CN1670587A - Backlight module detection arrangement - Google Patents
Backlight module detection arrangement Download PDFInfo
- Publication number
- CN1670587A CN1670587A CN 200410026613 CN200410026613A CN1670587A CN 1670587 A CN1670587 A CN 1670587A CN 200410026613 CN200410026613 CN 200410026613 CN 200410026613 A CN200410026613 A CN 200410026613A CN 1670587 A CN1670587 A CN 1670587A
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- backlight
- module
- light emitting
- detecting device
- emitting diode
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Abstract
This invention relates to one aphototropism module set test device, which comprises one test workbench, one turnover device, one movable luminescence diode, one movable electrode clamper and one positioning structure. The turnover device comprises one luminescence diode, one turnover cover and two projecting blocks, wherein the diode is welded to the cover centered on the two blocks through connection lever. The two blocks can move within certain range on the workbench.
Description
[technical field]
The invention relates to a kind of pick-up unit, particularly about a kind of module detecting device backlight.
[background technology]
In LCD (LCD, Liquid Crystal Display) manufacture process, back segment module assembling processing procedure is with the face glass behind the liquid crystal filling and other production operation as multiple spare part assembling such as light guide plate, otpical leaf, circuit, housing.Usually will be in module assembling processing procedure to detection of lighting a lamp of light guide plate and module backlight, whether to clean and whether module backlight correctly electrically conducts on inspection light guide plate surface.
Fig. 1 is the vertical view of prior art light guide plate spatter property pick-up unit 1, it grips a light guide plate 10, and this light guide plate spatter property pick-up unit 1 comprises a testing platform 100, two positioning wedged blocks 150, two light emitting diodes 120 and two power switches 130.These two positioning wedged blocks 150 be fixed on this testing platform 100 above, light guide plate 10 to be detected is fixed at the diagonal angle, these two light emitting diodes 120 are welded on this testing platform 100 by printed circuit board (PCB) (figure does not show), and the incidence surface of close this light guide plate 10 (an indicating) side setting, thereby check its spatter property to light this light guide plate 10, these two power switches 130 are used for controlling the on off state of these two light emitting diodes 120.Because the light emitting diode 120 of this light guide plate spatter property pick-up unit 1 is welded on the fixed position of testing platform 100, it can only be used to detect a kind of light guide plate of specific standard size, just need the different light guide plate spatter property pick-up unit of exploitation for the light guide plate of different specification size.
Mould the light guide plate of frame for packing into, need detect together with assembling the module of finishing backlight, Fig. 2 is the vertical view of first kind of module detecting device 2 backlight of prior art, it grips a module 20 backlight, this module 20 backlight comprises the light guide plate 21 of moulding frame 29 and being positioned at its top, and this module detecting device 2 backlight comprises a testing platform 200, two positioning wedged blocks 250 and flip cover assemblies 280.These two positioning wedged blocks 250 be fixed on this testing platform 200 above, with the fixing module 20 backlight in diagonal angle, this flip cover assembly 280 comprises that two light emitting diodes 282, renovate 286, leader 283 and two projections 284, these two light emitting diodes 282 are welded on this and renovate on 286, this is renovated 286 and ties on these two projections 284 by linkage assembly (indicate) pivot, and can overturn around linkage assembly, these two projections 284 are fixed on this testing platform 200, and this handle 283 is installed in this and renovates a side of 286 so that overturn that this renovates 286.
When this module detecting device 2 backlight is worked, locate module 20 backlight earlier, draw to forward to and mould near frame 29 tops renovating 286 again, make these two light emitting diodes 282 just in time to incidence surface (indicating) that should light guide plate 21, light these two light emitting diodes 282 and can carry out spatter property to light guide plate 21 and detect.
Module backlight for built-in light emitting diode, also promptly with the module backlight of flexible PCB, generally be to detect by the flexible PCB of connecting module backlight, Fig. 3 is the vertical view of second kind of module detecting device 3 backlight of prior art, it grips a module 30 backlight, and this module detecting device 3 backlight comprises a testing platform 300, two positioning wedged blocks 350 and flip cover assemblies 380.
This module 30 backlight comprises moulds frame 39, a light guide plate 31, two built-in light emitting diodes 32 and flexible PCBs 38, this light guide plate 31 is positioned at the top that this moulds frame 39, these two built-in light emitting diodes 32 are arranged on the place of this top of moulding frame 39 near light guide plate 31 incidence surfaces (indicate), and this flexible PCB 38 is connected with built-in light emitting diode 32 and the one end extends module 30 backlight.
These two positioning wedged blocks 350 be fixed on this testing platform 300 above, with the fixing module 30 backlight in diagonal angle, this flip cover assembly 380 comprises that a joint circuit board 382, renovates 386, leader 383 and two projections 384, this joint circuit board 382 is welded on this and renovates on 386, this is renovated 386 and ties on these two projections 384 by linkage assembly (indicate) pivot, and can overturn around linkage assembly, these two projections 384 are fixed on this testing platform 300, and this handle 383 is installed in this and renovates a side of 386 so that overturn that this renovates 386.
When this module detecting device 3 backlight is worked, locate module 30 backlight earlier, draw the position that forwards near flexible PCB 38 renovating 386 again, make the electrode of this joint circuit board 382 just in time be pressed together on the electrode top of flexible PCB 38, energized (figure does not show) is lighted these two built-in light emitting diodes 32 and can be carried out the spatter property inspection to light guide plate 31.
For module detecting device 2,3 backlight, because of its flip cover assembly 280,380 not removable, this module detecting device 2,3 backlight is the same with light guide plate spatter property pick-up unit 1, can only be applicable to a kind of module backlight 20,30 of specific standard size, just need the different module detecting device backlight of exploitation for the module backlight of different specification size.In addition, prior art can increase the quantity of the equipment in the production procedure like this, thereby increase production cost to the detection of guide plate light, need different equipment respectively to the detection of module backlight and to the detection of the module backlight that has flexible PCB.
[summary of the invention]
For overcome prior art module detecting device specification backlight fix, adapt to size can not change and production procedure in the too much problem of equipment needed thereby, the invention provides the adjustable module detecting device backlight of a kind of specification with conformability.
The technical scheme that technical solution problem of the present invention is adopted is: a kind of module detecting device backlight is provided, comprise a testing platform, a flip cover assembly, a removable light emitting diode, travelling electrode folder and a location mechanism, this flip cover assembly comprises that a light emitting diode, is renovated and two projections, this light emitting diode is welded on this and renovates, this is renovated by the linkage assembly pivot and ties on these two projections, and these two projections can move in the particular range on this testing platform.
Compared to prior art, the present invention's module detecting device backlight adopts removable light emitting diode, travelling electrode folder and has the flip cover assembly of removable slide block, by the mobile realization of the above detecting element detection to different size specification light guide plate and module backlight, and then this module detecting device backlight is applicable to the light guide plate and the module backlight of different size specification.Because the present invention's module detecting device backlight is integrated prior art equipment, an equipment can satisfy different detection demands.
[description of drawings]
Fig. 1 is the vertical view of prior art light guide plate spatter property pick-up unit, and it grips a light guide plate.
Fig. 2 is the vertical view of first kind of module detecting device backlight of prior art, and it grips a module backlight.
Fig. 3 is the vertical view of second kind of module detecting device backlight of prior art, and it grips a module backlight.
Schematic perspective view when Fig. 4 is the present invention's module detecting device detection backlight light guide plate.
Fig. 5 is the schematic perspective view of the present invention's module detecting device backlight when detecting not module backlight with flexible PCB.
Fig. 6 is the schematic perspective view of the present invention's module detecting device backlight when detecting the module backlight of band flexible PCB.
[embodiment]
See also Fig. 4, the schematic perspective view when being the present invention's module detecting device detection backlight light guide plate.Wherein, this module detecting device 4 backlight grips a light guide plate 40.This module detecting device 4 backlight comprises a testing platform 400, a flip cover assembly 480, two removable light emitting diodes 420, travelling electrode folder 470 and one module positioning device backlight (indicating).This testing platform 400 comprises that one is positioned at the power supply 410 below it.This flip cover assembly 480 comprises that two light emitting diodes 482, renovate 486, two slide blocks 484 and leader 483, this light emitting diode 482 is welded in this and renovates on 486, this is renovated 486 and ties on these two slide blocks 484 by linkage assembly (indicate) pivot, this handle 483 is installed in this and renovates a side of 486, this renovates 486 so that overturn around this linkage assembly by this handle 483, these two slide blocks 484 are positioned on this testing platform 400 by a bolt (not indicating) and can slide along it, move to drive flip cover assembly 480.This module positioning device backlight can be adjusted according to the required fixing light guide plate 40 or the size of module backlight.
This travelling electrode folder 470 comprises that one is positioned at the printed circuit board (PCB) 471 of its end.These two removable light emitting diodes 420 are welded in respectively on two less printed circuit board (PCB)s (figure does not show), so that move these two removable light emitting diodes 420 by the mobile printing circuit board during work.These two removable light emitting diodes 420, this travelling electrode folder 470 and these two light emitting diodes 482 join with this power supply 410 by lead (figure does not show) respectively, in addition, the several Control switch also can be set to control the on off state of this light emitting diode 482, these two removable light emitting diodes 420 and this travelling electrode folder 470 on testing platform 400, this module positioning device backlight also can change into and use some vacuum suction hole to adsorb fixing light guide plate and module backlight to be detected.
When this module detecting device 4 backlight is worked, locate light guide plate 40 earlier, again these two removable light emitting diode 420 usefulness glue or double faced adhesive tape are fixed on this testing platform 400 near near the relevant position light guide plate 40 incidence surfaces (not indicating), light these two removable light emitting diodes 420 and can carry out the light guide plate spatter property and detect, the fixed position that also can adjust these two removable light emitting diodes 420 according to the size and the incidence surface position of detection light guide plate this moment.
Seeing also Fig. 5, is the schematic perspective view of the present invention's module detecting device backlight 4 when detecting not module backlight with flexible PCB.This module detecting device 4 clampings one module 50 backlight backlight, this module 50 backlight comprises moulds frame 59 and a light guide plate 51 thereon.This moment, these module detecting device 4 courses of work backlight were as follows: 1 locatees module 50 backlight earlier, adjust the relative position of this flip cover assembly 480 and this module 50 backlight again, on this testing platform 400, move these two slide blocks 484, feasible handle is renovated 486 and is drawn and forward to when moulding near frame 59 tops, and two light emitting diodes 482 just in time detect with the spatter property that carries out light guide plate 51 incidence surface (indicating) that should light guide plate 51.In the time need detecting, can finish with the relative position of testing platform 400 by adjusting this flip cover assembly 480 to the module backlight of an other dimensions.
Seeing also Fig. 6, is the schematic perspective view of the present invention's module detecting device backlight 4 when detecting the module backlight of band flexible PCBs, this module detecting device 4 clampings one module 60 backlight backlight.This module 60 backlight comprises moulds frame 69, a light guide plate 61, two built-in light emitting diodes 67 and flexible PCBs 68.This light guide plate 61 is positioned at the top that this moulds frame 69, these two built-in light emitting diodes 67 are arranged on the place of this top of moulding frame 69 near light guide plate 61 incidence surfaces (indicate), and this flexible PCB 68 is connected with two built-in light emitting diodes 67 and the one end extends module 60 backlight.This moment, these module detecting device 4 courses of work backlight were as follows: locate module 60 backlight earlier, clamp the electrode tip of this flexible PCB 68 with this travelling electrode folder 470, make the electrode of printed circuit board (PCB) 471 and the electrode of this flexible PCB 68 realize electrically conducting, can realize the spatter property of light guide plate 61 is detected by gauge tap.
The present invention's module detecting device 4 backlight adopts removable light emitting diode 420, travelling electrode folder 470 and has the flip cover assembly 480 of removable slide block 484, to the light guide plate of different size specification and the detection of module backlight, and then this module detecting device 4 backlight is applicable to the light guide plate and the module backlight of different size specification by the mobile realization of above detecting element.
Claims (5)
1. module detecting device backlight, comprise a testing platform, one flip cover assembly and a location mechanism, this flip cover assembly comprises that a light emitting diode, is renovated and two projections, this light emitting diode is welded in this and renovates, this is renovated by the linkage assembly pivot and ties on these two projections, it is characterized in that: this module detecting device backlight further comprises a removable light emitting diode and travelling electrode folder, and these two projections can move in the particular range on this testing platform.
2. module detecting device backlight as claimed in claim 1, it is characterized in that: this testing platform further comprises a power supply, and this power supply is fixed in this testing platform below and is connected by the light emitting diode on the removable light emitting diode of lead and this, travelling electrode folder and the flip cover assembly.
3. module detecting device backlight as claimed in claim 1 is characterized in that: further comprise a plurality of power switches, can control the conducting state of the light emitting diode on this removable light emitting diode, travelling electrode folder and the flip cover assembly respectively.
4. module detecting device backlight as claimed in claim 1 is characterized in that: this detent mechanism is that a plurality of vacuum suction hole is to adsorb fixing module backlight to be detected.
5. module detecting device backlight as claimed in claim 1 is characterized in that: this flip cover assembly further comprises the leader, and this handle is installed in this side of renovating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100266139A CN100371702C (en) | 2004-03-20 | 2004-03-20 | Backlight module detection arrangement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100266139A CN100371702C (en) | 2004-03-20 | 2004-03-20 | Backlight module detection arrangement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1670587A true CN1670587A (en) | 2005-09-21 |
| CN100371702C CN100371702C (en) | 2008-02-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100266139A Expired - Fee Related CN100371702C (en) | 2004-03-20 | 2004-03-20 | Backlight module detection arrangement |
Country Status (1)
| Country | Link |
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| CN (1) | CN100371702C (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102004338A (en) * | 2010-10-08 | 2011-04-06 | 友达光电(厦门)有限公司 | Assembly structure and method of display device |
| CN101412209B (en) * | 2007-10-19 | 2011-11-09 | 鸿富锦精密工业（深圳）有限公司 | Positioning apparatus |
| US8235343B2 (en) | 2009-04-08 | 2012-08-07 | Hon Hai Precision Industry Co., Ltd. | Fixing device for fixing backlight module |
| CN103217436A (en) * | 2013-03-06 | 2013-07-24 | 京东方科技集团股份有限公司 | Backlight module group defect detection method and equipment |
| CN103411755A (en) * | 2013-08-08 | 2013-11-27 | 深圳市华星光电技术有限公司 | Optical testing device |
| TWI448674B (en) * | 2009-04-17 | 2014-08-11 | Hon Hai Prec Ind Co Ltd | Backlight module fixing tool |
| CN104267034A (en) * | 2014-09-11 | 2015-01-07 | 汕头轻工装备研究院 | Visual inspection equipment of backlight screen |
| CN105074482A (en) * | 2014-03-11 | 2015-11-18 | 新东工业株式会社 | Inspection system for device to be tested, and method for operating inspection system for device to be tested |
| CN106628980A (en) * | 2016-12-22 | 2017-05-10 | 重庆淳祥电子科技有限公司 | Keyboard circuit factory leaving complete inspection station |
| CN106895962A (en) * | 2016-08-25 | 2017-06-27 | 芜湖德仓光电有限公司 | A kind of backlight module detection arrangement and its detection method |
| WO2017152491A1 (en) * | 2016-03-07 | 2017-09-14 | 京东方科技集团股份有限公司 | Backlight source monitoring apparatus and lamp lighting machine |
| CN109813530A (en) * | 2019-01-08 | 2019-05-28 | 深圳奥比中光科技有限公司 | A kind of multifunctional optical mould group test pedestal |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2822966B1 (en) * | 2001-03-28 | 2003-12-12 | Automa Tech Sa | CHASSIS OF EXPOSURE TO THE LIGHT OF A PRINTED CIRCUIT |
| US6876211B2 (en) * | 2002-03-13 | 2005-04-05 | Seagate Technology Llc | Printed circuit board test fixture that supports a PCB to be tested |
| CN2694314Y (en) * | 2004-03-20 | 2005-04-20 | 鸿富锦精密工业（深圳）有限公司 | Backlight module detection equipment |
-
2004
- 2004-03-20 CN CNB2004100266139A patent/CN100371702C/en not_active Expired - Fee Related
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101412209B (en) * | 2007-10-19 | 2011-11-09 | 鸿富锦精密工业（深圳）有限公司 | Positioning apparatus |
| US8235343B2 (en) | 2009-04-08 | 2012-08-07 | Hon Hai Precision Industry Co., Ltd. | Fixing device for fixing backlight module |
| CN101858577B (en) * | 2009-04-08 | 2013-06-05 | 鸿富锦精密工业（深圳）有限公司 | Fixing jig of back light module |
| TWI448674B (en) * | 2009-04-17 | 2014-08-11 | Hon Hai Prec Ind Co Ltd | Backlight module fixing tool |
| CN102004338B (en) * | 2010-10-08 | 2012-03-14 | 友达光电(厦门)有限公司 | Assembly structure and method of display device |
| CN102004338A (en) * | 2010-10-08 | 2011-04-06 | 友达光电(厦门)有限公司 | Assembly structure and method of display device |
| CN103217436A (en) * | 2013-03-06 | 2013-07-24 | 京东方科技集团股份有限公司 | Backlight module group defect detection method and equipment |
| CN103411755A (en) * | 2013-08-08 | 2013-11-27 | 深圳市华星光电技术有限公司 | Optical testing device |
| CN103411755B (en) * | 2013-08-08 | 2015-11-11 | 深圳市华星光电技术有限公司 | A kind of optical testing device |
| US9518819B2 (en) | 2013-08-08 | 2016-12-13 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Optical testing device |
| US10161990B2 (en) | 2014-03-11 | 2018-12-25 | Sintokogio, Ltd. | Inspection system for device to be tested, and method for operating inspection system for device to be tested |
| CN105074482A (en) * | 2014-03-11 | 2015-11-18 | 新东工业株式会社 | Inspection system for device to be tested, and method for operating inspection system for device to be tested |
| CN105074482B (en) * | 2014-03-11 | 2020-03-06 | 新东工业株式会社 | Inspection system for device under test and method of operating the same |
| CN104267034A (en) * | 2014-09-11 | 2015-01-07 | 汕头轻工装备研究院 | Visual inspection equipment of backlight screen |
| WO2017152491A1 (en) * | 2016-03-07 | 2017-09-14 | 京东方科技集团股份有限公司 | Backlight source monitoring apparatus and lamp lighting machine |
| US10578484B2 (en) | 2016-03-07 | 2020-03-03 | Boe Technology Group Co., Ltd. | Backlight source testing device and light-on testing apparatus |
| CN106895962A (en) * | 2016-08-25 | 2017-06-27 | 芜湖德仓光电有限公司 | A kind of backlight module detection arrangement and its detection method |
| CN106628980A (en) * | 2016-12-22 | 2017-05-10 | 重庆淳祥电子科技有限公司 | Keyboard circuit factory leaving complete inspection station |
| CN109813530A (en) * | 2019-01-08 | 2019-05-28 | 深圳奥比中光科技有限公司 | A kind of multifunctional optical mould group test pedestal |
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| Publication number | Publication date |
|---|---|
| CN100371702C (en) | 2008-02-27 |
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