CN1522104A - Vacuum porefilling method for printed circuit board and porefilling apparatus being used - Google Patents
Vacuum porefilling method for printed circuit board and porefilling apparatus being used Download PDFInfo
- Publication number
- CN1522104A CN1522104A CNA031110134A CN03111013A CN1522104A CN 1522104 A CN1522104 A CN 1522104A CN A031110134 A CNA031110134 A CN A031110134A CN 03111013 A CN03111013 A CN 03111013A CN 1522104 A CN1522104 A CN 1522104A
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- circuit board
- printed circuit
- vacuum
- pcb
- heating
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Abstract
The invention discloses the method of vacuum filling perforation for printed circuit board and filling perforation apparatus thereof, wherein the method comprises the steps of, pouring in ink into the closed perforation needed by the printed circuit board, immigrating into a vacuum chamber, exhausting the air in the perforation and immigrating into a heated kilning chamber quickly, drying the ink to accomplish filling perforation operation. The method can prevent the damage of the printed circuit board hole from cracking during the filling operation. The invention also discloses the perforation filling apparatus for realizing the method.
Description
Technical field
The present invention relates to a kind of processing method of circuit board, particularly a kind of printed circuit board (PCB) vacuum filling perforation method and used filling perforation device.
Background technology
Printed circuit board (PCB) is to be made of sandwich construction, sees also shown in Figure 1ly, offers most holes on the surface of circuit board 10, and the entire circuit plate thickness may be run through in those holes, and for example the hole 11, also may be that part penetrates circuit board, and for example the hole 12; Basically those perforation are need and to offer according to conduction, and can weld or connect some electronic component.
But sometimes because the change of circuit design or some perforation are mistaken or perforation need not or some exception factor, the essential packing of the perforation of on printed circuit board (PCB), being offered.
Known packing mode is printing ink to be poured in the perforation to fill up at normal temperatures, and then printed circuit board (PCB) is heated, make ink setting solidify, promptly finish the packing perforation, such prior art method, though can reach purpose with the perforation packing,, when practical operation, because the liquid printing ink of inserting is mixed with air, after being heated, because the quick-fried problem in hole can take place in the expansion of air, when serious, even with unbearably use of entire circuit plate damage.
Summary of the invention
The purpose of this invention is to provide a kind of printed circuit board (PCB) filling perforation method that solves the quick-fried problem in hole.
Another object of the present invention provides a kind of filling perforation device of realizing said method.
Method of the present invention may further comprise the steps in regular turn:
A, the perforation of wanting packing on the printed circuit board (PCB) is poured into liquid printing ink;
B, printed circuit board (PCB) is moved to a vacuum chamber;
C, vacuum chamber continue to be pumped into vacuum state, make that the air in the liquid printing ink is discharged from;
D, printed circuit board (PCB) is moved to the heating, drying chamber rapidly;
E, treat to shift out after printing ink solidifies, finish packing perforation operation.
In this method, utilize the vacuum state of vacuum chamber, the air in the liquid printing ink is discharged, add thermocoagulation then rapidly, make when printing ink solidifies, it is quick-fried that the hole can not take place, and when the packing printed circuit board (PCB) was bored a hole, it is quick-fried that the hole can not take place yet.
The device of realizing the present invention's method includes a vacuum chamber, a heating, drying chamber, first gate, second gate, the 3rd gate, and wherein, vacuum chamber has vacuum pump with the vacuum chamber of the sealing state that is evacuated; The heating, drying chamber is connected with vacuum chamber, in be provided with mechanical arm, and have a heating drying system to its inside heating, drying; Before first gate is arranged at vacuum chamber, can opens printed circuit board (PCB) is inserted; Second gate is arranged between vacuum chamber and the heating, drying chamber, can open for mechanical arm and stretch in the vacuum chamber from the heating, drying chamber, printed circuit board (PCB) is moved to heating lamp rapidly do indoor; After the 3rd gate is arranged at the heating, drying chamber, can opens and take out printed circuit board (PCB).
After first perforation with printed circuit board (PCB) pours into printing ink, make printed circuit board (PCB) send in the vacuum chamber first gate opening, then with first closing gate; Start vacuum pump the air in the vacuum chamber is extracted out, simultaneously the air of sneaking in the printing ink is discharged; Afterwards,, utilize mechanical arm to stretch in the vacuum chamber from heating, drying is indoor, printed circuit board (PCB) is moved to the heating, drying chamber rapidly, again with second closing gate and start heating drying system, to the printed circuit board (PCB) heating that moves into second gate opening; After printing ink solidifies, then,, printed circuit board (PCB) is shifted out the 3rd gate opening, finish whole packing perforation operation.
Description of drawings
Fig. 1 is the cross-sectional schematic of multiple field printed circuit board (PCB).
Fig. 2 is the flow chart of the present invention's method.
Fig. 3 is the present invention's apparatus structure schematic diagram.
Embodiment
See also shown in Figure 2ly, the present invention's printed circuit board (PCB) vacuum filling perforation method may further comprise the steps in regular turn:
A, the perforation of wanting packing on the printed circuit board (PCB) is poured into liquid printing ink;
B, printed circuit board (PCB) is moved to a vacuum chamber;
C, vacuum chamber continue to be pumped into vacuum state, make that the air in the liquid printing ink is discharged from;
D, printed circuit board (PCB) is moved to the heating, drying chamber rapidly;
E, treat to shift out after printing ink solidifies, finish packing perforation operation.
The vacuum degree of vacuum chamber can calculate the vacuum degree of air-out according to the character of printing ink, but does not cause liquid printing ink to be extracted out in perforation.
The filling perforation apparatus structure of realizing said method is as follows:
Can design vacuum chamber and be connected, as shown in Figure 3, have first gate 231 before the vacuum chamber 21, be used for putting into printed circuit board (PCB) with the heating, drying chamber; And establish one second gate 232 in addition between true chamber, chamber 21 and the heating, drying chamber 22; 22 rear ends, heating, drying chamber have the 3rd gate 233, are used for taking out printed circuit board (PCB); In addition, vacuum chamber 21 is provided with a vacuum pump 24, the air in the vacuum chamber 21 is discharged form vacuum state; And be provided with mechanical arm 25 in the heating, drying chamber 22, can pass second gate 231 printed circuit board (PCB) in the vacuum chamber 21 is moved in the heating, drying chamber 22.
When practical operation, after first perforation with printed circuit board (PCB) pours into printing ink, make printed circuit board (PCB) can send in the vacuum chamber 21 231 unlatchings of first gate, then first gate 231 is closed; Start vacuum pump 24 air in the vacuum chamber 21 is extracted out, simultaneously the air of sneaking in the printing ink is discharged; Afterwards, second gate 23 is opened, utilized mechanical arm 25 in heating, drying chamber 22, to stretch in the vacuum chamber 21, printed circuit board (PCB) is moved to heating, drying chamber 22 rapidly, again second gate 232 is closed and start heating drying system 26, to the printed circuit board (PCB) heating that moves into; After printing ink solidifies, then, the 3rd gate 233 is opened, printed circuit board (PCB) is shifted out, finish whole packing perforation operation.
By above-described method and device, printing ink is being heated when solidifying as can be known, air is discharged, and with the quick-fried shortcoming in hole that can not take place again to produce because of air expansion, can reach the operation of the packing of printed circuit board (PCB) perforation fast and effectively.
Claims (3)
1, a kind of printed circuit board (PCB) vacuum filling perforation method, it may further comprise the steps in regular turn:
A, the perforation of wanting packing on the printed circuit board (PCB) is poured into liquid printing ink;
B, printed circuit board (PCB) is moved to a vacuum chamber;
C, vacuum chamber continue to be pumped into vacuum state, make that the air in the liquid printing ink is discharged from;
D, printed circuit board (PCB) is moved to the heating, drying chamber rapidly;
E, treat to shift out after printing ink solidifies, finish packing perforation operation.
2, according to the described printed circuit board (PCB) vacuum of claim 1 filling perforation method, it is characterized in that: the vacuum degree of vacuum chamber calculates the vacuum degree of required air-out according to the character of printing ink, but does not cause liquid printing ink to be extracted out from perforation.
3, realize the filling perforation device of the described method of claim 1, it is characterized in that: include a vacuum chamber, a heating, drying chamber, first gate, second gate, the 3rd gate, wherein, vacuum chamber has vacuum pump with the vacuum chamber of the sealing state that is evacuated; The heating, drying chamber is connected with vacuum chamber, in be provided with mechanical arm, and have a heating drying system to its inside heating, drying; Before first gate is arranged at vacuum chamber, can opens printed circuit board (PCB) is inserted; Second gate is arranged between vacuum chamber and the heating, drying chamber, can open for mechanical arm and stretch in the vacuum chamber from the heating, drying chamber, printed circuit board (PCB) is moved to heating lamp rapidly do indoor; After the 3rd gate is arranged at the heating, drying chamber, can opens and take out printed circuit board (PCB).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA031110134A CN1522104A (en) | 2003-02-14 | 2003-02-14 | Vacuum porefilling method for printed circuit board and porefilling apparatus being used |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA031110134A CN1522104A (en) | 2003-02-14 | 2003-02-14 | Vacuum porefilling method for printed circuit board and porefilling apparatus being used |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1522104A true CN1522104A (en) | 2004-08-18 |
Family
ID=34283343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA031110134A Pending CN1522104A (en) | 2003-02-14 | 2003-02-14 | Vacuum porefilling method for printed circuit board and porefilling apparatus being used |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1522104A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104470258A (en) * | 2014-12-23 | 2015-03-25 | 深圳市五株科技股份有限公司 | Circuit board ink hole plugging technological method |
| CN106535485A (en) * | 2017-01-04 | 2017-03-22 | 南昌浩牛科技有限公司 | Efficient baking equipment for solder resist ink for circuit board |
| CN111295052A (en) * | 2020-03-25 | 2020-06-16 | 深圳捷飞高电路有限公司 | Blind hole filling process and grinding device for high-density interconnected printed circuit board |
-
2003
- 2003-02-14 CN CNA031110134A patent/CN1522104A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104470258A (en) * | 2014-12-23 | 2015-03-25 | 深圳市五株科技股份有限公司 | Circuit board ink hole plugging technological method |
| CN104470258B (en) * | 2014-12-23 | 2018-04-27 | 深圳市五株科技股份有限公司 | Circuit board ink plugging process |
| CN106535485A (en) * | 2017-01-04 | 2017-03-22 | 南昌浩牛科技有限公司 | Efficient baking equipment for solder resist ink for circuit board |
| CN106535485B (en) * | 2017-01-04 | 2018-12-18 | 浙江万叶绝缘材料有限公司 | A kind of circuit board anti-solder ink roasting plant |
| CN111295052A (en) * | 2020-03-25 | 2020-06-16 | 深圳捷飞高电路有限公司 | Blind hole filling process and grinding device for high-density interconnected printed circuit board |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |