CN1669906A - Method for making minisize flow passage by lead frame technology - Google Patents
Method for making minisize flow passage by lead frame technology Download PDFInfo
- Publication number
- CN1669906A CN1669906A CN 200410030027 CN200410030027A CN1669906A CN 1669906 A CN1669906 A CN 1669906A CN 200410030027 CN200410030027 CN 200410030027 CN 200410030027 A CN200410030027 A CN 200410030027A CN 1669906 A CN1669906 A CN 1669906A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- flow channel
- micro flow
- fabrication techniques
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 139
- 238000005516 engineering process Methods 0.000 title description 18
- 238000004519 manufacturing process Methods 0.000 claims description 66
- 239000002184 metal Substances 0.000 claims description 56
- 229910052751 metal Inorganic materials 0.000 claims description 56
- 239000010408 film Substances 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 15
- 239000012530 fluid Substances 0.000 claims description 13
- 238000007747 plating Methods 0.000 claims description 10
- 229920002120 photoresistant polymer Polymers 0.000 claims description 9
- 238000004381 surface treatment Methods 0.000 claims description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 229910000846 In alloy Inorganic materials 0.000 claims description 3
- 239000006071 cream Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000000427 thin-film deposition Methods 0.000 claims description 2
- 238000001816 cooling Methods 0.000 description 14
- 238000012545 processing Methods 0.000 description 10
- 238000009434 installation Methods 0.000 description 9
- 238000003466 welding Methods 0.000 description 9
- 238000005219 brazing Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000005459 micromachining Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 238000010923 batch production Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 238000001393 microlithography Methods 0.000 description 2
- NHDHVHZZCFYRSB-UHFFFAOYSA-N pyriproxyfen Chemical compound C=1C=CC=NC=1OC(C)COC(C=C1)=CC=C1OC1=CC=CC=C1 NHDHVHZZCFYRSB-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Landscapes
- Micromachines (AREA)
Abstract
This invention relates to a method to process micro channel by conductive structure technique, which comprises the following steps: first forming one groove channel on one conductive rack; then fixing one cover on the groove channel on the rack to determine one micro flow channel.
Description
[technical field]
The present invention relates to a kind of method of making micro flow channel, particularly relate to a kind of method of using lead frame fabrication techniques micro flow channel.
[background technology]
Electronic technology is maked rapid progress now, such as mobile phone (cell phone), personal digital assistant (PD (A), and the laptop (electronic equipment of Noteboo (k) etc., all towards light, thin, short, little, beautiful, and multi-functional trend development, and make also miniaturization thereupon of electronic component above-mentioned electronic equipment comprise as little processing wafer etc., more on arithmetic speed and processing energy, significantly rise to simultaneously, therefore relatively in the process of running, just quite be easy to generate accumulation of heat, cause component temperature to raise.Add along with the collective electron component density that trend caused of miniaturization improves, and because of the high-frequency current that high speed circuit caused, make each element and system be subject to working temperature and what is heard is arranged can't represent the thing of actual usefulness the time.Therefore, for each electronic component can effectively be provided, particularly as the heat radiation of key element such as little processing wafer, just industry has the suggestion of utilization microsystems technology development micro cooling device.
Microsystems technology is meant the technology that volume is small, have the structure of function and self-organizing system of making, general as MEMS (micro electro mechanical system) (Micro-Electro-Mechanical System, MEMS), microcomputer photosystem (Micro-Optic-Mechanical System, MOMS), and Micro-Opto-Electro-Mechanical Systems (Micro-Electro-Mecha-Optical System, MEMOS) etc., the field that all belongs to microsystems technology.Because micro-system can be widely used in fields such as information electronics, photoelectricity communication, precision optical machinery, monitoring of environment, medical biochemistry, and can significantly promote the technical level of every field, so be the key technology area of development in science and technology now, and wherein play the part of very important role with centimetre (mm) level to the manufacturing technology of the microstructure of micron (μ m) level, therefore, the existing microsystems technology that is applied to make micro cooling device is based on the microstructure of centimetre (mm) level to micron (μ m) level.
The manufacture method of existing microstructure can be divided into criticizing to be made (batch process) and makes (non-batch process) with non-batch, wherein can criticize the technology of making and include the trickle processing of matrix (bulkmicro machining), surperficial trickle processing (surface micro machining), and micro-lithography electroforming model (LIGA, a German acronym for lithographie, galvanoformung, abformung) etc., it mainly is to continue to use existing semi-conductive microelectric technique development, and is therefore quite ripe.Yet having, wherein preceding two technology can't carry out high-aspect-ratio (high aspectratio), and the shortcoming of complicated three-dimensional space stereochemical structure processing, therefore being applied to make microstructure just is subjected to suitable restriction.Though micro-lithography electroforming model then is to be the technology that purpose is researched and developed batch to make, but because its equipment needed thereby and production cost are higher, and, therefore in fact still can't carry out the making of microstructure in enormous quantities with low cost at technical bottlenecks that still exists such as die casting or injection moldings.
The technology of non-batch manufacturing then includes little Precision Machining (precision micro machining), micro discharge processing (electro-discharge micro machining), and little laser processing (lasermicro machining) etc., though it can carry out than high-aspect-ratio, and complicated three-dimensional space stereochemical structure processing, but owing to can't make in batches, therefore can't be by the advantage of a large amount of productions with the performance micro-system that reduces cost.
[summary of the invention]
Main purpose of the present invention is that a kind of method with lead frame fabrication techniques micro flow channel is being provided.
But another object of the present invention is in the method that a kind of batch making micro flow channel is provided.
Based on above-mentioned purpose, the invention provides a kind of method with lead frame fabrication techniques micro flow channel, it is characterized in that: this method comprises the following step: (a) form a conduit on a lead frame; And (b) set firmly a lid of containing this conduit on this lead frame, to define a micro flow channel.
Method with lead frame fabrication techniques micro flow channel of the present invention can also have following additional technical feature:
This lead frame in this step (a) has one first basal plane and second basal plane in contrast to this first basal plane, and the conduit on this lead frame is to be extended to this second basal plane orientation by this first basal plane.
This step (a) also can comprise the following step:
(a-1) formation one runs through the groove of wearing of this lead frame; And
(a-2) set firmly one and contain this base plate of wearing groove on this lead frame, to form this by conduit that this lead frame and this base plate was defined.
This step (a) can laser, etching, and one of them mode of mechanical stamping removes the part of this lead frame to form this conduit.
This step (a) also can comprise the following step:
(a-3) definition one predetermined pattern on this lead frame; And
(a-4) remove the part of this lead frame, to form this conduit corresponding to this predetermined pattern.
This step (a-3) can comprise the following step:
(a-31) preparation one has the light shield of this predetermined pattern;
(a-32) coating one photoresist layer is on this lead frame; And
(a-33) shift this predetermined pattern of this light shield on this photoresist layer.
This step (a-4) can etched mode remove the part of this lead frame corresponding to this predetermined pattern.
Contiguous this lead frame side of this lid is formed with a channel in this step (b), and this conduit is connected with this channel and forms this micro flow channel.
This lid can be a lead frame.
This step (b) can comprise the following step:
(b-1) on this lead frame, form a low-melting-point metal film;
(b-2) this lid is posted by on this low-melting-point metal film; And
(b-3) heat this low-melting-point metal film to molten condition, this lid is fixed on this lead frame.
This step (b-1) can be electroplated, evaporation, and one of them mode of sputter with this low-melting-point metal thin film deposition on this lead frame.
This low-melting-point metal film can be tin cream, this step (b-1) be with wire mark and revolve the plating one of them mode with this low-melting-point metal film coated on this lead frame.
The material of this low-melting-point metal film can be the one kind of material of tin metal, tin-indium alloy and gun-metal.
The thickness of this low-melting-point metal film can be 5 μ m to 10 μ m.
This step (b-3) is to be heated in 160 ℃ to 280 ℃ the temperature range to engage.
This step (b-3) more can comprise the power that this lid and this lead frame are approached mutually that applies.
This step (b-3) applies 5k/cm
2To 40kg/cm
2Power make this lid and this lead frame approaching mutually to engage.
The state of this step (b-3) can be kept 5 minutes to 60 minutes.
This method more can be contained in the preceding the following step of step (b-1):
(b-4) this lead frame is carried out surface treatment.
This step (b) can comprise the following step:
(b-5) this lid is posted by on this lead frame; And
(b-6) heat this lid and this lead frame, and apply the power that this lid and this lead frame are approached mutually, this lid is fixed on this lead frame.
This step (b-6) can be heated in 850 ℃ to 1300 ℃ the temperature range to engage.
The power that this step (b-6) can apply 2500Pa to 4500Pa makes this lid and this lead frame approaching mutually to engage.
The state of this step (b-6) was kept 2 hours to 10 hours.
This method more is contained in the preceding the following step of step (b-5):
(b-7) this lead frame is carried out surface treatment.
This method more is included in the following step after the step (b):
(f) injecting a fluid enters in this micro flow channel.
The present invention also provides a kind of method with lead frame fabrication techniques micro flow channel, it is characterized in that: this method comprises the following step:
On a lead frame, form a conduit;
(j) set firmly at least one be formed with wear groove plate body on this lead frame, and make this wear groove to be connected with this conduit; And
(k) set firmly one and contain this lid of wearing groove and this conduit on this plate body, to define a micro flow channel.
This plate body is a lead frame.
This step (j) for set firmly several be formed with respectively wear groove plate body on this lead frame, and make this respectively wear groove and this conduit is connected with each other logical.
This step (i) can comprise the following step:
(i-1) formation one runs through the groove of wearing of this lead frame; And
(i-2) set firmly one and contain this base plate of wearing groove on this lead frame, to form this by conduit that this lead frame and this base plate was defined.
Contiguous this lead frame side of this lid can be formed with a channel, and this conduit in this step (k), this wears groove and this channel and be connected with each other and lead to and form the micro flow channel of this sealing.
[description of drawings]
The present invention is described in detail below in conjunction with drawings and Examples:
Fig. 1 is the plane graph of the present invention with first preferred embodiment of the method for lead frame fabrication techniques micro flow channel;
Fig. 2 is the profile along the line II-II among Fig. 1;
Fig. 3 is a plane graph of this first preferred embodiment, illustrates that a lead frame has several blocks;
Fig. 4 is a flow chart of this first preferred embodiment;
Fig. 5 is a profile of this first preferred embodiment, and light shield with a predetermined pattern and a lead frame that is coated with a photoresist layer are described;
Fig. 6 is a profile of this first preferred embodiment, illustrates that this predetermined pattern of definition is on this lead frame;
Fig. 7 is a profile of this first preferred embodiment, illustrates that the part that removes this lead frame is to form a conduit;
Fig. 8 is a profile of this first preferred embodiment, illustrates to plate to establish a low-melting-point metal film on this lead frame;
Fig. 9 is a profile of this first preferred embodiment, illustrates to cover to establish a lid on this low-melting-point metal film;
Figure 10 is a profile of another aspect of this first preferred embodiment, illustrates to be formed with a channel on this lid;
Figure 11 is the profile of the present invention with second preferred embodiment of the method for lead frame fabrication techniques micro flow channel;
Figure 12 is a flow chart of this second preferred embodiment;
Figure 13 is a profile of this second preferred embodiment, illustrates to be formed with a lead frame of wearing groove;
Figure 14 is a profile of this second preferred embodiment, illustrate set firmly a base plate on this lead frame to form a conduit;
Figure 15 is a profile of this first preferred embodiment, illustrates to cover to establish a lid on this lead frame;
Figure 16 is the profile of the present invention with the 3rd preferred embodiment of the method for lead frame fabrication techniques micro flow channel;
Figure 17 is a flow chart of the 3rd preferred embodiment;
Figure 18 is a profile of the 3rd preferred embodiment, illustrates to be formed with a lead frame of wearing groove;
Figure 19 is a profile of the 3rd preferred embodiment, illustrate set firmly a base plate on this lead frame to form a conduit;
Figure 20 is a profile of the 3rd preferred embodiment, illustrate set firmly be formed with wear groove a plate body on this lead frame;
Figure 21 is a profile of the 3rd preferred embodiment, illustrates to plate to establish a low-melting-point metal film on this plate body; And
Figure 22 is a profile of the 3rd preferred embodiment, illustrates to cover to establish a lid on this low-melting-point metal film.
[embodiment]
About aforementioned and other technology contents, characteristics and effect of the present invention, in the following detailed description that cooperates with reference to three graphic preferred embodiments, can clearly understand.Before proposing detailed description, be noted that in the following description similar elements is to represent with identical numbering.Simultaneously because the function and the purposes of micro flow channel are a lot, be difficult to illustrate one by one, so following is example with a cooling back installation 1 only, manufacture method of the present invention is described, can understand easily by following embodiment in the nature of things and have the knack of this operator, other the every devices that can reach given efficacy with runner also can both be made with the method for lead frame fabrication techniques micro flow channel with the present invention.
As shown in Figures 1 and 2, the present invention is the cooling back installation 1 that making one can be passed to the heat of a high-temperature region 91 low-temperature space 92 with first preferred embodiment of the method for lead frame fabrication techniques micro flow channel.This cooling back installation 1 comprises one and has that one first basal plane 21 and a lead frame 2, in contrast to second basal plane 22 of this first basal plane 21 are fixedly arranged on that lid 3, on this first basal plane 21 is formed at this lead frame 2 and the micro flow channel 20 that is plane distribution, and one is installed in the fluid that is used to transfer heat in this micro flow channel 20.
As shown in Figure 3, generally be used to make the lead frame 2 that electrically connects usefulness, mostly be the large-scale scale copper of getting earlier as 22cm * 26cm, after being divided into several blocks 25 earlier, again simultaneously in respectively forming the hollow out zone with identical figure 200 on this block 25, after cutting and separating in addition, and be that unit finishes final product with this block 25 respectively.So in the following description, though be to make single cooling back installation 1 with plain conductor frame 2, have the knack of this skill person when guessing easily, the present invention also can make a plurality of cooling back installations 1 in plain conductor frame 2 simultaneously certainly simultaneously.
In the present embodiment, this lead frame 2 is one to comprise 97% copper metal before making, and thickness is the sheet metal of 1.25mm.This micro flow channel 20 comprises the low temperature that the heat radiation runner 202, of thermal-arrest runner 201, several contiguous these low-temperature spaces 92 of several contiguous these high-temperature regions 91 is communicated to these thermal-arrest runners 201 by these heat radiation runners 202 and carries runner 203, and a high temperature that is communicated to these heat radiation runners 202 by these thermal-arrest runners 201 is carried runner 204.
In the present embodiment, above-mentioned fluid is distilled water or deionized water, but not as limit, as the organic solvent of methyl alcohol and acetone etc., or other cooling agents (or refrigerant), even air also can be transferred the fluid that heat is used as this.Because this non-principal character of the present invention, and be to be familiar with the easy full of beard of this skill person institute to reach, so here no longer be described in detail.
As shown in Figure 4, the present invention comprises the following step with the method for the above-mentioned micro flow channel 20 of lead frame fabrication techniques:
Step 102 is coated with a photoresist layer 5 on first basal plane 21 of this lead frame 2;
Step 104 as shown in Figure 6, is transferred on this photoresist layer 5 with the mode of exposure imaging this predetermined pattern 40 with this light shield 4.Just finish via above-mentioned steps 100 to step 104 this predetermined pattern 40 is defined in step on this lead frame 2.
Step 108 is carried out surface treatment to this lead frame 2, be in the present embodiment with 5% dilute nitric acid solution clean be formed with the lead frame 2 of this conduit 23 after, dry with the clear water flushing again, to remove the impurity that these lead frame 2 surfaces attach.
Step 110, as shown in Figure 8, plating is established a low-melting-point metal film 6 on this lead frame 2, in the present embodiment, is to deposit the thick gun-metal of 6 μ m on this lead frame 2 with plating mode.Certainly, plate the mode of establishing this low-melting-point metal film 6 and do not exceed with plating, it also can adopt other modes such as evaporation and sputter; Simultaneously, the material of this low-melting-point metal film 6 also can be to substitute as other low-melting-point metals such as tin metal and tin-indium alloy etc. and gun-metals.
The thickness of this low-melting-point metal film 6 is also non-limiting to be 6 μ m, because this low-melting-point metal film 6 is in order to form Jie's metal with this lead frame 2 and this lid 3 (see figure 2)s in subsequent step, therefore its thickness all can reach desirable strength in the scope of 2 μ m to 10 μ m, but what need be illustrated is, when adopting electric plating method to deposit this low-melting-point metal film 6, to can make this low-melting-point metal film 6 of part enter in this conduit 23 unavoidablely, but, therefore will be unlikely to influence the desired effect of these conduit 23 designs because its thickness is minimum with respect to the size of this conduit 23.
Step 112, as shown in Figure 9, one lid 3 of containing this conduit 23 is posted by on this low-melting-point metal film 6, in the present embodiment, this lid 3 is another via the lead frame of the surface-treated and thick 1mm identical with above-mentioned steps 108, but the shape of this lid 3 and material etc. are not as limit, as long as have the material on a composition surface 31 that can engage, all can be applicable among the present invention with this lead frame 2.
Step 114, heat this lead frame 2, this lid 3, and this low-melting-point metal film 6 to this low-melting-point metal film 6 is molten condition, applies one simultaneously and makes this lid 3 and the approaching mutually power of this lead frame 2, so that this lid 3 is fixed on this lead frame 2 as shown in Figure 2.Because this low-melting-point metal film 6 is gun-metal in the present embodiment, thus this step be with hot press in 60 minutes time, apply and keep 40kg/cm
2Power, and be heated to 160 ℃ to 280 ℃ temperature range, make 3 of this low-melting-point metal film 6 and this lead frame 2 and this lids form Jie's metal, and this lead frame 2 and this lid 3 be engaged with each other.Certainly, this equitemperature and pressure can cooperate employed material adjustment, and general preferable state is to be heated in 200 ℃ to 250 ℃ the temperature range, and the scope that applies urgent power then is at 5kg/cm
2To 40kg/cm
2Between, the required time range of keeping of this step is then between 5 minutes to 60 minutes.
To step 114, the lid 3 that just this can be contained this conduit 23 is fixedly arranged on this lead frame 2, and defines this micro flow channel 20 by this lead frame 2 and this lid 3 through above-mentioned steps 110.
Usually, in above-mentioned manufacturing process, can reserve a perforation that is in communication with the outside (figure does not show),, this fluid be injected in this micro flow channel 20 so that after finishing above-mentioned steps.If but design is the fluid that flows in this micro flow channel with air, then owing to be not the use high vacuum furnace in above-mentioned manufacturing process, therefore in manufacturing process, air just occupies this space, conduit 23 place naturally, and after this micro flow channel 20 is finished, just be present in simultaneously in this micro flow channel 20, needless to say inject separately.But, then still must reserve one and bore a hole and enter in this micro flow channel 20 for air if set firmly equipment that this lid 3 adopted on this lead frame 2 time when being high vacuum furnace.
In addition, though adopt etched mode to remove the part of this lead frame 2 in above-mentioned steps 100 to step 106, forming this conduit 23 on this lead frame 2, but not as limit, it also can change to adopt as modes such as laser form this conduit 23 on this lead frame 2.
From the above, this lid 3 also can directly adopt another lead frame, therefore, as shown in figure 10, another aspect of present embodiment is before step 112, is formed with a channel 33 earlier in this lid 3 contiguous these lead frame 2 sides, so that when being posted by this lid 3 on this low-melting-point metal film 6 in step 112, it is logical that this conduit 23 and this channel 33 are connected with each other, with the micro flow channel 20 that forms this sealing.And this lid 3 forms the mode of this channel 33, then can adopt above-mentioned steps 100 to step 106 to form this mode of partly losing conduit 23 and form.
What deserves to be mentioned is, as described in step 112, in the mode of affixed this lid 3 of present embodiment employing with this lead frame 2, be the mode that belongs to soldered, yet except that this, other can be applicable among the present invention too as eutectic welding connections such as diffusion soft solderings.Certainly, and the non-limiting welding method that must belong to soldered just can be applied in the method for the present invention with lead frame fabrication techniques micro flow channel.In fact, as long as other can make this lid 3 be fixedly arranged on mode on this lead frame 2, as gluing, welding, or with methods such as anchor clamps are fixing, all can be applicable among the present invention, and its difference is, if adopt as gluing or welding or during with affixed this lid 3 of the fixing method of anchor clamps and this lead frame 2, the workable scope of this micro flow channel, selected wlding when being subject to stick selected when adopting adhesive means or adopting general welding, or employed clamp material when adopting anchor clamps fixedly.
So,, then certainly adopt methods such as above-mentioned gluing and general welding if the working temperature of these micro flow channel 20 designs is lower than the melting temperature of the grafting material that adopts; Wherein, if adopt the material of the employed tin cream of general electronic industry as this low-melting-point metal film 6, then at 110 energy of above-mentioned steps with wire mark or revolve modes such as plating this low-melting-point metal film 6 is coated on this lead frame 2.
If the working temperature of these micro flow channel 20 designs is higher, then except above-mentioned method with soldered, also can adopt method of brazing to carry out engaging of this lid 3 and this lead frame 2 in addition, following second preferred embodiment of introducing the present invention with the method for lead frame fabrication techniques micro flow channel is to use method of brazing this lid 3 is fixedly arranged on this lead frame 2.
As shown in figure 11, the present invention is roughly the same with second preferred embodiment and above-mentioned first preferred embodiment of the method for lead frame fabrication techniques micro flow channel, be to be used to make a cooling back installation 1 equally, this cooling back installation 1 comprises one to have one first basal plane 21 and a lead frame 2, in contrast to second basal plane 22 of this first basal plane 21 and is fixedly arranged on lid 3, on this first basal plane 21 and is fixedly arranged on a base plate 7, on this second basal plane 22 and is formed on this lead frame 2 micro flow channel 20, and one is installed in the fluid that is used to transfer heat in this micro flow channel 20.
As shown in figure 12, the present invention comprises the following step with the method for the above-mentioned micro flow channel 20 of lead frame fabrication techniques:
Step 300 as shown in figure 13, removes the part of this lead frame 2 in the mechanical stamping mode, form one run through this lead frame 2 wear groove 24.
Step 302 as shown in figure 14, sets firmly one and contains this base plate 7 of wearing groove 24 (seeing Figure 13) on this lead frame 2, to form the conduit 23 that this is defined by this lead frame 2 and this base plate 7.In the present embodiment, this base plate 7 is that another is through surface-treated lead frame.And this base plate 7 is fixedly arranged on the method on this lead frame 2, can adopt the described low-temperature welding method of above-mentioned first preferred embodiment, also can adopt following method of brazing with introduction, or other joint methods; But be noted that its temperature and intensity that is suitable for after engaging need meet temperature and the pressure that subsequent step takes place.
Step 304 is carried out surface treatment to this first basal plane 21 of this lead frame 2.
Step 306 as shown in figure 15, is posted by a lid 3 of containing this conduit 23 on this first basal plane 21 of this lead frame 2, and in the present embodiment, this lid 3 is similarly another through surface-treated lead frame.
Step 308 as shown in figure 11, heats this lead frame 2 and this lid 3 near molten condition, applies one simultaneously and makes this lid 3 and the approaching mutually power of this lead frame 2, this lid 3 is fixed on this lead frame 2, to form this little shape runner 20.In the present embodiment, this step is 5 * 10 with high vacuum furnace
-5Under the environment of Torr, apply suitable power, and be heated to, keep engaging in 10 hours to 980 ℃.
According to the material of this lead frame 2 and the technology of hard solder, the heating-up temperature scope of this step can be between 850 ℃ to 1300 ℃, because in the present embodiment, the material copper content of this lead frame 2 reaches 97%, so the temperature range of this heating is preferable between 950 ℃ to 1100 ℃.The power that applies then can be between 2500 to 4500Pa.Engaging time can be adjusted in 2 hours to 10 hours scope then according to material and required bond strength.
Step 310 is injected a fluid and is entered in this micro flow channel 20, to finish this cooling device 1.This step is to reserve in this lead frame 2, this base plate 7 by original, or the perforation on this lid 3 (figure does not show) is injected this fluid in this micro flow channel 20, owing to be to use high vacuum furnace in the present embodiment, therefore must reserve a perforation for comprising air in interior arbitrary fluid injects this micro flow channel 20.
By above-mentioned first and second preferred embodiment as can be known, the present invention can only not engage with another lead frame as this lid 3 with a lead frame 2 that is formed with this conduit 23 and form this micro flow channel 20; More can be with a lead frame 2 that is formed with this conduit 23, and two engage as the lead frame of this base plate 7 and this lid 3 respectively and form this micro flow channel 20 in addition.In fact, the present invention can adopt a plurality of lead frames to be engaged with each other with the method for lead frame fabrication techniques micro flow channel and form more complicated three-dimensional micro flow channel 20.Below just be illustrated by the 3rd preferred embodiment.
As shown in figure 16, the present invention is with the 3rd preferred embodiment of the method for lead frame fabrication techniques micro flow channel, be to be used to make a cooling back installation 1 equally, this cooling back installation 1 comprises one and has one first basal plane 21 and a lead frame 2 in contrast to second basal plane 22 of this first basal plane 21, one is fixedly arranged on the plate body 8 on this first basal plane 21, one is fixedly arranged on the lid 3 of this plate body 8 away from these lead frame 2 sides, one is fixedly arranged on the base plate 7 on this second basal plane 22, one be formed on this lead frame 2 with this plate body 8 on micro flow channel 20, and one be installed in the fluid that is used to transfer heat in this micro flow channel 20.As shown in figure 17, the present invention comprises the following step with the method for the above-mentioned micro flow channel 20 of lead frame fabrication techniques:
Step 400 as shown in figure 18, removes the part of this lead frame 2 with etching mode, form one run through this lead frame 2 wear groove 24.
Step 402 as shown in figure 19, sets firmly one and contains this base plate 7 of wearing groove 24 (seeing Figure 18) on this lead frame 2, to form the conduit 23 that this is defined by this lead frame 2 and this base plate 7.In the present embodiment, this base plate 7 is similarly another through surface-treated lead frame, and is that the low-temperature welding method introduced with above-mentioned first preferred embodiment is affixed, but not as limit.Certainly, the mode that forms this conduit 23 also can adopt the mode of half erosion of introducing as first preferred embodiment directly to form this on this lead frame 2 partly to lose conduit 23, and non-limitingly forms in these base plate 7 these modes of wearing groove 24 of sealing.
Step 404 is carried out surface treatment to this first basal plane 21 of this lead frame 2.
Step 406, as shown in figure 20, set firmly one be formed with wear groove 81 plate body 8 on this first basal plane 21 of this lead frame 2, and make this wear groove 81 to be connected with this conduit 23.In the present embodiment, this plate body 8 is similarly another through surface-treated lead frame, and the affixed mode of this plate body 8 and this lead frame 2 also is to adopt the low-temperature welding method of aforementioned first preferred embodiment to finish, certainly, it also can be as other modes such as method of brazing of being introduced in above-mentioned second preferred embodiment this plate body 8 is fixed on this lead frame 2.
Step 408, as shown in figure 21, the plating establish a low-melting-point metal film 6 in this plate body 8 away from these lead frame 2 sides, in the present embodiment, be to deposit the thick gun-metal of 10 μ m on this lead frame 2 with plating mode, certainly, the mode that the material that this low-melting-point metal film 6 is selected for use, plating are established, and the thickness that forms is non-as limit.
Step 410 as shown in figure 22, contains this lid of wearing groove 81 3 with one and is posted by this plate body 8 away from these lead frame 2 sides, is about to this lid 3 and is posted by on this low-melting-point metal film 6; In the present embodiment, this lid 3 is similarly another through surface-treated lead frame.
Step 412, heat this lead frame 2, this low-melting-point metal film 6, this plate body 8 and this lid 3 to this low-melting-point metal film 6 and be molten condition, apply one simultaneously and make this lid 3, this plate body 8 and the approaching mutually power of this lead frame 2, so that this lid 3 is fixed on this plate body 8, just can finish as shown in figure 16 this micro flow channel 20 that defines jointly by this base plate 7, this lead frame 2, this plate body 8 and 3 of this lids via above-mentioned steps.In the present embodiment, this low-melting-point metal film 6 is a gun-metal, thus this step be with hot press in 90 minutes time, apply and keep 40kg/cm
2Power, and be heated to 200 ℃ to 250 ℃ temperature range and engage.
Step 414 is injected a fluid and is entered in this micro flow channel 20, to finish this cooling device 1.
From the above, there is the plane at this lead frame 2 and this plate body 8 places simultaneously in this micro flow channel 20, and makes this micro flow channel 20 become a three-dimensional flow passage system.In addition, be familiar with this skill person when guessing by foregoing, in step 406, this is formed with this and wears groove 81 and plate body 8 numbers that are fixedly arranged on this lead frame 2 are not to exceed with one, it also can be to set firmly several to be formed with respectively and to be connected with each other the logical plate body of wearing groove 81 8 on this lead frame 2, by these communicate with each other and be communicated with this conduit 23 these wear groove 81, form complicated more three-dimensional flow passage system.
Equally from the above, in this second and third preferred embodiment, this cooling device 1 that is formed with this micro flow channel 20 all can be formed with this channel 33 in these lid 3 contiguous these lead frame 2 sides, and make this conduit 23, this wears groove 81 and this channel 33 and is connected with each other logical and forms the micro flow channel 20 of this sealing.
In sum, the present invention provides a manufacturing to comprise the brand-new microsystems technology of the microstructure of above-mentioned micro flow channel 20 with the method for lead frame fabrication techniques micro flow channel, decapacitation is integrated outside the processing procedure of the ripe lead frame of utilization prior art, more can make full use of lead frame and can criticize the advantage of making production in a large number, particularly this conduit 23, these wear the generation type of groove 24,81 and this channel 33, all can criticize the mode made from lead frame makes, can only be not rapidly and make this micro flow channel 20 in large quantities, more can be so as to making production cost significantly reduce.
In addition, the present invention can only not make micron order and be the micro flow channel 20 of flat state with the method for lead frame fabrication techniques micro flow channel with extremely low production cost, more can make micron-sized three-dimensional micro flow channel 20 with extremely low cost equally; And, make and to carry out stereoscopic-state and the quite making of complicated micro flow channel system, very advantageous according to the present invention with the method for lead frame fabrication techniques micro flow channel by superimposed layer conductor frame 2.
Claims (30)
1. method with lead frame fabrication techniques micro flow channel, it is characterized in that: this method comprises the following step:
(a) on a lead frame, form a conduit; And
(b) set firmly a lid of containing this conduit on this lead frame, to define a micro flow channel.
2. the method with lead frame fabrication techniques micro flow channel as claimed in claim 1 is characterized in that:
This lead frame in this step (a) has one first basal plane and second basal plane in contrast to this first basal plane, and the conduit on this lead frame is to be extended to this second basal plane orientation by this first basal plane.
3. the method with lead frame fabrication techniques micro flow channel as claimed in claim 1 is characterized in that:
This step (a) comprises the following step:
(a-1) formation one runs through the groove of wearing of this lead frame; And
(a-2) set firmly one and contain this base plate of wearing groove on this lead frame, to form this by conduit that this lead frame and this base plate was defined.
4. the method with lead frame fabrication techniques micro flow channel as claimed in claim 1 is characterized in that:
This step (a) is with laser, etching, and one of them mode of mechanical stamping removes the part of this lead frame to form this conduit.
5. the method with lead frame fabrication techniques micro flow channel as claimed in claim 1 is characterized in that:
This step (a) comprises the following step:
(a-3) definition one predetermined pattern on this lead frame; And
(a-4) remove the part of this lead frame, to form this conduit corresponding to this predetermined pattern.
6. the method with lead frame fabrication techniques micro flow channel as claimed in claim 5 is characterized in that:
This step (a-3) comprises the following step:
(a-31) preparation one has the light shield of this predetermined pattern;
(a-32) coating one photoresist layer is on this lead frame; And
(a-33) shift this predetermined pattern of this light shield on this photoresist layer.
7. the method with lead frame fabrication techniques micro flow channel as claimed in claim 5 is characterized in that:
This step (a-4) is to remove the part of this lead frame corresponding to this predetermined pattern in etched mode.
8. the method with lead frame fabrication techniques micro flow channel as claimed in claim 1 is characterized in that:
Contiguous this lead frame side of this lid is formed with a channel in this step (b), and this conduit is connected with this channel and forms this micro flow channel.
9. the method with lead frame fabrication techniques micro flow channel as claimed in claim 1 is characterized in that:
This lid is a lead frame.
10. the method with lead frame fabrication techniques micro flow channel as claimed in claim 1 is characterized in that:
This step (b) comprises the following step:
(b-1) on this lead frame, form a low-melting-point metal film;
(b-2) this lid is posted by on this low-melting-point metal film; And
(b-3) heat this low-melting-point metal film to molten condition, this lid is fixed on this lead frame.
11. the method with lead frame fabrication techniques micro flow channel as claimed in claim 10 is characterized in that:
This step (b-1) be with electroplate, evaporation, and one of them mode of sputter with this low-melting-point metal thin film deposition on this lead frame.
12. the method with lead frame fabrication techniques micro flow channel as claimed in claim 10 is characterized in that:
This low-melting-point metal film is a tin cream, this step (b-1) be with wire mark and revolve the plating one of them mode with this low-melting-point metal film coated on this lead frame.
13. the method with lead frame fabrication techniques micro flow channel as claimed in claim 10 is characterized in that:
The material of this low-melting-point metal film is the one kind of material of tin metal, tin-indium alloy and gun-metal.
14. the method with lead frame fabrication techniques micro flow channel as claimed in claim 10 is characterized in that:
The thickness of this low-melting-point metal film is 5 μ m to 10 μ m.
15. the method with lead frame fabrication techniques micro flow channel as claimed in claim 10 is characterized in that:
This step (b-3) is to be heated in 160 ℃ to 280 ℃ the temperature range to engage.
16. the method with lead frame fabrication techniques micro flow channel as claimed in claim 10 is characterized in that:
This step (b-3) more comprises the power that this lid and this lead frame are approached mutually that applies.
17. the method with lead frame fabrication techniques micro flow channel as claimed in claim 16 is characterized in that:
This step (b-3) applies 5kg/cm
2To 40kg/cm
2Power make this lid and this lead frame approaching mutually to engage.
18. the method with lead frame fabrication techniques micro flow channel as claimed in claim 16 is characterized in that:
The state of this step (b-3) was kept 5 minutes to 60 minutes.
19. the method with lead frame fabrication techniques micro flow channel as claimed in claim 10 is characterized in that:
This method more is contained in the preceding the following step of step (b-1):
(b-4) this lead frame is carried out surface treatment.
20. the method with lead frame fabrication techniques micro flow channel as claimed in claim 1 is characterized in that:
This step (b) comprises the following step:
(b-5) this lid is posted by on this lead frame; And
(b-6) heat this lid and this lead frame, and apply the power that this lid and this lead frame are approached mutually, this lid is fixed on this lead frame.
21. the method with lead frame fabrication techniques micro flow channel as claimed in claim 20 is characterized in that:
This step (b-6) is to be heated in 850 ℃ to 1300 ℃ the temperature range to engage
22. the method with lead frame fabrication techniques micro flow channel as claimed in claim 20 is characterized in that:
This step (b-6) is that the power that applies 2500Pa to 4500Pa makes this lid and this lead frame approaching mutually to engage.
23. the method with lead frame fabrication techniques micro flow channel as claimed in claim 20 is characterized in that:
The state of this step (b-6) was kept 2 hours to 10 hours.
24. the method with lead frame fabrication techniques micro flow channel as claimed in claim 20 is characterized in that:
This method more is contained in the preceding the following step of step (b-5):
(b-7) this lead frame is carried out surface treatment.
25. the method with lead frame fabrication techniques micro flow channel as claimed in claim 1 is characterized in that:
This method more is included in the following step after the step (b):
(f) injecting a fluid enters in this micro flow channel.
26. the method with lead frame fabrication techniques micro flow channel is characterized in that:
This method comprises the following step:
(i) formation-conduit on a lead frame;
(j) set firmly at least one be formed with wear groove plate body on this lead frame, and make this wear groove to be connected with this conduit; And
(k) set firmly one and contain this lid of wearing groove and this conduit on this plate body, to define a micro flow channel.
27. the method with lead frame fabrication techniques micro flow channel as claimed in claim 26 is characterized in that:
This plate body is a lead frame.
28. the method with lead frame fabrication techniques micro flow channel as claimed in claim 26 is characterized in that:
This step (j) for set firmly several be formed with respectively wear groove plate body on this lead frame, and make this respectively wear groove and this conduit is connected with each other logical.
29. the method with lead frame fabrication techniques micro flow channel as claimed in claim 26 is characterized in that:
This step (i) comprises the following step:
(i-1) formation one runs through the groove of wearing of this lead frame; And
(i-2) set firmly one and contain this base plate of wearing groove on this lead frame, to form this by conduit that this lead frame and this base plate was defined.
30. the method with lead frame fabrication techniques micro flow channel as claimed in claim 26, it is characterized in that: contiguous this lead frame side of this lid is formed with a channel, and this conduit in this step (k), this wears groove and this channel and be connected with each other and lead to and form the micro flow channel of this sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100300271A CN1301897C (en) | 2004-03-17 | 2004-03-17 | Method for making minisize flow passage by lead frame technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100300271A CN1301897C (en) | 2004-03-17 | 2004-03-17 | Method for making minisize flow passage by lead frame technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1669906A true CN1669906A (en) | 2005-09-21 |
| CN1301897C CN1301897C (en) | 2007-02-28 |
Family
ID=35041384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100300271A Expired - Lifetime CN1301897C (en) | 2004-03-17 | 2004-03-17 | Method for making minisize flow passage by lead frame technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1301897C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107249286A (en) * | 2017-07-13 | 2017-10-13 | 王楠楠 | A kind of ultra-thin cooled plate and its processing method |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1057424C (en) * | 1996-02-29 | 2000-10-11 | 中国科学院上海光学精密机械研究所 | micro-channel cooling heat sink |
| US6437981B1 (en) * | 2000-11-30 | 2002-08-20 | Harris Corporation | Thermally enhanced microcircuit package and method of forming same |
| US6610605B2 (en) * | 2001-06-28 | 2003-08-26 | Intel Corporation | Method and apparatus for fabricating encapsulated micro-channels in a substrate |
| CN1187653C (en) * | 2001-12-31 | 2005-02-02 | 中国科学技术大学 | Manufacturing method of micro-pipeline |
| CN1228631C (en) * | 2002-06-20 | 2005-11-23 | 中国科学院理化技术研究所 | Process for preparing high polymer micro-flow control chips |
| CN100423243C (en) * | 2003-10-20 | 2008-10-01 | 中国科学院广州能源研究所 | Miniature efficient self-circulating electronic cooler |
-
2004
- 2004-03-17 CN CNB2004100300271A patent/CN1301897C/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107249286A (en) * | 2017-07-13 | 2017-10-13 | 王楠楠 | A kind of ultra-thin cooled plate and its processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1301897C (en) | 2007-02-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1260789C (en) | Circuit board, semiconductor device mfg. method, and electroplating system | |
| KR100883725B1 (en) | Composite material and wafer supporting member and manufacturing method thereof | |
| CN1326853A (en) | Laminated board | |
| CN1531028A (en) | Electroplating method | |
| CN1720355A (en) | Metal plating structure and method for production thereof | |
| CN101067192A (en) | Carbon fiber reinforced nickel-based composite material and producing method thereof | |
| CN1910676A (en) | Heat insulating stamper structure | |
| CN1733979A (en) | Connecting terminal | |
| CN1421019A (en) | Method of mfg. COF package | |
| CN1391242A (en) | Metal membrane and manufacture thereof, laminated ceramic electronic elements and manufacture thereof | |
| CN1301897C (en) | Method for making minisize flow passage by lead frame technology | |
| JP6753721B2 (en) | Metal-ceramic circuit board and its manufacturing method | |
| CN1212754C (en) | Circuit board and its manufacturing method | |
| CN1301896C (en) | Minisize circulating flow passage device made by lead frame | |
| CN2791701Y (en) | Peltier moudle | |
| CN1572909A (en) | Molten salt bath for electroforming and method of manufacturing metal product using the same | |
| CN1551930A (en) | Fine-electroforming die, and method for manufacturing the same | |
| CN1301635C (en) | Manufacturing method and apparatu for circuit substrate | |
| CN1273762A (en) | Printed circit board material and method of manufacturing board material and intermediate block body for board material | |
| Son et al. | Manufacture of μ-PIM gear mold by electroforming of Fe–Ni and Fe–Ni–W alloys | |
| JP2001210848A (en) | Solar battery and method of manufacturing it | |
| CN1898782A (en) | Electrostatic chuck and chuck base having cooling path for cooling wafer | |
| CN111621816B (en) | Method for manufacturing metal micro-column array with ultrahigh depth-to-width ratio | |
| CN111799152B (en) | Wafer double-sided metal process | |
| CN114434894A (en) | Copper foil graphite film and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: QI SCIENCE & TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SHENG DA TECHNOLOGY, INC. Effective date: 20070928 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20070928 Address after: Kaohsiung city of Taiwan Province Patentee after: Asia Vital Components Co.,Ltd. Address before: Taipei County of Taiwan Province Patentee before: Sentelic Corp. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20070228 |
|
| CX01 | Expiry of patent term |