CN1526783A - Prepn of arylkyl phenolic resin adhesive solution specially for electrician - Google Patents
Prepn of arylkyl phenolic resin adhesive solution specially for electrician Download PDFInfo
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- CN1526783A CN1526783A CNA031359027A CN03135902A CN1526783A CN 1526783 A CN1526783 A CN 1526783A CN A031359027 A CNA031359027 A CN A031359027A CN 03135902 A CN03135902 A CN 03135902A CN 1526783 A CN1526783 A CN 1526783A
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- electrician
- resin adhesive
- phenol resin
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- 239000005011 phenolic resin Substances 0.000 title claims abstract description 44
- 239000000853 adhesive Substances 0.000 title claims abstract description 19
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 19
- 229920001568 phenolic resin Polymers 0.000 title abstract description 13
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 title abstract 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims abstract description 78
- -1 methoxy xylene Chemical compound 0.000 claims abstract description 47
- 239000000178 monomer Substances 0.000 claims abstract description 23
- 239000002904 solvent Substances 0.000 claims abstract description 22
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000003054 catalyst Substances 0.000 claims abstract description 15
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 22
- 238000006243 chemical reaction Methods 0.000 claims description 21
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 20
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 18
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 18
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 16
- 239000002253 acid Substances 0.000 claims description 14
- 238000002360 preparation method Methods 0.000 claims description 13
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 12
- CTQNGGLPUBDAKN-UHFFFAOYSA-N o-dimethylbenzene Natural products CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 11
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 10
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 claims description 10
- 102000004895 Lipoproteins Human genes 0.000 claims description 9
- 108090001030 Lipoproteins Proteins 0.000 claims description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 claims description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 8
- KIWBPDUYBMNFTB-UHFFFAOYSA-N Ethyl hydrogen sulfate Chemical compound CCOS(O)(=O)=O KIWBPDUYBMNFTB-UHFFFAOYSA-N 0.000 claims description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 8
- 150000001299 aldehydes Chemical class 0.000 claims description 8
- 150000002989 phenols Chemical class 0.000 claims description 8
- 241000158728 Meliaceae Species 0.000 claims description 7
- 230000002378 acidificating effect Effects 0.000 claims description 7
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 claims description 6
- 150000002460 imidazoles Chemical class 0.000 claims description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Natural products C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 6
- 235000006408 oxalic acid Nutrition 0.000 claims description 6
- 150000003739 xylenols Chemical class 0.000 claims description 6
- 150000002894 organic compounds Chemical class 0.000 claims description 5
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 claims description 4
- 230000002194 synthesizing effect Effects 0.000 claims description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 2
- 229910017604 nitric acid Inorganic materials 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 abstract description 6
- 239000004744 fabric Substances 0.000 abstract description 3
- 239000011521 glass Substances 0.000 abstract description 3
- 239000008096 xylene Substances 0.000 abstract 3
- 239000003377 acid catalyst Substances 0.000 abstract 1
- 239000003513 alkali Substances 0.000 abstract 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- 238000003756 stirring Methods 0.000 description 12
- 239000011152 fibreglass Substances 0.000 description 11
- 230000018044 dehydration Effects 0.000 description 8
- 238000006297 dehydration reaction Methods 0.000 description 8
- 238000010992 reflux Methods 0.000 description 8
- 238000000605 extraction Methods 0.000 description 7
- 230000032683 aging Effects 0.000 description 5
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000000630 rising effect Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003679 aging effect Effects 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 244000208060 Lawsonia inermis Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Landscapes
- Phenolic Resins Or Amino Resins (AREA)
Abstract
The arylkyl phenolic resin adhesive solution specially for electrician is prepared with methoxy xylene monomer, phenol, aldehyde, acid catalyst and alkali catalyst and toluene, which are reacted chemically to synthesize methoxy xylene modified phenolic resin solution. The present invention features that into methoxy xylene modified phenolic resin solution, organic promoter and solvent are added to produce prepolymerization at 40-60 deg.c for 40-80 min to obtain the product arylkyl phenolic resin adhesive solution. The product of the present invention may be used in making soaked glass fabric of 180 heat-resisting level and its laminated product, and the produced electric insulating material has stable electric insulation performance and higher mechanical performance.
Description
Technical field
The invention belongs to a kind of preparation method of tackiness agent, relate to a kind of preparation method of electrician's special utility aralkyl-phenol resin adhesive solvent, product is applicable in the production of electrician's woven fiber glass (or glass fibre) lamination (or mold pressing) goods.
Background technology
In the prior art, the preparation method of methoxyl group parylene monomer modified phenolic resins adopts 80～120 parts of (weight) methoxyl group parylene monomers, 80～100 parts of phenols, 80～120 parts of aldehydes, adds 1～4 part of an acidic catalyst and 4～8 parts of basic catalysts, 70 parts of toluene respectively, and is synthetic by chemical reaction.Because this methoxyl group parylene monomer modified phenolic resins cross-linking density is less, moulding process is poor, only 130 grades of resin system heat-proof aging grades (ultimate temperature that is the insulating material life-time service produced is 130 ℃), its use is restricted, and the over-all properties of resin subsequent product (lamination and pressing) is relatively poor.
Summary of the invention
Purpose of the present invention is intended to overcome above-mentioned deficiency of the prior art, by in methoxyl group dimethylbenzene modified phenolic resin lipoprotein solution, adding the organic compound promotor single step reaction of going forward side by side, thereby provide a kind of electrical insulating material of production that makes to have the preparation method of electrician's special utility aralkyl-phenol resin adhesive solvent of stable electrical insulation properties and higher mechanical properties.
Content of the present invention is: a kind of preparation method of electrician's special utility aralkyl-phenol resin adhesive solvent, comprise: adopt 80～120 parts of (weight) methoxyl group parylene monomers, 80～100 parts of phenols, 80～120 parts of aldehydes, add 1～4 part of an acidic catalyst and 4～8 parts of basic catalysts respectively, 70 parts of toluene, by chemical reaction synthesizing methoxy dimethylbenzene modified phenolic resin lipoprotein solution, its feature part is also to comprise the following steps: to add 1～6 part of organic compound promotor and 50～120 parts of solvents in described methoxyl group dimethylbenzene modified phenolic resin lipoprotein solution, under 40 ℃～60 ℃, after carrying out 40～80 minutes prepolymerization reactions, promptly obtain product aralkyl-phenol resin adhesive solvent.Aralkyl-phenol resin solution is the henna stabilizing solution of even clear.
In the content of the present invention: described organic compound promotor is Witco 1298 Soft Acid, sulfovinic acid, mahogany acid, urotropine, oxalic acid, imidazoles, N, one or more in the N-dimethyl benzylamine.
In the content of the present invention: described phenols is that phenol is or/and xylenol.
In the content of the present invention: described aldehydes is that formaldehyde is or/and furfural.
In the content of the present invention: described an acidic catalyst is that hydrochloric acid, tosic acid, sulfuric acid are or/and nitric acid.
In the content of the present invention: described basic catalyst is that sodium hydroxide, ammoniacal liquor, urotropine are or/and potassium hydroxide.
In the content of the present invention: described solvent is that toluene, alcohol, acetone are or/and methane amide.
In the content of the present invention: the processing method of described synthesizing methoxy dimethylbenzene modified phenolic resin lipoprotein solution generally has two kinds:
Technology one (reflux dewatering method): with the dehydration that under 1～4 part of an acidic catalyst effect, heats up of methoxyl group parylene monomer 80～120 parts (weight) and 80～100 parts of phenols, cooling cooling when the water of deviating from reaches a certain amount of, and then add 4～8 parts, 70 parts toluene of basic catalyst and aldehydes carries out reflux dewatering for 80～120 parts, to transparent, promptly make methoxyl group dimethylbenzene modified phenolic resin lipoprotein solution.
Technology two (vacuum dehydration method): with the dehydration that under 1～4 part of an acidic catalyst effect, heats up of methoxyl group parylene monomer 80～120 parts (weight) and 80～100 parts of phenols, cooling cooling when the water of deviating from reaches a certain amount of, and then add 4～8 parts, 70 parts toluene of basic catalyst and aldehydes carries out vacuum hydro-extraction for 80～120 parts, to transparent, promptly make methoxyl group dimethylbenzene modified phenolic resin lipoprotein solution.
Compared with prior art, adopt the present invention to have following characteristics:
(1) in methoxyl group dimethylbenzene modified phenolic resin lipoprotein solution, adds 1～6 part promotor, the active group (NH in these promotor molecular structures
2Methylol in ,-COOH) and the methoxyl group parylene monomer modified phenolic resins is at the hot initial reaction of process down, formation contains a certain amount of active group structure that has and has a catenate macromole, unreacted promotor (Witco 1298 Soft Acid, sulfovinic acid, mahogany acid, urotropine, a N as-NH-COO-, one or more of N-dimethyl benzylamine, oxalic acid, imidazoles) and not the mixing solutions of the methoxyl group dimethylbenzene modified phenolic resins that reacts with promotor, the described electrician's aralkyl-phenol resin of patent promptly of the present invention adhesive solvent.During preliminary drying (annotate: preliminary drying is promptly the removed unnecessary solvent) process that coats the glasscloth preimpregnation material at the described electrician's aralkyl-phenol resin of patent of the present invention adhesive solvent is solidified in hot-forming mid-term, later stage with the glasscloth preimpregnation material, owing to these macromole are containing-NH
2The promotor effect of-COOH down, be more conducive to the described electrician's aralkyl-phenol resin of patent of the present invention adhesive solvent in unreacted methoxyl group dimethylbenzene modified phenolic resins carry out effective cross-linking and curing reaction, can make production process be easy to control, and the later stage curing reaction is more thorough when it is used as tackiness agent than methoxyl group dimethylbenzene modified phenolic resins, cross-linking density increases, form a large amount of C-N keys, can stablize the electrical insulation properties of follow-up goods, improve the mechanical property and the heat aging property of follow-up goods, being mainly reflected in one is that hot (180 ℃) flexural strengths of aralkyl phenol woven fiber glass goods can reach about 200MPa, and hot (180 ℃) flexural strength of the woven fiber glass goods of existing methoxyl group dimethylbenzene modified phenolic resins only is about 50Mpa; The 2nd, the heat-proof aging index of aralkyl phenol woven fiber glass goods reaches 180 grades (193 ℃ of measured values), and the woven fiber glass goods heat-proof aging index of existing dimethylbenzene modified phenolic resins can only reach 130 grades;
(2) improved the complete processing of follow-up goods.Aralkyl-phenol resin solution of the present invention can be according to different needs, satisfy the requirement of making aralkyl phenol glass grey cloth and aralkyl phenol glass cloth laminated board by the consumption that changes phenols, aldehydes and promotor, can make the electrical insulating material (woven fiber glass or glass fibre laminated and pressing) of production have stable electrical insulation properties and higher mechanical properties.The raising of mechanical property is mainly reflected in hot (180 ℃) of aralkyl phenol woven fiber glass goods, and flexural strength can reach about 200MPa, and hot (180 ℃) flexural strength of the woven fiber glass goods of existing methoxyl group parylene monomer modified phenolic resins only is about 50Mpa;
(3) heat aging property of the follow-up goods of raising.The heat-proof aging index of the woven fiber glass goods of existing methoxyl group parylene monomer modified phenolic resins only can reach 130 grades, and aralkyl phenol woven fiber glass goods of the present invention can be brought up to the heat-proof aging index 180 grades;
(4) use cost of reduction electrical engineering and electric apparatus industry material requested and component.Existing H level electrical insulating material (woven fiber glass or glass fibre laminated and pressing) exceeds 30%～40% than the cost of the electrical insulating material of producing with aralkyl-phenol resin of the present invention usually.
Embodiment
Below be specific embodiments of the invention, the person skilled in art can further understand technical scheme of the present invention according to the content of the following stated, also can this make some nonessential improvement and adjustment.
Embodiment 1: with 100 parts of (weight, the back is together) the methoxyl group parylene monomer, 80 parts of phenol and 3 parts of hydrochloric acid add in the reactor, heat temperature raising (being no more than 140 ℃) dewaters, cooling cooling when the water of deviating from reaches a certain amount of, add 120 parts in formaldehyde then, 4 parts of ammoniacal liquor, toluene carries out the temperature rising reflux dehydration for 70 parts, by the time after solution is transparent, add 30 parts of toluene, 20 parts in acetone and promotor (Witco 1298 Soft Acid: mahogany acid: oxalic acid=20: 2: 1) 6 parts, at 40 ℃～60 ℃, after carrying out 40 minutes to 80 minutes prepolymerization reactions, stirring obtains product aralkyl-phenol resin solution.
Embodiment 2: 100 parts of methoxyl group parylene monomers, 100 parts of phenol and 4 parts of tosic acid are added reactor, heat temperature raising (being no more than 140 ℃) dewaters, cooling cooling when the water of deviating from reaches a certain amount of, add 80 parts in formaldehyde, 5 parts in sodium hydroxide, toluene then and carry out vacuum hydro-extraction for 70 parts, treat that the transparent back of solution adds 1 part of 70 parts of toluene, 50 parts of alcohol and promotor sulfovinic acid, at 40 ℃～60 ℃, after carrying out 40 minutes to 80 minutes prepolymerization reactions, stirring obtains product aralkyl-phenol resin solution.
Embodiment 3: 100 parts of methoxyl group parylene monomers, 100 parts of phenol and 1 part of tosic acid are added reactor, heat temperature raising (being no more than 140 ℃) dewaters, cooling cooling when the water of deviating from reaches a certain amount of, add 100 parts in formaldehyde, 8 parts of ammoniacal liquor, toluene then and carry out reflux dewatering for 70 parts, by the time when solution is transparent, adding 3 parts of 60 parts of alcohol and promotor urotropines, at 40 ℃～60 ℃, after carrying out 40 minutes to 80 minutes prepolymerization reactions, stirring obtains product aralkyl-phenol resin solution.
Embodiment 4: with 100 parts of methoxyl group parylene monomers, 90 parts of phenol and 2 parts of sulfuric acid add in the reactor, heat temperature raising (being no more than 140 ℃) dewaters, cooling cooling when the water of deviating from reaches a certain amount of, add 110 parts in formaldehyde then, 6 parts in potassium hydroxide, toluene carries out vacuum hydro-extraction for 70 parts, by the time when solution is transparent, adding 50 parts of alcohol, 50 parts of methane amides and promotor (Witco 1298 Soft Acid: sulfovinic acid: mahogany acid=10: 8: 3) 3 parts, at 40 ℃～60 ℃, after carrying out 40 minutes to 80 minutes prepolymerization reactions, stirring obtains product aralkyl-phenol resin solution.
Embodiment 5: 100 parts of methoxyl group parylene monomers, 80 parts of xylenols and 3 parts of hydrochloric acid are added in the reactor, heat temperature raising (being no more than 140 ℃) dewaters, cooling cooling when the water of deviating from reaches a certain amount of, add 70 parts in 120 parts in furfural, 4 parts of ammoniacal liquor, toluene then and carry out the temperature rising reflux dehydration, by the time after solution is transparent, add 20 parts of toluene, 30 parts in acetone and promotor (urotropine: N, N-dimethyl benzylamine=1: 9) 5 part, at 40 ℃～60 ℃, after carrying out 40 minutes to 80 minutes prepolymerization reactions, stirring obtains product aralkyl-phenol resin solution.
Embodiment 6: with 100 parts of methoxyl group parylene monomers, 90 parts of phenol and 2 parts of hydrochloric acid add in the reactor, heat temperature raising (being no more than 140 ℃) dewaters, cooling cooling when the water of deviating from reaches a certain amount of, add 100 parts in furfural then, 4 parts of ammoniacal liquor, 70 parts of vacuum hydro-extractions that heat up of toluene, by the time after solution is transparent, add 60 parts of methane amides, 60 parts in acetone and promotor (urotropine: N, N-dimethyl benzylamine: imidazoles=1: 5: 3) 3 parts, at 40 ℃～60 ℃, after carrying out 40 minutes to 80 minutes prepolymerization reactions, stirring obtains product aralkyl-phenol resin solution.
Embodiment 7: 100 parts of methoxyl group parylene monomers, 90 parts of xylenols and 3 parts of hydrochloric acid are added in the reactor, heat temperature raising (being no more than 140 ℃) dewaters, cooling cooling when the water of deviating from reaches a certain amount of, add 70 parts in 120 parts in formaldehyde, 4 parts of ammoniacal liquor, toluene then and carry out the temperature rising reflux dehydration, by the time after solution is transparent, add 30 parts of toluene, 20 parts of methane amides and promotor (N, N-dimethyl benzylamine: imidazoles=5: 5) 2 parts, at 40 ℃～60 ℃, after carrying out 40 minutes to 80 minutes prepolymerization reactions, stirring obtains product aralkyl-phenol resin solution.
Embodiment 8: 100 parts of methoxyl group parylene monomers, 90 parts of phenol and 4 parts of hydrochloric acid are added in the reactor, heat temperature raising (being no more than 140 ℃) dewaters, cooling cooling when the water of deviating from reaches a certain amount of, add 80 parts in formaldehyde, 4 parts of ammoniacal liquor, 70 parts of vacuum hydro-extractions that heat up of toluene then, by the time after solution is transparent, add 30 parts of toluene, 50 parts in acetone and promotor (sulfovinic acid: mahogany acid: oxalic acid=20: 15: 3) 6 parts, at 40 ℃～60 ℃, after carrying out 40 minutes to 80 minutes prepolymerization reactions, stirring obtains product aralkyl-phenol resin solution.
Embodiment 9: 100 parts of methoxyl group parylene monomers, 80 parts of phenol and 4 parts of hydrochloric acid are added in the reactor, heat temperature raising (being no more than 140 ℃) dewaters, cooling cooling when the water of deviating from reaches a certain amount of, add 70 parts in 110 parts in furfural, 4 parts of ammoniacal liquor, toluene then and carry out the temperature rising reflux dehydration, by the time after solution is transparent, add 20 parts of alcohol, 30 parts in acetone and promotor (urotropine: imidazoles=3: 11) 6 parts, at 40 ℃～60 ℃, after carrying out 40 minutes to 80 minutes prepolymerization reactions, stirring obtains product aralkyl-phenol resin solution.
Embodiment 10: with 80 parts of methoxyl group parylene monomers, 80 parts of xylenols and 3 parts of hydrochloric acid add in the reactor, heat temperature raising (being no more than 140 ℃) dewaters, cooling cooling when the water of deviating from reaches a certain amount of, add 90 parts in formaldehyde then, 5 parts of urotropines, 70 parts of vacuum hydro-extractions that heat up of toluene, by the time after solution is transparent, add methane amide 30,40 parts in acetone and promotor (Witco 1298 Soft Acid: sulfovinic acid: oxalic acid=15: 8: 3) 4 parts, at 40 ℃～60 ℃, after carrying out 40 minutes to 80 minutes prepolymerization reactions, stirring obtains product aralkyl-phenol resin solution.
Embodiment 11: with 80 parts of methoxyl group parylene monomers, 90 parts of phenol and 2 parts of sulfuric acid add in the reactor, heat temperature raising (being no more than 140 ℃) dewaters, cooling cooling when the water of deviating from reaches a certain amount of, add 110 parts in formaldehyde then, 4 parts in potassium hydroxide, toluene carries out vacuum hydro-extraction for 70 parts, by the time when solution is transparent, adding 100 parts of alcohol and promotor (Witco 1298 Soft Acid: sulfovinic acid: mahogany acid=10: 8: 3) 3 parts, at 40 ℃～60 ℃, after carrying out 40 minutes to 80 minutes prepolymerization reactions, stirring obtains product aralkyl-phenol resin solution.
Embodiment 12: 120 parts of methoxyl group parylene monomers, 90 parts of xylenols and 3 parts of hydrochloric acid are added in the reactor, heat temperature raising (being no more than 140 ℃) dewaters, cooling cooling when the water of deviating from reaches a certain amount of, add 70 parts in 120 parts in formaldehyde, 4 parts of ammoniacal liquor, toluene then and carry out the temperature rising reflux dehydration, by the time after solution is transparent, add 2 parts of 40 parts of toluene, 30 parts of alcohol and promotor (urotropine), at 40 ℃～60 ℃, after carrying out 40 minutes to 80 minutes prepolymerization reactions, stirring obtains product aralkyl-phenol resin solution.
Above-mentioned specific embodiment only is that the present invention is further described, and can not be interpreted as limiting the scope of the invention, the invention is not restricted to the foregoing description, and content of the present invention is described all can be implemented, and has described good result.
Claims (7)
1. the preparation method of electrician's special utility aralkyl-phenol resin adhesive solvent, comprise: adopt 80～120 parts of (weight) methoxyl group parylene monomers, 80～100 parts of phenols, 80～120 parts of aldehydes, add 1～4 part of an acidic catalyst and 4～8 parts of basic catalysts respectively, 70 parts of toluene, by chemical reaction synthesizing methoxy dimethylbenzene modified phenolic resin lipoprotein solution, it is characterized in that also comprising the following steps: in described methoxyl group dimethylbenzene modified phenolic resin lipoprotein solution, adding 1～6 part of organic compound promotor and 50～120 parts of solvents, under 40 ℃～60 ℃, after carrying out 40～80 minutes prepolymerization reactions, promptly obtain product aralkyl-phenol resin adhesive solvent.
2. the preparation method of electrician's special utility aralkyl-phenol resin adhesive solvent according to claim 1, it is characterized in that: described organic compound promotor is Witco 1298 Soft Acid, sulfovinic acid, mahogany acid, urotropine, oxalic acid, imidazoles, N, one or more in the N-dimethyl benzylamine.
3. the preparation method of electrician's special utility aralkyl-phenol resin adhesive solvent according to claim 1 and 2 is characterized in that: described phenols is that phenol is or/and xylenol.
4. the preparation method of electrician's special utility aralkyl-phenol resin adhesive solvent according to claim 1 and 2 is characterized in that: described aldehydes is that formaldehyde is or/and furfural.
5. the preparation method of electrician's special utility aralkyl-phenol resin adhesive solvent according to claim 1 and 2 is characterized in that: described an acidic catalyst is that hydrochloric acid, tosic acid, sulfuric acid are or/and nitric acid.
6. the preparation method of electrician's special utility aralkyl-phenol resin adhesive solvent according to claim 1 and 2 is characterized in that: described basic catalyst is that sodium hydroxide, ammoniacal liquor, urotropine are or/and potassium hydroxide.
7. the preparation method of electrician's special utility aralkyl-phenol resin adhesive solvent according to claim 1 and 2 is characterized in that: described solvent is that toluene, alcohol, acetone are or/and methane amide.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03135902 CN1219842C (en) | 2003-09-25 | 2003-09-25 | Prepn of arylkyl phenolic resin adhesive solution specially for electrician |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03135902 CN1219842C (en) | 2003-09-25 | 2003-09-25 | Prepn of arylkyl phenolic resin adhesive solution specially for electrician |
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| Publication Number | Publication Date |
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| CN1526783A true CN1526783A (en) | 2004-09-08 |
| CN1219842C CN1219842C (en) | 2005-09-21 |
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| CN102718940A (en) * | 2012-06-28 | 2012-10-10 | 广州高金技术产业集团有限公司 | High-bonding-strength and high-temperature-resisting phenolic resin modified polyurethane adhesive and preparation method thereof |
| CN102719055A (en) * | 2012-06-28 | 2012-10-10 | 广州高金技术产业集团有限公司 | High temperature resistant epoxy glass fiber reinforced plastic composite material and preparation method thereof |
| CN103935092A (en) * | 2014-04-11 | 2014-07-23 | 四川东材科技集团股份有限公司 | Polyester-phenol-polyvinyl butyral-epoxy composite material and preparation method thereof |
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2003
- 2003-09-25 CN CN 03135902 patent/CN1219842C/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101207312B (en) * | 2007-10-24 | 2012-01-11 | 苏州巨峰电气绝缘系统股份有限公司 | Interface strap for generator coil die stamping insulation and production method thereof |
| CN102718940A (en) * | 2012-06-28 | 2012-10-10 | 广州高金技术产业集团有限公司 | High-bonding-strength and high-temperature-resisting phenolic resin modified polyurethane adhesive and preparation method thereof |
| CN102719055A (en) * | 2012-06-28 | 2012-10-10 | 广州高金技术产业集团有限公司 | High temperature resistant epoxy glass fiber reinforced plastic composite material and preparation method thereof |
| CN102718940B (en) * | 2012-06-28 | 2013-11-27 | 广州高金技术产业集团有限公司 | High-bonding-strength and high-temperature-resisting phenolic resin modified polyurethane adhesive and preparation method thereof |
| CN102719055B (en) * | 2012-06-28 | 2014-04-02 | 广州高金技术产业集团有限公司 | High temperature resistant epoxy glass fiber reinforced plastic composite material and preparation method thereof |
| CN103935092A (en) * | 2014-04-11 | 2014-07-23 | 四川东材科技集团股份有限公司 | Polyester-phenol-polyvinyl butyral-epoxy composite material and preparation method thereof |
| CN103935092B (en) * | 2014-04-11 | 2016-08-31 | 四川东材科技集团股份有限公司 | Polyester-phenolic aldehyde-polyvinyl butyral resin-epoxy composite material and preparation method thereof |
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| CN1219842C (en) | 2005-09-21 |
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