CN1451985A - Case for packaging optical device and making method thereof - Google Patents
Case for packaging optical device and making method thereof Download PDFInfo
- Publication number
- CN1451985A CN1451985A CN 02108879 CN02108879A CN1451985A CN 1451985 A CN1451985 A CN 1451985A CN 02108879 CN02108879 CN 02108879 CN 02108879 A CN02108879 A CN 02108879A CN 1451985 A CN1451985 A CN 1451985A
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- Prior art keywords
- mirror slip
- optical
- device package
- optical device
- flat
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Abstract
An encapsulating casing of optical device is prepared through providing a case able to contain optical device and an optical lens, mounting the optical lens to the light transmission window on the top of said case, loading them in a mould, filling the heated transparent plastics with a certain viscosity in the mould until it flows to the mounting position of optical lens, and cooling to inlay the optical lens in said window.
Description
[technical field]
The invention relates to a kind of optical device package and manufacture method thereof, is to be applied to the light emission module in light transmission field or other semiconductor lasers device and optical detection device in the Optical Receivers.
[background technology]
Along with the continuous development of society, the application of optical device also progressively enlarges, and is also developed accordingly as the laser devices of light source, and it generally includes a laser diode and a light detects diode.Because it is all relatively more fragile that laser diode and light detect diode, the extraneous physical shock and the influence of humidity all can make its unstable properties.Be protection laser diode and light detection diode, need usually encapsulate laser diode and light detection diode.
The encapsulation and the method for general existing laser devices comprise: a pedestal is provided, and this base-plates surface is laser diode and light detection diode fixedly; One package is provided, and itself and pedestal are sealed and matched fully, detect diode with protection laser diode and light.This package is generally a jar shape (Can), it typically is metal material, and in the top of package one optical transmission window is arranged, in order to outside transmitting optical signal.
A kind of prior art such as Japanese patent laid-open 2-165684 number, please refer to Fig. 1, this laser devices 10 comprises a pedestal 11, this pedestal 11 detects diode 15 in order to place laser diode 14 and light; One housing 13, this housing 13 are sealed and matched with pedestal 11 and detect diode 15 to accommodate this laser diode 14 of protection and light; Housing 13 tops are tool one opening 12 in addition; One optical transmission window 16, the opening 12 that is bonded in housing 13 by a glass sheet 161 forms.
The manufacture method of the optical transmission window 16 of this laser devices 10 is to adopt viscose glue by glass sheet 161, as being bonded in the epoxy resin (epoxy) in the opening 12 of housing 13, to realize printing opacity and sealing function.But this use viscose glue needs the method that fixing glass sheet 161 is bonded in shell nozzle 12 through heating, baking, and this glass sheet 161 needs just can reach desirable optics requirement through extra processing, its production cycle is longer, the operation more complicated, can't realize producing in enormous quantities, so kind method for packing cost is higher; And in manufacture process, may there be excessive glue, thereby pollutes glass sheet 161, influence light transmission; In addition, the structure of the optical transmission window 16 that the method obtains is being subjected under foreign impacts or the hot environment, and viscose glue easily lost efficacy, thereby it is loosening that this structure is taken place, and then influences the overall performance of laser devices 10.
In view of this, provide a sound construction, be suitable for producing in batches, lower-cost optical device (as other semiconductor lasers device, optical detection device) package and manufacture method thereof be real in necessary.
[summary of the invention]
Optical device package and the manufacture method thereof of the purpose of this invention is to provide that a kind of cost is lower, sound construction and can realizing being produced in batches.
The objective of the invention is to be achieved through the following technical solutions: optical device package of the present invention comprises that one is used to hold the housing and an optical mirror slip of optical device, this housing tool one flat-top, flat-top is provided with the optical mirror slip installation portion, this optical mirror slip installation portion comprises a light openings that connects and runner mouth, fin or inner groovy structure that the edge tool of light openings one is continuous; This optical mirror slip guides into this optical mirror slip installation portion by the transparent plastic material mat jetting formation process that is heated to the tool certain viscosity by the runner mouth, cooling forming, and by the fin or the inner groovy structure of light openings, the phase build-in is due to the flat-top of housing.By the mutually embedding of optical mirror slip, realize the package of a sealing and printing opacity with flat-top.
Compared with prior art, the invention has the advantages that: on the light openings of optical device package of the present invention by in-mold forming process form one with the housing flat-top optical mirror slip of embedding mutually, so its sound construction; In addition, the optical mirror slip that this invention obtains does not need extra processing, can reach desired precision, thus can reduce the assembly work amount, and in-mold forming process is with short production cycle, and general needs to finish several seconds, is suitable for producing in batches; And plastic material is with respect to glass material, and its cheap and tool toughness is so improved optical device package cost performance.
[description of drawings]
Fig. 1 is the encapsulating structure figure of existing laser devices.
Fig. 2 is the housing stereographic map of optical device package of the present invention.
Fig. 3 is the housing vertical view of optical device package shown in Figure 2.
Fig. 4 is the cut-open view of the housing of optical device package shown in Figure 3 along IV～IV direction.
Fig. 5 is an optical device package stereographic map of the present invention.
Fig. 6 is the package cut-open view of optical device package shown in Figure 5.
Fig. 7 is another embodiment cut-open view of optical device package of the present invention.
[embodiment]
Optical device package of the present invention and manufacture method thereof comprise the step that a housing and an optical mirror slip (back is described in detail) are provided, and please refer to Fig. 2 and shown in Figure 6, and this optical package cover 40 comprises a housing 20 and an optical mirror slip 31.This housing 20 tools, one flat-top 21 and an annular bottom plate 22, this housing 20 is integrally formed and roughly become one jar of shape.Wherein have an optical mirror slip installation portion 23 that connects on the flat-top 21, this optical mirror slip installation portion 23 comprises a light openings 231 and first-class road junction 232.In addition, annular bottom plate 22 is along the outward extending shade shape of shell rim annular bottom plate, so that package can closely cooperate with the pedestal (not icon) of placing optical device when encapsulating optical device (not icon) from place, housing 20 bottoms.The housing 20 available metal materials of this package are stamped to form or adopt the plastic mould pressing moulding.
, be the housing vertical view and the cut-open view thereof of Fig. 2 optical device package please in conjunction with reference Fig. 3 and shown in Figure 4.The fin 24 that the edge tool one of this light openings 231 is continuous, this runner mouth 232 are an opening that connects with light openings 231, and fin 24 extends to this runner mouth 232 to form a continuous fin ring from the edge of light openings 231.
Please in conjunction with reference Fig. 5 and shown in Figure 6, be the stereographic map and the cut-open view thereof of optical device package 40 of the present invention, the optical mirror slip 31 of this package 40 is positioned the optical mirror slip installation portion 23 of housing 20, this optical mirror slip 31 is by jetting formation process by optical mirror slip raw material such as transparent optical plastic material, as the moulding in optical mirror slip installation portion 23 of in-molded (Insert molding) mode, build-in is fixed mutually by the fin 24 of optical mirror slip installation portion 23 and flat-top 21.Form an optical transmission window by optical mirror slip 31 is embedded in the flat-top 21 of housing 20 mutually, realize the sealing and the printing opacity effect of package 40.
The manufacture method of optical device package 40 of the present invention, mainly may further comprise the steps: the housing 20 that a tool one flat-top 21 at first is provided, this housing 20 is can be by metal stamping one-body molded or adopt the plastic mould pressing moulding, offer the optical mirror slip installation portion 23 that constitutes by light openings 231 that connects and runner mouth 232 on this flat-top 21, light openings 231 tools one fin 24 that is provided, and fin 24 extends to runner mouth 232 to form a continuous fin ring from the edge of light openings 231; Then; One mould is provided, housing 20 is placed within; One optical mirror slip raw material such as transparent optical plastic material are provided, with optical mirror slip raw material preheating drying, after being heated to the tool certain viscosity again, adopt in-molded mode, this optical mirror slip raw material is injected the die cavity of sealing by the nozzle of mould, direct it to optical mirror slip installation portion 23 by runner mouth 232, until filling with; After the solidifying and setting to be cooled, this optical device package 40 is taken out in die sinking.
Please refer to Fig. 7, it is the cut-open view of another embodiment of optical device package, compare with first embodiment, this fin 24 is substituted by an inner groovy 24 ', the optical mirror slip 31 ' that its in-mold forming process forms and inner groovy 24 ' mutually inlay card preferably to be immobilizated on the housing flat-top 21.
The light openings of the housing flat-top of optical device package of the present invention can be established multilayer fin or groove, and the runner mouth that connects with light openings can be the shallow grooves of a non-through housing flat-top.
Optical device package of the present invention can be used for the encapsulated semiconductor laser diode, light detects diode, optical transceiver module etc.
Claims (16)
1. optical device package, comprise a housing and an optical mirror slip, housing has a flat-top, it is characterized in that: offer an optical mirror slip installation portion on this flat-top, this optical mirror slip installation portion comprises light openings and the runner mouth that connects, and has an inlay card structure at least; Optical mirror slip be by jetting formation process in the optical mirror slip installation portion moulding and with the inlay card respective outer side edges.
2. optical device package as claimed in claim 1 is characterized in that: described inlay card structure is a fin.
3. optical device package as claimed in claim 1 is characterized in that: described inlay card structure is an inner groovy.
4. optical device package as claimed in claim 1 is characterized in that: described optical mirror slip installation portion further comprises a light openings, in order to outside transmission light signal.
5. optical device package as claimed in claim 4 is characterized in that: described optical mirror slip installation portion further comprises a runner mouth that connects with light openings, in order to the guided optical Raw materials for lenses to the optical mirror slip installation portion.
6. optical device package as claimed in claim 1 is characterized in that: described optical mirror slip material is the transparent optical plastics.
7. optical device package as claimed in claim 5 is characterized in that: described runner mouth is the shallow grooves of a non-through flat-top.
8. optical device package as claimed in claim 5 is characterized in that: described runner mouth connects flat-top.
9. the manufacture method of an optical device package, it is characterized in that said method comprising the steps of: (1) provides the housing of a tool one flat-top, offers an optical mirror slip installation portion that is made of light openings that connects and runner mouth on this flat-top; (2) described housing is positioned in the jetting formation process mould; (3) provide an optical mirror slip raw material; (4) this optical mirror slip raw material mat mould is injected into the runner mouth, guides to the optical mirror slip installation portion by the runner mouth, until filling up; (5) solidifying and setting to be cooled is taken mould away, and the optical mirror slip of institute's moulding is embedded in the housing flat-top mutually.
10. the manufacture method of optical device package as claimed in claim 9 is characterized in that: light openings edge tool one fin or the inner groovy structure of described housing flat-top.
11. the manufacture method of optical device package as claimed in claim 9 is characterized in that: the runner mouth of described housing flat-top is the opening of a tool fin or inner groovy structure.
12. the manufacture method of optical device package as claimed in claim 9 is characterized in that: the runner mouth of described housing flat-top is the shallow grooves of a non-through flat-top.
13. the manufacture method of optical device package as claimed in claim 9 is characterized in that: described housing can be shaped by plastic mould pressing.
14. the manufacture method of optical device package as claimed in claim 9 is characterized in that: described housing can be made by the metal material punching press.
15. the manufacture method of an optical device package, it is characterized in that said method comprising the steps of: (1) provides the housing of a tool one flat-top, offer an optical mirror slip installation portion that is made of light openings that connects and runner mouth on this flat-top, this optical mirror slip installation portion has an inlay card structure at least; (2) described housing is positioned in the jetting formation process mould; (3) provide an optical mirror slip raw material; (4) this optical mirror slip raw material mat mould is injected into the runner mouth, guides to the optical mirror slip installation portion by the runner mouth, until filling up; (5) solidifying and setting to be cooled is taken mould away, the optical mirror slip of institute's moulding and inlay card respective outer side edges.
16. the manufacture method of optical device package as claimed in claim 15 is characterized in that: further offering first-class road junction on the described flat-top, is to connect with this light openings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021088799A CN100426031C (en) | 2002-04-20 | 2002-04-20 | Case for packaging optical device and making method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021088799A CN100426031C (en) | 2002-04-20 | 2002-04-20 | Case for packaging optical device and making method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1451985A true CN1451985A (en) | 2003-10-29 |
| CN100426031C CN100426031C (en) | 2008-10-15 |
Family
ID=29220789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021088799A Expired - Fee Related CN100426031C (en) | 2002-04-20 | 2002-04-20 | Case for packaging optical device and making method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100426031C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101193507B (en) * | 2006-12-01 | 2011-07-27 | 深圳富泰宏精密工业有限公司 | Shell with flat visual window lens and its making method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2737345C2 (en) * | 1976-08-20 | 1991-07-25 | Canon K.K., Tokio/Tokyo | Semiconductor laser device with a Peltier element |
| US4768070A (en) * | 1986-03-20 | 1988-08-30 | Hitachi, Ltd | Optoelectronics device |
| JPH0376286A (en) * | 1989-08-18 | 1991-04-02 | Sony Corp | Semiconductor laser device and assembly thereof |
-
2002
- 2002-04-20 CN CNB021088799A patent/CN100426031C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101193507B (en) * | 2006-12-01 | 2011-07-27 | 深圳富泰宏精密工业有限公司 | Shell with flat visual window lens and its making method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100426031C (en) | 2008-10-15 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081015 Termination date: 20100420 |