CN1507086A - Hydrophobic film forming process - Google Patents
Hydrophobic film forming process Download PDFInfo
- Publication number
- CN1507086A CN1507086A CNA021558930A CN02155893A CN1507086A CN 1507086 A CN1507086 A CN 1507086A CN A021558930 A CNA021558930 A CN A021558930A CN 02155893 A CN02155893 A CN 02155893A CN 1507086 A CN1507086 A CN 1507086A
- Authority
- CN
- China
- Prior art keywords
- dewaters
- formation method
- film formation
- film
- mode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The drying film forming process includes provides one desiccant, and depositing the desiccant to form the drying film. The method of forming drying film on the cover plate is also provided and is one deposition process of the desiccant. The method of forming drying film for organic LED element is also provided and it is to deposit desiccant onto a substrate, which has one first electrode, one organic light emitting layer and one second electrode formed in advance, to form the drying film.
Description
Technical field
The present invention relates to the formation method of a kind of film that dewaters (drying film), particularly a kind of film formation method that dewaters of utilization deposition (deposition) mode is to be applied in the organic light-emitting diode element.
Background technology
Along with development of science and technology, present various electronic components not only become gently, thin, short, little, and employed material also becomes with rapid changepl. never-ending changes and improvements.Wherein, many elements or material are arranged for the suitable sensitivity of the aqueous vapor in the environment, that is be that it is very easy to produce chemistry or physical reactions with airborne hydrone and oxygen, the result can influence the employed material function of can't bringing into normal play, and then makes electronic component lose efficacy.
With the organic light-emitting diode element is example, and Organic Light Emitting Diode is the element that a kind of self luminous characteristic of utilizing organic functional material (organic functional materials) reaches display effect.Please refer to shown in Figure 1ly, Organic Light Emitting Diode 1 comprises a substrate 11, one first electrode 12, an organic luminous layer 13, one second electrode 14 and a cover plate 15.Wherein, the substrate 11 and first electrode 12 are light-transmitting materials, and first electrode 12 and second electrode 14 are respectively as anode and negative electrode; When imposing an electric current in Organic Light Emitting Diode 1, the electricity hole is injected by first electrode 12, electronics is injected by second electrode 14 simultaneously, at this moment, because the potential difference that extra electric field caused, make carrier in organic luminous layer 13, move, meet and produce combination again that can excite light emitting molecule in the organic luminous layer 13 and combine the exciton (exciton) that is produced with electric hole by electronics, the light emitting molecule of excitation state gives off energy with the form of light then.
Wherein, organic luminous layer 13 can be single layer structure, double-decker or the structure more than three layers, and for example, organic luminous layer 13 can comprise an electric hole implanted layer, an electric hole transfer layer, a luminescent layer, an electron transfer layer and an electron injecting layer.
From the above, the normal dedining mechanism that takes place is the not generation of light-emitting zone (dark spot) in Organic Light Emitting Diode, therefore will promote the durability (durability) of Organic Light Emitting Diode, just is how to reduce the not generation of light-emitting zone.And the organic functional material in the organic LED structure and easy and airborne moisture and oxygen reaction (especially moisture) as second electrode of negative electrode cause the not generation of light-emitting zone.Therefore, it is considerable moisture being removed completely.So, generally when making organic light-emitting diode element, can under vacuum state, carry out plated film usually, then vacuum breaker takes out semi-finished product, and the mode to encapsulate under normal pressure is sealed organic light-emitting diode element.But such mode can't guarantee fully that still organic light-emitting diode element can not be subjected to the influence of moisture and cause the not generation of light-emitting zone; And the vacuum process of plated film and the pressure of the encapsulation procedure under the normal pressure are not complementary, need that vacuum breaker causes that processing procedure is complicated, yield reduces, manufacturing cost increases, moreover, moisture and oxygen can be invaded in the semi-finished product of not finishing encapsulation in the atmosphere, make organic light-emitting diode element produce deterioration (degradation).
As mentioned above, thoroughly prevent the not generation of light-emitting zone, and then promote the life-span and the stability of Organic Light Emitting Diode, primarily be the water of removing Organic Light Emitting Diode inside fully.A kind of common mode is to add a water absorbing agent (water-trapping agent) or drier (drying agent) in the inside of Organic Light Emitting Diode.In order to solve the not generation of light-emitting zone of Organic Light Emitting Diode inside, existing several relevant patent application cases: in European patent case EP0776147, propose as people such as Kawami, Organic Light Emitting Diode is sealed in one contains in sealing (airtight) container of the solid material of chemical water absorption character, the compound that this class has chemical water absorption character comprises metal oxides such as calcium oxide and barium monoxide.And in British patent case GB2368 192, people such as Hisamitsu use organo-metallic compound (organometalliccompound) as the suction material, therefore organo-metallic compound can effectively be adsorbed with the water of OLED inside, simultaneously can adsorb other chemical water absorbing agent (chemical drying agents) and physics water absorbing agent (physical drying agents), and then reach and prevent the not generation of light-emitting zone.And in United States Patent (USP) case US6226890, people such as Boroson propose, the drier blending is had in the adhesive agent (binder) of aqueous vapor percent of pass (water vapor transmission rate) preferably in one, make it in Organic Light Emitting Diode, form a film again, make it can have better or keep the soaking effect of this solid drier.
In more detail, the mode that material is filled in the Organic Light Emitting Diode that generally will absorb water has two kinds; Please refer to shown in Figure 2, the first material 26 that will absorb water earlier fills in one and has been precast with in the cover plate 25 of groove 251, add the permeable film 27 of last layer again in groove 251 tops, push-down stack on the cover plate 25 that suction material 26 will be housed subsequently and the Organic Light Emitting Diode (not shown) that has prepared, and make it become a potted component its driving fit with sealing.But use this technology,, need to add the permeable film 27 of last layer simultaneously, so will increase the complexity on the processing procedure, make the yield of producing reduce and heighten with manufacturing cost because need in groove 251, load suction material 26.
In addition, please refer to shown in Figure 3, its two be will suction material 36 blending in the Polymer Solution of tool water penetration, mode by coating, formation one includes the film 37 of suction material 36 on cover plate 35, subsequently again with removal of solvents, its driving fit is become the element of a sealing with it then again with push-down stack on cover plate 35 and the Organic Light Emitting Diode (not shown) that has prepared, and with sealing.Though this mode is comparatively approaching with encapsulation procedure on processing procedure; and reduced the complexity on the process technique; but after coating process; must toast processing procedure with removal of solvents; regular meeting causes and still residual in the Organic Light Emitting Diode partly solvent is arranged as a result; thereby cause peeling off of the organic light-emitting diode element that prepared and cover plate, and cause component wear.
In above-mentioned prior art, the suction material is to utilize coating method, and utilizes Polymer Solution (bonding agent) material that will absorb water to be fixed on Organic Light Emitting Diode inside to form one except that water layer; Yet, the organic luminous layer in the Organic Light Emitting Diode and second electrode, be to utilize the vacuum moulding machine mode to form, can't be incorporated into identical operations pressure, and need that vacuum breaker causes that processing procedure is complicated, yield reduces, manufacturing cost increases with the processing procedure under the normal pressure; Moreover, form one with coating method and remove the problem that water layer also has hole (pin hole) and coating dead angle.
In addition, when utilizing adhesive agent to fix the suction material, the thickness that removes water layer can't lower effectively, thereby can limit the degree of dwindling of the thickness of Organic Light Emitting Diode; Particularly Organic Light Emitting Diode is because of simple in structure, its thickness of formed flat-panel screens can be thinner than LCD, it is not good but to be subject to the existing suction material usefulness that dewaters, and make and the time need add a large amount of suction materials in encapsulation, make Organic Light Emitting Diode thickness increase, sacrificed the advantage that organic light emitting display can be thinner; In addition, when utilizing adhesive agent to fix the suction material, the suction material that only is fixed in the laminar surface that dewaters can touch the hydrone of Organic Light Emitting Diode inside, so, the suction material that only is fixed in the laminar surface that dewaters can reach the effect of adsorbed water molecule, thereby can't effectively bring into play the adsorption capacity of suction material.
Therefore, how to provide a kind of operating environment of deposition manufacture process and encapsulation procedure of can integrating to reduce manufacturing cost, reduce organic illuminating element before encapsulation procedure, be exposed under the atmospheric environment chance with promote yield, reduce to remove the thickness of water layer and effectively performance remove water layer adsorption capacity remove water layer formation method, one of important topic of current electronic industry just.
Summary of the invention
At the problems referred to above, purpose of the present invention is for providing a kind of film formation method that dewaters that can reduce except that the thickness of water layer.
Another object of the present invention is for providing a kind of film formation method that dewaters that can effectively bring into play the adsorption capacity of the film that dewaters.
Another purpose of the present invention is for providing a kind of operating environment that can integrate deposition manufacture process and encapsulation procedure, and then reduces organic illuminating element is exposed to the chance under the atmospheric environment before encapsulation procedure the film formation method that dewaters.
For reaching above-mentioned purpose, the present invention utilizes depositional mode to form to dewater film absorbing extraneous moisture and oxygen, and makes the film that dewaters to be coated on closely in the organic illuminating element, stops infiltration, the diffusion of follow-up moisture and oxygen.
The film formation method that dewaters of the present invention comprise a suction material is provided and the material that will absorb water with depositional mode formation one film that dewaters.
The present invention also provides a kind of film formation method that dewaters of cover plate, and it comprises a prefabricated cover plate, a suction material is provided and the material that will absorb water is formed on the cover plate to form the film that dewaters with depositional mode.
In addition, the present invention provides a kind of film formation method that dewaters of organic illuminating element again, and it comprises a prefabricated substrate, a suction material is provided and the material that will absorb water is formed at above the substrate to form the film that dewaters with depositional mode.In the present invention, one first electrode, an organic luminous layer and one second electrode have been pre-formed on the substrate in regular turn.
As mentioned above, because according to the film formation method that dewaters of the present invention is to utilize depositional mode to form the film that dewaters, so the operating environment that can integrate deposition manufacture process and encapsulation procedure when formation dewaters film is to reduce manufacturing cost, further reduce organic illuminating element and before encapsulation procedure, be exposed to chance under the atmospheric environment promoting yield, and the operating environment that can continue to use deposition manufacture process is to avoid problem of solvent residue; In addition, can also reduce to dewater thickness, and the dewater adsorption capacity of film of performance effectively of film.
Description of drawings
Fig. 1 is a schematic diagram, shows the schematic diagram of existing Organic Light Emitting Diode;
Fig. 2 is a schematic diagram, shows the cover plate of existing Organic Light Emitting Diode and the schematic diagram of suction material;
Fig. 3 is a schematic diagram, shows the cover plate of another existing Organic Light Emitting Diode and the schematic diagram of suction material;
Fig. 4 is a flow chart, shows the flow process of the film formation method that dewaters of preferred embodiment of the present invention;
Fig. 5 is a schematic diagram, shows that the film formation method that dewaters of utilizing preferred embodiment of the present invention forms the schematic diagram of the film that dewaters on cover plate;
Fig. 6 is a schematic diagram, shows the schematic diagram of the organic light-emitting diode element with cover plate as shown in Figure 5;
Fig. 7 is a schematic diagram, shows that the film formation method that dewaters of utilizing preferred embodiment of the present invention forms the schematic diagram of the film that dewaters on prefabricated organic light-emitting diode element;
Fig. 8 A is a schematic diagram, shows the schematic diagram of the organic light-emitting diode element with prefabricated organic light-emitting diode element as shown in Figure 7; And
Fig. 8 B is a schematic diagram, shows that another has the schematic diagram of the organic light-emitting diode element of prefabricated organic light-emitting diode element as shown in Figure 7.
Symbol description among the figure
1 organic light-emitting diode element
11 substrates
12 first electrodes
13 organic luminous layers
14 second electrodes
15 cover plates
25 cover plates
251 grooves
26 suction materials
27 permeable films
35 cover plates
36 suction materials
37 films
The 4 film formation methods that dewater
41～42 flow processs that dewater film formation method
51 cover plates
52 films that dewater
52 ' sedimentary origin
6 prefabricated organic light-emitting diode elements
61 substrates
62 first electrodes
63 organic luminous layers
64 second electrodes
7 prefabricated organic light-emitting diode elements
71 substrates
72 first electrodes
73 organic luminous layers
74 second electrodes
75 films that dewater
75 ' sedimentary origin
76 cover plates
761 sealings
77 protective layers
Embodiment
Hereinafter with reference to relevant drawings, the film formation method that dewaters of preferred embodiment of the present invention is described, wherein components identical will be illustrated with identical reference marks.
Please refer to shown in Figure 4ly, the film formation method 4 that dewaters of preferred embodiment of the present invention may further comprise the steps:
At first, step 41 provides a suction material earlier.In the present embodiment, the suction material is one can be used as the material of sedimentary origin (deposition source), that is is that it can be applied in the deposition manufacture process, and it has the material of adsorbed water molecule ability; This suction material can be organo-metallic compound (organometalic complex compound), alkali metal compound (alkalinemetal compound), alkali metal oxide (alkaline metal oxide compound), alkaline earth metal compound (alkaline earth metal compound), alkaline earth oxide (alkaline earth metal oxide compound), sulfur-bearing metallic compound (sulfatecompound), metal halide (metal halide compound), cross chloric acid compound (perchlorate compound), or organic compound (organic compound).
Then, step 42 is to form the film that dewaters with will absorb water material deposition of depositional mode.In the present embodiment, the film that dewaters can be to utilize existing depositional mode to form, and for example is vapour deposition (vapor deposition), physical vapour deposition (PVD) (physical vapor deposition), chemical vapour deposition (CVD) (chemical vapor deposition) or evaporation (evaporation).
For content of the present invention is more readily understood, below will be for two example two, with the application of the film formation method 4 that dewaters of explanation preferred embodiment of the present invention.
Please refer to shown in Figure 5ly, present embodiment is to show that the film formation method 4 that dewaters is applied on the cover plate 51.In the present embodiment, cover plate 51 is to be used for the prefabricated organic light-emitting diode element 6 (as shown in Figure 6) of capping one, and prefabricated organic light-emitting diode element 6 is to include a substrate 61, one first electrode 62, an organic luminous layer 63 and one second electrode 64.
In the present embodiment, first electrode 62 is to be formed on the substrate 61; Organic luminous layer 63 is to be formed on first electrode 62; Second electrode 64 is to be formed on the organic luminous layer 63.Generally speaking, substrate 61 is generally a transparency carrier, for example a glass substrate, a plastic cement (plastic) substrate or a flexibility (flexible) substrate; First electrode 62 can be to utilize sputter (sputtering) mode or ion plating (ion plating) mode is formed on the substrate 61, this first electrode 62 is generally a transparent conductive metal oxide as anode and its material usually, for example is tin indium oxide (ITO), aluminum zinc oxide (AZO) or indium zinc oxide (IZO); Organic luminous layer 63 comprises an electric hole implanted layer usually, one electric hole transfer layer, one luminescent layer, one electron transfer layer and an electron injecting layer (not shown), the main material of electricity hole implanted layer is copper phthalocyanine (CuPc), the material of electricity hole transport layer mainly is to be 4,4 '-bis[N-(1-naphthyl)-N-phenylamino] biphenyl (NPB), the material of electron injecting layer mainly is to be lithium fluoride (LiF), the material of electron transfer layer mainly is to be tris (8-quinolinato-N1,08)-aluminum (Alq), and organic luminous layer 63 can be with evaporation (evaporation), rotary coating (spin coating), ink jet printing (inkjet printing) or the printing (printing) mode be formed on first electrode 62, in addition, the light launched of organic luminous layer 63 can be blue light, green glow, ruddiness, white light or other monochromatic light; Second electrode 64 can be to utilize vapour deposition method, electron beam coating method (E-gun) or sputtering method (sputtering) to form, and its material can be conductive materials such as aluminium, aluminium/lithium, calcium, magnesium silver alloy or silver, and second electrode 64 is normally as negative electrode.
As shown in Figure 5, sedimentary origin 52 ' is to be a suction material, and present embodiment is to utilize deposition manufacture process that sedimentary origin 52 ' is deposited on the cover plate 51 with the formation film 52 that dewaters; Formation method relevant for the film that dewaters is as previously mentioned, so no longer set forth.
In addition, please refer to shown in Figure 7ly, in another preferred embodiment of the present invention, the film formation method 4 that dewaters is to be applied in the prefabricated organic light-emitting diode element 7.In the present embodiment, prefabricated organic light-emitting diode element 7 is to include a substrate 71, one first electrode 72, an organic luminous layer 73 and one second electrode 74.Explanation relevant for prefabricated organic light-emitting diode element 7 is as previously mentioned, so no longer set forth.
As shown in the figure, sedimentary origin 75 ' is to be a suction material, and present embodiment is to utilize deposition manufacture process that sedimentary origin 75 ' is deposited on the prefabricated organic light-emitting diode element 7 with the formation film 75 that dewaters; Formation method relevant for the film that dewaters is as previously mentioned, so no longer set forth.Be noted that the film 75 that dewaters can be to coat first electrode 72, organic luminous layer 73 and second electrode 74, it can also be to be formed at (not shown) on second electrode 74.
Then, carry out encapsulation procedure again so that finish the making of organic light-emitting diode element.Shown in Fig. 8 A, it is to utilize a cover plate 76 that first electrode 72, organic luminous layer 73, second electrode 74 and the film 75 that dewaters are closed in the seal cavity, wherein, cover plate 76 is to place on the substrate 71 by gluing by a sealing 761, and this sealing 761 is for example to be epoxy resin (epoxy).In addition, shown in Fig. 8 B, it is to utilize a protective layer (passivation film) 77 to coat first electrode 72, organic luminous layer 73, second electrode 74 and the film 75 that dewaters.
In sum, because according to the film formation method that dewaters of dewater film formation method, cover plate of the present invention and the film formation method that dewaters of organic illuminating element is to utilize depositional mode to form the film that dewaters, so when formation dewaters film, can integrate the operating environment of encapsulation procedure and leading portion deposition manufacture process, it for example is the deposition manufacture process when forming second electrode, so manufacturer must not spend extra cost and remove to build the environment of execution coating process, reaches to buy and carry out the board of coating process, thereby can reduce manufacturing cost.In addition, utilize depositional mode to form to dewater film can avoid the dissolvent residual problem, and the thickness of the film that can reduce effectively to dewater, can avoid the interference of adhesive agent in addition and the dewater adsorption capacity of film of performance effectively.
The above only is an illustrative, but not is restricted person.Anyly do not break away from spirit of the present invention and category, and, all should be contained among the scope of claim its equivalent modifications of carrying out or change.
Claims (19)
1. the film that dewaters (drying film) formation method comprises:
One suction material (desiccant) is provided; It is characterized in that,
The material that should absorb water forms the film that dewaters in deposition (deposition) mode.
2. the film formation method that dewaters as claimed in claim 1 is characterized in that, this depositional mode is a vapour deposition (vapor deposition) mode.
3. the film formation method that dewaters as claimed in claim 1 is characterized in that, this depositional mode is an evaporation (evaporation) mode.
4. the film formation method that dewaters as claimed in claim 1 is characterized in that, this suction material is a sedimentary origin (deposition source) material.
5. the film formation method that dewaters as claimed in claim 4 is characterized in that, this suction material is an organo-metallic compound (organometalic complex compound).
6. the film formation method that dewaters as claimed in claim 4 is characterized in that, this suction material is an alkali metal compound (alkaline metal compound).
7. the film formation method that dewaters as claimed in claim 4 is characterized in that, this suction material is an alkaline earth metal compound (alkaline earth metal compound).
8. the film formation method that dewaters as claimed in claim 4 is characterized in that, this suction material is a sulfur-bearing metallic compound (sulfate compound).
9. the film formation method that dewaters as claimed in claim 4 is characterized in that, this suction material is a metal halide (metal halide compound).
10. the film formation method that dewaters as claimed in claim 4 is characterized in that, this suction material is a mistake chloric acid compound (perchlorate compound).
11. the film formation method that dewaters as claimed in claim 4 is characterized in that, this suction material is an organic compound (organic compound).
12. the film formation method that dewaters of a cover plate comprises:
A prefabricated cover plate;
One suction material is provided; It is characterized in that,
The material that should absorb water is formed on this cover plate to form the film that dewaters with depositional mode.
13. the film formation method that dewaters of cover plate as claimed in claim 12 is characterized in that, this depositional mode is a vapour deposition mode.
14. the film formation method that dewaters of cover plate as claimed in claim 12 is characterized in that, this depositional mode is an evaporation mode.
15. the film formation method that dewaters of an organic illuminating element comprises:
A prefabricated substrate is formed with one first electrode, an organic luminous layer and one second electrode in regular turn on this substrate;
One suction material is provided; It is characterized in that,
The material that should absorb water is formed at this substrate top to form the film that dewaters with depositional mode.
16. the film formation method that dewaters of organic illuminating element as claimed in claim 15 is characterized in that, this film that dewaters is to be formed on this second electrode.
17. the film formation method that dewaters of organic illuminating element as claimed in claim 15 is characterized in that, this film that dewaters is to coat this first electrode, this organic luminous layer and this second electrode.
18. the film formation method that dewaters of organic illuminating element as claimed in claim 15 is characterized in that, this depositional mode is a vapour deposition mode.
19. the film formation method that dewaters of organic illuminating element as claimed in claim 15 is characterized in that, this depositional mode is an evaporation mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA021558930A CN1507086A (en) | 2002-12-12 | 2002-12-12 | Hydrophobic film forming process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA021558930A CN1507086A (en) | 2002-12-12 | 2002-12-12 | Hydrophobic film forming process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1507086A true CN1507086A (en) | 2004-06-23 |
Family
ID=34236078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA021558930A Pending CN1507086A (en) | 2002-12-12 | 2002-12-12 | Hydrophobic film forming process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1507086A (en) |
-
2002
- 2002-12-12 CN CNA021558930A patent/CN1507086A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1212662C (en) | Package structure of display element | |
| CN1244255C (en) | Organic EL device and its mfg. method | |
| CN1617636A (en) | Organic luminous panel with hydrophobic layer | |
| CN101080121A (en) | An organic EL part and its making method | |
| CN1815748A (en) | Double-side displaying apparatus | |
| CN1652643A (en) | Electro-optical apparatus, manufacturing method thereof, and electronic instrument | |
| CN101030628A (en) | A method of fabricating organic electro-luminescent devices | |
| CN1612650A (en) | Organic light-emitting display panel | |
| CN1802877A (en) | Organic semiconductor device and its manufacturing method | |
| CN1901246A (en) | Self-emission panel and method of manufacturing same | |
| US20100012966A1 (en) | Organic light emitting display apparatus and method of manufacturing the same | |
| CN1812156A (en) | Sealing member, self-emitting panel, and method of manufacturing self-emitting panel | |
| US20040070334A1 (en) | Encapsulated electrode | |
| CN1643989A (en) | Organic electroluminescence display panel | |
| CN1882203A (en) | Self-emission panel, self-emission panel sealing member, and self-emission panel manufacturing method | |
| CN100587998C (en) | Organic luminous panel with hydrophobic layer | |
| CN1732718A (en) | Manufacturing method of display device | |
| CN1655654A (en) | Panel substrate, display panel, organic EL panel, and method of manufacturing the same | |
| CN1678152A (en) | Organic electroluminescence device, manufacturing method thereof and electronic equipment | |
| KR20050117049A (en) | Organic electroluminescence display | |
| CN1291504C (en) | Organic LED with hydrophobic film and its manufacture | |
| CN1612648A (en) | Organic light-emitting display panel | |
| TWI249366B (en) | Organic EL panel and method for manufacturing the same | |
| CN1653852A (en) | Electroluminescent panel | |
| CN2613053Y (en) | Organic LED with water removing film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |