CN1525332A - A method for realizing reliability test of temperature - Google Patents
A method for realizing reliability test of temperature Download PDFInfo
- Publication number
- CN1525332A CN1525332A CNA031052916A CN03105291A CN1525332A CN 1525332 A CN1525332 A CN 1525332A CN A031052916 A CNA031052916 A CN A031052916A CN 03105291 A CN03105291 A CN 03105291A CN 1525332 A CN1525332 A CN 1525332A
- Authority
- CN
- China
- Prior art keywords
- temperature
- test
- function
- operational limit
- product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses a method to realize temperature reliability test aiming at computer product, placing the computer product in the temperature change device, setting an initial temperature, gradually changing the test temperature of the computer product on the basis of the initial temperature, obtaining high- and low- temperature operable and destructive limits by functional reliability test, making fast temperature conduction test on the basis of the high- and low- temperature operable limit so as to obtain the operable limit to the fast temperature conduction. It makes the design personnel able to obtain these limits and at the same time the defects in mechanical, electrical and functional properties of the computer product at various temperatures, thus able to optimize the design of the product and enhancing the temperature reliability of the system.
Description
Technical field
The present invention relates to the measuring technology of computer equipment and related device, relate to the method for the realization temperature reliability test of the electronic product relevant or rather with computing machine.
Background technology
After the 1950's, widespread use along with development of modern science and technology and electronic product, reliability index is mentioned in the same breath with indexs such as the performance of electronic product, expense, volume, weight, become one of leading indicator of weighing the electronic product quality, so-called reliability is meant that product under defined terms and in the official hour, finishes the ability of predetermined function.
Why so important reliability index is, the reason that two aspects of electronic product and enterprise are arranged, at first for electronic product itself, development of modern science and technology makes electronic product complicated more, do not improve the reliability of electronic product, the failure rate of electronic product will rise greatly, thereby causes electronic product almost can't use, and the characteristics that electronic product may use in various environment also require electronic product to have high reliability; And for enterprise, in order to capture the market of electronic product, just must shorten the lead time of electronic product, and if reduce in the development process repeatedly, just must predict and control the reliability of the element of electronic product and total system.
As everyone knows, in the environment for use of computer electronic products such as server, PC, notebook computer, very big such as various abominable factors such as temperature, vibration, humidity, impact, voltage ripple of power network to the influence of such properties of product, for temperature factor, temperature is too high, mistake is low or warm speed change is spent and all may be caused soon the machine system of this series products can't operate as normal.The main cause that machine system breaks down under the temperature environment condition of severe has two: one is that electronic devices and components break down, and another is the performance appearance fluctuation of machine system.Because but present electronic devices and components and machine system all has only a general operating temperature range, this scope is very inaccurate, simultaneously, also neither one accurately method estimate the system of computer product and electronic devices and components and destroy serviceable life under the environment in temperature fatigue, when working in the temperature environment of computer product in complexity, just have certain electronic devices and components probably and break down, or complete machine performance appearance fluctuation, thereby cause the complete machine operation to be broken down.And show according to the relevent statistics, in the reason that causes computer electronic product to break down in the course of the work, what belong to electronic component failure accounts for 50%, the quality of electronic devices and components performance directly has influence on machine performance thus, and the one of the main reasons of these electronic component failures is that the designer only considers the performance index of electronic devices and components when design, and do not consider desired temperature conditions when electronic devices and components use, be electronic devices and components can be under the residing temperature of complete machine operate as normal, that is to say the temperature reliability that does not fully take into account electronic devices and components, temperature reliability level to electronic devices and components, failure mode is unclear, fails to maximize favourable factors and minimize unfavourable ones in the design of complete machine.
Therefore, in the development stage of computer electronic product, the producer of this series products need pay much attention to the electronic devices and components of this series products and the temperature reliability of machine system, understand electronic devices and components and the failure mode of machine system under the different temperatures environment, analyze failure cause, find out weak link,, thereby improve the reliability of complete machine so that take the temperature reliability level of corresponding measure with raising electronic devices and components and machine system.Though at present industry is also relevant for the test of temperature reliability, but generally this type of temperature reliability test is just after production, whether satisfying the maximum temperature that GB provides and the qualification of minimum temperature detects, if it is defective, then replace be damaged or underproof device after test again again, till qualified.Such detection can only learn whether total system can meet the regulation of GB, and it is more suitable to know which kind of standard system or certain device should reach, more can not weigh in the system comprehensively various components and parts should satisfy which kind of temperature standard mate mutually just more reasonable, the entire system performance is better, can not realize the temperature reliability testing scheme of above-mentioned purpose in the prior art.
Summary of the invention
In view of this, fundamental purpose of the present invention is to provide a kind of method of testing at the realization temperature reliability of computer electronic product, so that the technician is when the computer electronic product of development, can in time understand electronic devices and components and the failure mode of machine system under the different temperatures environment, so that improve the complete machine performance of computer electronic product.
For reaching above purpose, technical scheme of the present invention is achieved in that a kind of method that realizes the temperature reliability test, is applicable to computer products, and this method may further comprise the steps:
A1. set the initial temperature of this test;
A2. on the basis of initial temperature, progressively change current probe temperature, behind each temperature stabilization, carry out once or once above reliable in function property testing, judge whether the function of current test product occurs unusually after each end of test (EOT), if, then enter step a3, otherwise, as the test initial temperature, return step a2 with Current Temperatures;
A3. temperature is returned to the test initial temperature that sets, behind this temperature stabilization, carry out once or the detection of once above functional reliability, whether full recovery is normal to judge all functions of test product after each end of test (EOT), if, temperature before then function occurs unusually among the step a2 is set to the temperature operational limit, and process ends; Otherwise, reduce each temperature change amount, with function among the step a2 unusual temperature before appears as the test initial temperature, return step a2.
Described in the step a2 changing into of probe temperature heated up or cooling; The operational limit of temperature described in the step a3 is high temperature operational limit or low temperature operational limit, and after high temperature operational limit and low temperature operational limit all obtained, this method further may further comprise the steps:
A4. between high temperature operational limit and low temperature operational limit, change current probe temperature with a quick temperature speed change degree, carry out the test of high temperature or low temperature velocity variations, when arriving high temperature or low temperature operational limit, behind temperature stabilization, carry out once or above reliable in function property testing, whether the function of judging test product after the end of test (EOT) occurs unusually, if there do not have function to occur to be unusual, then should be set to the operational limit that fast temperature conducts, process ends by temperature speed change degree; Otherwise, enter step a5;
A5. reduce the quick temperature speed change degree among the step a4, and return step a4.
If all functions full recovery is normal among the step a3, described step a3 further comprises:
A31. unusual temperature appears as initial temperature with function;
A32. continue progressively to change current probe temperature, behind temperature stabilization, current probe temperature is returned to initial temperature, behind temperature stabilization, carry out once or above functional reliability detection, judge whether the function of current test product occurs unusually after each end of test (EOT), if, then current probe temperature is set to temperature and destroys boundary, and process ends, otherwise, as the test initial temperature, return step a32 with Current Temperatures.
If function can not be recovered normally among the step a3, described step a3 further comprises: current probe temperature is set to temperature and destroys boundary.
Described functional reliability detects: the data storage medium to test product carries out surface damage scanning, and whether the function of each electronic devices and components of inspection test product and the performance of each interface be normal; Or the system that detects whole test product is under the situation of full load operation, the stability of each parts or entire system operation and compatible; Or the detection test product is to the adaptive faculty of power grid environment; Or the combination in any of above three kinds of tests.
Described data storage medium to test product carries out surface damage scanning to be realized by the system test software WinPie3.24 that has disposed the disk scanning test pack.
Under the described full load running status stability and compatible detection are realized by modular system test software WinPie3.24 of operation and network test software Drive Reaper.
Described detection to the power grid environment adaptive faculty realizes by the distortion of AC power supply simulation mains waveform.
The current probe temperature of described change is realized by thermal shock test chamber.
Carry out once above high temperature or the test of low temperature velocity variations with same quick temperature speed change degree among the described step a3.
The inventive method is tested by the temperature reliability to electronic devices and components, can obtain different electronic devices and components temperature operational limit accurately, temperature is destroyed the operational limit of boundary and fast temperature conduction, and under each temperature electronic devices and components in mechanical property, defective on electrical characteristics and the functional characteristic, make the designer when carrying out entire machine design, can take into full account the various characteristics of electronic devices and components, improve design as required and the temperature reliability of raising electronic devices and components, or be replaced by the higher electronic devices and components of temperature reliability, thereby make the temperature reliability performance of complete machine more stable, and the statistics and the calculating of temperature reliability that can be by each electronic devices and components realize having one to estimate comparatively accurately to the temperature reliability of complete machine; Test by temperature reliability, obtain the operational limit of system's temperature and fast temperature conduction accurately, make the designer when design, can carry out system optimization as required, thereby improve the temperature reliability of system system.
Embodiment
Below in conjunction with drawings and the specific embodiments the inventive method is described in further detail.
The present invention program's core concept is exactly: utilize one can carry out in a big way temperature soon, the temperature inversion device of conversion at a slow speed, the electronic devices and components or the system of computer electronic product to be measured are placed in this temperature inversion device, when progressively increasing or reducing temperature, carry out the reliable in function property testing of test prototype, obtain temperature operational limit and temperature that the electronic devices and components of computer electronic product or system can operate as normal and destroy boundary.Then, destroying boundary with the temperature operational limit of resulting various components and parts and temperature is standard, and computer electronic product is developed or improved; Or utilize the temperature operational limit of resulting various components and parts and temperature destruction boundary to be standard, when carrying out the complete machine combination, obtain the cell configuration scheme that makes the entire system performance better.
Wherein, the operational limit of described temperature or the fast temperature conduction temperature stress critical point that after temperature stress is eliminated, can recover automatically for the functional fault of the computing machine electronic devices and components that in the temperature reliability process of the test, take place or system; Described temperature is destroyed functional fault temperature stress critical point of existence still after temperature stress is eliminated that boundary is computing machine electronic devices and components or system, in this operational limit, increase or reduce temperature then fast, carry out the reliable in function property testing of test prototype simultaneously, obtain the maximum temperature speed change degree that the electronic devices and components of computer electronic product or system can operate as normal, and with its operational limit as electronic devices and components or system's fast temperature conduction.
In such scheme, the functional reliability test that Devices to test or device carried out is comprised three aspects:
1) data storage medium to parts such as the internal memory of the electronic devices and components such as memory hard disk of needs tests, hard disks carries out surface damage scanning, whether the function of each electronic devices and components of inspection computing machine and the performance of each interface be normal, and this detection can have been disposed the system test software WinPie3.24 realization of disk scanning test pack by operation;
2) detect whole computer system under the situation of full load operation, the stability of each parts or entire system operation and compatible, this detection can realize by modular system test software WinPie3.24 of operation and network test software Drive Reaper;
3) each electronic devices and components of detection computations machine and system are to the adaptive faculty of power grid environment, can simulate various mains waveform distortions by AC power supply each electronic devices and components of computing machine and system are detected, the distortion of the various mains waveform that AC power supply can be simulated comprises the slow lifting of power supply instant cut-off, instantaneous surging, power supply deficiency, voltage and frequency etc.
The temperature inversion device that present embodiment adopts is warm change scope into-100 ℃～+ 200 ℃, maximum temperature speed change degree are the thermal shock test chamber of 60 ℃/min, utilizes this device that the electronic devices and components and the system of computing machine are detected.At first carry out the temperature stress test, this test comprises hot stage stress test and low thermophase stress test, these two tests are order in no particular order, the model machine that electronic devices and components to be measured or system will be housed before test is placed in the chamber, the temperature sensor of chamber is arranged on the tested electronic devices and components, the initial temperature that test is set is a room temperature, the amplitude that will heat up or lower the temperature is controlled at 8 ℃～12 ℃, concrete test temperature value is according to the electronic devices and components of computing machine or the complexity decision of system, if the electronic devices and components of computing machine or system very complex, then it can be more responsive to variation of temperature, therefore need to adopt less liter, cooling extent, otherwise, can adopt bigger liter, cooling extent.
Present embodiment at first hangs down the thermophase stress test, on the basis of room temperature, tested model machine is lowered the temperature one by one with a fixed temperature value, after each cooling, keep a period of time so that temperature stabilization, this section of present embodiment period is set to 15 minutes, under this stable temperature, carry out reliable in function property testing at least once afterwards, if each test is all normal, then lower the temperature with the temperature after this cooling next time, if once or more than test out tested model machine function occur unusual, then temperature is returned to room temperature, recovering to keep a period of time after the room temperature, carry out reliable in function property testing at least once afterwards again, if once or the function of being tested in the above test can not recover, unusual corresponding temperature then this function occurred and be called the low temperature damage boundary, and the amplitude that reduces to lower the temperature, parafunctional temperature that temperature before occurring with this is initial temperature, again hang down the thermophase stress test, to obtain the low temperature operational limit.If the unusual function that occurs can both be recovered, unusual temperature before then this function occurred and be called the low temperature operational limit, and on the basis of the corresponding unusually temperature of this function appearance, lower the temperature one by one again to obtain the low temperature damage boundary, lower the temperature in this case, after cooling is stable, carry out reliable in function property testing at least once equally, the function of this tested model machine can occur in test at least once unusually, temperature is returned to room temperature, recovering to stablize a period of time after the room temperature, carry out reliable in function property testing at least once afterwards again, if the unusual function that occurs can both be recovered, then carry out cooling next time, if once or more than test out this function and can't recover, then occur this function unusual and can't recover corresponding temperature being called the low temperature damage boundary.
After low thermophase stress test is finished, carry out the hot stage stress test with similar methods, different is with a fixed temperature value tested model machine to be heated up one by one on the basis of room temperature, finally finds out high temperature operational limit and high temperature and destroys boundary.
Obtain to carry out the fast temperature conduction test after the high and low temperature operational limit of electronic devices and components or system.The height that obtains at said temperature stage stress test, between the low temperature operational limit, from room temperature, fast temperature rate of change with 15 ℃～60 ℃/min carries out one or above round-robin height respectively, the test that low temperature changes, present embodiment has adopted 6 round-robin height, low temperature changes, specifically choosing of fast temperature rate of change according to the electronic devices and components of computing machine or the complexity decision of system, if the electronic devices and components of computing machine or system very complex, then it can be more responsive to variation of temperature, therefore adopt and 15 ℃ of close less rate of temperature changes, otherwise, can adopt the bigger rate of temperature change close with 60 ℃, in each circulation, when temperature rises to the high temperature operational limit or drops to the low temperature operational limit, keep a period of time to make temperature stabilization, carry out the reliable in function property testing afterwards again, if discovery fault, then this fault must be the restorability fault, then temperature conduction speed is reduced 15 ℃～20 ℃/min, repeat above-mentioned fast temperature conduction test again, 6 circulations are carried out in this test equally, if in one or above reliable in function property testing, still find fault, then reducing temperature conduction speed again tests, all do not have the reversibility fault to take place up to each circulation, then this temperature is the operational limit of fast temperature conduction.
Adopt the inventive method according to first parts, the order of back machine system is carried out the temperature reliability test of computer electronic product, can expose computer electronic product in mechanical property, defective on electrical characteristics and the functional characteristic, solve corresponding defective according to test result, just can improve the performance of each parts and even total system, thereby can improve the mean free error time (MTBF of computer electronic product system, mean time between failures) value, ensure the temperature reliability of new product, shorten the development time of new product, thereby quickened the Time To Market of new product, and reduced the R﹠D costs and the after service cost of new product.
Claims (10)
1, a kind of method that realizes the temperature reliability test is applicable to computer products, it is characterized in that this method may further comprise the steps:
A1. set the initial temperature of this test;
A2. on the basis of initial temperature, progressively change current probe temperature, behind each temperature stabilization, carry out once or once above reliable in function property testing, judge whether the function of current test product occurs unusually after each end of test (EOT), if, then enter step a3, otherwise, as the test initial temperature, return step a2 with Current Temperatures;
A3. temperature is returned to the test initial temperature that sets, behind this temperature stabilization, carry out once or the detection of once above functional reliability, whether full recovery is normal to judge all functions of test product after each end of test (EOT), if, temperature before then function occurs unusually among the step a2 is set to the temperature operational limit, and process ends; Otherwise, reduce each temperature change amount, with function among the step a2 unusual temperature before appears as the test initial temperature, return step a2.
2, method according to claim 1 is characterized in that, described in the step a2 changing into of probe temperature is heated up or cooling; The operational limit of temperature described in the step a3 is high temperature operational limit or low temperature operational limit, and after high temperature operational limit and low temperature operational limit all obtained, this method further may further comprise the steps:
A4. between high temperature operational limit and low temperature operational limit, change current probe temperature with a quick temperature speed change degree, carry out the test of high temperature or low temperature velocity variations, when arriving high temperature or low temperature operational limit, behind temperature stabilization, carry out once or above reliable in function property testing, whether the function of judging test product after the end of test (EOT) occurs unusually, if there do not have function to occur to be unusual, then should be set to the operational limit that fast temperature conducts, process ends by temperature speed change degree; Otherwise, enter step a5;
A5. reduce the quick temperature speed change degree among the step a4, and return step a4.
3, method according to claim 1 is characterized in that, if all functions full recovery is normal among the step a3, described step a3 further comprises:
A31. unusual temperature appears as initial temperature with function;
A32. continue progressively to change current probe temperature, behind temperature stabilization, current probe temperature is returned to initial temperature, behind temperature stabilization, carry out once or above functional reliability detection, judge whether the function of current test product occurs unusually after each end of test (EOT), if, then current probe temperature is set to temperature and destroys boundary, and process ends, otherwise, as the test initial temperature, return step a32 with Current Temperatures.
4, method according to claim 1 is characterized in that, if function can not be recovered normally among the step a3, described step a3 further comprises: current probe temperature is set to temperature and destroys boundary.
5, method according to claim 1, it is characterized in that, described functional reliability detects: the data storage medium to test product carries out surface damage scanning, and whether the function of each electronic devices and components of inspection test product and the performance of each interface be normal; Or the system that detects whole test product is under the situation of full load operation, the stability of each parts or entire system operation and compatible; Or the detection test product is to the adaptive faculty of power grid environment; Or the combination in any of above three kinds of tests.
6, method according to claim 5 is characterized in that, described data storage medium to test product carries out surface damage scanning to be realized by the system test software WinPie3.24 that has disposed the disk scanning test pack.
7, method according to claim 5 is characterized in that, under the described full load running status stability and compatible detection is realized by modular system test software WinPie3.24 of operation and network test software Drive Reaper.
8, method according to claim 5 is characterized in that, described detection to the power grid environment adaptive faculty realizes by the distortion of AC power supply simulation mains waveform.
According to claim 1,2 or 3 described methods, it is characterized in that 9, the current probe temperature of described change is realized by thermal shock test chamber.
10, method according to claim 2 is characterized in that, carries out once above high temperature or the test of low temperature velocity variations with same quick temperature speed change degree among the described step a3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA031052916A CN1525332A (en) | 2003-02-26 | 2003-02-26 | A method for realizing reliability test of temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA031052916A CN1525332A (en) | 2003-02-26 | 2003-02-26 | A method for realizing reliability test of temperature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1525332A true CN1525332A (en) | 2004-09-01 |
Family
ID=34282590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA031052916A Pending CN1525332A (en) | 2003-02-26 | 2003-02-26 | A method for realizing reliability test of temperature |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1525332A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102288910A (en) * | 2011-07-29 | 2011-12-21 | 海信容声(广东)冰箱有限公司 | Test method for temperature fuse component |
| CN102565596A (en) * | 2012-02-08 | 2012-07-11 | 电子科技大学 | Method for temperature stress limit evaluation of electronic component |
| CN102608449A (en) * | 2012-02-08 | 2012-07-25 | 电子科技大学 | Electric stress limit evaluation method for gallium arsenide monolithic microwave power amplifier |
| CN101443735B (en) * | 2004-12-16 | 2012-11-14 | 罗伯特·博世有限公司 | Method and device for predicting a life expectancy of a product containing a plurality of components |
| CN105279056A (en) * | 2015-10-30 | 2016-01-27 | 浪潮电子信息产业股份有限公司 | Test method for verifying reliability of high-temperature server system |
-
2003
- 2003-02-26 CN CNA031052916A patent/CN1525332A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101443735B (en) * | 2004-12-16 | 2012-11-14 | 罗伯特·博世有限公司 | Method and device for predicting a life expectancy of a product containing a plurality of components |
| CN102288910A (en) * | 2011-07-29 | 2011-12-21 | 海信容声(广东)冰箱有限公司 | Test method for temperature fuse component |
| CN102565596A (en) * | 2012-02-08 | 2012-07-11 | 电子科技大学 | Method for temperature stress limit evaluation of electronic component |
| CN102608449A (en) * | 2012-02-08 | 2012-07-25 | 电子科技大学 | Electric stress limit evaluation method for gallium arsenide monolithic microwave power amplifier |
| CN102608449B (en) * | 2012-02-08 | 2014-08-06 | 电子科技大学 | Electric stress limit evaluation method for gallium arsenide monolithic microwave power amplifier |
| CN102565596B (en) * | 2012-02-08 | 2014-08-06 | 电子科技大学 | Method for temperature stress limit evaluation of electronic component |
| CN105279056A (en) * | 2015-10-30 | 2016-01-27 | 浪潮电子信息产业股份有限公司 | Test method for verifying reliability of high-temperature server system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103487781B (en) | A kind of reliability estimation method of the electronic mutual inductor based on accelerated deterioration | |
| CN108120949A (en) | A kind of intelligent electric energy meter accelerated degradation test method | |
| CN111460644A (en) | Photovoltaic array monitoring system with fault diagnosis and power prediction functions | |
| CN111082749A (en) | Method and device for identifying running state of photovoltaic string and storage medium | |
| CN1525332A (en) | A method for realizing reliability test of temperature | |
| CN111077420A (en) | System and method for automatically testing voltage sag tolerance capability of sensitive equipment | |
| CN201489070U (en) | Arrester detecting device | |
| CN1525331A (en) | A method for realizing reliability test in combinational environment of temperature and vibration | |
| CN108664669A (en) | A kind of BGA solder joints thermal life prediction technique, test platform and test cabinet | |
| CN116484267B (en) | Transformer fault characteristic extraction and determination method, computer equipment and storage medium | |
| CN109559019A (en) | A kind of Electrical Power System Dynamic safety evaluation method based on risk index | |
| CN1525149A (en) | Method for realizing vibration reliability testing | |
| CN109635001A (en) | Product reliability method for improving and system based on the analysis of equipment failure data | |
| CN111413564A (en) | Supercapacitor failure early warning method, system and equipment | |
| CN116008787A (en) | DUT anomaly identification method, device and equipment for device under test | |
| CN109493773A (en) | A kind of design method and tester table of the overcurrent protection value of display panel | |
| CN115561663A (en) | Method and test system for evaluating reliability of power supply module | |
| CN110532142A (en) | A kind of computer system hard disk switching controller | |
| CN111459734A (en) | Method and system for testing fault monitoring period and computer storage medium | |
| CN1524634A (en) | Method for rapidly filtering products | |
| CN111398725B (en) | Equipment electromagnetic damage characterization method suitable for system electromagnetic vulnerability assessment | |
| Li et al. | Black box fault diagnosis method of power metering device based on digital filtering and EMD method | |
| Hofmeister et al. | Halt evaluation of SJ BIST technology for electronic prognostics | |
| Meng et al. | Analysis of Degradation Characteristics of Hard Disk Drives in Accelerated Aging Tests and Exploration of PHM Methods | |
| CN111737096B (en) | Method and device for detecting integral grading of TPC-H pre-test system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |