CN1532039A - Automatic nackaging method for memory card - Google Patents
Automatic nackaging method for memory card Download PDFInfo
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- CN1532039A CN1532039A CNA031213774A CN03121377A CN1532039A CN 1532039 A CN1532039 A CN 1532039A CN A031213774 A CNA031213774 A CN A031213774A CN 03121377 A CN03121377 A CN 03121377A CN 1532039 A CN1532039 A CN 1532039A
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- metal
- memory card
- packing
- plastic cement
- cement frame
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Abstract
The present invention relates to automatic memory card packaging process and is proposed for making information record carrier in small card package simply in low cost. The process includes conveying metal material band; punching the first and the second metal casings; injection molding the first and the second plastic frames on the first and the second metal casings separately; punching and cutting for the first and the second metal casings to separate from the metal material band; welding the two metal casings to form card for coating the inside circuit, and completing the package of the memory card.
Description
Technical field
The invention belongs to the automation method for packing of the manufacture method of information recording carrier, particularly a kind of memory card.
Background technology
Portable consumer numerical digit household electrical appliances (IA) product is much more popular gradually in the epoch of digitisation, and the small memory card market prospects continue good.Yet the encapsulation of small memory card must have enough mechanical strengths and electric property, and the beginning is able to big volume production; Be particular about with low cost more especially.
It is fast that at present common small memory card possesses compact, low power consumption, high power capacity, read or write speed, and have characteristics such as copyright safety protection function.Therefore, small memory card is widely used in PC, NB, PDA, mobile phone, printer, digital still camera, numerical digit is taken the photograph products such as video recorder, Digital Recorder, MP3, especially at mobile phone market, the whole world had more than 400,000,000 new cell-phone to add in 1 year, conservative estimation has 200,000,000 will adopt SD (SecureDigital) card or MMC (Multimedia Card) card, shows that small memory card has become emerging star's industry.
The method for packing of known card device has two kinds, and early system forms the card body with laminating type, but the shortcoming of this mode is to peel off easily in the bonding part, and intraware is damaged.Need expensive people's masterpiece to bind operation with laminating type production card body, cost is higher, yield is lower and reach volume production scale manufacturer needs expensive management, manpower and resources costs.
Referring to the method for the another kind improvement of No. the 5475919th, No. the 2295118th, BP, No. the 1686051st, Japan Patent and United States Patent (USP) be utilize ejection formation plastic cement frame direct injection on metal-back, the plastic cement frame with first and second housing is welded together again.Adopt the mode of production of ejection formation and ultrasonic welding can reduce the manpower cost.And yield is higher.Yet this kind technology needs one by one metal-back to be put into mould when ejection formation, thus still time-consuming, and also each sheet metal-back all is moulding in advance, is difficult to realize automated production.And more face new difficulty when being used in making small memory card body, because its thickness as thin as a wafer, the Insulation Problems between encapsulating shell and the internal circuit is the important topic that the utmost point need overcome.
Further modification method is to utilize ejection formation to form the plastic card body of small memory card.Yet this kind technology must be in conjunction with extremely difficult and expensive specially-shaped and Tool and Die Technology.Because plastic casing is as thin as a wafer, the card body of the minimum and dimensionally stable of stability, rapidity, the distortion of the extremely difficult control charging of the technology that this kind is called as micro-charging and film ejection formation, the consume of mould is high simultaneously.Therefore, utilize ejection formation to make the plastic card body of small memory card, need to control forming technique, mould, equipment and special material etc. and close the processing procedure key technology.Under so expensive process apparatus and condition, it is but innately too thin and undercapacity causes breaking easily and damaging to use ejection formation to make the plastic casing of small memory card, and yield and reliability are very low.
Summary of the invention
The purpose of this invention is to provide that a kind of processing procedure is simple, man-hour is short, cost of manufacture is cheap, reliability is high, be beneficial to a large amount of productions, the automation method for packing of the memory card of suitable for making high strength and the encapsulation of reliability small card.
The present invention includes following steps:
Step 1
The transferring metal strip;
Step 2
Punch forming the first/two metal-back;
Step 3
Form first and second plastic cement frame; Ejection formation forms the first/two plastic cement frame on the first/two metal-back respectively;
Step 5
Blanking; Punching press cuts so that the first/two metal-back breaks away from metal material belt, to form first/2 half box body that breaks away from metal material belt;
Step 6
First and second half box body of welding to form the card body that coats internal circuit, is finished the encapsulation of memory card.
Wherein:
After forming the step 3 of first and second plastic cement frame, print pattern on the first/two metal-back.
Stamping forming the first/two metal-back outside forms a plurality of tabs in punch forming the first/two metal-back step 2.
The first metal-back tabs bending forms vertical tabs.
The second metal-back tabs bending forms vertical tabs and forms the crooked edge that extends.
The first plastic cement frame coats the vertical tabs of first metal-back.
The second plastic cement frame coats the vertical tabs and the crooked edge that extends of second metal-back.
First and second plastic cement frame that is incorporated in the step 6 of first and second half box body of welding on first and second metal-back is with the ultrasonic welding.
The inner surface of metal material belt is coated with insulation film in advance in the step 1.
Owing to the present invention includes the transferring metal strip; Punch forming the first/two metal-back; Ejection formation forms the first/two plastic cement frame on the first/two metal-back respectively; Punching press cuts so that the first/two metal-back breaks away from metal material belt, to form first/2 half box body that breaks away from metal material belt; First and second half box body of welding to form the card body that coats internal circuit, is finished the encapsulation of memory card.First/2 half box body all is directly to be processed on metal material belt in this processing procedure, and metal material belt is suitable for transmitting on automation equipment, and therefore, the present invention can reach quick and cheap purpose; First and second plastic cement frame system is welded together with ultrasonic, and breach extends to first and second metal-back outer surface from the outer surface of first and second plastic cement frame; Encapsulating structure is adopted as the metal-back made from stainless steel material and is not known plastic casing, therefore, all can provide ground connection with the prevention Electromagnetic Interference; Not only processing procedure is simple, man-hour is short, cost of manufacture is cheap, reliability is high, be beneficial to a large amount of productions, and suitable for making high strength and the encapsulation of reliability small card, thereby reaches purpose of the present invention.
Description of drawings
Fig. 1, for to make small memory card structural representation stereogram with the present invention.
Fig. 2, for flow chart of the present invention.
Fig. 3, be step 1 of the present invention, two schematic diagrames.
Fig. 4, be A portion partial enlarged drawing among Fig. 3.
Fig. 5, for step 2 schematic diagram of the present invention.
Fig. 6, be B portion partial enlarged drawing among Fig. 5.
Fig. 7, for step 3 schematic diagram of the present invention.
Fig. 8, for step 4 schematic diagram of the present invention.
Fig. 9, for step 5 schematic diagram of the present invention.
Figure 10, the first half box body structure schematic isometric for making with the present invention.
Figure 11, the second half box body structure schematic isometric for making with the present invention.
The specific embodiment
As shown in Figure 1, the small memory card made from the present invention 10 comprise first metal-back 12 made with stainless steel material, second metal-back 14, the first plastic cement frame 16 that is combined as a whole with first metal-back 12, the second plastic cement frame 18 that is combined as a whole with second metal-back 14 and be coated on the internal circuit that combines respectively between first and second plastic cement frame 16,18 first and second metal-backs 12,14.
The second plastic cement frame 18 has a plurality of output into the output at position as printed circuit board (PCB) first data and goes into connector 19.
First and second plastic cement frame 16,18 is to be welded together with ultrasonic, and breach 20,22 extends to first and second metal-back 12,14 outer surfaces from the outer surface of first and second plastic cement frame 16,18.Owing to small memory card body encapsulating structure is adopted as the metal-back made from stainless steel material is not known plastic casing, and therefore, breach 20,22 all can provide ground connection with prevention Electromagnetic Interference (EMI).
As shown in Figure 2, the present invention includes following steps:
Step 1
Transferring metal strip 30
As Fig. 2, shown in Figure 3, pull out metal material belt 30 into stainless steel material, thickness≤0.15mm from winding 31; The inner surface of metal material belt 30 is coated with the insulation film 33 of promising Teflon in advance, and its both sides are provided with periodic arrangement so that the hole clipping 32 that is driven by conveying equipment;
Step 2
Punch forming the first/two metal-back 12/14;
As Fig. 3, Fig. 4, Fig. 5, shown in Figure 6, conveying equipment hole clipping 32 on metal material belt 30 drives and is transported to pressing equipment, punch forming the first/two metal-back 12/14, the first/two metal-back 12/14 has a plurality of tabs 24, the first/two metal-back, 12/14 both sides still are connected on the metal material belt 30 with brace 34,36, and tabs 24 bendings of the first/two metal-back 12/14 form vertical tabs 26;
Step 3
Form first and second plastic cement frame 16/18
As shown in Figure 7, ejection forming technique directly forms the first/two plastic cement frame 16/18 on the first/two metal-back 12/14, and make the first/two plastic cement frame 16/18 coat vertical tabs 26 and firmly be combined into one with the first/two metal-back 12/14, cool off in 3 seconds to form first/2 half box body, 44/44 ', the first/two plastic cement frames 16,18;
Step 4
Print pattern
As shown in Figure 8, optionally on the insulation film 33 of the first/two metal-back 12/14, be printed as the pattern 38 of trade mark or other signs;
Step 5
Blanking
As shown in Figure 9, punching press cut with will and the first/two metal-back 12/14 that is combined into one of the first/two plastic cement frame 16,18 and the brace 34,36 between the metal material belt 30 block, so that the first/two metal-back 12/14 breaks away from metal material belt 30, to form first/2 half box body 44/44 ' that breaks away from metal material belt 30; First/2 half box body 44/44 ' all is directly to be processed on metal material belt 30 in this processing procedure, and metal material belt 30 is suitable for transmitting on automation equipment, and therefore, the present invention can reach quick and cheap purpose; As shown in figure 10, the first half box bodys of making 44 comprise first metal-back 12 and the ejection formation first plastic cement frame 16 on first metal-back 12, and form breach 40,42 in both sides; As shown in figure 11, the second half box bodys of making 44 ' comprise second metal-back 14 and the ejection formation second plastic cement frame 18 on second metal-back 14, the insulation insulation film 33 of the promising Teflon of its inner surface 1402 coatings, second metal-back, 14 left and right sides and an end have vertical tabs 26, its other end has crooked extension edge 28, and makes vertical tabs 26 and the crooked edge 28 that extends imbed ejection formation to be incorporated in the second plastic cement frame 18 on second metal-back 14;
Step 6
First and second half box body 44,44 ' of welding
Be incorporated into first and second plastic cement frame 16,18 on first and second metal-back 12,14 to form the memory card body with the ultrasonic welding.
Also can after finishing first and second half box body of ultrasonic welding 44,44 ', again the memory card body that forms be broken away from metal material belt 30.
Claims (9)
1, a kind of automation method for packing of memory card is characterized in that it comprises the steps:
Step 1
The transferring metal strip;
Step 2
Punch forming the first/two metal-back;
Step 3
Form first and second plastic cement frame; Ejection formation forms the first/two plastic cement frame on the first/two metal-back respectively;
Step 5
Blanking; Punching press cuts so that the first/two metal-back breaks away from metal material belt, to form first/2 half box body that breaks away from metal material belt;
Step 6
First and second half box body of welding to form the card body that coats internal circuit, is finished the encapsulation of memory card.
2, the automation method for packing of memory card according to claim 1, it is characterized in that the step 3 of first and second plastic cement frame of described formation after, print pattern on the first/two metal-back.
3, the automation method for packing of memory card according to claim 1 is characterized in that stamping forming the first/two metal-back outside forms a plurality of tabs in described punch forming the first/two metal-back step 2.
4, the automation method for packing of memory card according to claim 3 is characterized in that the described first metal-back tabs bending forms vertical tabs.
5, the automation method for packing of memory card according to claim 3 is characterized in that the described second metal-back tabs bending forms vertical tabs and forms the crooked edge that extends.
6, the automation method for packing of memory card according to claim 4 is characterized in that the described first plastic cement frame coats the vertical tabs of first metal-back.
7, the automation method for packing of memory card according to claim 5 is characterized in that the described second plastic cement frame coats the vertical tabs and the crooked edge that extends of second metal-back.
8, the automation method for packing of memory card according to claim 1 is characterized in that first and second plastic cement frame that is incorporated on first and second metal-back in the step 6 of first and second half box body of described welding is with the ultrasonic welding.
9, the automation method for packing of memory card according to claim 1 is characterized in that the inner surface of metal material belt in the described step 1 is coated with insulation film in advance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA031213774A CN1532039A (en) | 2003-03-25 | 2003-03-25 | Automatic nackaging method for memory card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA031213774A CN1532039A (en) | 2003-03-25 | 2003-03-25 | Automatic nackaging method for memory card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1532039A true CN1532039A (en) | 2004-09-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA031213774A Pending CN1532039A (en) | 2003-03-25 | 2003-03-25 | Automatic nackaging method for memory card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1532039A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1804563A1 (en) * | 2005-12-28 | 2007-07-04 | Chin-Tong Liu | Structure and method for packaging flash memory cards |
-
2003
- 2003-03-25 CN CNA031213774A patent/CN1532039A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1804563A1 (en) * | 2005-12-28 | 2007-07-04 | Chin-Tong Liu | Structure and method for packaging flash memory cards |
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