CN1570191A - Eutectic alloy for spraying electronic component and its making method - Google Patents
Eutectic alloy for spraying electronic component and its making method Download PDFInfo
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- CN1570191A CN1570191A CNA031354270A CN03135427A CN1570191A CN 1570191 A CN1570191 A CN 1570191A CN A031354270 A CNA031354270 A CN A031354270A CN 03135427 A CN03135427 A CN 03135427A CN 1570191 A CN1570191 A CN 1570191A
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Abstract
The invention provides a eutectic alloy for electronic element surface spray coating and its preparing method. The alloy consists of Sn, Zn, Pb, Cu, and Bi or Cd and is prepared by smelting in proportion. The preparing process comprises: preparing the materials according to the proportion, smelting, cast forming, hot extrusion, and bright drawing. In the invention, the lead is replaced with Bi or/and Cd and Sb, which can reduce the lead pollution.
Description
Technical field
The invention belongs to low melting point alloy and production method thereof in the electronic component spray material, particularly a kind of spraying that does not contain harmful element lead is with eutectic alloy material (also being called gold spraying material), and this gold spraying material is particularly suitable as the material usefulness that electronical elements surfaces such as polyester book membrane capacitance is sprayed (plating) processing.
Background technology
Routine is used for electronical elements surfaces such as polyester book membrane capacitance are carried out the low melting point metal gold spraying material of spray treatment, and its composition adds the common meltings of element such as tin, zinc and forms mainly based on lead.The special-purpose gold spraying material of producing as Qingyuan City, Guangzhou electronics depositing materials factory of electrical condenser promptly belongs to this type of material.Though this class material has characteristics such as the material feedstock source is wide, cost is lower, production technique is also simpler, but because its major ingredient is plumbous, therefore, still in use all environment is brought more serious pollution in production process, health of operators is worked the mischief, enterprise all will spend a large amount of expenses every year and be used for prevention and cure of pollution and regularly operator are carried out lead discharging treatment, recuperate, and this kind material melting point is higher in addition, produce and use in energy consumption also higher.
Summary of the invention
The objective of the invention is to study a kind of electronic component spraying that does not contain harmful element lead with eutectic alloy and production method thereof, prevent the pollution of the environment, improve operator's Working environment, reduce expenses such as enterprise is antifouling, pollution treatment to substitute conventional gold spraying material, to reach; Reduce the energy consumption in the fusing point of material and production, the use simultaneously, improve purposes such as the homogeneity of spraying and adhesion strength.
Solution of the present invention is to adopt tin (Sn), bismuth (Bi) or/and cadmium (Cd) and zinc (Zn) are major ingredient, and the antimony (Sb) of adding adaptation and copper (Cu) are founded and formed again.Therefore, the present invention sprays with the eutectic alloy composition and comprises tin, zinc; Key is also to comprise bismuth in the alloy or/and cadmium and antimony, copper; Each composition in alloy content in the weight of alloy, wherein: tin (Sn) contains 5～30wt%, bismuth, and 20～60wt%, antimony (Sb) contain 0.1～1.5wt%, copper (Cu) contains 0.05～0.2wt% or/and cadmium (Bi is or/and Cd) contains.
The production method of above-mentioned alloy comprises:
A, get the raw materials ready: by the weight percent of contained each element in the above-mentioned alloy, will require purity tin, zinc, antimony powder, copper powder and bismuth or/and cadmium weighing is stand-by respectively;
B, melting: after at first that weighing is stand-by zinc drops into melt in furnace, continue to heat to more than 600 ℃ the time, add the stand-by antimony powder of weighing, treat to add stand-by copper powder again after antimony powder is fused in the zinc liquation fully and continue to heat treat that to 750 °～900 ℃ copper powder melts fully after, add stand-by tin, bismuth at last or/and cadmium; Above-mentioned fusion process all carries out under agitation condition;
C, casting forming: after the scum silica frost of above-mentioned melted alloy molten surface removed, inject die cavity, the side's of casting bar shaped or circle bar (rod) shape.
The purity of above-mentioned raw materials tin, zinc, antimony powder, copper powder and bismuth, cadmium is all more than 99.0%.And described smelting furnace is plumbago crucible stove or stainless steel smelting furnace.And describedly be cast into round bar (rod) shape, and this circle (rod) shape alloy also can be sent into and squeeze in the casting machine, adds the alloy silk that hot extrude is cast 1.0～4.0mm, and the alloy silk is again through drawing ray machine to draw optical processing as the surface, promptly makes spraying with eutectic alloy silk (also claiming the metal spraying line).
The present invention is owing to adopt bismuth or/and cadmium, antimony replace plumbously being smelted into eutectic alloy jointly with tin, zinc, copper etc., not only overcome background technology plumbous pollution and disadvantage such as the harm operator are healthy to environment in melting and use effectively, and the fusing point of alloy is reduced to 170 °～180 ℃ by 200 °～230 ℃ of background technology, and can improve electric conductivity about 5% and bonding force strong.Thereby the present invention has melting and use does not have Lead contamination, can effectively improve Working environment and operator's working conditions, helps protecting operator healthy, reduces the expenses such as treatment that enterprise is used for blowdown, pollution treatment and the regular lead discharging of operator; The fusing point of alloy own is low, be used for low to surperficial spraying operation energy consumptions such as polyester film condensers, coating is even, strong adhesion, characteristics such as electric conductivity height.
Embodiment
Present embodiment is an example to found 10kg alloy silk:
1, get the raw materials ready: with purity is 99.99% tin slab, purity at the spelter more than 99.0%, 240 purpose antimony powders and copper powder and bismuth and cadmium branch by tin slab 4.5kg, spelter 2.0kg, bismuth 2.0kg, cadmium 1.4kg, and antimony powder 90g, copper powder 10g are stand-by after the weighing respectively;
2, melting: after at first that weighing is stand-by spelter places the fusing of plumbago crucible stove, add antimony powder 90g when continuing to heat to 600 ℃, and when heating, add copper powder 10g to 800 ℃, treat copper powder fusing and with zinc, antimony fusion evenly after add tin slab 4.5kg, bismuth 2.0kg, cadmium 1.4kg again, treat all to remove surface scum after the fusing evenly, all fusion process all under agitation carries out;
3, casting forming: with above-mentioned die cavity except that the injection of the liquation behind removing dross diameter phi 28mm, long 100mm, cooling forming promptly makes alloy bar of the present invention;
This bar is sent in the crowded casting machine, added the alloy silk that hot extrude is cast φ 2.0mm, draw optical processing through glazer again, promptly finally make spraying eutectic alloy silk (being called for short the metal spraying silk).
Claims (5)
1, a kind of electronic component spraying uses eutectic alloy, alloy ingredient to comprise tin, zinc; It is characterized in that also containing bismuth in the alloy or/and cadmium and antimony, copper; The content of each composition in alloy is in weight alloy, wherein: tin contains that 30～50wt%, zinc contain 5～30wt%, bismuth, and 20～60wt%, antimony contain 0.1～1.5wt%, copper contains 0.05～0.2wt% or/and cadmium contains.
2, by the production method of the described spraying of claim 1 with eutectic alloy; It is characterized in that this production method comprises:
A, get the raw materials ready: by the weight percent of contained each element in the above-mentioned alloy, will require purity tin, zinc, antimony powder, copper powder and bismuth or/and cadmium weighing is stand-by respectively;
B, melting: after at first that weighing is stand-by zinc drops into melt in furnace, continue to heat to more than 600 ℃ the time, add the stand-by antimony powder of weighing, treat to add stand-by copper powder again after antimony powder is fused in the zinc liquation fully and continue to heat treat that to 750 °～900 ℃ copper powder melts fully after, add stand-by tin, bismuth at last or/and cadmium; Above-mentioned fusion process all carries out under agitation condition;
C, casting forming: after the scum silica frost of above-mentioned melted alloy molten surface removed, inject die cavity, the side's of casting bar shaped or circle bar shaped.
3, by the production method of the described spraying of claim 2 with eutectic alloy; The purity that it is characterized in that described tin, zinc, antimony powder, copper powder and bismuth, cadmium is all more than 99.0%.
4, by the production method of the described spraying of claim 2 with eutectic alloy; It is characterized in that described smelting furnace is plumbago crucible stove or stainless steel smelting furnace.
5, by the production method of the described spraying of claim 2 with eutectic alloy; It is characterized in that the described round bar shaped that is cast into, this circle bar shaped alloy also can be sent into and squeeze in the casting machine, adds the alloy silk that hot extrude is cast 1.0～4.0mm, and the alloy silk promptly makes spraying eutectic alloy silk again through drawing ray machine to draw optical processing as the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA031354270A CN1570191A (en) | 2003-07-18 | 2003-07-18 | Eutectic alloy for spraying electronic component and its making method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA031354270A CN1570191A (en) | 2003-07-18 | 2003-07-18 | Eutectic alloy for spraying electronic component and its making method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1570191A true CN1570191A (en) | 2005-01-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA031354270A Pending CN1570191A (en) | 2003-07-18 | 2003-07-18 | Eutectic alloy for spraying electronic component and its making method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101927226A (en) * | 2010-07-20 | 2010-12-29 | 河南省电力公司平顶山供电公司 | Method for adhering coating on electronic element substrate |
| CN104988354A (en) * | 2015-05-28 | 2015-10-21 | 无锡宏广电容器有限公司 | Metal spray wire for film capacitor, preparation method and spraying process thereof |
| CN106282734A (en) * | 2016-08-26 | 2017-01-04 | 杭州龙灿液态金属科技有限公司 | There is low melting point phase-change accumulation energy alloy, preparation technology and the application of high heat conductance |
| CN109881077A (en) * | 2019-03-21 | 2019-06-14 | 江阴恩特莱特镀膜科技有限公司 | A kind of alloy and preparation method thereof for High-reliability large-power capacitor metal spraying technique |
| GB2575045A (en) * | 2018-06-25 | 2020-01-01 | Rawwater Engineering Company Ltd | Sealing device |
-
2003
- 2003-07-18 CN CNA031354270A patent/CN1570191A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101927226A (en) * | 2010-07-20 | 2010-12-29 | 河南省电力公司平顶山供电公司 | Method for adhering coating on electronic element substrate |
| CN104988354A (en) * | 2015-05-28 | 2015-10-21 | 无锡宏广电容器有限公司 | Metal spray wire for film capacitor, preparation method and spraying process thereof |
| CN106282734A (en) * | 2016-08-26 | 2017-01-04 | 杭州龙灿液态金属科技有限公司 | There is low melting point phase-change accumulation energy alloy, preparation technology and the application of high heat conductance |
| GB2575045A (en) * | 2018-06-25 | 2020-01-01 | Rawwater Engineering Company Ltd | Sealing device |
| GB2575045B (en) * | 2018-06-25 | 2022-12-21 | Rawwater Engineering Company Ltd | Sealing device |
| CN109881077A (en) * | 2019-03-21 | 2019-06-14 | 江阴恩特莱特镀膜科技有限公司 | A kind of alloy and preparation method thereof for High-reliability large-power capacitor metal spraying technique |
| CN109881077B (en) * | 2019-03-21 | 2021-02-05 | 无锡鑫聚电子科技有限公司 | Alloy for high-reliability high-power capacitor metal spraying process and preparation method thereof |
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