CN1509877A - IC chip with multiple ink channel and orifice, cutting method thereof - Google Patents
IC chip with multiple ink channel and orifice, cutting method thereof Download PDFInfo
- Publication number
- CN1509877A CN1509877A CNA021577072A CN02157707A CN1509877A CN 1509877 A CN1509877 A CN 1509877A CN A021577072 A CNA021577072 A CN A021577072A CN 02157707 A CN02157707 A CN 02157707A CN 1509877 A CN1509877 A CN 1509877A
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- wafer
- circuit board
- flexible circuit
- ink
- volatility
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Abstract
An IC chip with multiple ink cavities and nozzles is prepared through generating heating unit above each ink cavity on chip, coating the volatile adhesive, putting a flexible circuit board on the IC chip in such manner that its nozzles are respectively aligned with the ink cavities on IC chip, and hot pressing for adhering them together. Its preparing apparatus is composed of a coater with a chamber of volatile adhesive and a hot press for adhering the flexible circuit board onto IC chip and exhausting the air between them. Its advantages are high adhesion and high print quality.
Description
Technical field
The present invention relates to a kind of device of making ink gun, especially a kind of IC wafer and engrating process thereof with a plurality of ink containers and spray orifice.
Background technology
Traditional ink gun has generally included an IC wafer and a flexible circuit board, the IC wafer is provided with a plurality of heaters and is provided with an ink container on each heater, and flexible circuit board is provided with electrical interconnection and is provided with spray orifice with respect to the ink container position on the IC wafer.With the accurate contraposition of flexible circuit board and IC wafer fixing after, the ink in the ink container is after heating produces bubble, by the spray orifice ejection formation printing effect of flexible circuit board.In the manufacture process of ink gun, when desire is fitted IC wafer and flexible circuit board, must carry out accurate contraposition, in hot pressing envelope mode IC wafer and flexible circuit board be fitted again, still, if during the defective tightness of its applying, ink container and accurately contraposition of the spray orifice on the flexible circuit board with making on the IC wafer can influence its spray printing quality, severe patient, IC wafer and flexible circuit board are broken away from mutually, and influence the qualification rate of its manufacturing.
Summary of the invention
Technical problem to be solved by this invention provides a kind of IC wafer and engrating process thereof with a plurality of ink containers and spray orifice, to reach the manufacturing qualification rate that improves ink gun.
The technical solution adopted for the present invention to solve the technical problems is: ink gun includes one and is provided with the IC wafer of a plurality of ink containers and is provided with the flexible circuit board of a plurality of spray orifices, flexible circuit board is in order to be sent to the control signal on the printing equipment on the IC wafer, inkjet printing with the control ink gun, this method comprises the following steps: to form heater above each ink container of IC wafer, be provided with coating volatility bonding agent on the IC wafer of heater again, flexible circuit board is put on the IC wafer, make on the flexible circuit board spray orifice respectively with the IC wafer on the ink container contraposition, and it is fixing mutually to fit.The inventive system comprises: an apparatus for coating, be provided with a room in order to ccontaining volatility cement in it, coat the IC wafer volatility is held agent, a hot-press arrangement is in order to be fitted in flexible circuit board hot pressing on the IC wafer that is coated with the volatility bonding agent.
The invention has the beneficial effects as follows: since on the IC wafer with the binding face of flexible circuit board, be coated with volatile bonding agent, therefore, when utilizing hot-press arrangement with flexible circuit board and the applying of IC wafer, can reach bonding effect more closely, and do not cause IC wafer and flexible circuit board to break away from, or make its accurate dislocation.In addition, hot-press arrangement bottom can be a plastic material, makes when with flexible circuit and the pressing of IC wafer, can be effectively with flexible circuit instead and the discharge of the air between the IC wafer, make the applying of flexible circuit board and IC wafer more tight.
Description of drawings
Fig. 1 is the flexible circuit board of ink gun of the present invention and the combination stereogram of IC wafer.
Fig. 2 makes the schematic perspective view of the device of ink gun for the present invention.
The specific embodiment
The ink gun that method of the present invention relates to includes an IC wafer 12 that is provided with a plurality of ink containers 10, and be provided with the flexible circuit board (TAB) 16 of a plurality of spray orifices 14, be laid with electrical interconnection 18 on the flexible circuit board 61, in order to the control signal on the printing equipment is sent on the IC wafer 12, inkjet printing with the control ink gun, the manufacture method of ink gun of the present invention comprises the following steps that 1. form heater above each ink container 10 on the IC wafer 12, in order to the ink in the ink container 10 is heated to produce bubble, utilize the pressure of bubble that ink is sprayed by the spray orifice on the flexible circuit board 16 14.2. be provided with coating volatility bonding agent on the IC wafer 12 of heater, the volatility bonding agent is water or organic appearance agent, its coating method can utilize an apparatus for coating to be coated on the IC wafer 12 with spray pattern, and it can more effectively be fitted tightly with flexible circuit board 16.3. flexible circuit board 16 is placed on the IC wafer 12, make on the flexible circuit board 16 spray orifice 14 respectively with IC wafer 12 on ink container 10 accurate contrapositions, and be pressed on flexible circuit board 16 and the IC wafer 12 with a hot-press arrangement, it is fixing that it is fitted mutually.The manufacture method of ink gun of the present invention, be after flexible circuit board 16 and IC wafer 12 are fitted, owing to be coated with volatile bonding agent on the IC wafer 12, therefore, can obtain higher adhesive effect, make IC wafer 12 be difficult on flexible circuit board 16, coming off, and after can making flexible circuit board 16 and IC wafer 12 carry out accurate contraposition applying, make spray orifice 14 and ink container 10 unlikely dislocation on it, and can improve the manufacturing efficient and the quality of ink gun.This device is in order to be pressed on flexible circuit board 16 on the IC wafer 12, and it includes an apparatus for coating 20 and a hot-press arrangement 22.During manufacturing, the flexible circuit board 16 that whole batching is provided with electrical interconnection is erected on the board, and each flexible circuit board 16 is launched, in order to fit with IC wafer 12.Apparatus for coating 20 also is located at flexible circuit board 16 peripheries, be provided with a room 24 in order to ccontaining volatility bonding agent in it, its bottom is provided with a nozzle 26 with respect to the top of IC wafer 12, in order to volatile solvent is coated on the IC wafer of desiring to fit with flexible circuit board 16 12.Hot-press arrangement 22 is arranged on flexible circuit board 16 tops, and in order to after flexible circuit board 16 and the 12 accurate contrapositions of IC wafer, hot pressing fits on the IC wafer 12 that is coated with performance property bonding agent.
Claims (5)
1. engrating process with IC wafer of a plurality of ink containers and spray orifice, it includes a flexible circuit board (16) that is provided with the IC wafer (12) of a plurality of ink containers (10) and is provided with a plurality of spray orifices (14), flexible circuit board (16) is in order to be sent to the control signal on the printing equipment on the IC wafer (12), inkjet printing with the control ink gun, it is characterized in that: method comprises the following steps: to form heater in each ink container (10) top of IC wafer (12), go up coating volatility bonding agent at the IC wafer (12) that is provided with heater again, flexible circuit board (16) is put on IC wafer (12), make on the flexible circuit board (16) spray orifice respectively with IC wafer (12) on ink container (10) contraposition, and it is fixing mutually to fit.
2. the engrating process with IC wafer of a plurality of ink containers and spray orifice according to claim 1 is characterized in that: described volatility bonding agent is an organic solvent.
3. the engrating process with IC wafer of a plurality of ink containers and spray orifice according to claim 1 is characterized in that: described flexible circuit board and IC wafer are with the hot-press arrangement pressing.
4. the engrating process with IC wafer of a plurality of ink containers and spray orifice according to claim 1 is characterized in that: described volatility bonding agent is coated on the IC wafer (12) with spray pattern.
5. IC wafer with a plurality of ink containers and spray orifice, it is characterized in that: comprise an apparatus for coating (20), be provided with a room in order to ccontaining volatility cement (24) in it, coat the IC wafer volatility is held agent, one hot-press arrangement (22) is in order to be fitted in flexible circuit board hot pressing on the IC wafer (12) that is coated with the volatility bonding agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA021577072A CN1509877A (en) | 2002-12-24 | 2002-12-24 | IC chip with multiple ink channel and orifice, cutting method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA021577072A CN1509877A (en) | 2002-12-24 | 2002-12-24 | IC chip with multiple ink channel and orifice, cutting method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1509877A true CN1509877A (en) | 2004-07-07 |
Family
ID=34236659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA021577072A Pending CN1509877A (en) | 2002-12-24 | 2002-12-24 | IC chip with multiple ink channel and orifice, cutting method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1509877A (en) |
-
2002
- 2002-12-24 CN CNA021577072A patent/CN1509877A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |