CN1513893A - Epoxy resin lalent solidifying agent - Google Patents
Epoxy resin lalent solidifying agent Download PDFInfo
- Publication number
- CN1513893A CN1513893A CNA031158609A CN03115860A CN1513893A CN 1513893 A CN1513893 A CN 1513893A CN A031158609 A CNA031158609 A CN A031158609A CN 03115860 A CN03115860 A CN 03115860A CN 1513893 A CN1513893 A CN 1513893A
- Authority
- CN
- China
- Prior art keywords
- dyhard
- latent curing
- solidifying agent
- curing agent
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
A latent solidifying agent of epoxy resin is prepared from bicyandiamide, urea derivative and guanidine derivative. The adhesive or paint prepared from it features low solidifying temp, short solidifying time, high stability and excellent chemical performance.
Description
Technical field
The present invention relates to a kind of Resins, epoxy latent curing agent.Latent curing agent is meant very long period of storage in Resins, epoxy under the room temperature, and the compound system of curing reaction can take place rapidly under effects such as heating.The Resins, epoxy latent curing agent is the raw material of preparation monocomponent epoxide-resin rubber adhesive and coating.
Background technology
Dyhard RU 100 is the Resins, epoxy latent curing agent of using always, is excellent storage stability with Dyhard RU 100 preparation monocomponent adhesive and coating biggest advantage, and excellent mechanical property is arranged simultaneously.Add 10 parts of Dyhard RU 100s as 100 parts of Resins, epoxy E-51,6 months period of storage is at room temperature arranged, after 180 ℃ of curing in 30 minutes, tensile shear strength can reach 27MPa.But it is too high that the shortcoming of Dyhard RU 100 maximum is a solidification value, and set time is long, generally need be heated to more than 150 ℃ and could solidify.Under 160 ℃, ability was solidified in 2 hours.
Summary of the invention
The object of the present invention is to provide a kind of Resins, epoxy latent curing agent, promptly the promotor of Dyhard RU 100 cured epoxy resin under the prerequisite of shortening period of storage within reason, is reduced to solidification value below 120 ℃, shortens to set time in 1 hour.
The present invention adds carbamide derivative A and guanidine derivatives B in Dyhard RU 100, as the curing catalyst of Dyhard RU 100, with the component epoxy latent curing agent.This mixture can be below 120 ℃ as the latent curing agent of Resins, epoxy, and cured article had excellent mechanical property with interior curing in 1 hour.The structure of described carbamide derivative A is:
Wherein, R, R ' are alkyl; Described guanidine derivatives is a vulkacit D.
The essentially consist of latent curing agent of the present invention (quality) is:
Dyhard RU 100 100
Carbamide derivative A 30～60
Guanidine derivatives B 10～35
Dyhard RU 100, carbamide derivative A and guanidine derivatives B are white crystalline powder.
In order to improve dispersion effect of the present invention, on the such scheme basis, described solidifying agent is the solidifying agent micro mist of carrier with the aluminum oxide.
The manufacturing process of latent curing agent of the present invention is as follows:
100 parts of Dyhard RU 100s add 30～60 parts of carbamide derivative A of A, 10～35 parts of guanidine derivatives B and 100～150 parts, and 400 order alumina powders grind in ball mill repeatedly.Sieve with 400 eye mesh screens then, obtain 400 order latent curing agent micro mists.
The purpose that adds 400 order alumina powders is to prevent the micro mist conglomeration, simultaneously because aluminum oxide hardness height adds the pulverizing mixing that aluminum oxide helps crystalline powder.
The present invention is that solidifying agent and Resins, epoxy are easier to mix in order to make with the purpose that latent curing agent grinds to form 400 order micro mists, with Resins, epoxy bigger contact area is arranged, and makes cured article that more excellent performance be arranged.
Among the carbamide derivative A, R the best is C
4H
9For, R ' the best is C
12～
14The straight chain saturated alkyl, we are referred to as accelerant A.Guanidine derivatives B (vulkacit D) is referred to as accelerant B.Therefore the best group of Resins, epoxy latent curing agent of the present invention becomes (this solidifying agent is referred to as latent curing agent C)
Dyhard RU 100 100
Accelerant A 50
Accelerant B 30
400 order aluminum oxide 120
Superiority of the present invention is: tackiness agent or powder coating so that the latent curing agent micro mist of such scheme gained is prepared, have excellent storage stability, and the room temperature storage time is long, can reach more than 3 months; Solidification value is low, and set time is short, can be below 120 ℃, and 1 hour with interior curing; Solidify back mechanical property excellence, tensile shear strength can reach more than the 26MPa.
Embodiment
Prescription 1 prescription 2 prescriptions 3 prescriptions 4
Dyhard RU 100 100 100 100 100
Accelerant A 50 30 40 60
Accelerant B 30 10 20 35
400 order aluminum oxide 120 100 100 130
Application examples 1
The present invention mixes with liquid-state epoxy resin with above-mentioned prescription 1, can prepare high performance monocomponent epoxide-resin rubber adhesive.
Representative formula:
Resins, epoxy E-51 100
Fill a prescription 1 30
Aerosil 2
The package stability measurement result is as shown in table 1
Table 1
| Storage temperature (℃) | ????0 | ????25 | ????40 |
| Period of storage (moon) | ????6 | ????3 | ????1 |
Annotate: measure viscosity according to GB/T 2794-1995, period of storage is the time that viscosity rises to 2 times of initial viscosities.
Solidification value and set time and curing back mechanics performance determining result are as shown in table 2
Table 2
| Solidification value (℃) | ????100 | ????110 | ????120 | ????150 |
| Set time (minute) | ????90 | ????60 | ????30 | ????15 |
| Tensile shear strength (MPa) | ????26 | ????27 | ????28 | ????26 |
Annotate: measure tensile shear strength according to GB 7124-86.
Application examples 2
The present invention 2 mixes with solid epoxy resin to fill a prescription, and can prepare high performance one-component epoxy resin powder coating.
Representative formula:
Resins, epoxy E-20 100
Fill a prescription 2 10
The package stability measurement result is as shown in table 3
Table 3
| Storage temperature (℃) | ????0 | ????25 | ????40 |
| Period of storage (moon) | ????12 | ????6 | ????1.5 |
Annotate: period of storage is can not the film forming time of melt-flow after the coating heating.
Solidification value and set time measurement result as shown in table 4
Table 4
| Solidification value (℃) | ????110 | ????120 | ????150 |
| Set time (minute) | ????90 | ????50 | ????20 |
Claims (3)
1, a kind of Resins, epoxy latent curing agent is a solidifying agent with the Dyhard RU 100, it is characterized in that adopting carbamide derivative and guanidine derivatives to make as the promotor of Dyhard RU 100, and the each component weight percent content is:
Dyhard RU 100 100
Carbamide derivative 30～60
Guanidine derivatives 10～35
The structure of described carbamide derivative is
Wherein, R, R ' are alkyl;
Described guanidine derivatives is a vulkacit D.
2, according to the described latent curing agent of claim 1, it is characterized in that described solidifying agent is the micro mist shape structure of carrier with the aluminum oxide.
The manufacturing process of 3 claims 1 or 2 described latent curing agents is characterized in that, adds aluminum oxide in component, grinds to form 400 purpose micro mists.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA031158609A CN1513893A (en) | 2003-03-18 | 2003-03-18 | Epoxy resin lalent solidifying agent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA031158609A CN1513893A (en) | 2003-03-18 | 2003-03-18 | Epoxy resin lalent solidifying agent |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1513893A true CN1513893A (en) | 2004-07-21 |
Family
ID=34239433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA031158609A Pending CN1513893A (en) | 2003-03-18 | 2003-03-18 | Epoxy resin lalent solidifying agent |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1513893A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102268126A (en) * | 2011-06-01 | 2011-12-07 | 上海大学 | Preparation method of organosilicon latent epoxy resin curing agent |
| CN101240154B (en) * | 2008-03-04 | 2012-05-23 | 上海回天化工新材料有限公司 | Single-component high peel strength epoxy resin adhesive and preparation method thereof |
| CN102964274A (en) * | 2012-11-14 | 2013-03-13 | 江苏泰仓农化有限公司 | Reuse of synthesis and centrifugation mother liquid of epoxy resin latent accelerant TDI80 |
| CN103261263A (en) * | 2011-02-23 | 2013-08-21 | 澳泽化学股份公司 | Novel curing agents for epoxy resins |
| CN101842407B (en) * | 2007-11-08 | 2014-04-23 | Adeka股份有限公司 | Method for producing latent curing agent for powder epoxy resin, latent curing agent for powder epoxy resin obtained by the method, and curable epoxy resin composition using the same |
| CN104271631A (en) * | 2012-05-18 | 2015-01-07 | 赫克塞尔合成有限公司 | Fast cure epoxy resins and prepregs obtained therefrom |
| CN105368010A (en) * | 2015-11-13 | 2016-03-02 | 中航复合材料有限责任公司 | Epoxy resin suitable for long-term storage at room temperature and preparation method thereof |
| US9382374B2 (en) | 2012-08-02 | 2016-07-05 | Alzchem Ag | Liquid hardeners for hardening epoxide resins (II) |
| CN117089240A (en) * | 2023-10-12 | 2023-11-21 | 广州境好新材料有限公司 | Single-component waterborne epoxy temporary protective ink and preparation method thereof |
-
2003
- 2003-03-18 CN CNA031158609A patent/CN1513893A/en active Pending
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101842407B (en) * | 2007-11-08 | 2014-04-23 | Adeka股份有限公司 | Method for producing latent curing agent for powder epoxy resin, latent curing agent for powder epoxy resin obtained by the method, and curable epoxy resin composition using the same |
| CN101240154B (en) * | 2008-03-04 | 2012-05-23 | 上海回天化工新材料有限公司 | Single-component high peel strength epoxy resin adhesive and preparation method thereof |
| CN103261263B (en) * | 2011-02-23 | 2016-03-16 | 澳泽化学股份公司 | The LCM of epoxy resin |
| US9499653B2 (en) | 2011-02-23 | 2016-11-22 | Alzchem Ag | Curing agents for epoxy resins |
| KR20140009246A (en) * | 2011-02-23 | 2014-01-22 | 알즈켐 아게 | Novel curing agents for epoxy resins |
| KR101923528B1 (en) | 2011-02-23 | 2019-02-27 | 알즈켐 트로스트베르크 게엠바하 | Novel curing agents for epoxy resins |
| US9617369B2 (en) | 2011-02-23 | 2017-04-11 | Alzchem Ag | High-latency hardeners for epoxy resins |
| CN103261263A (en) * | 2011-02-23 | 2013-08-21 | 澳泽化学股份公司 | Novel curing agents for epoxy resins |
| US9296855B2 (en) | 2011-02-23 | 2016-03-29 | Alzchem Ag | High-latency hardeners for epoxy resins |
| CN102268126A (en) * | 2011-06-01 | 2011-12-07 | 上海大学 | Preparation method of organosilicon latent epoxy resin curing agent |
| CN104271631A (en) * | 2012-05-18 | 2015-01-07 | 赫克塞尔合成有限公司 | Fast cure epoxy resins and prepregs obtained therefrom |
| US9382374B2 (en) | 2012-08-02 | 2016-07-05 | Alzchem Ag | Liquid hardeners for hardening epoxide resins (II) |
| US9499659B2 (en) | 2012-08-02 | 2016-11-22 | Alzchem Ag | Liquid hardeners for hardening epoxide resins (I) |
| CN102964274A (en) * | 2012-11-14 | 2013-03-13 | 江苏泰仓农化有限公司 | Reuse of synthesis and centrifugation mother liquid of epoxy resin latent accelerant TDI80 |
| CN105368010A (en) * | 2015-11-13 | 2016-03-02 | 中航复合材料有限责任公司 | Epoxy resin suitable for long-term storage at room temperature and preparation method thereof |
| CN105368010B (en) * | 2015-11-13 | 2020-04-28 | 中航复合材料有限责任公司 | Epoxy resin with long storage period at room temperature and preparation method thereof |
| CN117089240A (en) * | 2023-10-12 | 2023-11-21 | 广州境好新材料有限公司 | Single-component waterborne epoxy temporary protective ink and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1305923C (en) | Polyurea-carbamate rheology control agent and its preparation method | |
| CN1513893A (en) | Epoxy resin lalent solidifying agent | |
| EP0046907B1 (en) | Vinyl-silicone pastes for taking dental impressions | |
| CN101058640A (en) | Organic silicon polyurea base polymer, elastic body prepared by the same, preparation method and application thereof | |
| CN1817942A (en) | Power with improved recovery characteristic, method of preparation the same and application | |
| CN1546590A (en) | Preparation method of room temperature cured high temperature tolerant flexible epoxy adhesive | |
| DE112018003560T5 (en) | Electrically conductive adhesive composition | |
| CN113403022B (en) | Organic silicon heat-conducting pouring sealant and preparation method thereof | |
| EP0114280B1 (en) | Method of manufacturing abrasive bodies | |
| CN100341969C (en) | Fast-setting two-component epoxy adhesive and its preparing method | |
| CN1239560C (en) | Potential curing agent for epoxy resin solidified epoxy resin composition | |
| DE20221002U1 (en) | Addition-curing two-component silicone materials with high Shore D hardness | |
| CN1751097A (en) | Polyurethane system and application thereof | |
| DE4119205A1 (en) | DENTAL COMPOSITION FOR IMPRESSION TAKING | |
| CN100336856C (en) | Silicomethane coupling agent containing cyanide and secondary amino and its preparation process and application thereof | |
| CN1232601C (en) | Die-attaching paste and semiconductor device | |
| EP2910526B1 (en) | A method of modification of a bentonite and a method of application of modified bentonite to polymer resins | |
| DE1143511T1 (en) | Preparation of thermally conductive substances by liquid metal bridged particle groups | |
| CN1113083C (en) | Semiconductor sealing epoxy resin compsn. and semiconductor device using same | |
| KR101567341B1 (en) | Thermosetting epoxy resin, and method of manufacturing the same | |
| US7718748B2 (en) | Antimicrobial polymerizable ear piece material | |
| CN1727423A (en) | Resin binder modified by Nano silicon dioxide, and preparation method | |
| EP4121473A1 (en) | Chemical wall plug on isocyanate-amine basis with improved strength, and use thereof | |
| EP2049606B1 (en) | White mixture for applying a coating | |
| CN113211336B (en) | Polishing pad for polishing corners of electronic display screen and production method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |