CN1510697A - Flexible photoelectric transmission bus - Google Patents
Flexible photoelectric transmission bus Download PDFInfo
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- CN1510697A CN1510697A CNA021570868A CN02157086A CN1510697A CN 1510697 A CN1510697 A CN 1510697A CN A021570868 A CNA021570868 A CN A021570868A CN 02157086 A CN02157086 A CN 02157086A CN 1510697 A CN1510697 A CN 1510697A
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- 230000005540 biological transmission Effects 0.000 title claims description 53
- 230000003287 optical effect Effects 0.000 claims abstract description 30
- 239000000835 fiber Substances 0.000 claims description 48
- 230000005622 photoelectricity Effects 0.000 claims description 45
- 239000000758 substrate Substances 0.000 claims description 19
- 238000006243 chemical reaction Methods 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 230000005693 optoelectronics Effects 0.000 claims description 8
- 239000010409 thin film Substances 0.000 claims description 8
- 238000012546 transfer Methods 0.000 claims description 7
- 239000010408 film Substances 0.000 claims description 6
- 230000008054 signal transmission Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 2
- 230000010354 integration Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 3
- 230000003044 adaptive effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000011469 building brick Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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Abstract
A flexible photoelectric transmitting bus is constructed by combining a flexible optical guide and an electric bus for transmitting high-speed signals and low-speed signals simultaneously, wherein the low-speed signals are transmitted in the electric bus, and the high-speed signals are shunted by a shunting-combining unit into a transmitting signal and a receiving signal, the transmitting signal is converted to an optical transmitting signal, transmitted to a photoelectric receiver at another terminal by an optical guide and converted back to electric signal, and the transmitting signal and the receiving signal are combined by another signal shunting-combining unit and sent to the same electronic transmitting channel.
Description
Technical field
The present invention relates to a kind of photoelectricity transmission bus, the particularly a kind of transmitting optical signal simultaneously and the signal of telecommunication and have flexual photoelectricity transmission bus.
Background technology
The photoelectricity transmission demand that adapts to high-speed broadband, at rigid print circuit plates making fiber waveguide and transmitting-receiving optical assembly, (Electronic-Optical Circuit Board EOCB) becomes main solution at present to form the integrated substrate of photoelectricity.So-called photoelectric substrates is in order to solve existing a kind of technological means that bottleneck was proposed of sending light signal with fax.As shown in Figure 1,, for example in the middle of optical-electric module 210 and optical-electric module 220, fiber waveguide 230 is imbedded in the printed circuit board (PCB) 200, be a kind of application of photoelectric substrates for the notion of optical communication is introduced substrate.
In the photoelectric substrates known technology that has proposed, announce patent (patent name: the photosignal transmission system of disclosed a kind of burying (embedded) in printed circuit board (PCB) PACKAGING ENHANCED BOARD LEVEL OPTP-ELECTRONICINTERCONNECTS) No. 6243509 as United States Patent (USP), be that the waveguide of transmission ray is buried in printed circuit board (PCB), convert the electrical signal to light signal by drive integrated circult chip (drive IC) and electrical to optical converter, be sent to the other end by waveguide, change the telegram in reply signal by mirror reflects to optical-electrical converter again, handle follow-up signal by IC again.
This fiber waveguide problem to be overcome a bit of burying in printed circuit board (PCB), because of its manufacturing process difficulty and material cost can improve because of the increase of substrate area, its product percent of pass relatively therefore and significantly reduces, and making has the restriction of its elder generation the sky in the application of medium-and-large-sized size substrate.On the other hand, at the light path connector of system's inner assembly or system and intermodule, only limit to the light transmitting medium of passive type at present.So-called light passive component is meant, by the optical characteristics of assembly itself continue to being transmitted in light signal in the optical fiber, effects such as difference, filtering or decay, this class component comprises optical connector, light jumper, optical coupler, optical isolator, optical attenuator and high-density wavelength division multiplexer (DWDM) etc.With respect to passive component is driving component, finger need utilize electric energy to carry out the conversion of photoelectricity (or electric light) signal, or the assembly that light signal is amplified, comprise optical transceiver and image intensifer, be with the difference of light passive component maximum, because the light driving component must be undertaken photosignal conversion or strengthen the ability of light signal, so laser diode (Laser Diode) is played the part of in this class component epochmaking role is arranged.And photoelectric substrates belongs to passive component more at present.
And in existing printed circuit board (PCB), if want to utilize light as the high-speed transfer mode, certainly will revise its route and increase photoelectric subassembly, this measure will significantly increase equipment investment and manufacturing cost.Therefore, development has initiatively opto-electronic conversion and transmittability, with the existing electrical connection interface compatibility of printed circuit board (PCB), can be used as simultaneously the flexible base plate structure of interior high-speed assembly of large-size substrate or intermodule deflection storehouse connector again, can significantly reduce the cost of photoelectricity integration system, also be applied in the low profile photovoltaic module simultaneously, with the trend of adaptive system miniaturization.
Summary of the invention
In view of above problem, main purpose of the present invention is to provide a kind of photoelectricity transmission bus, is applied to the signal transmission between optical-electric module, simultaneously the transmitting optical signal and the signal of telecommunication.
Another object of the present invention is to provide a kind of pliability photoelectricity transmission bus, with the material of flexible high polymer material as fiber waveguide, with signal transmission between the optical-electric module that is applied to the solid space storehouse or different system and be connected, effectively utilize the space of electro-optical system, the trend of compliance with system downsizing.
Another purpose of the present invention is to provide a kind of active opto-electronic conversion and transport module, makes its transfer bus that possesses fiber waveguide and the common structure of plain conductor, with the optic electric interface of simplification with existing system.
Therefore, for achieving the above object, the disclosed pliability photoelectricity transmission of the present invention bus, comprise fiber waveguide and electric bus, both common structures and stacking mutually, form metallic circuit on the fiber waveguide, be provided with two groups of signal shunting/combiners, electric light transmitter and photelectric receiver, can be respectively by the metallic circuit on metallic pad and the fiber waveguide, or electric bus is electrically connected, signal shunting/combiner wherein, split into reception (read) signal and transmission (write) signal in order to the high-velocity electrons signal that will share same electric transmission channel, maybe the reception that will shunt (read) signal and transmission (write) signal are merged into high speed signal and are shared same electric transmission channel again.Transmission signal after the shunting, after the processing of electric light transmitter, kenel with light is transmitted by fiber waveguide, other low-velocity electron signal of shunting processing then can be by the remittance flow transmission, and the electric light transmitter, be in order to should send signal, and to convert the light kenel to, and to transmit by fiber waveguide by the electronic signal kenel; Change the direction that optical signal transmission is advanced by the reflection of first in the fiber waveguide with second speculum again, light signal is sent to photelectric receiver with the other end, the conversion of signals of light kenel is become the electronic signal kenel, to receive (read) signal with the signal combiner more at last and transmission (write) signal merges back same electric transmission channel, to transfer in the next optical-electric module.
The disclosed structure of the present invention has initiatively opto-electronic conversion and transmittability, can with the existing electrical connection interface compatibility of printed circuit board (PCB), can be used as simultaneously the flexible base plate structure of interior high-speed assembly of large-size substrate or intermodule deflection storehouse connector again, also can be applicable in the low profile photovoltaic module, with the trend of adaptive system miniaturization.
Description of drawings
Fig. 1 is known photosignal transmission system of burying in printed circuit board (PCB);
Fig. 2 is the structural representation of pliability photoelectricity transmission bus of the present invention; And
Fig. 3 A to Fig. 3 D is the manufacture method of the disclosed pliability photoelectricity transmission of the present invention bus.
Embodiment
The disclosed structure of the present invention is to make metallic pad on the pliability fiber waveguide, driving and binding as optical transceiver and main passive component, with soft printed circuit board and fiber waveguide pressing, form transfer bus again with pliability light path and the common structure of circuit with photoelectricity transmission master passive component.
As shown in Figure 2, Fig. 2 is the structural representation of the disclosed photoelectricity transmission bus 100 of the present invention, have in the bus for the fiber waveguide 110 and the power supply road of optic path and transmit electric bus 120, both stack mutually, fiber waveguide 110 is made by the flexible high polymer material, fiber waveguide 110 tops are coated with optical thin film 111, and electric bus 120 belows then are coated with conductive film 121.Fiber waveguide 110 is to be made by flexual macromolecule material, and electric bus 120 is soft printed circuit board (PCB), and by the mode of pressing fiber waveguide 110 and electric bus 120 being pressed together becomes pliability photoelectricity transmission bus, simultaneously the transmitting optical signal and the signal of telecommunication.
Optical thin film 111 is equiped with signal shunting combiner 131 and signal combiner 132, do to electrically contact with metallic pad 170 and optical thin film 111, in order to general IC or modular telecommunications number are done pre-process, chip pin position (I/O Pins) is sent or the signal shunting (de-serialize) that receives or merge (serialize).
In the photosignal transmission, be to convert light signal to electronic signal, and in same electric transmission channel, transmit, comprising high speed signal and low speed signal with other electronic signal, high speed signal is generally by light signal and converts, and low speed signal is generally electronic signal originally.Therefore, during with the above-mentioned signal of the disclosed photoelectricity bus transfer of the present invention, must earlier received signal in the high speed signal or transmission Signal Separation be come out, because received signal is an one way signal with sending signal.
Signal shunting combiner 131 is that high speed signal is split into received signal and sends signal, transmission signal after the shunting is transmitted by fiber waveguide 110, the low speed signal of telecommunication is then transmitted by electric bus 120, and signal combiner 132 is that received signal and transmission signal are merged back same electric transmission channel, is resent to next optical-electric module.Signal shunting combiner 131 and signal combiner 132 can be application-specific IC (Application Specific integrated Circuit, ASIC).
Also install electric light transmitter 141 on the optical thin film 111, make electric coupling with metallic pad 170 and optical thin film 111, in order to the transmission conversion of signals that will shunt from signal shunting combiner 131 is that light sends signal, makes that sending signal can transmit in fiber waveguide 110 with the kenel of light.Be equiped with first speculum 161 on the same direction of electric light transmitter 141, be arranged in fiber waveguide 110, the light after the conversion sends signal and then by first speculum 161 in the fiber waveguide 110 light is sent in the signal lead-in light waveguide 110 and transmit.
When light signal at fiber waveguide 110 other ends, light signal then reflects into into photoelectricity receiver 142 by second speculum 162, photelectric receiver can be photo-detector (Photo Detector).Convert the light signal that is received to the signal of telecommunication by photelectric receiver 142, by amplifier 152 ultra-weak electronic signal being amplified also demodulation (de-modulation) again is the compatible signal of telecommunication, and, be sent to connector connection other end electronic building brick or module through after signal combiner 132 treatment conversion.
So can form one group of unidirectional active opto-electronic conversion and transmit the transmitting-receiving path.Use two groups or more transceiver and light wave guide rule can reach the transmitted in both directions purpose.
Above-mentioned electrical to optical converter 141 is light emitting laser diode (Lasor Diode), and the driving by driver 151 is able to luminous, makes light signal be able to transmission in fiber waveguide 110.Electric light transmitter 141 determines according to the wavelength of different light signals.And photelectric receiver 142 is photo-detector (photo detector), selects according to optical wavelength and system performance equally, is all integrated circuit (IC) chip with electrical to optical converter 141.
The disclosed photoelectricity transmission bus of the present invention possesses initiatively photoelectricity transmission ability, and exports to go into to reach with electric contact, can reach the high speed optoelectronic integration system not changing under the existing printed circuit board arrangement.Simultaneously, possess deflection soft board characteristic, remove and in same substrate, to carry out the two dimensional surface binding, also can be used for carrying out in the three dimensions subsystem or module and ask that the photoelectricity storehouse connects.
The manufacturing process of the disclosed photoelectricity transmission bus of the present invention then is described.See also Fig. 3 A to Fig. 3 D, be the manufacture method of the disclosed pliability photoelectricity transmission of the present invention bus.
At first on substrate 300, form fiber waveguide 310 and metallic film 320 in regular turn, as shown in Figure 3A, then again fiber waveguide 310 and metallic film 320 are peeled off on substrate 300, shown in Fig. 3 B, in fiber waveguide 310, form first speculum 161 and second speculum 162, shown in Fig. 3 C, again with optical thin film 310 and electric bus 330 pressings to form the photoelectricity transmission bus, shown in Fig. 3 D.
Again signal is shunted combiner 131, signal combiner 132, electric light transmitter 141 and photelectric receiver 142 at last and be electrically connected, to finish whole manufacturing process with metallic pad 170 and fiber waveguide 310.
The binding of active photoelectricity and the transmission structure and the manufacture method of pliability fiber waveguide mantle of the present invention (Flexible waveguide film) and soft printed circuit board (Flexible PCB), utilize the functional photoelectric conversion module of this structure and built-in fiber waveguide/electricity to be total to the structure bus, can be directly with module surface engagement assembling mode, be applied to the high-speed optical signal transmission of existing printed circuit board (PCB) inner assembly and intermodule, or the photoelectricity of three-dimensional deflection storehouse connects between each subsystem printed circuit board (PCB), solve the integrated substrate of present photoelectricity (EOCB) complex manufacturing process and problem that can't heavy industry, and can be applicable to the realization of light bus in zonule on the large scale printed circuit board (PCB), can utilize the stereo-stacking characteristic to reduce photoelectricity integration system assembling space simultaneously.
The disclosed structure of the present invention possesses initiatively photoelectricity transmission ability, and exports to go into to reach with electric contact, can constitute the high speed optoelectronic integration system not changing under the existing printed circuit type structure.Simultaneously,, link, also can be used for carrying out in the three dimensions subsystem or intermodule photoelectricity storehouse and link except can in same substrate, carrying out two dimensional surface because the disclosed structure of the present invention possesses deflection soft board characteristic.Also promptly by the fiber waveguide of deflection and plain conductor altogether the transfer bus of structure conflux, can be applied between the optical-electric module/subsystem of solid space storehouse the signal transmission and be connected, with the saving space.
Be provided with active opto-electronic conversion and transport module on the bus with the optic electric interface of simplification with existing system, promote extendibility.In addition, can also on substrate, carry, passive component main, do other signal processing with binding.Need not significantly to change the existing PCB manufacturing process and the opering characteristic of electric apparatus, the integrated substrate technical bottleneck of photoelectricity be can break through and low cost and industrial upgrading compatibility taken into account, realize photoelectricity integration system universalness in advance.
Though preferred embodiment of the present invention discloses as above; yet be not in order to limit the scope of the invention; anyly be familiar with the person skilled in art; without departing from the spirit and scope of the present invention; a little change and the modification done all should be included within the scope that claims of the present invention protect.
Claims (10)
1. a pliability photoelectricity transmission bus is used for high speed signal and low speed signal transmission between different optical-electric modules, it is characterized in that, comprising:
Fiber waveguide has a plurality of metallic pad on it;
Signal shunting combiner is electrically connected by this metallic pad and this fiber waveguide, and this signal shunting combiner splits into this high speed signal received signal and transmits signal;
The electricity bus is superimposed with this fiber waveguide, in order to transmit this low speed signal;
The electric light transmitter is electrically connected by this metallic pad and this fiber waveguide, and this electric light transmitter should send conversion of signals and become light to send signal, and making this light send signal can transmit in this fiber waveguide;
Photelectric receiver is done to be electrically connected with this fiber waveguide by this metallic pad, this photelectric receiver receives this light and sends signal, and this light is sent conversion of signals becomes the signal of telecommunication; And
The signal combiner is electrically connected by this metallic pad and this fiber waveguide, and this signal combiner sends this light signal and this light receiving signal and is combined into this high speed signal.
2. pliability photoelectricity transmission bus as claimed in claim 1 is characterized in that, also comprises in this fiber waveguide:
First speculum forms in this fiber waveguide, is positioned on the same direction with this electric light transmitter, and this first mirror reflects sends signal from this light of this photoelectricity transmission device, makes this light send signal and transmits via this fiber waveguide; And
Second speculum forms in this fiber waveguide, and this second mirror reflects sends a signal to this photelectric receiver from this light of this first speculum.
3. pliability photoelectricity transmission bus as claimed in claim 1 is characterized in that, this fiber waveguide is that macromolecular material is made.
4. pliability photoelectricity transmission bus as claimed in claim 1 is characterized in that, this signal shunting combiner is an application-specific IC.
5. pliability photoelectricity transmission bus as claimed in claim 1 is characterized in that this electric light transmitter is a laser diode.
6. pliability photoelectricity transmission bus as claimed in claim 5 is characterized in that this electric light transmitter also comprises driver, this laser diode of this driver drives.
7. pliability photoelectricity transmission bus as claimed in claim 6 is characterized in that this driver is an integrated circuit.
8. pliability photoelectricity transmission bus as claimed in claim 1 is characterized in that this photelectric receiver is a photo-detector.
9. the manufacture method of a pliability photoelectricity transmission bus comprises the following steps:
On substrate, form fiber waveguide and metallic film in regular turn;
Optical thin film and metallic film are peeled off on this substrate;
In this optical thin film, form first speculum and second speculum;
With this fiber waveguide and electric bus pressing to form the photoelectricity transmission bus.
10. pliability opto-electronic conversion transfer bus as claimed in claim 9 is characterized in that this fiber waveguide is a macromolecular material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 02157086 CN1236456C (en) | 2002-12-24 | 2002-12-24 | Flexible photoelectric transmission bus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN 02157086 CN1236456C (en) | 2002-12-24 | 2002-12-24 | Flexible photoelectric transmission bus |
Publications (2)
Publication Number | Publication Date |
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CN1510697A true CN1510697A (en) | 2004-07-07 |
CN1236456C CN1236456C (en) | 2006-01-11 |
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CN 02157086 Expired - Fee Related CN1236456C (en) | 2002-12-24 | 2002-12-24 | Flexible photoelectric transmission bus |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102203754A (en) * | 2008-10-31 | 2011-09-28 | 惠普开发有限公司 | Variably configurable computer buses |
CN103428997A (en) * | 2012-05-23 | 2013-12-04 | 鸿富锦精密工业(深圳)有限公司 | Photoelectric circuit board and circuit board module |
CN104582449A (en) * | 2015-01-06 | 2015-04-29 | 华为技术有限公司 | Communication device and single board for communication device |
-
2002
- 2002-12-24 CN CN 02157086 patent/CN1236456C/en not_active Expired - Fee Related
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102203754A (en) * | 2008-10-31 | 2011-09-28 | 惠普开发有限公司 | Variably configurable computer buses |
CN102203754B (en) * | 2008-10-31 | 2015-08-26 | 惠普开发有限公司 | The computer bus of reconfigurable |
CN103428997A (en) * | 2012-05-23 | 2013-12-04 | 鸿富锦精密工业(深圳)有限公司 | Photoelectric circuit board and circuit board module |
CN104582449A (en) * | 2015-01-06 | 2015-04-29 | 华为技术有限公司 | Communication device and single board for communication device |
CN104582449B (en) * | 2015-01-06 | 2017-08-18 | 华为技术有限公司 | A kind of communication equipment and the veneer for the communication equipment |
CN107360693A (en) * | 2015-01-06 | 2017-11-17 | 华为技术有限公司 | A kind of communication equipment and the veneer for the communication equipment |
US10122411B2 (en) | 2015-01-06 | 2018-11-06 | Huawei Technologies Co., Ltd. | Communications device and board used in communications device |
CN107360693B (en) * | 2015-01-06 | 2022-02-18 | 华为技术有限公司 | Communication equipment and single board used for same |
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CN1236456C (en) | 2006-01-11 |
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