CN1529198A - Connection pad structure of display and manufacturing method thereof - Google Patents
Connection pad structure of display and manufacturing method thereof Download PDFInfo
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- CN1529198A CN1529198A CNA200310102433XA CN200310102433A CN1529198A CN 1529198 A CN1529198 A CN 1529198A CN A200310102433X A CNA200310102433X A CN A200310102433XA CN 200310102433 A CN200310102433 A CN 200310102433A CN 1529198 A CN1529198 A CN 1529198A
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- conductive layer
- connection gasket
- display
- gasket structure
- opening
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Abstract
The structure includes following element: a first conducting layer formed on a substrate, a protection layer formed on the substrate and covering the first conducting layer, a second conducting layer formed on the protection layer, an opening throughout the second conducting layer and the protection layer in order to expose the first conducting layer, a third conducting layer formed on the second conducting layer, and covering sidewall and bottom of the opening. The third conducting layer is connected to the second conducting layer in order to provide first connection path electrically. The third conducting layer is connected to the first conducting layer in order to provide second connection path electrically.
Description
Technical field:
The present invention is about the connection gasket structure of a kind of display technology, particularly a kind of LCD, in order to being connected to the external drive assembly, can provide an auxiliary electrical access path by the open design of connection gasket, in order to replace the electrical connection path of a damaged conductor.
Background technology:
(liquid crystal display is a kind of flat-panel screens that is widely used most at present LCD) to LCD, has features such as low consumption electric power, slim light weight and low voltage drive.Generally speaking, the viewing area of LCD comprises a plurality of pixel areas, it is the sweep trace (scanning line) and the defined rectangular area of data line (data line) of arranged perpendicular, and be provided with a thin film transistor (TFT) (thin film transistor in each pixel area, hereinafter to be referred as TFT) and a pixel capacitors, this thin film transistor (TFT) is a kind of switch module (switching device).In addition, can design a connection gasket (bonding pad) structure, utilize winding to engage (Tape Automatic Bonding in the terminal of sweep trace and data line; Be called for short TAB) technology or flexible printed wiring board (FPC) technology, connection gasket can form with external drive IC and electrically connect effect, and then reaches the driving pixel capacitors so that the purpose of image signal to be provided.
See also Fig. 1, it shows the floor map of conventional liquid crystal.Conventional liquid crystal 10 by a TFT substrate 12 and a colorized optical filtering (color filter, CF) substrate 14 constitutes, its inner space is filled with a liquid crystal material layer.The outer peripheral areas of TFT substrate 12 is manufactured with a plurality of connection gasket structures, and it can be by a signal processing substrate 16 (for example: TAB or FPCB substrate) to be electrically connected to an exterior I C circuit board 18.
See also Fig. 2, it shows the floor map of the connection gasket structure of traditional TFT substrate.Be manufactured with multi-strip scanning line 20 and data line 22 on the TFT substrate 12, the pixel area 24 of a plurality of arrays of its arranged perpendicular mode definable.One connection gasket 26 of the end 20a of each bar sweep trace 20 and top forms and electrically connects, so connection gasket 26 can be electrically connected to exterior I C circuit board 18 via signal processing substrate 16.In the same manner, the end 22a of each bar data line 22 and the connection gasket of top 26 forms and electrically connects, so by signal processing substrate 16 to be electrically connected to exterior I C circuit board 18.
A kind of connection gasket structure of tradition as shown in Figure 3, it is for showing the diagrammatic cross-section of traditional connection gasket structure along the 3-3 of Fig. 2 tangent line.Comprise a first metal layer M1, a protective seam 25 and an indium tin oxide (ITO) layer on the outer peripheral areas of TFT substrate 12.The pattern of the first metal layer M1 definition becoming sweep trace 20 and end 20a thereof.Protective seam 25 covers the first metal layer M1, and comprises the predetermined electrical connection zone of an opening in order to the 20a of exposed terminal place.The ITO layer is a transparent electrode layer, and definition becomes the pattern of a pixel capacitors and connection gasket 26, and connection gasket 26 can be electrically connected with the end 20a formation of below via the opening of protective seam 25.
The another kind of connection gasket structure of tradition as shown in Figure 4, it is for showing the diagrammatic cross-section of traditional connection gasket structure along the tangent line 4-4 of Fig. 2.Comprise a first metal layer M1, a protective seam 25, one second metal level M2 and an indium tin oxide (ITO) layer on the outer peripheral areas of TFT substrate 12.The pattern of the first metal layer M1 definition becoming sweep trace 20.Protective seam 25 covers the first metal layer M1.The pattern of second metal level M2 definition becoming data line 22 and end 22a thereof.The ITO layer is a transparent electrode layer, and definition becomes the pattern of a pixel capacitors and connection gasket 26, and connection gasket 26 directly forms with the end 22a of below and is electrically connected.
See also Fig. 5, its diagrammatic cross-section shows the situation that is electrically connected of traditional connection gasket structure and exterior I C circuit board.With connection gasket structure shown in Figure 4 is example, in TAB or FPC processing procedure, in the time of need repairing as if the discovery defective, need earlier TAB or FPC are removed, again the cull of an anisotropy conductive film (ACF) 17 on glass is removed, could again that another is new TAB or FPC be sticked.Yet, when removing the ACF cull, may be because of misoperation the scratch lead, or all may the scratch lead in follow-up test, personnel operation process.When this scrapes the excessive or whole lead of crosscut in injury, shown in oblique line 19, then the conducting particles of anisotropy conductive film (ACF) 17 can come in contact the problem of area deficiency, and then make be electrically connected path (as shown by arrows) can't be smoothly by scraping injury 19, so can influence production reliability, even be to cause product rejection.
Summary of the invention:
In view of this, purpose of the present invention just is to provide a kind of connection gasket structure of display, can provide an auxiliary electrical access path by the open design of connection gasket, in order to replace the electrical connection path of a damaged conductor.
For reaching above-mentioned purpose; the invention provides a kind of connection gasket structure of display; comprise that one first conductive layer is formed in the substrate; one protective seam is formed in this substrate and covers this first conductive layer; one second conductive layer is formed on this protective seam; one opening runs through this second conductive layer and this protective seam to expose this first conductive layer, and one the 3rd conductive layer is formed on this second conductive layer and covers the sidewall and the bottom of this opening.The 3rd conductive layer is electrically connected this second conductive layer to provide one first to be electrically connected the path, and the 3rd conductive layer is electrically connected this first conductive layer to provide one second to be electrically connected the path.
The invention provides a kind of connection gasket structure of display, in order to being connected to the external drive assembly, can provide an auxiliary electrical access path by the open design of connection gasket, in order to replace the electrical connection path of a damaged conductor.The present invention can be applicable to LCD (LCD) or organic electro-luminescent display (OLED), and this connection gasket structure can be made in the end of sweep trace (scanning line) or data line (data line).
Description of drawings:
Fig. 1 shows the floor map of conventional liquid crystal.
Fig. 2 shows the floor map of the connection gasket structure of traditional TFT substrate.
Fig. 3 is for showing the diagrammatic cross-section of traditional connection gasket structure along the 3-3 of Fig. 2 tangent line.
Fig. 4 is for showing the diagrammatic cross-section of traditional connection gasket structure along the tangent line 4-4 of Fig. 2.
Fig. 5 shows the situation that is electrically connected of traditional connection gasket structure and exterior I C circuit board.
Fig. 6 shows the top view of the connection gasket structure of first embodiment of the invention.
Fig. 7 is the diagrammatic cross-section that shows the connection gasket structure of first embodiment of the invention along the tangent line 7-7 of Fig. 6.
Fig. 8 is electrically connected to the diagrammatic cross-section of an exterior I C circuit board for the tangent line 8-8 along Fig. 6 shows the connection gasket structure of first embodiment of the invention via a signal processing substrate.
Fig. 9 shows the top view of a kind of opening of second embodiment of the invention.
Figure 10 shows the top view of the another kind of opening of second embodiment of the invention.
11A figure shows the top view of another opening of second embodiment of the invention,
11B figure is the diagrammatic cross-section that shows the connection gasket structure of second embodiment of the invention along the tangent line 11-11 of 11A figure.
Symbol description:
Conventional art
LCD～10; TFT substrate～12; Colored optical filtering substrates～14; Signal processing substrate～16; Anisotropy conductive film～17; Exterior I C circuit board～18; Scrape injury～19; Sweep trace～20; End～20a; Data line～22; End～22a; Pixel area～24; Protective seam～25; Connection gasket～26; The first metal layer～M1; Second metal level～M2.
The technology of the present invention
Display base plate～30; Sweep trace～32; Data line～34; Pixel area～36; Connection gasket～38; Opening～40; First conductive layer～42; First protective seam～44; Second conductive layer～46; Second protective seam～48; The 3rd conductive layer～50; Signal processing substrate～52; Exterior I C circuit board～54; Conductive film～56; Scrape injury～58; First is electrically connected path～I; Second is electrically connected path～II.
Embodiment:
For above and other objects of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and cooperate appended diagram, be described in detail below:
[first embodiment]
See also Fig. 6, it shows the top view of the connection gasket structure of first embodiment of the invention.Be manufactured with multi-strip scanning line 32 and data line 34 on one display base plate 30, sweep trace 32 extends along first direction, and data line 34 extends along second direction, then the pixel area 36 of a plurality of arrays of cross-over configuration mode definable of sweep trace 32 and data line 34.(for example: TFT) can make a pixel capacitors and a switch module in each pixel area 36.The end of each bar sweep trace 32 (terminal) is manufactured with a connection gasket 38, and then this connection gasket 38 can be electrically connected to an exterior I C circuit board via a signal processing substrate.In the same manner, the end of each bar data line 34 is manufactured with a connection gasket 38, and then this connection gasket 38 can be electrically connected to an exterior I C circuit board via a signal processing substrate.In addition, each connection gasket structure fabrication has an opening 40, and then connection gasket 38 can form with the two conductive layers of below respectively via opening 40 and be electrically connected effect, is electrically connected the path to provide two.
See also Fig. 7, it is the diagrammatic cross-section that shows the connection gasket structure of first embodiment of the invention along the tangent line 7-7 of Fig. 6.The connection gasket structure of the outer peripheral areas of display base plate 30 is made of one first conductive layer 42, one first protective seam 44, one second conductive layer 46, one second protective seam 48 and one the 3rd conductive layer 50.The method for making of connection gasket structure may further comprise the steps.At first, deposition first conductive layer 42 on substrate 30 utilizes micro image etching procedure 42 definition of first conductive layer to be become the pattern of sweep trace 32 and end thereof again.Then, deposition first protective seam 44 on substrate 30 is in order to cover first conductive layer 42.Then, deposition second conductive layer 46 on first protective seam 44 utilizes micro image etching procedure 46 definition of second conductive layer to be become the pattern of data line 34 and end thereof again.Thereafter, carry out micro image etching procedure to form opening 40, it is to run through second conductive layer 46 and first protective seam 44, and exposes the predetermined electrical connection zone of first conductive layer 42.Follow-up, deposit second protective seam 48 covering second conductive layer 46 and first protective seam 44, and can second protective seams 48 in second conductive layer, 46 surfaces and the opening 40 be removed by the etch-back processing procedure.At last, compliance ground deposition the 3rd conductive layer 50 utilizes micro image etching procedure 50 definition of the 3rd conductive layer to be become the pattern of a connection gasket 38 and a pixel capacitors again.Because the 3rd conductive layer 50 covers the bottom and the sidewall of openings 40, so connection gasket 38 can be electrically connected second conductive layer 46 so that one first access path to be provided, and connection gasket 38 can be electrically connected first conductive layer 42 so that one second access path to be provided simultaneously.The preferably is that the making of the 3rd conductive layer 50 can be selected a transparent conductive material for use, for example: indium tin oxide (ITO).
See also Fig. 8, it is electrically connected to the diagrammatic cross-section of an exterior I C circuit board for the tangent line 8-8 along Fig. 6 shows the connection gasket structure of first embodiment of the invention via a signal processing substrate.Utilize TAB or FPC technology, the connection gasket structure of the outer peripheral areas of display base plate 30 can be by a signal processing substrate 52 (for example: TAB or FPCB substrate) to be electrically connected to an exterior I C circuit board 54.In addition, need provide a conductive film 56 (for example: the anisotropy conductive film), can make the surface of contact of signal processing substrate 52 and connection gasket 38 reach adhesion and conductive effect simultaneously.In the same manner, conductive film 56 can make the surface of contact of signal processing substrate 52 and exterior I C circuit board 54 reach adhesion and conductive effect simultaneously.
In TAB or FPC processing procedure, in the time of need repairing as if the discovery defective, need earlier TAB or FPC are removed, again the cull of conductive film 56 is removed, could again that another is new TAB or FPC stick.Yet, when removing the cull of conductive film 56, may be because of misoperation the scratch lead, or all may the scratch lead in follow-up test, personnel operation process.When this scraped the excessive or whole lead of crosscut in injury, shown in oblique line 58, then the conducting particles of conductive film 56 can come in contact the problem of area deficiency, so make first be electrically connected path I can't be smoothly by conducting.The invention is characterized in that the 3rd conductive layer 50 is to be electrically connected to first conductive layer 42 along the bottom of opening 40 and sidewall, thus can provide second to be electrically connected path II as an auxiliary electrical access path, in order to replace the electrical connection path of damaged conductor.Therefore even the scratch defective takes place and when can't conducting first being electrically connected path I, second is electrically connected path II still can reach normal conducting effect, so can effectively solve production reliability and reduce or the problem of product rejection in the surface of second conductive layer 46.In addition, first protective seam 44 between first conductive layer 42 and second conductive layer 46 can be strengthened the structural strength of opening 44 herein, to guarantee the conductive effect of the 3rd conductive layer 50.
[second embodiment]
Connection gasket structure of second embodiment of the invention and preparation method thereof is roughly described identical with first embodiment, and something in common is omitted narration in this.Difference is that the opening 40 of first embodiment is designed to a hole, and second embodiment is designed to a plurality of holes, a strip opening or a circular opening with opening 40.
See also the 9th～11 figure, it shows the top view of the connection gasket structure of second embodiment of the invention.
See also Fig. 9, it shows the top view of a kind of opening of second embodiment of the invention.Each connection gasket structure comprises at least two openings 40, but does not limit aperture, symmetry and the arrangement mode of opening 40.
See also Figure 10, it shows the top view of the another kind of opening of second embodiment of the invention.Each connection gasket structure comprises at least one strip opening 40, but does not limit length, width, bearing of trend and the quantity of strip opening 40.
11A figure shows the top view of another opening of second embodiment of the invention, and 11B figure shows the diagrammatic cross-section of the connection gasket structure of second embodiment of the invention along the tangent line 11-11 of 11A figure.Each connection gasket structure comprises at least one enclosed circular opening 40, and is one enclosed ring-like around becoming along the periphery of connection gasket structure, but do not limit the width and the profile of circular opening 40.
Though the present invention discloses as above with preferred embodiment; right its is not in order to qualification the present invention, any insider, without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking claims person of defining.
Claims (24)
1. the connection gasket structure of a display comprises:
One substrate;
One first conductive layer is formed in this substrate;
One protective seam is formed in this substrate and covers this first conductive layer;
One second conductive layer is formed on this protective seam, and wherein an opening runs through this second conductive layer and this protective seam to expose this first conductive layer; And
One the 3rd conductive layer is formed on this second conductive layer, and covers the sidewall and the bottom of this opening;
Wherein, the 3rd conductive layer is electrically connected this second conductive layer to provide one first to be electrically connected the path;
Wherein, the 3rd conductive layer is electrically connected this first conductive layer to provide one second to be electrically connected the path.
2. the connection gasket structure of display as claimed in claim 1, wherein this opening is a hole.
3. the connection gasket structure of display as claimed in claim 1, wherein this opening is made of a plurality of hole.
4. the connection gasket structure of display as claimed in claim 1, wherein this opening is a rectangular opening.
5. the connection gasket structure of display as claimed in claim 1, wherein this opening is a closed circular opening.
6. the connection gasket structure of display as claimed in claim 1, wherein the 3rd conductive layer is a transparency conducting layer or an indium oxide layer of tin.
7. the connection gasket structure of display as claimed in claim 1, wherein the 3rd conductive layer is a connection gasket, and can be electrically connected to an exterior I C circuit board via a signal processing substrate.
8. the connection gasket structure of display as claimed in claim 7, wherein this signal processing substrate is that a winding engages (TAB) substrate or a flexible printed wiring board (FPC).
9. the connection gasket structure of display as claimed in claim 7, wherein the 3rd conductive layer is electrically connected to this signal processing substrate via a conductive film.
10. the connection gasket structure of display as claimed in claim 9, wherein this conductive film is an anisotropy conductive film.
11. the connection gasket structure of display as claimed in claim 1, wherein this substrate also comprises:
Many the sweep traces that extend along first direction; And
Many the data lines that extend along first direction;
Wherein, this sweep trace and this data line cross-over configuration are to constitute the pixel area of a plurality of arrays;
Wherein, this connection gasket structure is formed at the end of this sweep trace or the end of this data line.
12. the connection gasket structure of display as claimed in claim 1, wherein this display is a LCD or an organic electro-luminescent display.
13. the method for making of the connection gasket structure of a display comprises the following steps:
One substrate is provided;
Form one first conductive layer in this substrate;
Form a protective seam in this substrate and cover this first conductive layer;
Form one second conductive layer on this protective seam
Form an opening to run through this second conductive layer and this protective seam, to expose this first conductive layer; And
Form one the 3rd conductive layer on this second conductive layer, and cover the sidewall and the bottom of this opening;
Wherein, the 3rd conductive layer is electrically connected this second conductive layer to provide one first to be electrically connected the path;
Wherein, the 3rd conductive layer is electrically connected this first conductive layer to provide one second to be electrically connected the path.
14. the method for making of the connection gasket structure of display as claimed in claim 13, wherein this opening is a hole.
15. the method for making of the connection gasket structure of display as claimed in claim 13, wherein this opening is made of a plurality of hole.
16. the method for making of the connection gasket structure of display as claimed in claim 13, wherein this opening is a rectangular opening.
17. the method for making of the connection gasket structure of display as claimed in claim 13, wherein this opening is a closed circular opening.
18. the method for making of the connection gasket structure of display as claimed in claim 13, wherein the 3rd conductive layer is a transparency conducting layer or an indium tin oxide layer.
19. the method for making of the connection gasket structure of display as claimed in claim 13, wherein the 3rd conductive layer is a connection gasket, and can be electrically connected to an exterior I C circuit board via a signal processing substrate.
20. the method for making of the connection gasket structure of display as claimed in claim 19, wherein this signal processing substrate is that a winding engages (TAB) substrate or a flexible printed wiring board (FPC).
21. the method for making of the connection gasket structure of display as claimed in claim 19, wherein the 3rd conductive layer is electrically connected to this signal processing substrate via a conductive film.
22. the method for making of the connection gasket structure of display as claimed in claim 21, wherein this conductive film is an anisotropy conductive film.
23. the method for making of the connection gasket structure of display as claimed in claim 13, wherein this substrate also comprises:
Many the sweep traces that extend along first direction; And
Many the data lines that extend along first direction;
Wherein, this sweep trace and this data line cross-over configuration are to constitute the pixel area of a plurality of arrays;
Wherein, this connection gasket structure is formed at the end of this sweep trace or the end of this data line.
24. the method for making of the connection gasket structure of display as claimed in claim 13, wherein this display is a LCD or an organic electro-luminescent display.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200310102433XA CN1318886C (en) | 2003-10-20 | 2003-10-20 | Connection pad structure of display and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200310102433XA CN1318886C (en) | 2003-10-20 | 2003-10-20 | Connection pad structure of display and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1529198A true CN1529198A (en) | 2004-09-15 |
| CN1318886C CN1318886C (en) | 2007-05-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200310102433XA Expired - Fee Related CN1318886C (en) | 2003-10-20 | 2003-10-20 | Connection pad structure of display and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1318886C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101726874B (en) * | 2008-10-10 | 2011-12-07 | 华映视讯（吴江）有限公司 | Connecting structure for display panel and flexible circuit board |
| CN101988994B (en) * | 2009-07-30 | 2012-12-05 | 瀚宇彩晶股份有限公司 | Bonding pad, wafer-substrate bonded packaging structure and liquid crystal display panel |
| CN104035222A (en) * | 2014-06-13 | 2014-09-10 | 京东方科技集团股份有限公司 | Array substrate, display panel and display device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3625598B2 (en) * | 1995-12-30 | 2005-03-02 | 三星電子株式会社 | Manufacturing method of liquid crystal display device |
| KR100262953B1 (en) * | 1997-06-11 | 2000-08-01 | 구본준 | Lcd and manufacturing method of the same |
| CN1171188C (en) * | 2000-10-27 | 2004-10-13 | 友达光电股份有限公司 | Flat display with film transistors and its making method |
| CN2470908Y (en) * | 2001-02-27 | 2002-01-09 | 元太科技工业股份有限公司 | Metal-electrode contacting device of liquid-crystal display film-eloctric-crystal |
| KR100813019B1 (en) * | 2001-10-19 | 2008-03-13 | 삼성전자주식회사 | Displaying substrate and liquid crystal display device having the same |
-
2003
- 2003-10-20 CN CNB200310102433XA patent/CN1318886C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101726874B (en) * | 2008-10-10 | 2011-12-07 | 华映视讯（吴江）有限公司 | Connecting structure for display panel and flexible circuit board |
| CN101988994B (en) * | 2009-07-30 | 2012-12-05 | 瀚宇彩晶股份有限公司 | Bonding pad, wafer-substrate bonded packaging structure and liquid crystal display panel |
| CN104035222A (en) * | 2014-06-13 | 2014-09-10 | 京东方科技集团股份有限公司 | Array substrate, display panel and display device |
| US9543332B2 (en) | 2014-06-13 | 2017-01-10 | Boe Technology Group Co., Ltd. | Array substrate, display panel and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1318886C (en) | 2007-05-30 |
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