CN1508294A - Additive for electroplating liquid and its use in tin-lead alloy plating - Google Patents
Additive for electroplating liquid and its use in tin-lead alloy plating Download PDFInfo
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- CN1508294A CN1508294A CNA021280304A CN02128030A CN1508294A CN 1508294 A CN1508294 A CN 1508294A CN A021280304 A CNA021280304 A CN A021280304A CN 02128030 A CN02128030 A CN 02128030A CN 1508294 A CN1508294 A CN 1508294A
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- solution additive
- additive
- alloy plating
- plating
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- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a plating solution additive and application in Sn-Al alloy plating. The additive contains OP21 10-30g/l,2,4-dichlorobenzaldehyde 1g/l, HCHO 5-15g/l and o-toluidine 6-10g/l. It places the additive in the Sn-Al alloy plating technical formula, and uses the plating technique to obtain high quality plated parts, apparent minute surface bright, three proofing performance good, welding performance better than silver-plated layer, able to directly be applied to industrial production.
Description
Technical field
The present invention relates to a kind of solution additive, particularly relate to a kind of solution additive and the application thereof that plating piece is shown be the minute surface light in tin-lead alloy plating, used.
Background technology
As everyone knows, silver plate can turn black after placing for some time in oxidation, and its resistivity and weldability can be affected greatly.Not only influence outward appearance after being coated with DJB-823, and electroconductibility will just be arranged under certain pressure, develop very greatly for the silvering meaning, Sn-Pb technology becomes the plating of selection.But traditional Sn-Pb coating is lacklustre, in order to obtain tin-lead-coat that minute surface light, weldability and resistivity satisfy service requirements, must carry out the research of solution additive.
Summary of the invention
The purpose of this invention is to provide the plating piece surface that to make of in the tin-lead alloy plating, using and be a kind of solution additive and the application thereof of minute surface light, this solution additive had both solved the lacklustre technical barrier of plating piece in the plating of present tin-lead, provided a kind of again and can satisfy the solution additive that weldability and resistivity service requirements, plating piece have the tin-lead alloy plating of minute surface light.
The objective of the invention is to realize by the enforcement following technical proposals:
A kind of solution additive is characterized in that: include:
OP21 10-30g/L
2,4 dichloro benzene formaldehyde 1g/L
HCHO 5-15g/L
Ortho Toluidine 6-10ml/L
The specific configuration method steps of solution additive of the present invention is as follows:
Earlier 2,4 dichloro benzene formaldehyde is joined in the Ortho Toluidine after reaction for some time, add OP21 and HCHO again; HCHO also can not put into this solution and join plating bath separately.
The application of solution additive of the present invention comprises: the application in bright Sn-Pb alloy plating.
The concrete application of solution additive of the present invention in bright Sn-Pb alloy plating is as follows:
A, solution additive of the present invention is mixed with following component:
Sn2+ 18-25g/L
Pb2+ 8-11g/L
Fluoroboric acid HBF4 (dissociating) 250-300g/L
Boric acid H3BO3 10-30g/L
B, the application of solution additive of the present invention in bright Sn-Pb alloy depositing process, the technical process when it is used:
Pre-treatment, cupric cyanide feel secure, clean, plate Sn-Pb, cleaning, passivation, cleaning, dry, deliver for a check.C, quality of coating detect effect:
Outward appearance: be minute surface light with blue look
Salt fog, mould, damp and hot NBC protective performance: press GJB367,2-87 and carry out, damp and hot and salt-fog test result: GJB1674-1995 is rated very.
Welding property: be better than silvered film, good leveling property.
The invention has the advantages that: use the Sn-Pb plating of this additive, the coating minute surface light of plating piece, and be coated with the efficient height, with the large-current electric plating, generally use 5-10 minute; Plating bath and additive are stable in electroplating technology; The invention solves traditional lacklustre technical barrier of Sn-Pb plating plating piece, can be directly used in production.
Embodiment
Embodiment 1:
Solution additive of the present invention comprises:
OP21 10g/L
2,4 dichloro benzene formaldehyde 1g/L
HCHO 5g/L
Ortho Toluidine 6mL/L
Embodiment 2:
Solution additive of the present invention comprises:
OP21 18g/L
2,4 dichloro benzene formaldehyde 1g/L
HCHO 2g/L
Ortho Toluidine 8ml/L.
Embodiment 3:
Solution additive of the present invention includes:
OP21 30g/L
2,4 dichloro benzene formaldehyde 1g/L
HCHO 15g/L
Ortho Toluidine 10ml/L
The specific configuration method steps of solution additive of the present invention is as follows: earlier 2,4 dichloro benzene formaldehyde is joined in the Ortho Toluidine after reaction for some time, add OP21 and HCHO again; HCHO also can not put into this solution and join plating bath separately.
Embodiment 4:
The concrete application of solution additive of the present invention in bright Sn-Pb alloy depositing process is as follows:
With solution additive of the present invention:
OP21 10g/L
2,4 dichloro benzene formaldehyde 1g/L
HCHO 5g/L
Ortho Toluidine 6ml/L
Mix with following component:
Sn
2+ 18g/L
Pb
2+ 8g/L
Fluoroboric acid HBF4 (dissociating) 250g/L
Boric acid H3BO3 10g/L
In described solution additive was used: elder generation added OP21 and HCHO after 2,4 dichloro benzene formaldehyde being joined reacting for some time in the Ortho Toluidine again; HCHO also can not put into this solution and join plating bath separately, thereby constitutes solution additive, again with above-mentioned other component mixing match.
Embodiment 5:
The application of solution additive of the present invention in bright Sn-Pb alloy depositing process:
With solution additive of the present invention:
OP21 18/L
2,4 dichloro benzene formaldehyde 1g/L
HCHO 2g/L
Ortho Toluidine 8ml/L
Mix with following component:
Sn
2+ 20g/L
Pb
2+ 10g/L
Fluoroboric acid HBF4 (dissociating) 280g/L
Boric acid H3BO3 25g/L
In described solution additive was used: elder generation added OP21 and HCHO after 2,4 dichloro benzene formaldehyde being joined reacting for some time in the Ortho Toluidine again; HCHO also can not put into this solution and join plating bath separately, thereby constitutes solution additive, again with above-mentioned other component mixing match.
Embodiment 6:
The application of solution additive of the present invention in bright Sn-Pb alloy depositing process:
With solution additive of the present invention:
OP21 30g/L
2,4 dichloro benzene formaldehyde 1g/L
HCHO 15g/L
Ortho Toluidine 10ml/L
Mix with following component:
Sn
2+ 25g/L
Pb
2+ 11g/L
HBF4 (dissociating) 300g/L
H3BO3 30g/L
In described solution additive was used: elder generation added OP21 and HCHO after 2,4 dichloro benzene formaldehyde being joined reacting for some time in the Ortho Toluidine again; HCHO also can not put into this solution and join plating bath separately, thereby constitutes solution additive, again with above-mentioned other component mixing match.
Embodiment 7:
The application of solution additive of the present invention in bright Sn-Pb alloy depositing process, the technical process when it is used is:
Pre-treatment, cupric cyanide feel secure, clean, plate Sn-Pb, cleaning, passivation, cleaning, dry, deliver for a check.
The present invention uses the Sn-Pb plating of this additive, the coating minute surface light of plating piece, and be coated with the efficient height, with the large-current electric plating, generally use 5-10 minute; Solution additive is stable in electroplating technology; The invention solves traditional lacklustre technical barrier of Sn-Pb plating plating piece, can be directly used in production.
Claims (5)
1, a kind of solution additive is characterized in that: include:
OP21 10-30g/L
2,4 dichloro benzene formaldehyde 1g/L
HCHO 5-15g/L
Ortho Toluidine 6-10mL/L
2, a kind of solution additive according to claim 1 is characterized in that:
The specific configuration method steps of described solution additive is as follows: earlier 2,4 dichloro benzene formaldehyde is joined in the Ortho Toluidine after reaction for some time, add OP21 and HCHO again; HCHO also can not put into this solution and join plating bath separately.
3, the application of a kind of solution additive in the tin-lead alloy plating is characterized in that: be included in the application in the bright Sn-Pb alloy plating.
4, the application of a kind of solution additive according to claim 3 in the tin-lead alloy plating is characterized in that: the application in bright Sn-Pb alloy plating is: solution additive of the present invention is mixed with following component:
Sn
2+ 18-25g/L
Pb
2+ 8-11g/L
Fluoroboric acid HBF4 (dissociating) 250-300g/L
Boric acid H3BO3 10-30g/L
5, the application in the tin-lead alloy plating according to claim 3 or 4 described a kind of solution additives is characterized in that: the technical process when described solution additive is used in bright Sn-Pb alloy depositing process:
Pre-treatment, cupric cyanide feel secure, clean, plate Sn-Pb, cleaning, passivation, cleaning, dry, deliver for a check.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02128030 CN1292097C (en) | 2002-12-16 | 2002-12-16 | Additive for electroplating liquid and its use in tin-lead alloy plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02128030 CN1292097C (en) | 2002-12-16 | 2002-12-16 | Additive for electroplating liquid and its use in tin-lead alloy plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1508294A true CN1508294A (en) | 2004-06-30 |
| CN1292097C CN1292097C (en) | 2006-12-27 |
Family
ID=34231199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02128030 Expired - Fee Related CN1292097C (en) | 2002-12-16 | 2002-12-16 | Additive for electroplating liquid and its use in tin-lead alloy plating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1292097C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102002739A (en) * | 2010-10-08 | 2011-04-06 | 杜石峰 | Compounded main brightener for preparing zinc-plating brightener |
| CN102433581A (en) * | 2011-12-05 | 2012-05-02 | 昆明理工恒达科技有限公司 | Method for preparing novel anode material for electro-deposition of nonferrous metals |
-
2002
- 2002-12-16 CN CN 02128030 patent/CN1292097C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102002739A (en) * | 2010-10-08 | 2011-04-06 | 杜石峰 | Compounded main brightener for preparing zinc-plating brightener |
| CN102002739B (en) * | 2010-10-08 | 2012-07-04 | 杜石峰 | Compounded main brightener for preparing zinc-plating brightener |
| CN102433581A (en) * | 2011-12-05 | 2012-05-02 | 昆明理工恒达科技有限公司 | Method for preparing novel anode material for electro-deposition of nonferrous metals |
| CN102433581B (en) * | 2011-12-05 | 2014-06-18 | 昆明理工恒达科技股份有限公司 | Method for preparing novel anode material for electro-deposition of nonferrous metals |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1292097C (en) | 2006-12-27 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061227 Termination date: 20111216 |