CN1520944A - Method for recovering integrated circuit chips - Google Patents
Method for recovering integrated circuit chips Download PDFInfo
- Publication number
- CN1520944A CN1520944A CNA031043232A CN03104323A CN1520944A CN 1520944 A CN1520944 A CN 1520944A CN A031043232 A CNA031043232 A CN A031043232A CN 03104323 A CN03104323 A CN 03104323A CN 1520944 A CN1520944 A CN 1520944A
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- Prior art keywords
- chip
- circuit board
- printed circuit
- pcb
- conducting film
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The recovering method for IC chip in planar display is suitable for printed circuit board to be detached owing to its bad quality. Special detaching cutter is used to detach chip adhered with anisotropic conductive film and the chip is recovered for reuse. The present invention can reduce waste.
Description
Technical field
The present invention relates to a kind of flat-panel screens, in particularly a kind of flat-panel screens, the recovery method of the IC chip on the bad printed circuit board (PCB) (PWB).
Background technology
Because multimedia developing rapidly makes the user require more and more high to the acousto-optic equipment of periphery.(Cathode Ray Tube, the CRT) display of type because volume is too huge, were being pursued in light, thin, short, the little epoch, gradually the incompatibility demand now for Chang Yong cathode-ray tube or title kinescope in the past.Therefore, have many flat-panel screens (Flat Panel Display) technology to be developed in succession in recent years, (Liquid Crystal Display LCD), becomes the main flow of following display gradually as LCD.
In the process of making LCD, often use printed circuit board (PCB) (PWB) to assemble, between printed circuit board (PCB) and display floater, utilize IC chip (IC) to make bridge joint, for example cobasis plate IC chip (COG) reaches the circuit control to display panels.Fig. 1 illustrates existing a kind of liquid crystal flat panel display planar structure schematic diagram.Please refer to Fig. 1, in the S of display floater 100 side adjacency printed circuit board (PCB) 110 is arranged, between the two with several IC chip 130 bridge joints.Same, in the G of display floater 100 side, adjacency has printed circuit board (PCB) 120, and uses chip 140 bridge joints.In the time of traditionally on chip 130 being fixed in display floater 100 and printed circuit board (PCB) 110, use anisotropy conducting film (AnisotropicConductive Film, ACF) carry out set, not only can chip 130 is fixing completely, but also has good electrical conductivity, the face that connects between printed circuit board (PCB) 110 and the chip 130 problem of conducting electricity is solved fully, and it is easier that chip is installed.
Yet; took place because printed circuit board (PCB) assembling condition of poor through regular meeting in the past; that, position bad such as printed circuit board (PCB) quality skew, ACF attach is bad, chip misalignment position or the like; abandon and the full wafer printed circuit board (PCB) must be comprised that chip on it is removed together; because the unit price of chip is not low; for chip can be reclaimed and re-use, and improve the rate of recovery of chip, be that each display manufacturer wants the important goal improved always.
Summary of the invention
Therefore a purpose of the present invention is the recovery method that is to provide a kind of IC chip, IC chip on the bad printed circuit board (PCB) is suitably disassembled, make IC chip reclaim use again, be applied on the good printed circuit board (PCB), reduce the waste of chip.
Another object of the present invention is to provide a kind of recovery method of IC chip, utilize the special cutter of disassembling, pull down the IC chip that uses the anisotropy conducting film to attach, can reduce the fracture of chip pin or crooked, reduce the scrappage of chip.
Another purpose of the present invention is to provide a kind of recovery method of IC chip, with the complete IC chip of pulling down, is installed on the good printed circuit board (PCB), makes the IC chip of disassembling reach the purpose that re-uses.
The invention provides a kind of recovery method of IC chip, be applicable to bad printed circuit board (PCB), reclaim the IC chip that uses the anisotropy conducting film to attach, the method comprises the following steps at least.At first use one to disassemble cutter, pull down the IC chip on the bad printed circuit board (PCB) is complete, then with an organic solvent,, remove residual anisotropy conducting film on the IC chip such as acetone or alcohol.Afterwards new anisotropy conducting film is attached at another new and good printed circuit board (PCB), again the IC chip contraposition under complete the disassembling is fitted on the good printed circuit board (PCB) at last.
Utilize the cutter of disassembling of the present invention, utilize its round blunt end and level and smooth blade can be with the IC chip on the anisotropy conducting film complete disassembling, can reduce chip pin fracture or crooked problem take place, thereby the recovery that improves chip re-uses rate.
Brief Description Of Drawings
Below in conjunction with accompanying drawing the specific embodiment of the present invention is described in further detail.
In the accompanying drawing,
Fig. 1 illustrates the planar structure schematic diagram of existing a kind of liquid crystal flat panel display;
Fig. 2 illustrates the flow chart of recovery method of the present invention;
Fig. 3 illustrates the structural representation that chip of the present invention is disassembled cutter;
Fig. 4 illustrates chip cleaning action schematic diagram of the present invention;
Fig. 5 illustrates the structural representation that chip contraposition of the present invention is fitted.
The specific embodiment
The invention provides a kind of recovery method of IC chip, utilize the cutter of disassembling of the present invention, can be with complete the pulling down of IC chip of using anisotropy conducting film (ACF) to adhere to, promote the rate of recovery of IC chip, reduce IC chip and cause unnecessary waste because of bad the abandoning of printed circuit board (PCB).
At first in the process of making flat-panel screens, after installing, IC chip detects, if find the skew of printed circuit board (PCB) occurrence positions, quality is bad, ACF attaches bad, the IC chip contraposition is inaccurate, and full contrast is bad or the like, must change printed circuit board (PCB), but IC chip but is under the good situation, just must carry out the recovery of IC chip, IC chip is re-used on other good printed circuit board (PCB), reduce the unnecessary waste of IC chip.
Fig. 2 illustrates the flow chart of the recovery method according to the present invention.Please refer to Fig. 2, at first use the cutter of disassembling of the present invention that IC chip on the bad printed circuit board (PCB) is pulled down (step 210).Of the present inventionly disassemble cutter as shown in Figure 3, disassemble cutter 300 and roughly be the L type, mainly comprise mobile jib 310, handle of a knife 330, and link mobile jib 310 and handle of a knife 330, the fixed part 320 that handle of a knife 330 is fixing.Angle is about about 135 degree between mobile jib 310 and the handle of a knife 330, and this angle helps the application of force of mobile jib 310.Mobile jib 310 is rectangular rod shape, length L 1 is about 115mm, it is flat that handle of a knife 330 then is, and length L 2 is about 8mm, and the blade 332 of handle of a knife 330 is at outboard end, and the front end of handle of a knife 330 is circular-arc, its arc radius R is about 2,5mm, utilizes blunt front end of circle and level and smooth blade 332, can the complete dismounting with the IC chip on the ACF, and can not cause the pin of IC chip that fracture or crooked problem, the utilization rate again that can significantly promote IC chip like this take place.And, use the cutter of disassembling of the present invention to disassemble IC chip and very save time conveniently, can save significantly and disassemble the activity duration.
Then carry out the cleaning of IC chip, with an organic solvent, such as acetone or alcohol, the pin of cleaning IC chip remains in ACF (step 220) on the IC chip so as to removal.Fig. 4 illustrates the cleaning action schematic diagram of chip, and as shown in the figure, when cleaning chip 430, cleaning direction D needs from inside to outside, keeps equidirectional with pin 432, avoids causing pin 432 fractures or crooked.
After the cleaning of finishing IC chip 430, use ACF to attach machine, be attached at new ACF new and good printed circuit board (PCB) on (step 230).Then IC chip 430 contrapositions are fitted in (step 240) on the printed circuit board (PCB).As shown in Figure 5, printed circuit board (PCB) 410 is adjacent to panel 400, and the loci 434,436 with on the aligning of the registration holes on the IC chip 430 printed circuit board (PCB) 410 accurately aims the place IC chip 430.After aligned position, such as with about 10-30kg/cm
2Pressure put on chip 430, then with about 180 ℃ of temperature, heat about 20-60 second, ACF is solidified, make chip 430 be bonded in printed circuit board (PCB) 410 surfaces.Utilize the electroconductive particle in the ACF, make chip 430 and printed circuit board (PCB) 410 electrically connects.
Because all recyclable several the IC chips of each sheet printed circuit board (PCB), and the unit price of every chips is very high, by recovery method of the present invention, and recyclable a large amount of chip, reduce the unnecessary waste of chip, and the chip that is reclaimed, its pin situation is all very good, seldom has the situation of crooked or fracture to take place, reduce the coefficient of losses of chip, so can save a large amount of costs, and the good quality of the equal tool of the chip that re-uses, can reach the predetermined requirement of new product fully.
Be understandable that; for the person of ordinary skill of the art; can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (7)
1, a kind of recovery method of IC chip is applicable to a bad printed circuit board (PCB), and so as to reclaiming the IC chip that uses an anisotropy conducting film to attach, this method comprises the following step at least:
Use one to disassemble cutter, complete the pulling down of this IC chip on the printed circuit board (PCB) that this is bad;
Use an organic solvent, remove this residual on this IC chip anisotropy conducting film;
One new anisotropy conducting film is attached on the good printed circuit board (PCB); And
This IC chip contraposition is fitted on this good printed circuit board (PCB).
2, method according to claim 1, wherein this is disassembled cutter and comprises a mobile jib and a handle of a knife.
3, method according to claim 2, wherein the angle of this mobile jib and this handle of a knife is about about 135 degree.
4, method according to claim 2, wherein the front end of this handle of a knife is circular-arc.
5, method according to claim 1, wherein this organic solvent comprises acetone or alcohol.
6, method according to claim 1 is when wherein removing this residual on this IC chip anisotropy conducting film, along the pin direction cleaning of this IC chip.
7, method according to claim 1 when wherein will this new anisotropy conducting film being attached on this good printed circuit board (PCB), comprising and uses an anisotropy conducting film to attach machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031043232A CN1267213C (en) | 2003-01-29 | 2003-01-29 | Method for recovering integrated circuit chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031043232A CN1267213C (en) | 2003-01-29 | 2003-01-29 | Method for recovering integrated circuit chips |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1520944A true CN1520944A (en) | 2004-08-18 |
| CN1267213C CN1267213C (en) | 2006-08-02 |
Family
ID=34282203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031043232A Expired - Fee Related CN1267213C (en) | 2003-01-29 | 2003-01-29 | Method for recovering integrated circuit chips |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1267213C (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100382974C (en) * | 2004-09-07 | 2008-04-23 | 精工爱普生株式会社 | Method of recycling a liquid cartridge |
| CN102298223A (en) * | 2010-06-26 | 2011-12-28 | 比亚迪股份有限公司 | Method for recycling poorly pressed flexible printed circuit (FPC) |
| CN105405784A (en) * | 2015-10-31 | 2016-03-16 | 芜湖宏景电子股份有限公司 | Manufacturing technology of active equalization module |
| CN113334066A (en) * | 2021-05-17 | 2021-09-03 | 湖北三赢兴光电科技股份有限公司 | Assembling method and device for COB module |
-
2003
- 2003-01-29 CN CNB031043232A patent/CN1267213C/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100382974C (en) * | 2004-09-07 | 2008-04-23 | 精工爱普生株式会社 | Method of recycling a liquid cartridge |
| CN102298223A (en) * | 2010-06-26 | 2011-12-28 | 比亚迪股份有限公司 | Method for recycling poorly pressed flexible printed circuit (FPC) |
| CN102298223B (en) * | 2010-06-26 | 2014-03-12 | 比亚迪股份有限公司 | Method for recycling poorly pressed flexible printed circuit (FPC) |
| CN105405784A (en) * | 2015-10-31 | 2016-03-16 | 芜湖宏景电子股份有限公司 | Manufacturing technology of active equalization module |
| CN113334066A (en) * | 2021-05-17 | 2021-09-03 | 湖北三赢兴光电科技股份有限公司 | Assembling method and device for COB module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1267213C (en) | 2006-08-02 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Fujian Huaying Display Technology Co., Ltd. Assignor: Chunghwa Picture Tubes Ltd. Contract fulfillment period: 2008.9.18 to 2013.9.18 contract change Contract record no.: 2008990000659 Denomination of invention: Method for recovering integrated circuit chips Granted publication date: 20060802 License type: Exclusive license Record date: 20081010 |
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| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.9.18 TO 2013.9.18; CHANGE OF CONTRACT Name of requester: FUJIAN HUAYING DISPLAY SCIENCE CO., LTD. Effective date: 20081010 |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060802 Termination date: 20160129 |
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| EXPY | Termination of patent right or utility model |