CN1549016A - Luminous diode array light source and back light assembly using the same light source - Google Patents
Luminous diode array light source and back light assembly using the same light source Download PDFInfo
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- CN1549016A CN1549016A CNA031234879A CN03123487A CN1549016A CN 1549016 A CN1549016 A CN 1549016A CN A031234879 A CNA031234879 A CN A031234879A CN 03123487 A CN03123487 A CN 03123487A CN 1549016 A CN1549016 A CN 1549016A
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Abstract
The LED array light source consists of at least one carrier and several LED's. The carrier has one right side and one back side with several joints. The LED's are configured on the carrier and connected to the joints separately, and the light source the LED's supplies emits out from one lateral side of the carrier. The LED array light source is used in back light assembly, and the back light assembly can start under low temperature and has no overheat produced.
Description
Technical field
The invention relates to backlight assembly (the backlight module of a kind of light source and this kind of use light source, be called for short B/L), and particularly relevant for a kind of light emitting diode (light emitting diode, be called for short LED) array light source and use the backlight assembly of this kind light source.
Background technology
Along with high-tech development, video product, particularly digitized video signal or device for image become in general daily life common product.In these digitized video signals or the device for image, display is a critical elements, to show relevent information.The user can read information by display, or and then the running of control device.And in order to cooperate modern life pattern, it is thin light that the volume of video signal or device for image day by day is tending towards.Traditional cathode layer ray display, though still have its advantage, it need take large volume and power consumption.Therefore, cooperate photoelectric technology and semiconductor fabrication, the display of panel type has been developed to become common display product, for example LCD at present.
Because LCD belongs to the display of non-autoluminescence kenel, so the purpose that must provide enough light sources can reach demonstration, and LCD can be divided into penetrating LCD (transmissive LCD), reflective liquid-crystal display (reflective LCD) and partly penetrate-semi-reflecting liquid-crystal display (tran-flective LCD) according to the kenel of utilizing of light source.With penetrating LCD or partly penetrate-semi-reflecting liquid-crystal display is an example, it normally utilizes backlight assembly as its main light source, and backlight assembly is usually by cold cathode fluorescent lamp (the cold cathode fluorescent lamp as light emitting source, abbreviation CCFL), light guide plate (light guide panel, be called for short LGP), reflecting plate and lamp tube cover members such as (lamp holder) form, it disposes as shown in Figure 1.
The diagrammatic cross-section of the backlight assembly of known a kind of notebook computer shown in Figure 1.With reference to Fig. 1, known backlight assembly 100 mainly is made up of the members such as cold cathode fluorescent lamp 102, light guide plate 104 and a lamp tube cover 106 as light emitting source, and wherein light guide plate 104 has a light entrance face 103a, a light-emitting face 103b and a light scattering face 103c.And lamp tube cover 106 is corresponding to the light entrance face 103a of light guide plate 104 configuration, and 102 of fluorescent tubes are to be disposed in the lamp tube cover 106, and the light that fluorescent tube sent can be concentrated and be incident in the light guide plate by lamp tube cover.
Yet, owing to be subject to the caliber of cold cathode fluorescent lamp 102, so the thickness of entire backlight assembly also is difficult to reduce.In addition, use cold cathode fluorescent lamp 102 for a long time after, the Chang Yinwei temperature rises, and causes light guide plate 104 near cold cathode fluorescent lamp 102 places yellows, and then the phenomenon of look inequality takes place, even makes light guide plate 104 produce the phenomenon of warpages.And the known cold cathode fluorescent lamp that adopts 102 is difficult for starting at low temperatures, and cold cathode fluorescent lamp 102 must be taked the next briliancy that can obtain to expect of preheating (warm up) means at the initial stage of lighting a lamp.
Summary of the invention
Therefore, the purpose of this invention is to provide a kind of light emitting diode matrix light source and use the backlight assembly of this kind light source, cause the problem of light guide plate yellow or distortion to avoid high temperature.
A further object of the present invention provides a kind of light emitting diode matrix light source and uses the backlight assembly of this kind light source, to dwindle the thickness of entire backlight assembly.
Another object of the present invention provides a kind of light emitting diode matrix light source and uses the backlight assembly of this kind light source, with startup under low temperature, and without preheating.
Another purpose of the present invention provides a kind of light emitting diode matrix light source and uses the backlight assembly of this kind light source, to increase briliancy.
According to above-mentioned and other purpose, the present invention proposes a kind of light emitting diode matrix light source, comprise a carrier and several light emitting diodes, and carrier has a positive and back side, wherein has many windings point on the front and back, light emitting diode then is disposed on the carrier, and wherein each light emitting diode is to be electrically connected with each winding point respectively, and the light source that light emitting diode provided is the side outgoing by carrier.
The present invention reintroduces a kind of light emitting diode matrix light source, bendable P.e.c. (the flexible printed circuit that comprises a doubling, be called for short FPC) film and several light emitting diodes, and the pliable printed circuit film of doubling has one first engaging zones, one second engaging zones and a bending region that is connected first engaging zones and second engaging zones, wherein has on first engaging zones and has many group second contacts on many group first contacts, second engaging zones.In addition, light emitting diode is to be disposed on first engaging zones and second engaging zones, wherein each light emitting diode is to organize first contact and each to organize second contact and be electrically connected with each, and the light source that light emitting diode provided is the side outgoing by the pliable printed circuit film of doubling.
The present invention proposes a kind of backlight assembly again, comprises a light guide plate and a light emitting diode matrix light source, and wherein light guide plate has a light entrance face, a light-emitting face and a light scattering face.The light emitting diode matrix light source then is disposed at by the light entrance face of light guide plate, and the light emitting diode matrix light source comprises a carrier and several light emitting diodes, and wherein carrier has a positive and back side, and has many windings point on front and back.Light emitting diode then is disposed on the carrier, and wherein each light emitting diode is to be electrically connected with each winding point respectively, and the light source that light emitting diode provided is the side outgoing by carrier.
In addition, the present invention proposes a kind of backlight assembly again, comprise a light guide plate and a light emitting diode matrix light source, wherein light guide plate has a light entrance face, one light-emitting face and a light scattering face, and the light emitting diode matrix light source just is disposed at by the light entrance face of light guide plate, it comprises pliable printed circuit film and several light emitting diodes of a doubling, and the pliable printed circuit film of doubling has one first engaging zones, one second engaging zones and connect first engaging zones and a bending region of second engaging zones wherein has many group first contacts on first engaging zones, have many group second contacts on second engaging zones.In addition, light emitting diode is to be disposed on first engaging zones and second engaging zones, wherein each light emitting diode is to organize first contact and each to organize second contact and be electrically connected with each, and the light source that light emitting diode provided is the side outgoing by the pliable printed circuit film of doubling.
The present invention is because utilize a carrier and several light emitting diodes as light source, thus can increase briliancy, and can avoid the known high temperature problem that is caused because of the long-time running of fluorescent tube.In addition, the thickness of backlight assembly will can not be subject to the caliber of cold cathode fluorescent lamp as known technology.And, use light source of the present invention to start down, and can reduce preheating time in low temperature.
For above-mentioned and other purposes of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and be described with reference to the accompanying drawings as follows:
Description of drawings
Fig. 1 shows the diagrammatic cross-section of the backlight assembly of known a kind of notebook computer;
Fig. 2 is the diagrammatic cross-section according to the backlight assembly of the first embodiment of the present invention;
Fig. 3 A is the diagrammatic cross-section according to the backlight assembly of the second embodiment of the present invention;
Fig. 3 B be Fig. 3 A backlight assembly the light emitting diode matrix light source on look the expansion synoptic diagram;
Fig. 4 A is the diagrammatic cross-section according to the backlight assembly of the third embodiment of the present invention; And
Fig. 4 B be Fig. 4 A backlight assembly the light emitting diode matrix light source on look the expansion synoptic diagram.
The drawing reference numeral explanation:
100,200,300,400: backlight assembly
102: cold cathode fluorescent lamp
103a, 203a, 303a: light entrance face
103b, 203b, 303b: light-emitting face
103c, 203c, 303c: light scattering face
104,204,304: light guide plate
106: lamp tube cover
202,302,402: the light emitting diode matrix light source
205,305: reflecting plate
206: carrier
207a: front
207b: the back side
208,308,408: light emitting diode
210,310a, 310b: contact
306,406: the pliable printed circuit film
307a, 307b, 407a, 407b: engaging zones
307c, 407c: bending region
320,420: broken line
Embodiment
Main concept of the present invention is formed the light source of the backlight assembly in the LCD with a carrier and several light emitting diodes, the formed backlight assembly of notion has three kinds of kenels at least according to this.Below will cooperate Fig. 2, Fig. 3 A, Fig. 3 B, Fig. 4 A and Fig. 4 B to do further explanation.
First embodiment
Fig. 2 is according to the backlight assembly of the one first embodiment of the present invention diagrammatic cross-section of (backlight module is called for short B/L).
With reference to Fig. 2, backlight assembly 200 of the present invention comprises a light emitting diode (light emitting diode, be called for short LED) array light source 202 and a light guide plate (light guide panel, be called for short LGP) 204, wherein light guide plate 204 has a light entrance face 203a, a light-emitting face 203b and a light scattering face 203c.Light emitting diode matrix light source 202 then is disposed at by the light entrance face 203a of light guide plate 204.Light emitting diode matrix light source 202 comprises carrier 206 and several light emitting diodes 208, wherein carrier 206 has a positive 207a and a back side 207b, and have many winding points 210 on positive 207a and back side 207b, and carrier 206 for example is that a printed circuit board (PCB), 208 of light emitting diodes are the light-emitting diodes of a surface adhesion type for example.
Continuation is with reference to Fig. 2, position relation between light emitting diode 208 and the carrier 206 then is that light emitting diode 208 is disposed on the carrier 206, wherein each light emitting diode 208 is to be electrically connected with each winding point 210 respectively, and the light source that provided of light emitting diode 208 is the side outgoing by carrier 206.In addition, when light emitting diode 208 is the light-emitting diode of surface adhering kenel, each light emitting diode 208 has one group of electrode (not illustrating), and light emitting diode 208 is to be electrically connected with contact 210 by electrode respectively, and light emitting diode 208 is to be mutually symmetrical configuration or configuration interlaced with each other, in addition, on the light scattering face 203c of light guide plate 204, more comprise a reflecting plate 205, and still more configurable as blooming pieces such as diffusion sheet, brightening pieces on the light-emitting face 203b of light guide plate 204.
Second embodiment
Fig. 3 A is the diagrammatic cross-section according to the backlight assembly of one second embodiment of the present invention.
With reference to Fig. 3 A, the backlight assembly 300 of present embodiment comprises a light emitting diode matrix light source 302 and a light guide plate 304, and wherein light guide plate 304 has a light entrance face 303a, a light-emitting face 303b and a light scattering face 303c.And light emitting diode matrix light source 302 just is disposed at by the light entrance face 303a of light guide plate 304.Light emitting diode matrix light source 302 comprises pliable printed circuit film (the flexible printed circuit of a doubling, be called for short FPC) 306 and several light emitting diodes 308, and the pliable printed circuit film 306 of doubling has one first engaging zones 307a, one second engaging zones 307b and connect the first engaging zones 307a and the bending region 307c of the second engaging zones 307b, wherein have many group first contact 310a on the first engaging zones 307a, have many group second contact 310b on the second engaging zones 307b, and pliable printed circuit film 306 is individual layer pliable printed circuit film or multilayer pliable printed circuit film, 308 of light emitting diodes are the light-emitting diodes of a surface adhesion type for example.
Continuation is with reference to Fig. 3 A, light emitting diode 308 is to be disposed on the first engaging zones 307a and the second engaging zones 307b, wherein each light emitting diode 308 is to organize the first contact 310a and each to organize the second contact 310b and be electrically connected with each, and the light source that provided of light emitting diode 308 is the side outgoing by the pliable printed circuit film 306 of doubling.In addition, when light emitting diode 308 is the light-emitting diode of surface adhering kenel, each light emitting diode 308 has one group of electrode (not illustrating), and light emitting diode 308 is to be electrically connected with the first contact 310a and the second contact 310b by electrode respectively, and the light emitting diode 308 that is electrically connected on the light emitting diode 308 of the first contact 310a and is electrically connected on the second contact 310b is be mutually symmetrical configuration or configuration interlaced with each other.In addition, on the light scattering face 303c of light guide plate 304, more comprise a reflecting plate 305, and still more configurable as blooming pieces such as diffusion sheet, brightening pieces on the light-emitting face 303b of light guide plate 304.
In addition for the light emitting diode matrix light source 302 of present embodiment is described, with reference to figure 3B.
Fig. 3 B be Fig. 3 A backlight assembly the light emitting diode matrix light source on look the expansion synoptic diagram, with reference to Fig. 3 B, pliable printed circuit film 306 in the light emitting diode matrix light source 302 has the first engaging zones 307a, the second engaging zones 307b and the bending region 307c that is connected the first engaging zones 307a and the second engaging zones 307b, and light emitting diode 308 then is configured on the pliable printed circuit film 306.Afterwards, again with the pliable printed circuit film 306 among the figure by broken line 320 doublings, and insert in the backlight assembly 300 of Fig. 3 A.
The 3rd embodiment
Fig. 4 A is the diagrammatic cross-section according to the backlight assembly of one the 3rd embodiment of the present invention.
With reference to Fig. 4 A, the different patterns that are light emitting diode matrix light source 402 of the backlight assembly 400 of present embodiment and backlight assembly 300 maximums of aforesaid Fig. 3 A, the light emitting diode matrix light source 402 of present embodiment comprises pliable printed circuit film 406 and several light emitting diodes 408 of a doubling, and the pliable printed circuit film 406 of doubling has one first engaging zones 407a, one second an engaging zones 407b and a bending region 407c who is connected the first engaging zones 407a and the second engaging zones 407b, wherein have many group first contact 410a on the first engaging zones 407a, have many group second contact 410b on the second engaging zones 407b, and be the light emitting diode matrix light source 402 of explanation present embodiment, with reference to figure 4B.
Fig. 4 B be Fig. 4 A backlight assembly the light emitting diode matrix light source on look the expansion synoptic diagram, with reference to Fig. 4 B, the pliable printed circuit film 406 in the light emitting diode matrix light source 402 is by broken line 420 doublings, inserts in the backlight assembly 400 of Fig. 4 A again.
Therefore, characteristics of the present invention are to utilize a carrier and the light source of several light emitting diodes as backlight assembly, so can increase briliancy.And, the present invention with light emitting diode as light source, so can avoid the known high temperature problem that is caused because of the long-time running of fluorescent tube.In addition, the thickness of backlight assembly of the present invention will can not be subject to the caliber of cold cathode fluorescent lamp as known.And, use light source of the present invention to start down, and can reduce preheating time in low temperature.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; any those skilled in the art; without departing from the spirit and scope of the present invention; can do various changes and retouching, so protection scope of the present invention is when looking being as the criterion of being defined with claims.
Claims (12)
1. light emitting diode matrix light source comprises:
One carrier, this carrier have a positive and back side, wherein should the front with this back side on have many windings point; And
Be disposed at a plurality of light emitting diodes on this carrier, wherein these light emitting diodes are to be electrically connected with these winding points respectively, and the light source that these light emitting diodes provided is the side outgoing by this carrier.
2. a light emitting diode matrix light source is to be applied to a backlight assembly, and this backlight assembly comprises a light guide plate, and this light guide plate has a light entrance face, a light-emitting face and a light scattering face; Wherein, this light emitting diode matrix light source comprises:
One carrier, this carrier have a positive and back side, wherein should the front with this back side on have many windings point; And
Be disposed at a plurality of light emitting diodes on this carrier, wherein these light emitting diodes are to be electrically connected with these winding points respectively, and the light source that these light emitting diodes provided is the side outgoing by this carrier.
3. light emitting diode matrix light source as claimed in claim 1 or 2 is characterized in that: this carrier comprises a printed circuit board (PCB).
4. light emitting diode matrix light source as claimed in claim 1 or 2 is characterized in that: this carrier comprises a pliable printed circuit film.
5. light emitting diode matrix light source as claimed in claim 4 is characterized in that: this pliable printed circuit film is in an individual layer pliable printed circuit film and the multilayer pliable printed circuit film.
6. light emitting diode matrix light source as claimed in claim 1 or 2, it is characterized in that: each these light emitting diode is the light-emitting diode of a surface adhesion type, each these light emitting diode has one group of electrode, and these light emitting diodes are to be electrically connected with these winding points by these group electrodes respectively.
7. light emitting diode matrix light source as claimed in claim 1 or 2 is characterized in that: the configuration mode of these light emitting diodes is to be selected from following row group: the configuration that is mutually symmetrical, configuration interlaced with each other and the part symmetric part is interconnected each other.
8. light emitting diode matrix light source comprises:
The pliable printed circuit film of one doubling, the pliable printed circuit film of this doubling has one first engaging zones, one second engaging zones, connects a bending region of this first engaging zones and this second engaging zones, organizes first contacts and second contacts of group more than having on this second engaging zones wherein have on this first engaging zones more; And
Be disposed at a plurality of light emitting diodes on this first engaging zones and this second engaging zones, wherein these light emitting diodes are to organize first contact and these with these to organize second contact and be electrically connected, and the light source that these light emitting diodes provided is the side outgoing by the pliable printed circuit film of this doubling.
9. a light emitting diode matrix light source is to be applied to a backlight assembly, and this backlight assembly comprises a light guide plate, and this light guide plate has a light entrance face, a light-emitting face and a light scattering face; Wherein, this light emitting diode matrix light source comprises:
The pliable printed circuit film of one doubling, the pliable printed circuit film of this doubling has one first engaging zones, one second engaging zones, connects a bending region of this first engaging zones and this second engaging zones, wherein have many group first contacts on this first engaging zones, and have many group second contacts on this second engaging zones; And
Be disposed at a plurality of light emitting diodes on this first engaging zones and this second engaging zones, wherein these light emitting diodes are to organize first contact and these with these to organize second contact and be electrically connected, and the light source that these light emitting diodes provided is the side outgoing by the pliable printed circuit film of this doubling.
10. light emitting diode matrix light source as claimed in claim 8 or 9, it is characterized in that: the light-emitting diode that each these first light emitting diode is a surface adhesion type, each these light emitting diode has one group of electrode, and these light emitting diodes be respectively by these the group electrodes organize first contact with these, these are organized second contact and are electrically connected.
11. light emitting diode matrix light source as claimed in claim 8 or 9 is characterized in that: being electrically connected on that these organize these light emitting diodes of first contact and be electrically connected on these configuration modes of organizing these light emitting diodes of second contact is to be selected from following row group: the configuration that is mutually symmetrical, configuration interlaced with each other and the part symmetric part is interconnected each other.
12. as claim 2 or 9 described backlight assemblies, it is characterized in that: also comprise a reflecting plate, wherein this reflecting plate is to be disposed on this light scattering face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA031234879A CN1549016A (en) | 2003-05-09 | 2003-05-09 | Luminous diode array light source and back light assembly using the same light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA031234879A CN1549016A (en) | 2003-05-09 | 2003-05-09 | Luminous diode array light source and back light assembly using the same light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1549016A true CN1549016A (en) | 2004-11-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA031234879A Pending CN1549016A (en) | 2003-05-09 | 2003-05-09 | Luminous diode array light source and back light assembly using the same light source |
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| Country | Link |
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| CN (1) | CN1549016A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100359389C (en) * | 2005-12-22 | 2008-01-02 | 友达光电股份有限公司 | Backlight module structure |
-
2003
- 2003-05-09 CN CNA031234879A patent/CN1549016A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100359389C (en) * | 2005-12-22 | 2008-01-02 | 友达光电股份有限公司 | Backlight module structure |
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