CN1542075A - Adhesive compound - Google Patents
Adhesive compound Download PDFInfo
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- CN1542075A CN1542075A CNA031230717A CN03123071A CN1542075A CN 1542075 A CN1542075 A CN 1542075A CN A031230717 A CNA031230717 A CN A031230717A CN 03123071 A CN03123071 A CN 03123071A CN 1542075 A CN1542075 A CN 1542075A
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Abstract
The composite adhesive capable of being used as safety thread protecting glue in bank note consists of resin selected from low molecular weight epoxy resin and/or high molecular weight polyketone resin in 20-70 wt%; wax in 0.1-10 wt% and solvent in 20-79 wt%. The protecting adhesive layer of the present invention is acid and alkali resistant and solvent corrosion resistant, and has high binding strength with aluminum and other material.
Description
Field of the present invention
The present invention relates to binder composition, particularly be suitable for as the protection glue on the Renminbi safety line.
The invention technical background
At present, the protection to banknote aluminium safety line is a difficult problem in the world, as the protection effect that wants to reach good must be compounded in aluminium between the two-layer PET.So, the thickness of safety line must increase, and influences its dispensing in paper certainly, thereby increases difficulty of processing.Simultaneously, the yield rate of product also will reduce.Therefore, need badly and a kind of safety line is protected, can overcome the protection glue of above-mentioned defective simultaneously.Because banknote has the singularity of its circulation, claimed glue-line acid and alkali-resistance, anti-solvent corrosion, and have conjugation preferably with base material such as aluminium.The present invention proposes just for this reason.
Disclosure of an invention
Therefore, one of purpose of the present invention has provided a kind of binder composition that Renminbi safety line protection glue uses that can be used for.Described composition comprises the resin that accounts for composition total weight 20-70%, and described resin is selected from the Resins, epoxy of molecular weight and in the high-molecular weight polyketone resin one or more; The wax of 0.1%-10%; And the solvent of 20-79%.
Another object of the present invention provides the purposes of composition of the present invention on bonding Renminbi safety line.
In a preferred embodiment of the invention, the Resins, epoxy softening temperature should be between 85-130 ℃, molecular-weight average is 1000-5000, and the softening temperature of polyketone resin should be between 100-130 ℃, molecular-weight average is more than 10000.
In a preferred embodiment of invention, described Resins, epoxy and the polyketone resin relative weight ratio in resin can be 2-8: 1.
Can be used for wax of the present invention and be in paraffin, Microcrystalline Wax or the synthetic wax one or more.In a preferred embodiment of the present invention, described wax is the about 50 ℃ paraffin of fusing point.
In the composition of the present invention, solvent can be selected from one or more in the following component, benzene or substituted benzene, lower alkyl ketone.Obviously, resin should be soluble in solvent.
By the rational proportion of each component of binder composition of the present invention, make that composition uses after, safety line can acid and alkali-resistance, anti-solvent corrosion.Binder composition of the present invention also can be widely used in other metal pattern anticorrosion of aluminium film.
The present invention describes in detail
Binder composition of the present invention is mainly used in the protection of safety line, because safety line itself, the notable feature of binder composition of the present invention is the hybrid resin that wherein comprises and the specific proportioning between other component and each component.Can be used for resin of the present invention and comprise low-molecular-weight Resins, epoxy and high-molecular weight polyketone resin etc.Preferably, the present invention selects the mixture of multiple these resins for use.In the present invention, can use one or more Resins, epoxy, one or more polyketone resins, and their mixture.
The usage quantity of resin can account for the 20-70% of the gross weight of composition.As use the mixture of Resins, epoxy and polyketone resin, and then both weight ratios are preferably 2-8: 1, be preferably 2-4: 1.
Can be used for low-molecular-weight Resins, epoxy of the present invention and also can be the Resins, epoxy such as the polyfunctional epoxy resin of remodeling, glycidyl ester type epoxy resin and some resol, but its softening temperature also should be between 85-130 ℃, and molecular-weight average is preferably 1000-5000.The example of concrete Resins, epoxy such as E-06 (homemade bisphenol A-type resin), B2 resin (being equivalent to E-12), 1007,1009 (Shell Co. Ltd's products).The polyketone resin also is commonly used those in this area, but its softening temperature also should be between 100-130 ℃, and preferred molecular-weight average is more than 10000, concrete example such as K-1717, and K-1717B, K-1717HMP etc. (LAWTER INTERNATIONAL, INC, USA).
Can comprise the solvent that accounts for composition weight 20-80% in the present composition, be selected from the following component one or more, benzene or the benzene that is replaced by one or more substituting groups, lower alkyl ketone.
Used term " low alkyl group " expression among the present invention contains the alkyl of 1-8 carbon atom straight chain or side chain.Term " substituting group " expression halogen, hydroxyl, C
1-4Alkyl, halo C
1-4Alkyl etc.The concrete example of alkyl comprises that methyl, ethyl, propyl group, sec.-propyl, butyl, isobutyl-, halogen comprise fluorine, chlorine, bromine.Preferably the substituting group number is 1-3, more preferably is 1-2.
The object lesson of described solvent such as toluene, chlorobenzene, dimethylbenzene, acetone, butanone, methyl isopropyl Ketone, pentanone.
The wax that uses among the present invention can be in paraffin, Microcrystalline Wax, the synthetic wax one or more.In the present invention, wax can account for composition total weight.In a preferred embodiment of the present invention, described wax is the paraffin that accounts for composition total weight 0.1-10%, and its fusing point is about 50 ℃.
Composition of the present invention also can comprise other additive commonly used in the binder composition such as antioxidant etc. certainly.Those of ordinary skills can grasp easily according to the component that reality is used.
Below further specify the present invention with specific embodiment.
Embodiment 1
Toluene 20 (weight part, down together)
Butanone 43
Resins, epoxy (1009) 30
Polyketone resin (K-1717B) 5
Paraffin (50 ℃ of fusing points) 2
Wax is stirred fusion under heating, slowly add other resin then, insulation was stirred 2-3 hour down.After cold slightly, add solvent, stir.
Embodiment 2
Toluene 20
Pentanone 50
Resins, epoxy (E-44) 20
Polyacetals ketone resin (K-1717HMP) 9
Paraffin (50 ℃ of fusing points) 1
Method with identical with embodiment 1 makes product.
Embodiment 3
Toluene 20
Butanone 25
Resins, epoxy (1007) 45
Polyketone urea formaldehyde (K-1717) 9
Paraffin (50 ℃ of fusing points) 1
Method with identical with embodiment 1 makes product.
Though the present invention specifies with foregoing description and embodiment, the present invention is not so limited.Protection scope of the present invention is limited by the claim in the appended claims, anyly is equal to replacement to what technical characterictic in the claim carried out, all should belong to institute of the present invention restricted portion.
Claims (11)
1. binder composition comprises:
Resin is selected from low-molecular-weight Resins, epoxy, high-molecular weight polyketone resin 20%-70%
Wax 0.1%-10%
Solvent 20%-79%
2. according to the composition of claim 1, the softening temperature of wherein said Resins, epoxy between 100-130 ℃, molecular weight is at 1000-5000, between the softening temperature 100-130 of polyketone resin ℃, molecular-weight average is more than 10000.
3. according to claim 2 composition, wherein said Resins, epoxy and the polyketone urea formaldehyde relative weight ratio in composition is 2-8: 1.
4. according to the composition of claim 3, wherein said Resins, epoxy is the E-12 resin.
5. according to the composition of claim 1 or 2 or 3 or 4, wherein said polyketone resin is K-1717B.
6. according to the composition of claim 1 or 2 or 3 or 4, wherein said wax is about 50 ℃-70 ℃ paraffin of fusing point.
7. according to the composition of claim 5, wherein said wax is the about 50 ℃ paraffin of fusing point.
8. according to the composition of claim 1 or 2 or 3 or 4, be selected from the following component one or more, benzene or substituted benzene, lower alkyl ketone in the wherein said solvent.
9. according to the composition of claim 5, be selected from the following component one or more, benzene or substituted benzene, lower alkyl ketone in the wherein said solvent.
10. according to the composition of claim 9, wherein said solvent is selected from toluene, butanone.
11. the purposes of the composition of claim 1-10 on bonding Renminbi safety line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03123071 CN1249192C (en) | 2003-04-29 | 2003-04-29 | Adhesive compound |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03123071 CN1249192C (en) | 2003-04-29 | 2003-04-29 | Adhesive compound |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1542075A true CN1542075A (en) | 2004-11-03 |
| CN1249192C CN1249192C (en) | 2006-04-05 |
Family
ID=34321210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03123071 Expired - Fee Related CN1249192C (en) | 2003-04-29 | 2003-04-29 | Adhesive compound |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1249192C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102887004A (en) * | 2011-07-20 | 2013-01-23 | 上海申悦油墨有限公司 | Novel coloring agent |
| CN108713043A (en) * | 2016-03-09 | 2018-10-26 | 日立化成株式会社 | Polyketone composition, polyketone solidfied material, optical element containing epoxide and image display device |
-
2003
- 2003-04-29 CN CN 03123071 patent/CN1249192C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102887004A (en) * | 2011-07-20 | 2013-01-23 | 上海申悦油墨有限公司 | Novel coloring agent |
| CN108713043A (en) * | 2016-03-09 | 2018-10-26 | 日立化成株式会社 | Polyketone composition, polyketone solidfied material, optical element containing epoxide and image display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1249192C (en) | 2006-04-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20081205 Address after: No. 6 Xing Huo Road, Science City, Fengtai District, Beijing, zip code: 100070 Co-patentee after: China banknote printing and Minting Corporation Patentee after: Central banknote special anti counterfeiting technology Co., Ltd. Address before: Beijing city Xicheng District Xizhimen Street No. 143 zip code: 100044 Patentee before: China banknote printing and Minting Corporation |
|
| ASS | Succession or assignment of patent right |
Owner name: ZHONGCHAO SPECIAL ANTI-COUNTERFEITING TECHNOLOGY C Free format text: FORMER OWNER: CHINA BANKNOTE PRINTING AND MINTING CORP. Effective date: 20081205 |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060405 Termination date: 20170429 |