CN1507085A - Organic LED with hydrophobic fiml and its manufacture - Google Patents
Organic LED with hydrophobic fiml and its manufacture Download PDFInfo
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- CN1507085A CN1507085A CNA021558922A CN02155892A CN1507085A CN 1507085 A CN1507085 A CN 1507085A CN A021558922 A CNA021558922 A CN A021558922A CN 02155892 A CN02155892 A CN 02155892A CN 1507085 A CN1507085 A CN 1507085A
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Abstract
The organic LED includes one substrate, one first electrode formed on the substrate, one organic light emitting layer formed on the first electrode, one second electrode formed on the organic light emitting layer, one water eliminating film formed through deposition and one cover plate set over the second electrode and forming together with the substrate one airtight space, in which the first electrode, the organic light emitting layer, the second electrode and the water eliminating film are located. The present invention also provides the manufacture process of the organic LED. In addition, the water eliminating film may be also deposited on the cover plate.
Description
Technical field
The present invention relates to a kind of Organic Light Emitting Diode and manufacture method thereof, particularly a kind of Organic Light Emitting Diode and manufacture method thereof with the film that dewaters (drying film).
Background technology
Organic Light Emitting Diode (Organic Light-Emitting Diode) with its self-luminous, no visual angle, power saving, advantage such as processing procedure is easy, cost is low, high answer speed and full-colorization, make Organic Light Emitting Diode have great application potential, be expected to become the illumination of follow-on flat-panel screens and planar light source, comprise special light sources and general lighting.
Please refer to shown in Figure 1ly, Organic Light Emitting Diode 1 comprises a substrate 11, one first electrode 12, an organic luminous layer 13, one second electrode 14 and a cover plate 15.Wherein, the substrate 11 and first electrode 12 are light-transmitting materials, and first electrode 12 and second electrode 14 are respectively as anode and negative electrode; When imposing an electric current in Organic Light Emitting Diode 1, the electricity hole is injected by first electrode 12, electronics is injected by second electrode 14 simultaneously, at this moment, because the potential difference that extra electric field caused, make carrier in organic luminous layer 13, move, meet and produce combination again that can excite light emitting molecule in the organic luminous layer 13 and combine the exciton (exciton) that is produced with electric hole by electronics, the light emitting molecule of excitation state gives off energy with the form of light then.
Generally speaking, Organic Light Emitting Diode is the element that a kind of self luminous characteristic of utilizing organic functional material (organicfunctional materials) reaches display effect.
From the above, the normal dedining mechanism that takes place is the not generation of light-emitting zone (dark spot) in Organic Light Emitting Diode, therefore will promote the durability (durability) of Organic Light Emitting Diode, just is how to reduce the not generation of light-emitting zone.And the organic functional material in the organic LED structure and easy and airborne moisture and oxygen reaction (especially moisture) as second electrode of negative electrode cause the not generation of light-emitting zone.Therefore, it is considerable moisture being removed completely.So, generally when making Organic Light Emitting Diode, can under vacuum state, carry out plated film usually, and the mode to encapsulate, Organic Light Emitting Diode is sealed.But such mode can't guarantee fully that still Organic Light Emitting Diode can not be subjected to the influence of moisture and cause the not generation of light-emitting zone.
As mentioned above, in order thoroughly to prevent the not generation of light-emitting zone, and then promoting the life-span and the stability of Organic Light Emitting Diode, primarily is the water of removing Organic Light Emitting Diode inside fully.A kind of common mode is to add a water absorbing agent (water-trapping agent) or drier (drying agent) in the inside of Organic Light Emitting Diode.In order to solve the not generation of light-emitting zone of Organic Light Emitting Diode inside, existing several relevant patent application cases: in European patent case EP0776147, propose as people such as Kawami, Organic Light Emitting Diode is sealed in one contains in sealing (airtight) container of the solid material of chemical water absorption character, the compound that this class has chemical water absorption character comprises metal oxides such as calcium oxide and barium monoxide.And in British patent case GB2368192, people such as Hisamitsu use organo-metallic compound (organometallic compound) as the suction material, therefore organo-metallic compound can effectively be adsorbed with the water of OLED inside, simultaneously can adsorb other chemical water absorbing agent (chemical drying agents) and physics water absorbing agent (physical drying agents), and then reach and prevent the not generation of light-emitting zone.And in United States Patent (USP) case US6226890, people such as Boroson propose, the drier blending is had in the adhesive agent (binder) of aqueous vapor percent of pass (water vaportransmission rate) preferably in one, make it in Organic Light Emitting Diode, form a film again, make it can have better or keep the soaking effect of this solid drier.
In more detail, the mode that material is filled in the Organic Light Emitting Diode that generally will absorb water has two kinds; Please refer to shown in Fig. 2 A, the first material 26 that will absorb water earlier fills in one and has been precast with in the cover plate 25 of groove 251, add the permeable film 27 of last layer again in groove 251 tops, push-down stack (shown in Fig. 2 B) on the Organic Light Emitting Diode that the cover plate 25 of suction material 26 will be housed subsequently and prepare, and with sealing 252 with cover plate 25 and substrate 21 driving fits forming a seal cavity, and first electrode 22, organic luminous layer 23, second electrode 24, permeable film 27 and suction material 26 are arranged in this seal cavity.But use this technology,, need to add the permeable film 27 of last layer simultaneously, so will increase the complexity on the processing procedure, make the yield of producing reduce and heighten with manufacturing cost because need in groove 251, load suction material 26.
In addition, please refer to shown in Fig. 3 A, its two be will suction material 36 blending in the Polymer Solution of tool water penetration, mode by coating, formation one includes the film 37 of suction material 36 on cover plate 35, subsequently again with removal of solvents, then again with push-down stack (shown in Fig. 3 B) on cover plate 35 and the Organic Light Emitting Diode that has prepared, and with sealing 351 with cover plate 35 and substrate 31 driving fits forming a seal cavity, and first electrode 32, organic luminous layer 33, second electrode 34, film 37 and suction material 36 are arranged in this seal cavity.Though this mode is comparatively approaching with encapsulation procedure on processing procedure; and reduced the complexity on the process technique; but after coating process; must toast processing procedure with removal of solvents; regular meeting causes and still residual in the Organic Light Emitting Diode partly solvent is arranged as a result; thereby cause the deterioration of sealing 351, and then make the peeling off of substrate 31 and cover plate 35, and cause the damage of element.
Above-mentioned for example in, the suction material is to utilize coating method, and utilizes Polymer Solution to be fixed on Organic Light Emitting Diode inside to form one except that water layer as the adhesive agent material that will absorb water; Yet, the organic luminous layer in the Organic Light Emitting Diode and second electrode, be to utilize the vacuum moulding machine mode to form, can't reach processing procedure and be incorporated under the identical operations pressure with the water layer coating process that removes under the normal pressure, and need vacuum breaker to cause that processing procedure is complicated, yield reduces, manufacturing cost increases; Moreover, form one with coating method and remove the problem that water layer also has hole (pin hole) and coating dead angle.
In addition, when utilizing adhesive agent to fix the suction material, the thickness that removes water layer can't lower effectively, thereby can limit the degree of dwindling of the thickness of Organic Light Emitting Diode; Particularly Organic Light Emitting Diode is because of simple in structure, its thickness of formed flat-panel screens can be thinner than LCD, it is not good but to be subject to the existing suction material usefulness that dewaters, and make and the time need add a large amount of suction materials in encapsulation, make Organic Light Emitting Diode thickness increase, sacrificed the advantage that organic light emitting display can be thinner; In addition, when utilizing adhesive agent to fix the suction material, the suction material that only is fixed in the laminar surface that dewaters can touch the hydrone of Organic Light Emitting Diode inside, so, the suction material that only is fixed in the laminar surface that dewaters can reach the effect of adsorbed water molecule, thereby can't effectively bring into play the adsorption capacity of suction material.
Therefore, how a kind of Organic Light Emitting Diode and manufacture method thereof are provided, form except that water layer, reduce to remove the thickness of water layer and effectively bring into play the adsorption capacity of removing water layer, one of important topic of current opto-electronics just in the hope of the operating environment that can integrate deposition manufacture process and encapsulation procedure.
Summary of the invention
At the problems referred to above, purpose of the present invention is for providing a kind of Organic Light Emitting Diode and manufacture method thereof of the film thickness that can reduce to dewater.
Another object of the present invention is for providing a kind of Organic Light Emitting Diode and the manufacture method thereof that can effectively bring into play the adsorption capacity of the film that dewaters.
Another purpose of the present invention forms the Organic Light Emitting Diode and the manufacture method thereof of the film that dewaters for a kind of operating environment that can integrate deposition manufacture process and encapsulation procedure is provided.
For reaching above-mentioned purpose, utilize depositional mode to form the film that dewaters according to Organic Light Emitting Diode of the present invention and manufacture method thereof.
Organic Light Emitting Diode of the present invention comprises a substrate, one first electrode, an organic luminous layer, one second electrode, dewater a film and a cover plate.In the present invention, first electrode is formed on the substrate, organic luminous layer is formed on first electrode, second electrode is formed on the organic luminous layer, cover plate is arranged at second electrode top, and form a seal cavity with substrate, so that first electrode, organic luminous layer, second electrode and the film that dewaters are placed in this seal cavity, and the film that dewaters is formed with depositional mode.
In addition, the present invention also provides a kind of production method of organic light emitting diode, and it comprises provides a substrate, in forming one first electrode on the substrate, form an organic luminous layer on first electrode, form one second electrode on organic luminous layer, forming a dewater a film and cover plate is arranged at second electrode top in the substrate top with depositional mode.In the present invention, cover plate and substrate form a seal cavity, wherein are equipped with first electrode, organic luminous layer, second electrode and the film that dewaters.
In addition, the present invention provides another kind of production method of organic light emitting diode again, it comprise provide a substrate, in form one second electrode on the substrate, on first electrode, form an organic luminous layer, in forming one second electrode on the organic luminous layer, a cover plate is provided, on cover plate, forms a dewater film and cover plate being arranged at above second electrode with depositional mode.In the present invention, cover plate and substrate form the seal cavity of ccontaining first electrode, organic luminous layer, second electrode and the film that dewaters, and the side that is formed with the film that dewaters in the cover plate is towards second electrode.
As mentioned above, owing to comply with Organic Light Emitting Diode of the present invention and manufacture method thereof and utilize depositional mode to form the film that dewaters, so the operating environment that can integrate deposition manufacture process and encapsulation procedure when formation dewaters film is to reduce manufacturing cost, reduce organic illuminating element and before encapsulation procedure, be exposed to chance under the atmospheric environment promoting yield, and utilize deposition manufacture process can avoid problem of solvent residue and save cost; In addition, owing to need not use adhesive agent to fix the suction material, so the thickness of the film that can reduce to dewater, and the dewater adsorption capacity of film of performance effectively.
Relevant detailed content of the present invention and technology, conjunction with figs. is described as follows.
Description of drawings
Fig. 1 is a schematic diagram, shows the schematic diagram of existing Organic Light Emitting Diode;
Fig. 2 A is a schematic diagram, shows the cover plate of existing Organic Light Emitting Diode and the schematic diagram of suction material;
Fig. 2 B is a schematic diagram, shows the schematic diagram of existing Organic Light Emitting Diode, and it has cover plate and suction material shown in Fig. 2 A;
Fig. 3 A is a schematic diagram, shows the cover plate of another existing Organic Light Emitting Diode and the schematic diagram of suction material;
Fig. 3 B is a schematic diagram, shows the schematic diagram of another existing Organic Light Emitting Diode, and it has the schematic diagram of the cover plate as shown in Figure 3A and the material that absorbs water;
Fig. 4 is a schematic diagram, shows the schematic diagram according to the Organic Light Emitting Diode of preferred embodiment of the present invention;
Fig. 5 A, 5B, 5C are schematic diagram, show that the film that wherein dewaters is formed at diverse location according to the schematic diagram of the Organic Light Emitting Diode of the other preferred embodiment of the present invention;
Fig. 6 is a flow chart, shows the flow process of the production method of organic light emitting diode of preferred embodiment of the present invention, and the film that wherein dewaters is formed at the substrate top; And
Fig. 7 is a flow chart, shows the flow process of the production method of organic light emitting diode of another preferred embodiment of the present invention, and the film that wherein dewaters is formed on the cover plate.
Symbol description among the figure
1 Organic Light Emitting Diode
11 substrates
12 first electrodes
13 organic luminous layers
14 second electrodes
15 cover plates
21 substrates
22 first electrodes
23 organic luminous layers
24 second electrodes
25 cover plates
251 grooves
252 sealings
26 suction materials
27 permeable films
31 substrates
32 first electrodes
33 organic luminous layers
34 second electrodes
35 cover plates
351 sealings
36 suction materials
37 films
4 Organic Light Emitting Diodes
41 substrates
42 first electrodes
43 organic luminous layers
44 second electrodes
45 films that dewater
46 cover plates
461 sealings
The production method of organic light emitting diode of 6 a preferred embodiment of the present invention
The flow process of the production method of organic light emitting diode of 601～606 a preferred embodiment of the present invention
The production method of organic light emitting diode of 7 another preferred embodiments of the present invention
The flow process of the production method of organic light emitting diode of 701～707 another preferred embodiments of the present invention
Embodiment
Hereinafter with reference to relevant drawings, the Organic Light Emitting Diode of preferred embodiment of the present invention is described, wherein components identical will be illustrated with identical reference marks.
Please refer to shown in Figure 4ly, the Organic Light Emitting Diode 4 of preferred embodiment of the present invention comprises a substrate 41, one first electrode 42, an organic luminous layer 43, one second electrode 44, dewater a film 45 and a cover plate 46.
As shown in Figure 4, first electrode 42 be formed at substrate 41 on; Organic luminous layer 43 be formed at first electrode 42 on; Second electrode 44 be formed at organic luminous layer 43 on; Cover plate 46 is formed at the top of second electrode 44; And the film 45 that dewaters is positioned at cover plate 46 on the side of the second Shen utmost point 44.
In the present embodiment, substrate 41 is generally a transparency carrier, for example a glass substrate, plastics (plastic) substrate or a flexibility (flexible) substrate.Wherein, plastic base and flexible base, board can be a Merlon (polycarbonate, PC) substrate, a polyester (polyester, PET) substrate, a cyclenes copolymer (cyclic olefin copolymer, COC) substrate, a crome metal compound base material one cyclenes copolymer (metallocene-based cyclic olefincopolymer, mCOC) substrate or a slim glass (Thin Glass) substrate.
Organic luminous layer 43 comprises an electric hole implanted layer, an electric hole transfer layer, a luminescent layer, an electron transfer layer and an electron injecting layer (not shown) usually.For example, the main material of electric hole implanted layer is copper phthalocyanine (CuPc); The material of electricity hole transport layer is mainly 4,4 '-bis[N-(1-naphthyl)-N-phenylamino] biphenyl (NPB); The material of electron injecting layer is mainly lithium fluoride (LiF); The material of electron transfer layer is mainly tris (8-quinolinato-N1,08)-aluminum (Alq).And organic luminous layer 43 can be formed on first electrode 42 with evaporation (evaporation), rotary coating (spin coating), ink jet printing (inkjet printing) or printing (printing) mode.In addition, the light launched of organic luminous layer 43 can be blue light, green glow, ruddiness, white light, other monochromatic light or full-color light.
The film 45 that dewaters utilizes depositional mode to form, and for example is vapour deposition (vapordeposition), physical vapour deposition (PVD) (physical vapor deposition), chemical vapour deposition (CVD) (chemical vapor deposition) or evaporation (evaporation).In the present embodiment, the material of the film 45 that dewaters be for can be used as the material of sedimentary origin (deposition source), that is is that it can be applied in the deposition manufacture process, and it has the material of adsorbed water molecule ability; The material of this film 45 that dewaters can be organo-metallic compound (organometaliccomplex compound), alkali metal compound (alkaline metal compound), alkali metal oxide (alkaline metal oxide compound), alkaline earth metal compound (alkalineearth metal compound), alkaline earth oxide (alkaline earth metal oxidecompound), sulfur-bearing metallic compound (sulfate compound), metal halide (metalhalide compound), cross chloric acid compound (perchlorate compound), or organic compound (organic compound).
In addition, the film 45 that dewaters can also be to be deposited on second electrode 44 or the substrate 41; Shown in Fig. 5 A, in Organic Light Emitting Diode according to another preferred embodiment of the present invention, the film 45 that dewaters be formed on second electrode 44 and first electrode 42 around substrate 41 on; Shown in Fig. 5 B, the film 45 that dewaters can also be to coat first electrode 42, organic luminous layer 43 and second electrode 44.
In addition, know the feature that the operator can also merge the foregoing description, the film that for example will dewater is formed on the cover plate simultaneously, on second electrode and on the substrate (shown in Fig. 5 C).
For content of the present invention is more readily understood, below will lift several examples, with the flow process of production method of organic light emitting diode of explanation preferred embodiment of the present invention.
Please refer to shown in Figure 6ly, the manufacture method 6 of the Organic Light Emitting Diode of preferred embodiment of the present invention comprises following several steps.
At first, step 601 provides a substrate.In the present embodiment, this substrate can be transparent material.One glass substrate of matter, a plastic substrate or a flexible base, board.
Then, step 602 forms one first electrode on substrate.In the present embodiment, first electrode utilizes sputtering way or the ion plating mode is formed on the substrate, and its material for example is a tin indium oxide.
In step 603, an organic luminous layer is formed on first electrode.In the present embodiment, organic luminous layer can be a single layer structure, and in addition, organic luminous layer can also be the plural layer structure, for example comprises an electric hole implanted layer, an electric hole transfer layer, a luminescent layer, an electron transfer layer and an electron injecting layer.
Step 604 forms one second electrode on organic luminous layer.In the present embodiment, second electrode can be to utilize vapour deposition method, electron beam coating method or sputtering method forms.
Step 605 forms the film that dewaters with depositional mode in substrate top.In the present embodiment, the film that dewaters can be to utilize vapour deposition, physical vapour deposition (PVD), chemical vapour deposition (CVD) or evaporation mode to form, and its position can be positioned on second electrode, the combination of on the substrate or above-mentioned position, the film that dewaters in addition can also be to coat first electrode, organic luminous layer and second electrode.Be noted that, the material of film of dewatering is to have adsorbed water molecule ability and can be as the material of sedimentary origin, for example be vapor deposition source (evaporation source), the material of this film that dewaters can be organo-metallic compound, alkali metal compound, alkali metal oxide, alkaline earth metal compound, alkaline earth oxide, sulfur-bearing metallic compound, metal halide, cross chloric acid compound or organic compound.
At last, step 606 is arranged at second electrode top to form a seal cavity with substrate with a cover plate.In the present embodiment, be provided with sealing on the substrate in advance, and then cover plate is placed in the sealing, so that form above-mentioned seal cavity, and first electrode, organic luminous layer, second electrode and the film that dewaters are arranged in seal cavity.
In addition, please refer to shown in Figure 7ly, the manufacture method 7 of the Organic Light Emitting Diode of another preferred embodiment of the present invention comprises following several steps.
In the present embodiment, step 701～704 are step 601～604 as the aforementioned, so no longer set forth.
Step 705 provides a cover plate, and step 706 forms the film that dewaters with depositional mode in cover plate top then.In the present embodiment, the film that dewaters can be to utilize vapour deposition, physical vapour deposition (PVD), chemical vapour deposition (CVD) or evaporation mode to form.
At last, step 707 is arranged at second electrode top forming a seal cavity with substrate with cover plate, and the side that is formed with the film that dewaters on the cover plate is to put towards second electrode.In the present embodiment, be provided with sealing on the substrate in advance, and then cover plate is placed in the sealing, so that form above-mentioned seal cavity, and first electrode, organic luminous layer, second electrode and the film that dewaters are arranged in seal cavity.
In sum, owing to utilize depositional mode to form the film that dewaters according to Organic Light Emitting Diode of the present invention, so when formation dewaters film, can integrate the operating environment of encapsulation procedure and leading portion deposition manufacture process, it for example is the deposition manufacture process when forming second electrode, so manufacturer must not spend extra cost and remove to build the environment of execution coating process, reaches to buy and carry out the board of coating process, thereby can reduce manufacturing cost.In addition, the dissolvent residual problem of utilizing depositional mode to form to dewater film can avoid existing coating adhesive agent mode to be caused, and the thickness of the film that can reduce effectively to dewater, can avoid the interference of adhesive agent in addition and the dewater hydrone adsorption capacity of film of performance effectively.
The above only is an illustrative, but not is restricted person.Anyly do not break away from spirit of the present invention and category, and, all should be contained among the scope of claim its equivalent modifications of carrying out or change.
Claims (20)
1. Organic Light Emitting Diode comprises:
One substrate;
One first electrode, it is formed on this substrate;
One organic luminous layer, it is formed on this first electrode;
One second electrode, it is formed on this organic luminous layer;
One cover plate, it is arranged at this second electrode top, and forms a seal cavity (airtight space) with this substrate, and this first electrode, this organic luminous layer and this second electrode are arranged in the sealing space; And
One film that dewaters, it is formed in the sealing space,
It is characterized in that:
This film that dewaters is formed in the sealing space in deposition (deposition) mode.
2. Organic Light Emitting Diode as claimed in claim 1 is characterized in that, this film that dewaters is formed on the side of this cover plate with depositional mode.
3. Organic Light Emitting Diode as claimed in claim 1 is characterized in that, this film that dewaters is formed on this second electrode with depositional mode.
4. Organic Light Emitting Diode as claimed in claim 1 is characterized in that, this film that dewaters is formed at this substrate top with depositional mode.
5. Organic Light Emitting Diode as claimed in claim 1 is characterized in that, this film that dewaters is formed in vapour deposition (vapor deposition) mode.
6. Organic Light Emitting Diode as claimed in claim 1 is characterized in that, this film that dewaters is formed in evaporation (evaporation) mode.
7. Organic Light Emitting Diode as claimed in claim 1 is characterized in that, the material of this film that dewaters is a sedimentary origin (deposition source) material.
8. Organic Light Emitting Diode as claimed in claim 7, it is characterized in that the material of this film that dewaters is selected from organo-metallic compound (organometalic complex compound), alkali metal compound (alkaline metal compound), alkaline earth metal compound (alkalineearth metal compound), sulfur-bearing metallic compound (sulfate compound), metal halide (metal halide compound), cross chloric acid compound (perchloratecompound), organic compound (organic compound) become group at least one of them.
9. production method of organic light emitting diode comprises:
One substrate is provided;
On this substrate, form one first electrode;
On this first electrode, form an organic luminous layer;
On this organic luminous layer, form one second electrode;
Form the film that dewaters in this substrate top; And
One cover plate is arranged at this second electrode top to form a seal cavity with this substrate, and this first electrode, this organic luminous layer, this second electrode and this film that dewaters are arranged in the sealing space,
It is characterized in that:
This film that dewaters is formed with depositional mode.
10. production method of organic light emitting diode as claimed in claim 9 is characterized in that, this film that dewaters is formed on this second electrode with depositional mode.
11. production method of organic light emitting diode as claimed in claim 9 is characterized in that, this film that dewaters is formed on this substrate with depositional mode.
12. production method of organic light emitting diode as claimed in claim 9 is characterized in that, this film that dewaters is formed in the vapour deposition mode.
13. production method of organic light emitting diode as claimed in claim 9 is characterized in that, this film that dewaters is formed in the evaporation mode.
14. production method of organic light emitting diode as claimed in claim 9 is characterized in that, the material of this film that dewaters is a deposition source material.
15. production method of organic light emitting diode as claimed in claim 14, it is characterized in that, the material of this film that dewaters be selected from organo-metallic compound, alkali metal compound (alkalinemetal compound), alkaline earth metal compound (alkaline earth metal compound), sulfur-bearing metallic compound (sulfate compound), metal halide (metal halidecompound), cross chloric acid compound (perchlorate compound), organic compound (organiccompound) become group at least one of them.
16. a production method of organic light emitting diode comprises:
One substrate is provided;
On this substrate, form one first electrode;
On this first electrode, form an organic luminous layer;
On this organic luminous layer, form one second electrode;
One cover plate is provided;
On this cover plate, form the film that dewaters; And
This cover plate is arranged at this second electrode top to form a seal cavity with this substrate, the side that is formed with this film that dewaters in this cover plate is towards this second electrode, this first electrode, this organic luminous layer, this second electrode and this film that dewaters are to be arranged in the sealing space
It is characterized in that:
This film that dewaters is formed with depositional mode.
17. production method of organic light emitting diode as claimed in claim 16 is characterized in that, this film that dewaters is formed in the vapour deposition mode.
18. production method of organic light emitting diode as claimed in claim 16 is characterized in that, this film that dewaters is formed in the evaporation mode.
19. production method of organic light emitting diode as claimed in claim 16 is characterized in that, the material of this film that dewaters is a deposition source material.
20. production method of organic light emitting diode as claimed in claim 19, it is characterized in that, the material of this film that dewaters is selected from organo-metallic compound, alkali metal compound (alkaline metalcompound), alkaline earth metal compound (alkaline earth metal compound), sulfur-bearing metallic compound (sulfate compound), metal halide (metal halidecompound), crosses chloric acid compound (perchlorate compound), organic compound (organiccompound) become group at least one of them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021558922A CN1266782C (en) | 2002-12-12 | 2002-12-12 | Organic LED with hydrophobic fiml and its manufacture |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021558922A CN1266782C (en) | 2002-12-12 | 2002-12-12 | Organic LED with hydrophobic fiml and its manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1507085A true CN1507085A (en) | 2004-06-23 |
| CN1266782C CN1266782C (en) | 2006-07-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021558922A Expired - Fee Related CN1266782C (en) | 2002-12-12 | 2002-12-12 | Organic LED with hydrophobic fiml and its manufacture |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103066217A (en) * | 2013-01-18 | 2013-04-24 | 南京邮电大学 | Method for preparing super-hydrophobic film for encapsulating flexible organic luminescent device |
| CN111599934A (en) * | 2020-05-07 | 2020-08-28 | Tcl华星光电技术有限公司 | Display panel and preparation method thereof |
-
2002
- 2002-12-12 CN CNB021558922A patent/CN1266782C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103066217A (en) * | 2013-01-18 | 2013-04-24 | 南京邮电大学 | Method for preparing super-hydrophobic film for encapsulating flexible organic luminescent device |
| CN103066217B (en) * | 2013-01-18 | 2015-05-06 | 南京邮电大学 | Method for preparing super-hydrophobic film for encapsulating flexible organic luminescent device |
| CN111599934A (en) * | 2020-05-07 | 2020-08-28 | Tcl华星光电技术有限公司 | Display panel and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1266782C (en) | 2006-07-26 |
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Granted publication date: 20060726 Termination date: 20121212 |