CN1492225A - Method and system for inpact resistance test in optimizing design of package and buffering piece - Google Patents
Method and system for inpact resistance test in optimizing design of package and buffering piece Download PDFInfo
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Abstract
The impact resistance test method in optimizing package and buffering element includes acquiring the impact signal the tested falling sample bears during falling with an impact signal acquiring device, and then processing and calculating with the impact signal to obtain impact load value. The system for implementing the method includes an impact signal acquiring device, vibration signal processing and analyzing system, and falling test device. The falling test device is for setting the tested falling sample to complete the falling test; the impact signal acquiring device is set onto the tested falling sample and connected to the vibration signal processing and analyzing system for acquiring and sending the impact signal; and the vibration signal processing and analyzing system receives the impact signal and obtains the impact load via signal processing and conversion. The present invention measures the practical borne impact load to optimize package design, utilize packing material effectively and lower the package cost.
Description
Technical Field：
The invention relates to a method and a system for impact resistance testing in optimized design of a package and a buffer part, in particular to a method and a system for obtaining measurement data for guiding design by performing impact testing on a designed sample in the design process of the package and the buffer part.
Background：
During the transportation, loading and unloading of products, packaging (including packaging boxes and buffers) is an important protection device for electromechanical products such as PCs, servers and chassis. Electromechanical products such as PCs, servers and cabinets may be subjected to processes such as: destructive impacts caused by dynamic pressure, impact, vibration, falling, rolling, tipping and the like, which may cause failure of precision hardware such as hard disks, memories and the like and damage of mechanical parts such as cabinets (machine cabinets) and the like, so that the quality of products cannot be finally guaranteed.
The cost of packaging and the loss caused by unscientific packaging (for example, the impact resistance of the packaging can not meet the requirement, so that the carried product is damaged) are high in China every year. Therefore, it is urgent to provide a scientific and effective design method for the design of the package.
The traditional packaging design method is to design the packaging according to the weight and the geometric dimension of the product and by experience, and the packaging design method is blind, and the specific load condition born by the product and the important parts thereof in the carrying process is unknown, so that the packaging which can ensure the safety of the product and the important parts thereof cannot be really designed; at the same time, it is an uneconomical practice that: to protect the product from damage, more and better packaging materials are used blindly. This method not only increases the cost of the product, but also wastes resources such as wood, and it is not always completely guaranteed that the load of the product is reduced.
Therefore, in order to save most of the packaging materials of the product and completely meet the impact resistance requirement of the product in structure, the scientific impact resistance test of the corresponding design sample is very critical in the design process of the package and the buffer part thereof.
Disclosure of Invention：
The invention mainly aims to provide a method and a system for impact resistance test in optimized design of a package and a buffer part, which are used for testing the impact load actually born by an electronic product in the carrying process and providing a technical basis for the optimized design of a package structure.
Another object of the present invention is to provide a method and system for impact resistance testing in optimized design of packages and buffers, whereby packaging materials can be used reasonably and effectively in product packaging design, avoiding waste of materials and reducing packaging cost.
The purpose of the invention is realized by the following technical scheme:
a method for impact resistance test in optimized design of package and buffer parts at least comprises the following steps:
step 1: collecting impact signals borne by a tested falling sample when the tested falling sample falls by utilizing an impact signal collecting device;
step 2: and (3) processing and calculating the impact signal obtained in the step (1) to obtain an impact load value.
The acquisition of the impact signal in the step 1 is specifically as follows:
step 11: the impact signal acquisition devices are arranged in the three-dimensional space direction of the detected falling sample, wherein the two directions are mutually vertical;
step 12: placing the tested drop sample on a drop test device for a drop test;
step 13: when the robot falls off, the impact signal acquisition device measures an impact signal;
step 14: and calculating the impact acceleration borne by the layout points of the impact signal acquisition device according to the calibration coefficient.
The impact signal acquisition device at least comprises: the device comprises an acceleration sensor, a charge conversion module, a filtering module and an analog-to-digital conversion module which are connected in sequence.
The impact signal acquisition device at least comprises: the device comprises an acceleration sensor, a charge conversion module, a filtering module, an analog-to-digital conversion module and a wireless transmitting module which are sequentially connected.
The impact signal acquisition device at least comprises: the shock signal acquisition and recording device records the vibration signals acquired by the acceleration sensor and transmits the recorded data to the vibration signal processing and analyzing system.
The processing of the impact signal in the step 2 includes:
calculating the impact acceleration vector born by each sensor according to the following formula to obtain the magnitude and the direction of the actual impact load born by the measured falling sample;
wherein, λ is the impact acceleration actually borne by the measured point;
alpha is the phase angle of the impact acceleration actually born by the measured point;
x, Y, Z are the impact accelerations correspondingly born by the measured points in the three-dimensional directions respectively.
A shock-resistant test system in packaging and buffer member design at least comprises a shock signal acquisition device, a vibration signal processing and analyzing system and a drop test device; wherein,
the drop test equipment is used for placing a tested drop sample to complete the drop test of the sample;
the impact signal acquisition device is arranged on the detected falling sample, acquires an impact signal when the detected falling sample falls, and sends a device signal to the vibration signal processing and analyzing system;
and the vibration signal processing and analyzing system is used for receiving the impact signal sent by the impact signal acquisition device and converting the signal into an impact load value.
The specific method for acquiring the impact signal by using the vibration signal acquisition device comprises the following steps:
arranging impact signal acquisition devices in a three-dimensional space direction perpendicular to each other of the tested falling samples;
placing the tested drop sample on a drop test device for a drop test;
and when the robot falls, the impact signal acquisition device measures an impact signal.
The impact signal acquisition device at least comprises: the device comprises an acceleration sensor, a charge conversion module, a filtering module and an analog-to-digital conversion module which are connected in sequence.
The impact signal acquisition device at least comprises: the device comprises an acceleration sensor, a charge conversion module, a filtering module, an analog-to-digital conversion module and a wireless transmitting module which are sequentially connected.
The impact signal acquisition device at least comprises: the vibration signal processing and analyzing system comprises an acceleration sensor and an impact signal acquiring and recording device connected with the acceleration sensor, wherein the impact signal acquiring and recording device records an impact signal acquired by the acceleration sensor and transmits the recorded data to the vibration signal processing and analyzing system.
The vibration signal processing and analyzing system is at least provided with a data acquisition module and a signal processing and calculating module which are connected in sequence.
The vibration signal processing and analyzing system is at least provided with a wireless receiving module, a data acquisition module and a signal processing and calculating module which are sequentially connected.
The vibration signal processing and analyzing system converts the vibration signal into an impact load value, and the processing is specifically as follows:
calculating the impact acceleration vector born by each sensor according to the following formula to obtain the magnitude and the direction of the actual impact load born by the measured falling sample;
wherein, λ is the impact acceleration actually borne by the measured point;
alpha is the phase angle of the impact acceleration actually born by the measured point;
x, Y, Z are the impact accelerations correspondingly born by the measured points in the three-dimensional directions respectively.
According to the technical scheme, the impact load actually born by the electronic product in the carrying process is tested, and a technical basis is provided for the optimized design of a packaging structure; meanwhile, the reasonability and effectiveness of the use of the packaging material can be guided in the product packaging design, the material waste is avoided, and the packaging cost is reduced.
The method for testing the impact resistance of the product package can guide engineering technicians to design the optimal package which saves most materials, has excellent and reliable buffering performance and can meet the technical requirement of the mechanical and electrical product on the carrying impact resistance; the huge loss of the product caused by the packaging problem is effectively avoided.
Drawings：
FIG. 1 is a schematic view of the dynamic cushioning curve of the packaging material of the present invention.
Fig. 2 is a schematic diagram of a wired acquisition process of an impact signal according to an embodiment of the present invention.
Fig. 3 is a system diagram of a wired transmission method of an acceleration sensor according to an embodiment of the invention.
Fig. 4 is a schematic diagram of a connection arrangement of an acceleration sensor and a drop sample to be measured in a manner of wired transmission of an impact signal according to an embodiment of the present invention.
Fig. 5 is a schematic view of a wireless acquisition process of an impact signal according to another embodiment of the present invention.
Fig. 6 is a system diagram of a wireless transmission method of an acceleration sensor according to another embodiment of the present invention.
Fig. 7 is a schematic view of a connection arrangement of a wireless transmitting module, an acceleration sensor and a measured drop sample according to still another embodiment of the invention.
Fig. 8 is a schematic view of an acquisition flow of the impact signal micro vibration signal acquisition recorder according to still another embodiment of the present invention.
Fig. 9 is a schematic system diagram of a mode of recording the acquired impact signal by the acceleration sensor through the micro vibration signal acquisition recorder according to still another embodiment of the present invention.
Fig. 10 is a schematic view of the connection arrangement of the acceleration sensor, the micro vibration signal acquisition recorder and the measured drop sample according to still another embodiment of the present invention.
Detailed Description：
The invention is described in further detail below with reference to the following figures and specific examples:
in the specific packaging design process, firstly, a packaging piece sample needs to be manufactured, then the packaging piece sample is tested, the collected test data is processed and analyzed, then the packaging piece sample is adjusted, and the experiment is repeated, and finally, the packaging piece meeting the requirements is designed. It can be seen from this that: the impact test of the package is a very important step in the whole design process.
Referring to fig. 1, it is data of a dynamic buffer curve of a packaging buffer material (based on a minimum brittle value point of the buffer material), and a plurality of product packaging buffer structures with the same structure size but different materials can be designed according to the weight of a product and allowable impact load (a packaging box made of the same material and having sufficient puncture strength and rupture strength is selected for packaging); then, the corresponding impact resistance test is carried out.
The package impact resistance test of the invention can be realized by three modes of a wired sensor, a wireless sensor, a miniature vibration signal acquisition recorder and the like:
example 1: referring to fig. 2, 3, 4, wired sensor approach:
in order to monitor the impact suffered by important vulnerable parts of electronic products in the carrying processThe load is formed by connecting three wired charge acceleration sensors (the frequency range of which is 0.5-8 KHz, the sensitivity coefficient of which is 1-2 pC/ms) on a vibration signal acquisition, processing and analysis system-2The limit range is 10000ms-2) The device is arranged in the three-dimensional space direction of the important wearing parts of the measured object which are mutually vertical in pairs; and then the packaging piece of the object to be tested is placed on a falling instrument to carry out a falling test, and the vibration signal processing and analyzing system acquires the impact signal of the acceleration sensor while the packaging piece falls.
The specific process of the vibration signal processing and analyzing system for acquiring the impact signal of the acceleration sensor is as follows: the method comprises the steps that a charge signal output by a sensor is converted into a voltage signal, the voltage signal is subjected to low-pass filtering and amplification through a multi-channel charge-voltage filtering integrating amplifier, the voltage signal is converted into a digital signal through analog-to-digital conversion (A/D conversion) of a data acquisition instrument, and then the magnitude of the impact acceleration borne by a sensor layout point of a vulnerable part is calculated by a vibration signal processing and analyzing system and corresponding analysis software according to a calibration coefficient (namely the corresponding relation between the output charge quantity of the sensor and the impact acceleration borne by the sensor).
And further, according to the calculated impact acceleration vectors borne by the three acceleration sensors which are distributed in the three-dimensional directions perpendicular to each other in pairs, calculating the size and the direction of the actual impact load borne by the important vulnerable part by utilizing a vibration signal processing and analyzing system and a vector superposition module of analysis software, wherein the specific basis algorithm is as follows:
wherein: lambda is the impact acceleration actually born by the vulnerable part;
alpha is the phase angle of the shock acceleration actually born by the vulnerable part;
x, Y, Z is the impact acceleration value correspondingly born by the three acceleration sensors arranged in the three-dimensional direction;
these load data are used to optimize the size and thickness of the cushioning material that minimizes the impact acceleration experienced by the critical consumable part.
Example 2: referring to fig. 5, 6, and 7, the wireless sensor approach:
the wireless mode is adopted to replace the signal wire of the existing sensor (namely, the wireless sensor is adopted), so that the difficulty of building the impact-resistant test platform can be greatly reduced, and various influences of the signal wire on the test process can be reduced. The transmission of the wireless sensor data can be divided into an instant transmission mode and a finish transmission mode, and the different modes have great influence on the selection of the wireless module.
The wireless mode can be based on a plurality of wireless transmission protocols with the signal of sensor, such as Radio Frequency (RF), infrared, bluetooth, domestic radio frequency (homeRF) etc. when setting up wireless sensor shock resistance test platform, can select for use according to particular case on the basis of factors such as the cost of comprehensive consideration, realization degree of difficulty. The radio frequency technology mainly utilizes full-duplex radio frequency to carry out communication, has high technical maturity, has very good safety due to encryption, has no directional limitation, has very good penetrability, even can penetrate metal, and has relatively low price. The defects are that no uniform standard exists, and the communication protocols of all companies are different; the infrared technology is a mature product with wide application and low cost. But the safety and the directivity are poor, the penetrability is avoided, the interference of various factors is easy to be caused, and a standard communication protocol is not available; bluetooth (IEEE802.15) is a recent standard. Bluetooth is more mobile than IEEE802.11 and can connect a device to a network, even supporting global roaming. In addition, bluetooth is expected to be lower in cost, smaller in size, and available for more devices. It can support one asynchronous data transmission channel and three synchronous voice transmission channels, the communication distance is 10-100m, and the bandwidth is about 1 Mbps. The radio frequency system of the Bluetooth adopts a frequency hopping technology to reduce signal interference, supports full duplex but still has high cost at present; HomeRF is designed primarily for home networking and is intended to reduce voice data costs. The HomeRF also adopts the spread spectrum technology, works in a 2.4GHz frequency band, can synchronously support 4 high-quality voice channels, and has the transmission rate of 1-2 Mb/s. However, since the development is relatively delayed, the application of the technology is limited and the cost is high.
In the embodiment, the radio frequency and infrared modes are suitable, and the transmission modes of bluetooth and HomeRF are only suitable for compact test (test occasions with a large number of sensors and a large amount of data to be transmitted).
The specific measurement process is as follows: the electric charge signal output by the sensor is converted into a voltage signal, the voltage signal is subjected to low-pass filtering and amplification by a multi-channel electric charge and voltage filtering integral amplifier, the voltage signal is converted into a digital signal by an A/D conversion circuit, the digital signal is sent to a wireless receiving module arranged at the front end of a vibration signal processing and analyzing system by a wireless transmitting module, and the vibration signal processing and analyzing system and corresponding analyzing software calculate the impact acceleration born by a sensor layout point of the vulnerable part according to a calibration coefficient (namely the corresponding relation between the output electric charge quantity of the sensor and the impact acceleration born by the sensor).
Compared with the wired sensor mode, the wireless mode has the same algorithm for processing the impact signal and the impact load except that the output mode of the sensor signal is different from the wired sensor mode.
Example 3: referring to fig. 8, 9 and 10, the vibration signal acquisition and recording mode is as follows:
and a miniature impact signal acquisition and recording device is arranged in the tested packing box and is connected with an acceleration sensor to acquire impact signals. The mode greatly reduces the workload of constructing the impact test platform, and is convenient and flexible to use.
The specific implementation method comprises the following steps: the miniature vibration signal acquisition recorder is fixed in a tested packing box, an acceleration sensor arranged on a vulnerable part is connected with the miniature vibration signal acquisition recorder through a signal line, and the miniature vibration signal acquisition recorder completes the signal acquisition work of the acceleration sensor in the process of impact testing. After the test is finished, the vibration signal collected by the miniature vibration signal collecting and recording instrument is transmitted to the vibration signal processing and analyzing system, and the vibration signal processing and analyzing system performs frequency spectrum analysis on the impact signal and calculation on the impact load.
Similarly, compared with the wired sensor mode, the method in this embodiment is the same as the algorithm for processing the impact signal and the impact load, except that the acquisition mode of the sensor signal is different from the wired sensor mode.
Although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes, modifications and equivalents may be made therein; without departing from the spirit and scope of the present invention, it should be understood that the present invention resides in the claims hereinafter appended.
Claims (14)
1. A method for impact resistance test in optimized design of packaging and buffer parts is characterized in that: it at least comprises the following steps:
step 1: collecting impact signals borne by a tested falling sample when the tested falling sample falls by utilizing an impact signal collecting device;
step 2: and (3) processing and calculating the impact signal obtained in the step (1) to obtain an impact load value.
2. The method for impact testing in optimized design of packaging and cushioning member according to claim 1, wherein: the specific process of acquiring the impact signal in the step 1 is as follows:
step 11: the impact signal acquisition devices are arranged in the three-dimensional space direction of the detected falling sample, wherein the two directions are mutually vertical;
step 12: placing the tested drop sample on a drop test device for a drop test;
step 13: when the robot falls off, the impact signal acquisition device measures an impact signal;
step 14: and calculating the impact acceleration borne by the layout points of the impact signal acquisition device according to the calibration coefficient.
3. The method for impact resistance testing in optimized design of packaging and cushioning member according to claim 1 or 2, wherein: the impact signal acquisition device at least comprises: the device comprises an acceleration sensor, a charge conversion module, a filtering module and an analog-to-digital conversion module which are connected in sequence.
4. The method for impact resistance testing in optimized design of packaging and cushioning member according to claim 1 or 2, wherein: the impact signal acquisition device at least comprises: the device comprises an acceleration sensor, a charge conversion module, a filtering module, an analog-to-digital conversion module and a wireless transmitting module which are sequentially connected.
5. The method for impact resistance testing in optimized design of packaging and cushioning member according to claim 1 or 2, wherein: the impact signal acquisition device at least comprises: the vibration signal processing and analyzing system comprises an acceleration sensor and an impact signal acquiring and recording device connected with the acceleration sensor, wherein the impact signal acquiring and recording device records an impact signal acquired by the acceleration sensor and transmits the recorded data to the vibration signal processing and analyzing system.
6. The method for impact testing in optimized design of packaging and cushioning member according to claim 1, wherein: the processing of the impact signal in the step 2 specifically comprises:
calculating the impact acceleration vector born by each sensor according to the following formula to obtain the magnitude and the direction of the actual impact load born by the measured falling sample;
wherein, λ is the impact acceleration actually borne by the measured point;
alpha is the phase angle of the impact acceleration actually born by the measured point;
x, Y, Z are the impact accelerations correspondingly born by the measured points in the three-dimensional directions respectively.
7. The utility model provides a system for shock resistance test in packing and bolster optimal design which characterized in that: the device at least comprises an impact signal acquisition device, a vibration signal processing and analyzing system and a drop test device; wherein,
the drop test equipment is used for placing a tested drop sample to complete the drop test of the sample;
the impact signal acquisition device is arranged on the detected falling sample, acquires an impact signal when the detected falling sample falls, and sends the impact signal to the vibration signal processing and analyzing system;
and the vibration signal processing and analyzing system is used for receiving the impact signal sent by the impact signal acquisition device and converting the signal into an impact load value.
8. The system for shock resistance testing in optimized packaging and cushioning design according to claim 7, wherein: the specific method for acquiring the impact signal by utilizing the impact signal acquisition device comprises the following steps:
arranging a vibration signal acquisition device in a three-dimensional space direction which is vertical to each other in pairs of the tested falling samples;
placing the tested drop sample on a drop test device for a drop test;
and when the robot falls, the impact signal acquisition device measures an impact signal.
9. The system for impact resistance testing in optimized design of packaging and cushioning member according to claim 7 or 8, wherein: the impact signal acquisition device at least comprises: the device comprises an acceleration sensor, a charge conversion module, a filtering module and an analog-to-digital conversion module which are connected in sequence.
10. The system for impact resistance testing in optimized design of packaging and cushioning member according to claim 7 or 8, wherein: this vibration signal acquisition device includes at least: the device comprises an acceleration sensor, a charge conversion module, a filtering module, an analog-to-digital conversion module and a wireless transmitting module which are sequentially connected.
11. The system for impact resistance testing in optimized design of packaging and cushioning member according to claim 7 or 8, wherein: the impact signal acquisition device at least comprises: the vibration signal processing and analyzing system comprises an acceleration sensor and an impact signal acquiring and recording device connected with the acceleration sensor, wherein the impact signal acquiring and recording device records an impact signal acquired by the acceleration sensor and transmits the recorded data to the vibration signal processing and analyzing system.
12. The system for shock resistance testing in optimized packaging and cushioning design according to claim 7, wherein: the vibration signal processing and analyzing system is at least provided with a data acquisition module and a signal processing and calculating module which are connected in sequence.
13. The system for shock resistance testing in optimized packaging and cushioning design according to claim 7, wherein: the vibration signal processing and analyzing system is at least provided with a wireless receiving module, a data acquisition module and a signal processing and calculating module which are sequentially connected.
14. The system for shock resistance testing in optimized packaging and cushioning design according to claim 7, wherein: the vibration signal processing and analyzing system converts the impact signal into an impact load value, and the processing is specifically as follows:
calculating the impact acceleration vector born by each sensor according to the following formula to obtain the magnitude and the direction of the actual impact load born by the measured falling sample;
wherein, λ is the impact acceleration actually borne by the measured point;
alpha is the phase angle of the impact acceleration actually born by the measured point;
x, Y, Z are the impact accelerations correspondingly born by the measured points in the three-dimensional directions respectively.
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102466599A (en) * | 2010-11-04 | 2012-05-23 | 纬创资通股份有限公司 | Packaging material drop test system and testing method |
| CN102706737A (en) * | 2012-07-06 | 2012-10-03 | 济南科汇试验设备有限公司 | Hanging pendulum buffer device of pendulum impact machine |
| CN103273925A (en) * | 2013-04-28 | 2013-09-04 | 华南农业大学 | Vertical-adjustment vibration-reduction device and method of chain freight cableway |
| CN105784106A (en) * | 2016-04-07 | 2016-07-20 | 曲阜师范大学 | Description method for resonance characteristic of cushioning material |
| CN106370384A (en) * | 2016-12-13 | 2017-02-01 | 郑州云海信息技术有限公司 | Fall-off test method and device |
| CN107063618A (en) * | 2017-05-08 | 2017-08-18 | 郑州云海信息技术有限公司 | It is a kind of to choose the method that logistics transportation impacts label paper |
| CN107271130A (en) * | 2017-06-16 | 2017-10-20 | 郑州云海信息技术有限公司 | A kind of server mechanical shock test tool |
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| CN108151995A (en) * | 2017-12-05 | 2018-06-12 | 郑州云海信息技术有限公司 | A kind of server back end mechanical shock jig |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102466599A (en) * | 2010-11-04 | 2012-05-23 | 纬创资通股份有限公司 | Packaging material drop test system and testing method |
| CN102706737A (en) * | 2012-07-06 | 2012-10-03 | 济南科汇试验设备有限公司 | Hanging pendulum buffer device of pendulum impact machine |
| CN102706737B (en) * | 2012-07-06 | 2014-01-22 | 济南科汇试验设备有限公司 | Hanging pendulum buffer device of pendulum impact machine |
| CN103273925A (en) * | 2013-04-28 | 2013-09-04 | 华南农业大学 | Vertical-adjustment vibration-reduction device and method of chain freight cableway |
| CN103273925B (en) * | 2013-04-28 | 2016-05-18 | 华南农业大学 | A kind of chain type freight ropeway vertical adjusting vibration absorber and method |
| CN105784106A (en) * | 2016-04-07 | 2016-07-20 | 曲阜师范大学 | Description method for resonance characteristic of cushioning material |
| CN106370384A (en) * | 2016-12-13 | 2017-02-01 | 郑州云海信息技术有限公司 | Fall-off test method and device |
| CN107063618A (en) * | 2017-05-08 | 2017-08-18 | 郑州云海信息技术有限公司 | It is a kind of to choose the method that logistics transportation impacts label paper |
| CN107271130A (en) * | 2017-06-16 | 2017-10-20 | 郑州云海信息技术有限公司 | A kind of server mechanical shock test tool |
| CN108151995A (en) * | 2017-12-05 | 2018-06-12 | 郑州云海信息技术有限公司 | A kind of server back end mechanical shock jig |
| CN108088639A (en) * | 2017-12-08 | 2018-05-29 | 郑州云海信息技术有限公司 | A kind of NF5170M5 mechanical shocks gauge |
| CN113420451A (en) * | 2021-06-29 | 2021-09-21 | 沈阳铁路信号有限责任公司 | Design method of buffer package |
| CN114993597A (en) * | 2022-06-29 | 2022-09-02 | 苏州浪潮智能科技有限公司 | Novel buffer gas column cushion packaging test device and method |
| CN114993597B (en) * | 2022-06-29 | 2024-01-12 | 苏州浪潮智能科技有限公司 | Novel buffer gas column pad packaging test device and method |
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