CN1566998A - Light guiding board and method for preparing same - Google Patents

Light guiding board and method for preparing same Download PDF

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Publication number
CN1566998A
CN1566998A CN 03139657 CN03139657A CN1566998A CN 1566998 A CN1566998 A CN 1566998A CN 03139657 CN03139657 CN 03139657 CN 03139657 A CN03139657 A CN 03139657A CN 1566998 A CN1566998 A CN 1566998A
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CN
China
Prior art keywords
guide plate
light guide
metal level
metal
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 03139657
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Chinese (zh)
Inventor
吕昌岳
余泰成
陈杰良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN 03139657 priority Critical patent/CN1566998A/en
Publication of CN1566998A publication Critical patent/CN1566998A/en
Pending legal-status Critical Current

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Abstract

This invention relates to a process method for light conductive plate, which comprises the following steps: to provide a base plate; to cover a heat stripping layer on the base plate; to deposit a metal film on the base plate; to coat a resistance film on the metal film; to expose and image form the resistance by use of pre-designed pattern light cover; then to etch the metal film; the stripping resistance layer is to get base plate of metal film pattern; to provide a father mode and mother mode, wherein, the mother mold has the compensating pattern of that of metal pattern ; to locate the base plate with metal film pattern on the mother mold surface; to project into shape ; to strip the mold to form light conductive plate.

Description

Light guide plate and manufacture method thereof
[technical field]
The present invention relates to a kind of light guide plate and manufacture method thereof.
[background technology]
In recent years, along with the colorize and the maximization of LCD, its application is more extensive, as notebook computer, various desk-top computer, LCD TV etc.Because LCD is a kind of passive device, itself can not be luminous, thereby need utilize the light source of a light-source system as LCD, as module backlight (Backlight Module), wherein, light guide plate is the critical elements in the module backlight, and it is used to guide the transmission direction of sending light beam from light source, converts line source or pointolite to the area source outgoing.
In order to improve the homogeneity of beam projecting, generally a plurality of sites are set on the light guide plate surface, be used for the total reflection condition of broken beam, and make the homogeneity of its scattering, and then promote the overall performance of module backlight with raising light guide plate outgoing beam in the light guide plate internal transmission.
As shown in Figure 1, be a kind of side view of prior art light guide plate.This light guide plate 100 is a rectangular light guide plate, and it generally is by transparent organic resin, and (Poly MethyI Meth Acrylate, PMMA) grade is made as polymethylmethacrylate.This light guide plate 100 comprises an exiting surface 120 and a bottom surface 140, and wherein this exiting surface 120 is relative with this bottom surface 140.This bottom surface 140 is provided with a plurality of sites 160, and it can scattering enter the light of light guide plate 100, makes light from these exiting surface 120 even outgoing, and then obtains comparatively uniform surface light source.
But these a plurality of sites 160 scatterings enter the light of light guide plate 100, and can increase light guide plate 100 and go out uniformity of light, but, because light guide plate 100 generally is to be made by transparent resin material, can cause a small amount of light from these a plurality of sites 160 outgoing, optical loss can be caused, and higher bright dipping briliancy can't be obtained.
[summary of the invention]
In order to overcome the not high defective of light guide plate bright dipping briliancy in the prior art, the invention provides the higher light guide plate of a kind of bright dipping briliancy.
The present invention also provides a kind of above-mentioned manufacturing method of light conducting board.
The technical scheme that technical solution problem of the present invention is adopted is: a kind of light guide plate is provided, and it comprises an exiting surface, one and the bottom surface that is oppositely arranged of exiting surface, and this bottom surface is provided with a plurality of sites, and wherein, this surface, a plurality of site has a metal level.
The technical scheme that technical solution problem of the present invention is adopted is: a kind of method of making light guide plate is provided, and it may further comprise the steps: a substrate is provided; In this substrate, cover a hot soarfing absciss layer; Deposition one metal level on this hot soarfing absciss layer; Coating one photoresist layer on this metal level; Utilize the tool light shield of layout in advance, this photoresist layer is exposed and develops; Subsequently metal level is carried out etching; Stripping resistance layer, acquisition has the substrate of metal layer pattern; One male model is provided, a master mold, wherein, this master mold has the pattern with the metal layer pattern complementation; The substrate that will have metal layer pattern places this master mold surface; Carry out ejection formation; The demoulding forms light guide plate.
Compared with prior art, light guide plate of the present invention is at site surface metallization layer, but its usable reflection makes it can reduce optical loss from the exiting surface outgoing raising light utilization, and then raising bright dipping briliancy to the light on surface, site.
[description of drawings]
Fig. 1 is the side view of prior art light guide plate.
Fig. 2 is a light guide plate side view of the present invention.
Fig. 3 is the depositing metal layers synoptic diagram of the metal level processing procedure of method for manufacturing light guide plate of the present invention.
Fig. 4 is the photoresistance coating synoptic diagram of the metal level processing procedure of method for manufacturing light guide plate of the present invention.
Fig. 5 is exposure, the development synoptic diagram of the metal level processing procedure of method for manufacturing light guide plate of the present invention.
Fig. 6 is the etching synoptic diagram of the metal level processing procedure of method for manufacturing light guide plate of the present invention.
Fig. 7 is that the photoresistance of the metal level processing procedure of method for manufacturing light guide plate of the present invention is removed synoptic diagram.
Fig. 8 is that the metal level of the light guide plate processing procedure of method for manufacturing light guide plate of the present invention is aimed at synoptic diagram.
Fig. 9 is that the mould of the light guide plate processing procedure of method for manufacturing light guide plate of the present invention closes synoptic diagram.
Figure 10 is that the resin of the light guide plate processing procedure of method for manufacturing light guide plate of the present invention is injected synoptic diagram.
Figure 11 is the demoulding synoptic diagram of the light guide plate processing procedure of method for manufacturing light guide plate of the present invention.
[embodiment]
See also Fig. 2, light guide plate 800 of the present invention comprises an exiting surface 830, a bottom surface 810 and a plurality of site 820.Wherein, this exiting surface 830 is oppositely arranged with this bottom surface 810, and these a plurality of sites 820 are positioned on this bottom surface 810, and it is shaped as cylindric, and these 820 surfaces, a plurality of site have a metal level 500.Incident light is after metal level 500 reflections of site 820, and bright dipping is even, and briliancy improves.
Seeing also Fig. 3 to Fig. 7, is the processing procedure of the metal level of method for manufacturing light guide plate of the present invention.
See also Fig. 3, a polyethylene terephthalate is provided, and (PolyethyleneTerephthalate, PET) film 300 covers a hot soarfing absciss layer 400 as substrate in this substrate 300.Then, deposition one metal level 500 on this hot soarfing absciss layer 400, wherein, this metal level 500 is the metal materials that adopt the tool high reflectance, and present embodiment adopts aluminum metal, certainly, also can adopt other metal, and its thickness is 0.3 micron to 0.5 micron.
See also Fig. 4, coating one photoresist layer 600 on this metal level 500, wherein Tu Bu photoresistance is organic photoresist material, can adopt positive photoresist or negative photoresist, present embodiment adopts positive photoresist, as phenolics.The method of coating photoresist layer 600 adopts spin coating method, also can adopt spraying method.
See also Fig. 5, utilizing in advance, the light shield of layout (figure does not show) exposes, development step.Light shield is aimed at this photoresist layer 600, carried out step of exposure.Wherein, the light source of exposure is ultraviolet ray, adopts the exposure of projection exposure technology.Be subjected to the photoresistance generation photosensitized reaction of irradiate light, generate the composition that is soluble in developer solution.Carry out development step, the pattern that is designed in advance.In general, the mask pattern design according to different can obtain different pattern, and the present invention is an example with cylindric site.Wherein, developer is a sodium hydroxide solution, spray developing liquid on metal level 500, and substrate remained static 30 seconds~60 seconds, make exposed portion (figure does not show) fully be dissolved in developer solution, exposed portions serve metal level 520, promptly the design transfer of light shield is to this photoresist layer 600.
As shown in Figure 6, be the etching step of metal level processing procedure.Wherein, etching solution is the potpourri of phosphoric acid, nitric acid, acetate, water and wetting agent.Etching solution is sprayed onto metal level 500 surfaces, and chemical reaction takes place with the part metals layer 520 that exposes in it after developing, and through one period reaction time, metal level 500 forms the structure shown in the figure.
As shown in Figure 7, spraying photoresistance exfoliant makes photoresist layer 600 residual unexposed portions 620 react with exfoliant, can obtain a metal level 500 with cylindrical pattern.
See also Fig. 8.One master mold 720, male model 740 are provided.Wherein, master mold 720 surfaces have the cylindrical recess pattern, and male model 740 includes a sprue 742.Master mold 720, male model 740 materials are the high metal of conventional thermal conductivity, as copper, aldary or beryllium copper.In addition, be to improve the rigidity of master mold 720 and male model 740, the nickel that can mix, nickel cobalt (alloy) (NiCo), nickel phosphide (NiP), hybrid silicon carbide (SiC), chromium or the contour hard material of titanium carbide (TiC) also form through electroforming.
Before the substrate 300 with metal level 500 patterns that makes placed this master mold 720, as shown in the figure, metal level 500 was relative with male model 740.Wherein, the pattern on these master mold 720 surfaces is and the cylindrical recess pattern of metal level 500 complementations that promptly, each of metal level 500 is protruded the cylindrical pattern of corresponding master mold 720 each depression of cylindrical pattern.
Please consult Fig. 9 together, master mold 720, male model 740 are closed, be formed for the die cavity 760 that the light guide plate moulding is used, die cavity 760 is communicated with above-mentioned sprue 742.Inject transparent molten resin through sprue 742.Wherein, resin material must have good light penetration, and as methacrylic resin, it is the polymkeric substance based on methyl methacrylate, and it can form multipolymer with alkylacrylates such as other resin such as methacrylate, ethyl propylene acid esters.In addition, this transparent resin material can add materials such as release agent, ultraviolet light absorber, pigment, antioxidant and detonator, and the light guide plate finished product that is beneficial to form has the good optical effect.At present, the industry injection rate is generally at 6000cm 3Below/second, be difficult for producing the tendency of residual deformation for making light guide plate, the scope of injection rate is preferably 1000 to 2500cm 3/ second.The viscosity of conventional molten resin is 50 to 5000Pa.sec, because of the viscosity of molten resin lower better when the moulding, reduce viscosity and can improve molten resin temperature, and improve injection rate, therefore charge into inert gas and can make the viscosity of molten resin be optimized for 200 to 1000Pa.sec.The heating-up temperature of molten resin can suitably be selected according to material therefor, and its temperature can be 170 to 300 ℃, wherein is preferably 190 to 270 ℃, more preferably 230 to 260 ℃.When resin is injected,, be provided with exhaust ditch (figure does not show), also can use vacuum system at master mold 720, male model 740 peripheries for getting rid of gas in the die cavity 760.
After molten resin injects, owing to only 1.0 microns to 1.5 microns of substrate 300 thickness with metal level 500 patterns, the extruding of the molten resin of being injected, the substrate 300 with metal level 500 patterns embeds in the pattern of master molds 720, as shown in figure 10.And temperature raises in the die cavity, because the effect of hot soarfing absciss layer 400 makes hot soarfing absciss layer 400 separate with metal level 500.
By coolant channel (figure does not show) it is carried out refrigeration, wherein chilling temperature is below 110 ℃, and wherein optimizing temperature is 105 ℃, and die sinking as shown in figure 11, promptly gets the light guide plate 800 of the site 820 with metal level 500.
Certainly, method for manufacturing light guide plate of the present invention is not limited to the described manufacture method of above-mentioned embodiment.For example, its site also can cave inward, and at this moment, each protrudes each protrusion pattern of the corresponding master mold of pattern metal level; Its site also can be for other shape, and as semisphere, its surface (indicating) has a metal level, after the site reflection of incident light through having this structure, and the even outgoing of light, and the bright dipping briliancy of raising light guide plate.
Light guide plate contrast prior art of the present invention has following advantage: its site surface metallization layer, but usable reflection makes it can reduce optical loss from the exiting surface outgoing raising light utilization, and then the bright dipping briliancy of raising light guide plate to the light on surface, site.

Claims (10)

1. light guide plate, it comprises an exiting surface, one and this exiting surface bottom surface and a plurality of site that are oppositely arranged, these a plurality of sites are positioned at this bottom surface, it is characterized in that: the surface of this site has metal level.
2. light guide plate as claimed in claim 1 is characterized in that: the material of this metal level is the high metal material of reflectivity.
3. light guide plate as claimed in claim 2 is characterized in that: the material of this metal level is an aluminium.
4. light guide plate as claimed in claim 1 is characterized in that: these a plurality of sites be shaped as cylindrical or semisphere.
5. method for manufacturing light guide plate, it may further comprise the steps: a substrate is provided; In this substrate, cover a hot soarfing absciss layer; Deposition one metal level on this hot soarfing absciss layer; Coating one photoresist layer on this metal level; Utilize the tool light shield of layout in advance, this photoresist layer is exposed and develops; Subsequently metal level is carried out etching; Stripping resistance layer, acquisition has the substrate of metal layer pattern; One male model is provided, a master mold, wherein, this master mold has the pattern with the metal layer pattern complementation; The substrate that will have metal layer pattern places this master mold surface; Carry out ejection formation; The demoulding forms light guide plate.
6. method for manufacturing light guide plate as claimed in claim 5 is characterized in that: the material of this metal level is the high metal material of reflectivity.
7. method for manufacturing light guide plate as claimed in claim 6 is characterized in that: the material of this metal level is an aluminium.
8. method for manufacturing light guide plate as claimed in claim 5 is characterized in that: this base material is a macromolecule polymer material.
9. method for manufacturing light guide plate as claimed in claim 8 is characterized in that: this base material is a polyethylene terephthalate.
10. method for manufacturing light guide plate as claimed in claim 5 is characterized in that: this photoresist layer coating process adopts spraying method or spin coating method.
CN 03139657 2003-06-26 2003-06-26 Light guiding board and method for preparing same Pending CN1566998A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 03139657 CN1566998A (en) 2003-06-26 2003-06-26 Light guiding board and method for preparing same

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Application Number Priority Date Filing Date Title
CN 03139657 CN1566998A (en) 2003-06-26 2003-06-26 Light guiding board and method for preparing same

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CN1566998A true CN1566998A (en) 2005-01-19

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100388083C (en) * 2005-11-01 2008-05-14 友达光电股份有限公司 Method for manufacturing rubber frame and light plate of backlight module by two-material ejection
CN101097406B (en) * 2006-06-26 2011-06-15 株式会社Orc制作所 Tracing system, tracing data correcting device and method, and manufacturing method of base plate
CN101344678B (en) * 2007-07-12 2011-07-27 鸿富锦精密工业(深圳)有限公司 Optical plate and preparation method thereof
CN106796368A (en) * 2014-10-06 2017-05-31 堺显示器制品株式会社 Light element, light supply apparatus and display device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100388083C (en) * 2005-11-01 2008-05-14 友达光电股份有限公司 Method for manufacturing rubber frame and light plate of backlight module by two-material ejection
CN101097406B (en) * 2006-06-26 2011-06-15 株式会社Orc制作所 Tracing system, tracing data correcting device and method, and manufacturing method of base plate
CN101344678B (en) * 2007-07-12 2011-07-27 鸿富锦精密工业(深圳)有限公司 Optical plate and preparation method thereof
CN106796368A (en) * 2014-10-06 2017-05-31 堺显示器制品株式会社 Light element, light supply apparatus and display device
CN106796368B (en) * 2014-10-06 2020-10-30 堺显示器制品株式会社 Light guide unit, light source device, and display device

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