polishing chassis.
In the above-mentioned steps 2) on the diamond film 4 pressure be 0.05～2MP.
The invention has the beneficial effects as follows simple and practical and can regulate to satisfy the needs of different polishing situations the various parameters of chemical mechanical polishing method.
Description of drawings
Fig. 1 is a diamond film burnishing device structural representation of the present invention;
Wherein
1-transmission component 2-motor 3-kinematic axis 4-diamond film 5-heater element
6-polishing chassis 7-insulation heat-barrier material 8-jacket casing shaft assembly 9-spring 10-temperature controller
11-relay control line 12-relay 13-temperature thermocouple 14-diamond film clamping assembly
15-liftable workbench 16-lead
The specific embodiment:
Chemical mechanical pulping diamond film burnishing device of the present invention comprises motor 2, transmission component 1, cooperatively interacts and can connect the jacket casing shaft assembly 8 of transmission and the spring that can compress 9 between them, diamond film clamping assembly 14, polishing chassis 6, insulation heat-barrier material 7, temperature controller 10, temperature thermocouple 13, relay 12, heater element 5, liftable workbench 15; Above-mentioned motor 2 and transmission component 1 thereof are connected with the upper end of jacket casing shaft assembly 8, diamond film clamping assembly 14 is connected with the lower end of jacket casing shaft assembly 8, be separated with insulation heat-barrier material 7 between polishing chassis 6 and the liftable workbench 15, polishing also is equipped with heater element 5 in the chassis 6, and heater element 5 is connected with temperature controller 10, relay 12 and temperature thermocouple 13 by lead 16.Be connected by a kinematic axis 3 between jacket casing shaft assembly 8 and the diamond film clamp device 14.Polishing 6 planes, chassis are vertical with diamond film grinding central axial direction.Motor 2 uses the electrodeless variable-speed motor.The center line correspondence on above-mentioned diamond film clamp device 14 axiss of rotation and polishing chassis 6.Polishing 6 surfaces, chassis evenly have minute groove.There is the hole of heating usefulness on the next door on polishing chassis 6.Polishing chassis 6 can select for use cast iron or mild steel also can adopt Al
2O
3Abrasive disk.
Main motion during polishing is rotated by driven by motor sleeve sleeve and is realized, can be by regulating its input current operating frequency and then adjusting the speed adjusting that its speed can realize 0-10m/min, and polish line speed generally is no more than 10m/min.To polish used oxidant and be added in the polishing chassis, also can suitably add some fine abrasives or oxygen release material increases polishing efficiency.With the polishing chassis that diamond film directly contacts can be burnishing surface, also can open some minute grooves thereon to strengthen the chance of diamond film catalytic oxidation agent.The polishing chassis can select for use cast iron or mild steel also can adopt Al
2O
3Abrasive disk, the carbon atom except chemistry and mechanism in the diamond also reach polishing effect to cast iron or mild steel diffusion simultaneously.
1. the adjusting of temperature: by a thermocouple polishing chassis is measured, utilized a temperature controller to come the disconnection and the connection of control relay.And then whether energising that can control heater spare is regulated the temperature on polishing chassis.
2. the adjusting of pressure: the size of pressure is regulated by the spring between the sleeve sleeve.Raise or reduce the decrement that the liftable workbench comes regulating spring (after diamond and polishing chassis contact) and just can increase or dwindle and polish the normal pressure of chassis diamond film.The pressure size can be regulated between 0.05-2MPa.
3. the adjusting of rotary speed: adopt stepless speed-regulating motor, thereby reach the polishing rotating speed of control diamond film by controlled frequency control motor speed.Perhaps adopt the external universal frequency converter combination of general motor also can reach same effect.
To describe several embodiment of finishing method of the present invention below, but content of the present invention is not limited to this fully.
Example one: on the polishing chassis, add proper amount of oxidant NaNO
3, KNO
3, LiNO
3, and an amount of SiO
2Heating-up temperature on the temperature controller is set in 150 ℃, connecting power supply heats the polishing chassis, after oxidant on the polishing chassis is melt into liquid state, start stepless speed-regulating motor, with its speed setting at 15r/min, adjust the liftable workbench this moment and promote its height, by the adjusting to amount of spring compression, adjusting diamond film is 0.6MPa to the pressure that polishes the chassis.
Example two: on the polishing chassis, add an amount of oxidant KNO
3And LiNO
3Heating-up temperature on the temperature controller is set in 250 ℃, connecting power supply heats the polishing chassis, after oxidant on the polishing chassis is melt into liquid state, start stepless speed-regulating motor, its speed setting at 50r/min, is adjusted the liftable workbench this moment and promoted its height, it is 0.8Mpa to the pressure on polishing chassis that the decrement of regulating spring makes diamond film, adds proper C rO in polishing process
3
Example three: on the polishing chassis, add an amount of oxidant NaNO
3Heating-up temperature on the temperature controller is set in 450 ℃, connecting power supply heats the polishing chassis, after oxidant on the polishing chassis is melt into liquid state, start stepless speed-regulating motor, its speed setting at 75r/min, is adjusted the liftable workbench this moment and promoted its height, and it is 1.2MPa to the pressure on polishing chassis that the decrement of regulating spring makes diamond film.
Claims (10)
1. a chemical mechanical pulping diamond film burnishing device is characterized in that comprising motor (2), transmission component (1), cooperatively interacts and can connect the jacket casing shaft assembly (8) of transmission and the spring that can compress (9) between them, diamond film clamping assembly (14), polishing chassis (6), insulation heat-barrier material (7), temperature controller (10), temperature thermocouple (13), relay (12), heater element (5) and liftable workbench (15); Above-mentioned motor (2) and transmission component (1) thereof are connected with the upper end of jacket casing shaft assembly (8), diamond film clamping assembly (14) is connected with the lower end of jacket casing shaft assembly (8), be separated with insulation heat-barrier material (7) between polishing chassis (6) and the liftable workbench (15), in the polishing chassis (6) heater element (5) is housed also, heater element (5) is connected with temperature controller (10), relay (12) and temperature thermocouple (13) by lead (16).
2. chemical mechanical pulping diamond film burnishing device according to claim 1 is characterized in that being connected by a kinematic axis (3) between above-mentioned jacket casing shaft assembly (8) and the diamond film clamp device (14); Above-mentioned motor (2) uses the electrodeless variable-speed motor.
3. chemical mechanical pulping diamond film burnishing device according to claim 1 is characterized in that plane, above-mentioned polishing chassis (6) and diamond film grinding central axial direction is vertical; Above-mentioned polishing chassis (6) with respect to the axis of rotation movement locus in the horizontal direction of diamond film clamp device (14) should with polishing chassis (6) center line correspondence in the longitudinal direction.
4. according to claim 1 or 2 or 3 described chemical mechanical pulping diamond film burnishing devices, it is characterized in that surface, above-mentioned polishing chassis (6) evenly has minute groove.
5. according to claim 1 or 2 or 3 described chemical mechanical pulping diamond film burnishing devices, it is characterized in that there is the hole of heating usefulness on the next door on above-mentioned polishing chassis (6).
6. chemical mechanical pulping diamond film burnishing device according to claim 1 is characterized in that above-mentioned polishing chassis (6) can select for use cast iron or mild steel also can adopt Al
2O
3Abrasive disk.
7. the finishing method of the described burnishing device of claim 1 is characterized in that comprising the steps:
1) goes up an amount of oxidant NaNO of interpolation on polishing chassis (6)
3, KNO
3And LiNO
3, the heating-up temperature on the temperature controller (10) is set, connect power supply polishing chassis (6) is heated, after the oxidant on the polishing chassis is melt into liquid state, starter motor (2);
2) height of adjustment liftable workbench (15), spring (9) is compressed, and diamond film (4) produces pressure to polishing chassis (6); Liftable workbench (15) can be done rectilinear motion in the horizontal direction, makes whole polishing chassis (6) to polish diamond film (4) equably;
3) when adding oxidant, can add The addition of C rO
3, SiO
2Deng additive.
8. finishing method according to claim 7 is characterized in that heating-up temperature is set in 150 ℃ to 500 ℃ in the step 1).
9. finishing method according to claim 7 is characterized in that having in the step 1) two kinds of situations:
When a) temperature of measuring when thermometric galvanic couple (13) was higher than the temperature of setting before, temperature controller (10) disconnects relay (12) heating to be stopped; B) when temperature is lower than the temperature of setting before, temperature controller (10) engage relay (12) begins the heating of polishing chassis.
10. finishing method according to claim 7 is characterized in that step 2) in diamond film (4) to go up pressure be 0.05～2MP.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100340235A CN100369713C (en) | 2005-04-11 | 2005-04-11 | Chemico-mechanical diamond film polisher and polishing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100340235A CN100369713C (en) | 2005-04-11 | 2005-04-11 | Chemico-mechanical diamond film polisher and polishing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1672875A true CN1672875A (en) | 2005-09-28 |
| CN100369713C CN100369713C (en) | 2008-02-20 |
Family
ID=35045782
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100340235A Expired - Fee Related CN100369713C (en) | 2005-04-11 | 2005-04-11 | Chemico-mechanical diamond film polisher and polishing method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101972979A (en) * | 2010-08-30 | 2011-02-16 | 南京航空航天大学 | Diamond surface chemical mechanical combined machining method and device thereof |
| CN101848791B (en) * | 2007-11-05 | 2013-07-31 | 依据1947年1月30日法令建立的钻石科学技术研究中心 | Method and device for mechanically processing diamond |
| CN103639886A (en) * | 2013-11-29 | 2014-03-19 | 上海华力微电子有限公司 | Mechanical machine grinding device and method for W-CMP |
| CN103909464A (en) * | 2013-01-09 | 2014-07-09 | 华邦电子股份有限公司 | Chemical mechanical polishing method and self-alignment method |
| CN103934746A (en) * | 2014-05-15 | 2014-07-23 | 常州机电职业技术学院 | Plane grinding device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0938856A (en) * | 1995-07-26 | 1997-02-10 | Sumitomo Electric Ind Ltd | Surface grinding device and its method |
| US6561870B2 (en) * | 2001-03-30 | 2003-05-13 | Lam Research Corporation | Adjustable force applying air platen and spindle system, and methods for using the same |
| WO2003002301A1 (en) * | 2001-06-26 | 2003-01-09 | Lam Research Corporation | End point detection system for chemical mechanical polishing applications |
| CN2561551Y (en) * | 2002-08-23 | 2003-07-23 | 郑州磨料磨具磨削研究所 | Abrasive band polisher for diamond saw discs |
| CN2822875Y (en) * | 2005-04-11 | 2006-10-04 | 广东工业大学 | Chemically mechanical diamond membrane polishing device |
-
2005
- 2005-04-11 CN CNB2005100340235A patent/CN100369713C/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101848791B (en) * | 2007-11-05 | 2013-07-31 | 依据1947年1月30日法令建立的钻石科学技术研究中心 | Method and device for mechanically processing diamond |
| CN101972979A (en) * | 2010-08-30 | 2011-02-16 | 南京航空航天大学 | Diamond surface chemical mechanical combined machining method and device thereof |
| CN103909464A (en) * | 2013-01-09 | 2014-07-09 | 华邦电子股份有限公司 | Chemical mechanical polishing method and self-alignment method |
| CN103639886A (en) * | 2013-11-29 | 2014-03-19 | 上海华力微电子有限公司 | Mechanical machine grinding device and method for W-CMP |
| CN103934746A (en) * | 2014-05-15 | 2014-07-23 | 常州机电职业技术学院 | Plane grinding device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100369713C (en) | 2008-02-20 |
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Fong Hing Precision Industry Co., Ltd. Assignor: Guangdong University of Technology Contract fulfillment period: 2008.2.28 to 2015.2.27 Contract record no.: 2009440001718 Denomination of invention: Chemico-mechanical diamond film polisher and polishing method Granted publication date: 20080220 License type: Exclusive license Record date: 20091022 |
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| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.2.28 TO 2015.2.27; CHANGE OF CONTRACT Name of requester: FENGXING PRECISION INDUSTRY( HUIZHOU ) CO., LTD. Effective date: 20091022 |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080220 Termination date: 20210411 |
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| CF01 | Termination of patent right due to non-payment of annual fee |