CN1507995A - Method for manufacturing light board - Google Patents
Method for manufacturing light board Download PDFInfo
- Publication number
- CN1507995A CN1507995A CNA021496501A CN02149650A CN1507995A CN 1507995 A CN1507995 A CN 1507995A CN A021496501 A CNA021496501 A CN A021496501A CN 02149650 A CN02149650 A CN 02149650A CN 1507995 A CN1507995 A CN 1507995A
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- manufacturing
- mould
- light conducting
- inert gas
- lgp
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Abstract
The method for making light-conducting plate includes the following steps: providing a mould, melting predefined resin material and inert gas, injecting the molten resin material and inert gas into a mould cavity of the mould, pressure-retaining and cooling said mould, demoulding so as to form the invented light-conducting plate finished product with the features of light weight and uniform surface.
Description
[technical field]
The present invention relates to a kind of manufacturing method of light conducting board.
[background technology]
Back light system (Backlight System) can be used as the light-source system of LCD, and it is applied in various information, communication, the consumer products.In recent years, along with the development of small-medium size product technology, as mobile phone, picture telephone, PDA etc., product constantly develops to compact direction, the side light type backlight system therefore occurs.The operation principle of back light system is that light source directly or indirectly enters propagation in the LGP, bottom surface and reflecting plate via LGP with optical texture design, diffusion is penetrated at an angle, and be evenly distributed in the light-emitting zone, utilize diffuser plate and prism plate to adjust the light source visual angle again, with the optical characteristics requirement of fluid,matching crystal display.
At present, the processing procedure of LGP mainly is divided into two kinds: printing-type (Screen Printing) and non-printing-type.Wherein, printing-type be at the coated ink dot in the bottom surface of LGP to form specific pattern (Dot Pattern), this ink dot is used for destroying the total reflection condition of incident ray, and then makes light evenly penetrate LGP.But light must see through LGP ability contact patterns in this kind LGP, thereby the intensity of reflection ray is weakened; In addition, in printing process,, and then influence the dispersion effect of light, thereby can't provide uniform light, influence the effect of liquid crystal display for back light system because printing-ink applies inhomogeneously.
But not the printing-type processing procedure at present comparatively mature technique be to adopt the ejection formation (Iniection Molding) of acryl (PMMA) material, relief pattern is set to reach the purpose of diffusion light in the bottom surface of LGP with cutting or direct injection mode.Therefore because incident ray can directly contact with relief pattern, the light intensity of reflection is greater than the printing-type LGP, and saves print routine in manufacture process, therefore has to expand to penetrate that effect is good, the simple advantage of processing procedure.Yet the viscosity of molten resin (Viscosity) can influence the uniformity of LGP finished product when ejection formation, if molten resin viscosity when penetrating is higher, molten resin is not transferred to promptly solidifying of die cavity all around, and therefore the LGP uniformity that makes is relatively poor; In addition, the LGP of existing ejection formation is more frivolous as if making, and then produces warpage easily after cooling, and then can influence the laser propagation effect of light.
[summary of the invention]
For overcome LGP cost height that the prior art method for manufacturing light guide plate makes, thickness is thicker and uneven defective, the invention provides the manufacture method of a kind of low cost, frivolous even light-guiding plate.
The manufacturing method of light conducting board that technical solution problem of the present invention is adopted comprises the steps: to provide a mould; Resin material and inert gas that fusion is predetermined; The die cavity that the resin material and the inert gas of fusion injected mould together; This mould is cooled off in pressurize; The demoulding promptly forms the LGP finished product.
The invention has the beneficial effects as follows: the resin material of this fusion and inert gas inject the die cavity of mould together, because this gas can reduce the viscosity of molten resin material, therefore the LGP finished product that forms is more even.In addition, this inert gas and resin material mix the viscosity that can reduce the LGP finished product, and it is comparatively frivolous therefore to make LGP.Because this processing procedure can omit printing ink dot program, therefore can shorten the production cycle, and reduce the integrated cost of each LGP again.
[description of drawings]
Fig. 1 is the generalized section of the used device of method for manufacturing light guide plate of the present invention.
Fig. 2 is the flow chart of method for manufacturing light guide plate of the present invention.
Fig. 3 is the structural representation according to the obtained LGP of manufacture method shown in Figure 2.
Fig. 4 is another structural representation according to the obtained LGP of manufacture method shown in Figure 2.
Fig. 5 is the another structural representation according to the obtained LGP of manufacture method shown in Figure 2.
[specific embodiment]
As shown in Figure 1, be the employed device of method for manufacturing light guide plate of the present invention.This device comprises injection device 10, mould 20 and aerating device 30.Wherein, this injection device 10 comprise the motor 13 of screw rod 12, the drive screw 12 of rotatable drivings in injection cylinder 11 machine barrels 11, to machine barrel 11 in the supply resin material hopper 14 and be arranged on the heater 15 of machine barrel 11 outer surfaces.This mould 20 comprises cover half 21, dynamic model 22, connects the passage 25 of cover half 21 and 22 liang of leading sections of dynamic model, is formed with in cover half 21 by the runner 23 of molten resin and the cast gate 4 that is communicated with runner 23.Wherein, this cover half 21 and dynamic model 22 formation one are used for the die cavity 26 of moulded products, and dynamic model 22 is provided with the outstanding element 27 that takes out molded product usefulness.This aerating device 30 comprises a gas passage 31 and air cavity 32, and the inner chamber of this gas passage 31 and machine barrel 11 links to each other when inflation.
At least simultaneously be provided with concavo-convex or saw-tooth like pattern in the die cavity 26 of this mould 20, so that corresponding convex-concave shape or the saw-tooth like pattern of forming in a surface of LGP.Wherein, this pattern can be set directly at the inner surface of die cavity 26, also can attach the die of the concavo-convex or saw-tooth like pattern of tool in die cavity 26.This pattern can adopt method settings such as stamped method, sand-blast, etch, laser processing method, milling cutter processing method, LIGA (German is Lithographie GavanoformungAbformung) processing and electrocasting.These mould 20 materials are for the existing high metal of thermal conductivity, as copper, copper alloy or beryllium copper.In addition, for improving the rigidity of mould 20, can use nickel, nickel phosphide (NiP), nickel cobalt (alloy) (NiCo) or hybrid silicon carbide (SiC), chromium and the contour hard material electroforming of titanium carbide (TiC) to form.
Please consulting Fig. 2 together, is the flow chart of method for manufacturing light guide plate of the present invention.In LGP processing procedure 60, comprise the steps: that step 62 is that preparation one mould, step 64 are that fusion preparation resin material and inert gas, step 70 are that melted material and inert gas are injected in the die cavity of mould simultaneously; Step 72 is that the resin material in this mould is cooled off in pressurize; Step 74 is that the LGP finished product is taken out in the demoulding.
Wherein, employed resin material has good light penetration in the step 64, as the thermoplastic resin of melting moulding such as methacrylic resin, Merlon, polystyrene, methyl methacrylate and cinnamic copolymer MS resin, noncrystalline cyclic olefin polymer, polypropylene, polyethylene, thermoplastics type's mylar.Wherein, methacrylic resin is the polymer based on methyl methacrylate, and it can form copolymer with alkylacrylates such as other resins such as methacrylate, ethyl propylene acid esters.In addition, this transparent resin material can add materials such as releasing agent, ultra-violet absorber, pigment, antioxidant and detonator, and the LGP finished product that is beneficial to form has the good optical effect.
In the step 64, at first predetermined resin material is charged in the machine barrel 11 continuously, use heater 15 to make the resin material fusion simultaneously, aerating device 30 charges into inert gas to the inner chamber of machine barrel 11 during 12 rotations of motor 13 drive screws, make molten resin and inert gas fully mix and push it to the front end of machine barrel 11 by drive screw 12 rotations, then molten resin and this inert gas are injected in the die cavity 26 fast.At present, the industry injection rate is generally at 600cm
3Below/the s, be difficult for producing the tendency of residual deformation for making LGP, the scope of injection rate is preferably 1000cm
3/ s is to 2500cm
3/ s.The viscosity of existing molten resin is that 50Pa.sec is to 5000Pa.sec at cast gate 24 places of mould 20, because of the viscosity of molten resin low more good more when the moulding, reduce viscosity and can improve molten resin temperature, and the raising injection rate, therefore charge into inert gas and can make the viscosity of molten resin be reduced to 200Pa.sec between the 1000Pa.sec.The heating-up temperature of molten resin can suitably be selected by material therefor, is example with the methacrylic resin, and its temperature can be 170 ℃ to 300 ℃, wherein is preferably 190 ℃ to 270 ℃, more preferably 230 ℃ to 260 ℃.Wherein, inert gas can be argon gas (Ar), helium (He), neon (Ne), and also available nitrogen replaces this inert gas, maybe this inert gas and nitrogen is mixed with same ratio.The pressure of this gas and flow velocity can be by adjusting device (figure does not show) controls of outside, and wherein this inert gas carries out preheating earlier before the inner chamber that charges into machine barrel 11, and the temperature range of preheating is 100 ℃ to 120 ℃, and wherein optimizing temperature is 110 ℃.
In the step 72, when charging into molten resin in the die cavity, with screw rod 12 be scheduled to stepping back apart from the time add packing pressure, by cooling device (figure does not show) it is carried out refrigeration then, wherein chilling temperature is below 110 ℃, and wherein optimizing temperature is 105 ℃, promptly makes the LGP finished product by cooling.
Wherein, step 74 is taken out this LGP finished product for the demoulding.Can design in this one-shot forming and take out two goods, also can design and take out four goods.Please consult Fig. 3, Fig. 4 and Fig. 5 together, select difform mould 20 for use, can make plate shaped LGP 4, wedge shape LGP 5 and dish-shaped LGP 6 respectively, LGP 4,5 and 6 bottom surface have reflecting layer relief pattern 41,51 and 61 respectively, and the convex-concave pattern 41 of LGP 4 is provided with more even; And the convex-concave pattern 51,61 of wedge shape LGP 5 and dish-shaped LGP 6 is far away from light source (figure does not show), and the density of its pattern and size are big more.The light-emitting face that its these bottom surface of light guide plate that neutralize are relative also can be provided with the light diffusion layer (figure does not show) of U-shaped or V-arrangement, so can obtain the LGP of high accuracy figuration, because of the reflecting layer and the light diffusion layer of this LGP can form together by ejection formation, so can omit printing process, shorten the production cycle, and reduce the integrated cost of each LGP.
In addition, the lens pillar of optical element that other are slim such as optical lens, optical fiber head, the dichronic mirror in the light engine, polarization spectroscope and other various prisms etc., also the method for available this ejection formation is made.
Claims (9)
1. a manufacturing method of light conducting board comprises the steps: to provide a mould; Resin material and inert gas that fusion is predetermined; The die cavity that the resin material and the inert gas of fusion injected mould together; This mould is cooled off in pressurize; The demoulding promptly forms the LGP finished product.
2. manufacturing method of light conducting board as claimed in claim 1 is characterized in that this LGP finished product is plate shaped, wedge shape or dish.
3. manufacturing method of light conducting board as claimed in claim 1 is characterized in that this resin material is a methacrylic resin.
4. manufacturing method of light conducting board as claimed in claim 1 is characterized in that this inert gas can be any one in argon gas, helium and the neon.
5. manufacturing method of light conducting board as claimed in claim 1 is characterized in that the preheat temperature of this inert gas injection die cavity is 100 ℃ to 120 ℃.
6. manufacturing method of light conducting board as claimed in claim 1 is characterized in that melt temperature is 170 ℃ to 300 ℃.
7. manufacturing method of light conducting board as claimed in claim 1, the viscosity of melted material is that 50Pa.sec is to 5000Pa.sec when it is characterized in that injecting die cavity.
8. manufacturing method of light conducting board as claimed in claim 1, at least one inner surface that at least one inner surface that it is characterized in that this mould is provided with relief pattern or this mould is provided with U-shaped or V-arrangement pattern.
9. manufacturing method of light conducting board as claimed in claim 1 is characterized in that this inert gas substitutes with nitrogen or with the mist replacement of argon gas, helium and neon and nitrogen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021496501A CN100411845C (en) | 2002-12-13 | 2002-12-13 | Method for manufacturing light board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021496501A CN100411845C (en) | 2002-12-13 | 2002-12-13 | Method for manufacturing light board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1507995A true CN1507995A (en) | 2004-06-30 |
| CN100411845C CN100411845C (en) | 2008-08-20 |
Family
ID=34233728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021496501A Expired - Fee Related CN100411845C (en) | 2002-12-13 | 2002-12-13 | Method for manufacturing light board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100411845C (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100395614C (en) * | 2004-08-16 | 2008-06-18 | 鸿富锦精密工业（深圳）有限公司 | Method for manufacturing light guiding plate |
| CN101165831B (en) * | 2006-10-20 | 2010-05-19 | 毅嘉科技股份有限公司 | Light conducting board structure manufacture method and key module possessing same |
| CN1838719B (en) * | 2005-03-22 | 2010-09-29 | 宇幕科技有限公司 | Penetration type scanner |
| US7817316B2 (en) | 2005-03-11 | 2010-10-19 | Chih-Hsien Wei | Scanning apparatus for transparent documents |
| CN101293393B (en) * | 2007-04-28 | 2010-12-01 | 株式会社名机制作所 | Light guide plate forming mold and light guide plate forming method |
| CN102398346A (en) * | 2010-09-10 | 2012-04-04 | 鸿富锦精密工业（深圳）有限公司 | Die for manufacturing fiber connector |
| CN103302828A (en) * | 2012-03-08 | 2013-09-18 | 住友重机械工业株式会社 | Injection molding machine |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5997781A (en) * | 1996-04-04 | 1999-12-07 | Mitsui Chemicals, Inc. | Injection-expansion molded, thermoplastic resin product and production process thereof |
| US5972276A (en) * | 1996-10-04 | 1999-10-26 | Asahi Kasei Kogyo Kabushiki Kaisha | Method for the injection molding of a resin |
| WO2001024995A1 (en) * | 1999-10-01 | 2001-04-12 | Incoe Corporation | Coupled fluid injection with same power source |
| US6491860B1 (en) * | 1999-10-01 | 2002-12-10 | Incoe Corporation | Coupled fluid injection with flow control |
| TW538260B (en) * | 2000-04-28 | 2003-06-21 | Sumitomo Chemical Co | Method for producing light transmitting plate |
-
2002
- 2002-12-13 CN CNB021496501A patent/CN100411845C/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100395614C (en) * | 2004-08-16 | 2008-06-18 | 鸿富锦精密工业（深圳）有限公司 | Method for manufacturing light guiding plate |
| US7817316B2 (en) | 2005-03-11 | 2010-10-19 | Chih-Hsien Wei | Scanning apparatus for transparent documents |
| US8004730B2 (en) | 2005-03-11 | 2011-08-23 | Muller Capital, Llc | Scanning apparatus for transparent documents |
| CN1838719B (en) * | 2005-03-22 | 2010-09-29 | 宇幕科技有限公司 | Penetration type scanner |
| CN101165831B (en) * | 2006-10-20 | 2010-05-19 | 毅嘉科技股份有限公司 | Light conducting board structure manufacture method and key module possessing same |
| CN101293393B (en) * | 2007-04-28 | 2010-12-01 | 株式会社名机制作所 | Light guide plate forming mold and light guide plate forming method |
| CN102398346A (en) * | 2010-09-10 | 2012-04-04 | 鸿富锦精密工业（深圳）有限公司 | Die for manufacturing fiber connector |
| CN103302828A (en) * | 2012-03-08 | 2013-09-18 | 住友重机械工业株式会社 | Injection molding machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100411845C (en) | 2008-08-20 |
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