CN1613899A - 基于聚合物塑料的绝缘材料 - Google Patents

基于聚合物塑料的绝缘材料 Download PDF

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CN1613899A
CN1613899A CNA2004100794252A CN200410079425A CN1613899A CN 1613899 A CN1613899 A CN 1613899A CN A2004100794252 A CNA2004100794252 A CN A2004100794252A CN 200410079425 A CN200410079425 A CN 200410079425A CN 1613899 A CN1613899 A CN 1613899A
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glass
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insulating material
softening temperature
temperature
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弗里德里克·米勒
克里斯托夫·丁克尔迈耶
艾尔弗雷德·格默尔
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Nexans SA
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/40Glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/08Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/17Protection against damage caused by external factors, e.g. sheaths or armouring
    • H01B7/29Protection against damage caused by extremes of temperature or by flame
    • H01B7/295Protection against damage caused by extremes of temperature or by flame using material resistant to flame
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/014Additives containing two or more different additives of the same subgroup in C08K
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/249921Web or sheet containing structurally defined element or component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/249921Web or sheet containing structurally defined element or component
    • Y10T428/249924Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity

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  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
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  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Inorganic Insulating Materials (AREA)
  • Insulated Conductors (AREA)
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Abstract

本发明涉及一种基于聚合物塑料的绝缘材料,其中加入了玻璃颗粒以在燃烧状况下达到稳定性,所述玻璃颗粒由具有不同软化温度的玻璃类物质组成。为了确保非常宽的温度范围,使用了至少三种具有不同软化温度的玻璃颗粒,即第一种玻璃类物质的软化温度低于约470℃,第二种玻璃类物质的软化温度高于约470℃并低于约620℃,第三种玻璃类物质的软化温度高于约760℃。

Description

基于聚合物塑料的绝缘材料
本发明涉及基于聚合物塑料的绝缘材料,其中混入玻璃颗粒以在燃烧时达到稳定性,所述玻璃颗粒由不同软化温度的玻璃类物质组成(EP0 978128B1)。
例如导电线路和光导线路或电缆的外壳以及导线的绝缘都需要这种绝缘材料。所述的线路是指如强电线路或通信传输和/或数据传输使用的线路。使用这种独特的绝缘材料,应当保证相应线路在燃烧状况下在确定持续的时间内所具有的功能。在该时间内,机器、装置和设备还应当供电,而且在该时间内也应还能传输信息。该时间要这样测定,即例如在建筑物内的所存在的人都能被通知到,并且建筑物内的照明保持连通,直到所有人离开,并且如果必要的话,材料还可以被带到安全的地方。由相应线路的安装人员预置的时间例如介于30分钟至3小时之间。
根据EP0 106 708B1,在已知线路中使用了绝缘材料,该绝缘材料由云母片、聚四氟乙烯(PTFE)层和用PTFE涂层的玻璃织物组成。PTFE在直到约600℃下是稳定的。它在更高的温度下分解为灰分。大多数情况下,对应的绝缘线路不容许具有高燃烧载荷(Brandlast)。燃烧时,由于存在氟,所述线路会散发出有毒的和化学腐蚀性气体(浓烟),由此金属线路和导电的或电子的线路会被腐蚀和毁坏。
EP0 968 502A1描述了用于电缆和线路的绝缘材料,该绝缘材料由作为第一组分的聚合物塑料、作为第二组分的玻璃或者陶瓷状或晶体状材料和例如作为第三组分的氧化铝组成。第二组分应在高于第一组分的熔融温度下开始熔融,而第三组分应在1000℃范围内熔融。利用这种绝缘材料,在450℃至1210℃范围内可实现对电缆和线路的功能。为此,必须以较高的费用,向绝缘材料中混入所提到的非常不同的添加剂,还必须首先使大部分改变以形成封闭层。
开始提到的EP 0 978 128B1公开了用一种防火绝缘材料以使电缆具有功能,在此绝缘材料中将来自碱性玻璃的玻璃料和钝化玻璃添加到一种有机硅聚合物中。为了稳定,聚合物中仅混入了玻璃。根据出版文献(Druckschrift),碱性玻璃的熔点低于750℃,而钝化玻璃的熔点不高于710℃。使用该绝缘材料,在700℃范围内形成了一种具有功能确保的玻璃层。因此,对于基于有机硅聚合物的绝缘材料来说,仅在从约400℃起的大温度范围内实现所具有的功能,所述绝缘材料本身首先在相对较高温度下熔融并由此形成玻璃层。
本发明的任务是,改进如前所述绝缘材料,即在明显扩大的温度范围内,确保以低的成本使绝缘线路、电缆和导线得到功能。
根据本发明通过如下方式解决所述任务,本发明使用了具有不同软化温度的至少三种玻璃类物质作为玻璃颗粒,即第一种玻璃类物质的软化温度低于约470℃,第二种玻璃类物质的软化温度高于约470℃并低于约620℃,第三种玻璃类物质的软化温度高于约760℃。
为了在燃烧状况下稳定而向绝缘材料中混入玻璃。制造成本也低。该玻璃的优点在于,其本身是直接可获得的。其中燃烧状况下的转变过程如陶瓷化不是必不可少的。至少三种不同的玻璃类物质确保了由相应绝缘材料包覆的线路、电缆和导线在宽的温度范围内具有功能。这种保护作用在约400℃开始,不超过此温度时,一般的聚合物是稳定的。聚合物从这温度至800℃和更高的温度可保持无缺陷。首先,在低于470℃的温度下,具有不同软化温度的至少三种不同的玻璃类物质提供了包覆线路、电缆或导线的绝缘玻璃层,所述玻璃层由于其中包含的其它两种玻璃类物质的玻璃颗粒而稳定。当第二种玻璃类物质几乎开始熔融时,该稳定的玻璃层在燃烧状况下保持持续升高的温度。在800℃和更高的温度下,由于第三玻璃类物质作为绝缘层而至少保持玻璃层一段时间,这时间对于所具有的功能是必要的并且是规定的。
在优选的实施方案中,绝缘材料中另外还可以混合来自其它玻璃类物质的另外的玻璃颗粒,该玻璃颗粒覆盖在更靠近过渡区,并在远远超过800℃的温度下仍然确保了理想的保护功能。
下面将说明本发明的绝缘材料的实例。
所有已知的聚合物塑料基本上都可以用作基体材料,优选使用防火的和无卤素的。其实例是聚乙烯、聚乙烯共聚物、聚酯、聚丙烯、硅氧烷或乙烯醋酸乙烯酯。
绝缘材料中可混入适量玻璃颗粒。其实例是实心球或空心球。它们的直径可以为1μm至70μm,优选1μm至20μm。
使用至少三种具有不同软化温度的不同玻璃类物质来得到功能。其中,100份基体聚合物中,例如分别加入20至120份三种玻璃类物质。优选实施方式中,100份基体聚合物中分别加入20至50份玻璃类物质。也称作组合物的绝缘材料能够以传统的混合装置制造。例如,内部混合器、双螺杆挤出机或联合捏合机(Ko-Kneter)。
可以使用软化温度为461℃的焊料玻璃(Lotglas)作为第一种玻璃类物质,此温度低于470℃。该玻璃含有少于10%的SiO2,各为11%的B2O3和Al2O3和75%的PbO。
可以使用软化温度为614℃的铁-易熔玻璃作为第二种玻璃类物质,此温度也位于470℃和620℃之间。该玻璃由58%SiO2和20%Na2O以及各低于10%的Al2O3、K2O、CaO、ZnO、BaO和F组成。
软化温度高于760℃的第三种玻璃类物质是一种钨-易熔玻璃。其软化温度为765℃。其组成是75%SiO2和16.5%B2O3以及各低于10%的Al2O3、Na2O和K2O。
绝缘材料中可以混入填料,如三氧化铝水合物、氢氧化镁、白垩或硅酸盐,优选片状硅酸盐如混凝土块(Betonit)或伊利石(Illite)。100份基体聚合物中例如可以额外地混入例如5至80份这种填料。
近来的损失情况表明,尤其是非常高温度下所得到的功能具有重要的意义。为此,有利的是,基体材料中可以混入其它的具有非常高软化温度的玻璃颗粒。
软化温度高于780℃的第四种玻璃类物质是一种硼硅酸盐玻璃,例如仪器玻璃(Gerteglas)G20。其软化温度为790℃。它是由78%SiO2和10%B2O3以及各低于10%的Al2O3、Na2O和CaO、BaO组成。
Duran,一种碱硼硅酸盐玻璃,作为第五种玻璃类物质,具有较高的815℃的软化温度。该玻璃由80%SiO2和13%B2O3以及各低于10%的Al2O3、Na2O、K2O组成。

Claims (10)

1.一种基于聚合物塑料的绝缘材料,其中混入了玻璃颗粒以在燃烧状况下具有稳定性,所述玻璃颗粒由具有不同软化温度的玻璃类物质组成,其特征在于,使用了具有不同软化温度的至少三种玻璃类物质作为玻璃颗粒,即第一种玻璃类物质的软化温度低于约470℃,第二种玻璃类物质的软化温度高于约470℃并低于约620℃,第三种玻璃类物质的软化温度高于约760℃。
2.根据权利要求1的绝缘材料,其特征在于第一种玻璃类物质焊料玻璃(Lotglas)的软化温度为461℃。
3.根据权利要求1的绝缘材料,其特征在于第二种玻璃类物质铁-易熔玻璃的软化温度为614℃。
4.根据权利要求1的绝缘材料,其特征在于第三种玻璃类物质钨-易熔玻璃的软化温度为765℃。
5.根据权利要求1至4中任一项的绝缘材料,其特征在于使用了软化温度高于780℃的第四种玻璃类物质的玻璃颗粒。
6.根据权利要求1至5中任一项的绝缘材料,其特征在于使用了软化温度高于800℃的第五种玻璃类物质的玻璃颗粒。
7.根据权利要求1至6中任一项的绝缘材料,其特征在于玻璃颗粒是实心球和/或空心球。
8.根据权利要求1至7中任一项的绝缘材料,其特征在于玻璃颗粒的直径介于1μm和70μm之间,优选介于1μm和20μm之间。
9.根据权利要求1的绝缘材料,其特征在于聚合物塑料是无卤素的。
10.根据权利要求1的绝缘材料,其特征在于聚合物塑料是防火的。
CNA2004100794252A 2003-10-02 2004-09-02 基于聚合物塑料的绝缘材料 Pending CN1613899A (zh)

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US7267867B2 (en) 2007-09-11
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