CN1516527A - Vibration-reducing sound-eliminating structure for inorganic electrically-excited light-emitting (EL) device - Google Patents

Vibration-reducing sound-eliminating structure for inorganic electrically-excited light-emitting (EL) device Download PDF

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Publication number
CN1516527A
CN1516527A CNA031000061A CN03100006A CN1516527A CN 1516527 A CN1516527 A CN 1516527A CN A031000061 A CNA031000061 A CN A031000061A CN 03100006 A CN03100006 A CN 03100006A CN 1516527 A CN1516527 A CN 1516527A
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China
Prior art keywords
layer
shock absorber
absorber part
damping
backplate
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Pending
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CNA031000061A
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Chinese (zh)
Inventor
王志源
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Wintek Corp
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Wintek Corp
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Publication date
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Priority to CNA031000061A priority Critical patent/CN1516527A/en
Publication of CN1516527A publication Critical patent/CN1516527A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a damping and silencing structure of a kind of organic electricity light. The device sets a luminous layer, a electricity inducing layer, a negative polar layer and a sealing layer in series on the positive polar layer, there sets a damping elements which is made up of electrostatic resistant material on the surface away from the positive polar, there has a isolation layer between damping element and the negative polar, the area of the element can covers the bus-bar of the negative polar layer, and the element connects with the ground of the driving circuit, the damping element eliminates the charge quickly and generates the damping effect.

Description

The damping and silencing structure of inorganic electroluminescence (EL) device
Technical field
The present invention is the damping and silencing structure of relevant a kind of inorganic electroluminescence (BL) device, refers to especially a kind ofly remove electric charge fast to produce cushioning effect, to reduce or even to eliminate the damping and silencing structure of vibrations noise to destatic material.
Background technology
At present, general inorganic electroluminescence assembly (hereinafter to be referred as the EL assembly), this EL assembly itself is to be laminar, uses based on as backlight assembly in market, all is made into PDA, mobile phone usually ... use Deng for field of backlights; Seeing also shown in Figure 6ly, is the EL modular construction for commonly using, and this EL assembly is in regular turn with a transparent substrate layer 81, a front electrode layer 82, a luminescent layer 83, an electric inducing layer 84, a backplate layer 85 and an insulating barrier 86 stacked compositions.It is to make this front electrode layer 82 and 85 on backplate layer pass to an alternating voltage by drive circuit, makes this luminescent layer 83 produce luminous effect.
Because this EL assembly is to come driven for emitting lights layer 83 luminous with alternating voltage, because the AC field effect makes the incandescnet particle 831 in this luminescent layer 83 excite vibrations and send noise, and then influences the using character of EL assembly.
For separating the luminescent layer 83 of the above-mentioned EL of the commonly using assembly of rhymed formula, because of the AC field effect produces vibrations and souffle problem, generally industry is that the thickness that adopts the backpiece mode to increase the EL component body shakes and noise to reduce, or the EL assembly is close to the generation that reduces vibrations and noise on the circuit board.
But be to use the EL assembly on the electronic product of small sizes such as mobile phone, it has the restriction of thickness specification on mechanism design, so the backpiece mode has the problem above the thickness specification.And the EL assembly is close on the circuit board, though the noise that can reduce more than 60% takes place, can cause the difficulty of module assembling operation, and increase the extraneous expense of double faced adhesive tape cost, hereat, necessity of being improved is arranged.
Summary of the invention
Main purpose of the present invention, be to solve the above problems and provide a kind of and will concentrate near the conductive layer electric charge guiding, to reduce or even to eliminate the damping and silencing structure of inorganic electroluminescence (BL) device of the vibrations noise that produces because of the alternating current place with shock absorber part.
For reaching aforesaid purpose, inorganic electroluminescence device of the present invention is folded in regular turn transparent front electrode layer, a luminescent layer, an electric inducing layer, the backplate layer of establishing on a transparency carrier, and be coated with an encapsulated layer in this luminescent layer, electric inducing layer and this backplate layer outer rim, and this front electrode layer has a conductive layer in a side, and this conductive layer and this backplate are that to be connected to one be the drive circuit that drives this luminescent layer luminous voltage with the alternating current;
In addition, this encapsulated layer is provided with a shock absorber part in the one side away from this front electrode layer, has an insulation system between this shock absorber part and this backplate, and this shock absorber part is to make for destaticing material, the area of this shock absorber part is the conductive layer (bus-bar) that is enough to hide this front electrode, and this shock absorber part is the earth electrode that is connected to this drive circuit.Remove electric charge fast and produce cushioning effect by this buffer layer, reduce or even eliminate the vibrations noise that produces because of the alternating current place.
Description of drawings
Fig. 1 is the structural upright schematic diagram of first embodiment of the invention
Fig. 2 is the structural profile view of first embodiment of the invention
Fig. 3 is that the conductive layer of the shock absorber part covering front electrode of first embodiment of the invention is overlooked view
Fig. 4 is the configuration diagram of second embodiment of the invention
Fig. 5 is the configuration diagram of third embodiment of the invention
Fig. 6 is a schematic diagram of commonly using the EL modular construction
Embodiment
See also Fig. 1, Fig. 2, shown in Figure 3, the damping and silencing structure of the inorganic electroluminescence of present embodiment (EL) device, it is the folded in regular turn transparent front electrode layer 12 (present embodiment is an example with the ITO conductive layer) of establishing on a transparency carrier 11, one by the molecular luminescent layer 13 of most photogenic granules, one electric inducing layer 14, one backplate layer 15, and in this luminescent layer 13, electric inducing layer 14 and this backplate layer 15 outer rims are coated with an encapsulated layer 16, this encapsulated layer is to form with the manufacturing of insulation material, and this front electrode layer 12 has a conductive layer (bus-bar in a side, be generally elargol or carbon paste or metal) 120, and this conductive layer 120 respectively is connected the conducting terminal 121 that stretches out outside this transparency carrier 11 with this backplate 15,151, connect this two conducting terminal 121 for drive circuit (end shows among the figure), 151, it is luminous to drive this luminescent layer 13 that this front electrode layer 12 and 15 on backplate layer are passed to alternating current.
In addition, this encapsulated layer 16 is provided with a shock absorber part 2 in the one side away from this front electrode layer 12, this shock absorber part 2 is to make for destaticing material, and this shock absorber part 2 with the encapsulated layer 16 of insulation and this backplate 15 do insulation layer every, in present embodiment, this shock absorber part 2 be for the metallic conduction material made, the area of this shock absorber part 2 is the conductive layers 120 that are enough to hide this front electrode 12, but do not cover this two conducting terminal 121,151, shown in the 2nd figure, and this shock absorber part 2 is the earth electrode that is connected to this drive circuit situation of its ground connection of ground connection symbolic representation (among the figure with).
Because the EL assembly can be considered an electric capacity thin slice, therefore, when passing to alternating voltage to this front electrode layer 12 and 15 on backplate layer, drive circuit drives this luminescent layer 13 when luminous, can produce the AC field effect in the EL assembly, the dielectric charge of each layer of EL assembly (front electrode layer 12, luminescent layer 13, electric inducing layer 14 and backplate layer 15) can be when driving electric field action, and the phenomenon of generation electric charge density skewness, thereby the buzzing sound of generation rule (being noise); Since shock absorber part 2 of the present invention be for metal material made, it has the function of guiding electric charge, and cover the conductive layer 120 of this front electrode 12, and be connected with the earth electrode of this drive circuit, so, near the CHARGE DISTRIBUTION of the comparatively dense that can fast front electrode layer 12 be produced this conductive layer 120 is directed to earthing position fast, reduce near the phenomenon the conductive layer 120 that charge concentration is distributed in this front electrode 12, the electric charge that makes this position can produce seismic wave weakens even disappears, make that simultaneously the CHARGE DISTRIBUTION of whole EL assembly is more average, and then reduce the noise generation, even noise is disappeared; So, the present invention is reached reduces or even eliminates because of the vibrations that the alternating current place produces, the effect of noise by being provided with of shock absorber part 2.
Certainly, still there are many examples in the present invention, therebetween the only variation on the details.See also Fig. 4, it is the second embodiment of the present invention, and wherein 3 of this dampings are to be embedded in this encapsulated layer 16 made from the insulation material, and the integral thickness of EL device can not be increased, and can reach the identical effect with aforementioned first embodiment.And this shock absorber part can also be made by conducting polymer composite except making with metal, reaches the effect of quick elimination electric charge.
See also shown in Figure 5, the third embodiment of the present invention is for possessing the good insulation performance effect equally between shock absorber part 31 that makes aforementioned each embodiment and the backplate 32, also can be coated with away from the one side of this front electrode 33 this insulating barrier 34 is housed in this backplate 32, then be provided with this shock absorber part 31 on this insulating barrier 34, and tool coats this envelope edge layer 35 of usefulness on this backplate 32 and this shock absorber part 31, can make shock absorber part possess the good insulation performance effect

Claims (6)

1, the damping and silencing structure of a kind of inorganic electroluminescence (BL) device, it is folded in regular turn transparent front electrode layer, a luminescent layer, an electric inducing layer, the backplate layer of establishing on a transparency carrier, and be coated with an encapsulated layer in this luminescent layer, electric inducing layer and this backplate layer outer rim, and this front electrode layer has a conductive layer in a side, and this conductive layer and this backplate are that to be connected to one be the drive circuit that drives this luminescent layer luminous voltage with the alternating current; It is characterized in that:
Be provided with a shock absorber part at this encapsulated layer in one side away from this front electrode layer, has an insulation system between this shock absorber part and this backplate, and this shock absorber part is to make for destaticing material, the area of this shock absorber part is the conductive layer that is enough to hide this face electrode, and this shock absorber part is the earth electrode that is connected to this drive circuit.
2, the damping and silencing structure of inorganic electroluminescence according to claim 1 (EL) device, it is characterized in that: this shock absorber part is to be attached at the one side of this encapsulated layer away from this front electrode layer.
3, the damping and silencing structure of inorganic electroluminescence according to claim 1 (EL) device is characterized in that: this encapsulated layer is become by the insulation material, and this shock absorber part is to be embedded in this encapsulated layer, and with this encapsulated layer be do insulation layer every this insulating barrier.
4, the damping and silencing structure of inorganic electroluminescence according to claim 2 (EL) device is characterized in that: wherein this shock absorber part is provided with this insulating barrier that separates this backplate and this shock absorber part in this backplate away from the one side of this front electrode.
5, the damping and silencing structure of inorganic electroluminescence according to claim 1 (EL) device is characterized in that: wherein this shock absorber part is that to destatic material made for metal, conducting polymer.
6, the damping and silencing structure of inorganic electroluminescence according to claim 1 (EL) device, it is characterized in that: wherein this conductive layer and this backplate respectively are connected and stretch out the outer conducting terminal of this transparency carrier, and this conducting terminal and be connected to this drive circuit respectively.
CNA031000061A 2003-01-02 2003-01-02 Vibration-reducing sound-eliminating structure for inorganic electrically-excited light-emitting (EL) device Pending CN1516527A (en)

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CNA031000061A CN1516527A (en) 2003-01-02 2003-01-02 Vibration-reducing sound-eliminating structure for inorganic electrically-excited light-emitting (EL) device

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100452943C (en) * 2005-03-30 2009-01-14 精工爱普生株式会社 Electronic device substrate, electronic device, method of manufacturing electronic device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100452943C (en) * 2005-03-30 2009-01-14 精工爱普生株式会社 Electronic device substrate, electronic device, method of manufacturing electronic device
US7677941B2 (en) 2005-03-30 2010-03-16 Seiko Epson Corporation Electronic device substrate, electronic device, method of manufacturing electronic device, and electronic apparatus

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