CN1435914A - Electric connector and chip soldered dot leveling method - Google Patents
Electric connector and chip soldered dot leveling method Download PDFInfo
- Publication number
- CN1435914A CN1435914A CN 02154409 CN02154409A CN1435914A CN 1435914 A CN1435914 A CN 1435914A CN 02154409 CN02154409 CN 02154409 CN 02154409 A CN02154409 A CN 02154409A CN 1435914 A CN1435914 A CN 1435914A
- Authority
- CN
- China
- Prior art keywords
- electric connector
- chip
- heat conduction
- solder joint
- conduction object
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
A method for levelling the soldered points on electric connector and chip includes such steps as providing a thermal conducting object with a solder-phobic smooth surface, heating it and putting the soldered points on said solder-phobic smooth surface closely.
Description
Technical field
The present invention relates to the solder joint flatening method of a kind of electric connector and chip, refer in particular to a kind of solder joint and obtain the electric connector of desirable coplane and the solder joint flatening method of chip by heating electric connector and chip.
Background technology
At present electric connector and chip be because circuit requires densification, so electric connector and chip change modes such as SMT into by the welding manner of DTP, further develops into modes such as BGA (tin ball grid array formula) or tin post array.But differing of adsorbance causes the solder joint of electric connector and chip bottom just to differ because of the error of the distortion of body, welding foot fit on and after planting ball bonding, cause some solder joint when welding to fail to produce smooth coplane and cause the phenomenon of empty weldering, scratch thereby give to produce to bring to be stranded greatly with circuit board with circuit board.Fig. 1 and present electric connector and the common defective of chip of being shown in Figure 2.Fig. 1 is because the distortion of body 1 causes solder joint 2 not at grade, thereby may produce empty weldering with circuit board 3 welding the time.What Fig. 2 represented then is that differing of adsorbance causes the solder joint 4 of electric connector or crystal bottom just to differ after planting ball bonding, thereby also may cause the generation of empty weldering phenomenon when being welded to circuit board 5.
Summary of the invention
The object of the present invention is to provide the solder joint flatening method of a kind of electric connector and chip, with scolder its slightly soluble is out of shape and obtains desirable coplane, thereby effectively avoid empty generation of welding phenomenon by heating electric connector and chip.
The solder joint flatening method of connector provided by the present invention and chip is used for the solder joint of fusibility assembly on electric connector and the chip is flattened, and it may further comprise the steps:
Provide one to be provided with the heat conduction object of refusing to weld flat surface;
Heating heat conduction object;
The end that solder joint is arranged on electric connector and the chip is adhered on the flat surface of heat conduction object;
Take out electric connector and chip.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples.
Fig. 1 is the schematic diagram of existing electric connector or chip and circuit board.
Fig. 2 is the schematic diagram of another existing electric connector or chip and circuit board.
Fig. 3 is the enforcement schematic diagram of the solder joint flatening method of electric connector of the present invention and chip.
Fig. 4 is electric connector or chip and the schematic diagram of circuit board after implementing the present invention shown in Figure 1.
Fig. 5 is electric connector or chip and the schematic diagram of circuit board after implementing the present invention shown in Figure 2.
Concrete ten thousand formulas of implementing
As shown in Figure 3, the present invention will be positioned at 12 levelings of the solder joint of tin ball 11 lower ends of electric connector or chip 10 bottoms, and its employed device 20 comprises thermostat 21, heating source 22 and heat conduction object 23.This heat conduction object 23 roughly is cube, and its upper surface is provided with the projection 232 of a flat surface of refusing to weld 231 and suitable height.This heating source 22 places heat conduction object 23, to heat this heat conduction object 23.This thermostat 21 links to each other with heating source 22, with the temperature limitation of heating source 22 in preset range.The tin ball 11 of electric connector or chip 10 bottoms during operation, at first activates heating source 22 heat conduction object 23 is heated to proper temperature, so that can produce the slightly soluble distortion; Then there is an end of tin ball 11 to adhere on the flat surface 231 of this heat conduction object 23 electric connector or chip 10, tin ball 11 is softening gradually, and electric connector or chip 10 are because of the moved downward of self, make original unsettled tin ball 11 also touch heat conduction object 23, the purpose that obtains desirable coplane is equalled in solder joint 12 welderings of irregular tin ball 11 lower ends thereby reach; Then electric connector or chip 10 are taken out.By this method, the solder joint 12 of this electric connector or chip 10 will keep good coplanarity, thus when having guaranteed to weld with circuit board (not drawing among the figure) all solder joints 12 all with circuit board on weld pad (not drawing among the figure) form excellent electrical property and contact.Projection 232 can support the body 13 of electric connector or chip 10, with the heat conduction object 23 predetermined distance of being separated by, prevent that electric connector or chip 10 are towards lopsidedness.
Fig. 4 is electric connector or chip and the schematic diagram of circuit board after implementing the present invention shown in Figure 1, and after implementing method of the present invention, the solder joint 2 that height differs on former electric connector or the chip is concordant fully, effectively contacts thereby can form with circuit board 3.
Fig. 5 is electric connector or chip and the schematic diagram of circuit board after implementing the present invention shown in Figure 2, solder joint on this electric connector or the chip is former, and height differs owing to the difference of adsorbance when planting ball bonding, after implementing method of the present invention, solder joint 4 all is positioned on the same horizontal plane, thereby can form excellent contact with circuit board 5 in when welding, can effectively avoid empty generation of welding phenomenon.
Claims (8)
1. the solder joint flatening method of an electric connector flattens with the solder joint with fusibility assembly on the electric connector, and it may further comprise the steps:
Provide one to be provided with the heat conduction object of refusing to weld flat surface;
Heating heat conduction object;
The end that solder joint is arranged on the electric connector is adhered on the flat surface of heat conduction object;
Take out electric connector.
2. the solder joint flatening method of electric connector as claimed in claim 1, it also comprises such step: a thermostat is provided, controls the heating-up temperature of heat conduction object.
3. the solder joint flatening method of electric connector as claimed in claim 1 or 2, its heating heat conduction objects system obtains by the heating source that is arranged in the heat conduction object.
4. the solder joint flatening method of electric connector as claimed in claim 1 or 2, the end that its heat conduction object is established flat surface is provided with projection in addition.
5. the solder joint flatening method of a chip flattens with the solder joint with fusibility assembly on the chip, and it may further comprise the steps:
Provide one to be provided with the heat conduction object of refusing to weld flat surface;
Heating heat conduction object;
The end that solder joint is arranged on the chip is adhered on the flat surface of heat conduction object;
Take out chip.
6. the solder joint flatening method of chip as claimed in claim 1, it also comprises such step: a thermostat is provided, controls the heating-up temperature of heat conduction object.
7. the solder joint flatening method of chip as claimed in claim 1 or 2, its heating heat conduction objects system obtains by the heating source that is arranged in the heat conduction object.
8. the solder joint flatening method of chip as claimed in claim 1 or 2, the end that its heat conduction object is established flat surface is provided with projection in addition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021544093A CN1193462C (en) | 2002-12-09 | 2002-12-09 | Electric connector and chip soldered dot leveling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021544093A CN1193462C (en) | 2002-12-09 | 2002-12-09 | Electric connector and chip soldered dot leveling method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1435914A true CN1435914A (en) | 2003-08-13 |
| CN1193462C CN1193462C (en) | 2005-03-16 |
Family
ID=27628781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021544093A Expired - Fee Related CN1193462C (en) | 2002-12-09 | 2002-12-09 | Electric connector and chip soldered dot leveling method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1193462C (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1595626B (en) * | 2004-07-15 | 2010-04-28 | 番禺得意精密电子工业有限公司 | Tin-ball forming method for electronic component |
| CN102509990A (en) * | 2011-10-19 | 2012-06-20 | 番禺得意精密电子工业有限公司 | Forming method of electric connector |
| CN108258467A (en) * | 2017-12-01 | 2018-07-06 | 番禺得意精密电子工业有限公司 | Electric connector |
| US10122141B1 (en) | 2017-06-16 | 2018-11-06 | Lotes Co., Ltd | Method for manufacturing electrical connector |
| CN117580249A (en) * | 2024-01-16 | 2024-02-20 | 长春希龙显示技术有限公司 | Display module circuit board and processing method thereof |
-
2002
- 2002-12-09 CN CNB021544093A patent/CN1193462C/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1595626B (en) * | 2004-07-15 | 2010-04-28 | 番禺得意精密电子工业有限公司 | Tin-ball forming method for electronic component |
| CN102509990A (en) * | 2011-10-19 | 2012-06-20 | 番禺得意精密电子工业有限公司 | Forming method of electric connector |
| US10122141B1 (en) | 2017-06-16 | 2018-11-06 | Lotes Co., Ltd | Method for manufacturing electrical connector |
| CN108258467A (en) * | 2017-12-01 | 2018-07-06 | 番禺得意精密电子工业有限公司 | Electric connector |
| CN117580249A (en) * | 2024-01-16 | 2024-02-20 | 长春希龙显示技术有限公司 | Display module circuit board and processing method thereof |
| CN117580249B (en) * | 2024-01-16 | 2024-05-03 | 长春希龙显示技术有限公司 | Display module circuit board and processing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1193462C (en) | 2005-03-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1200483C (en) | High density connector and method of manufacture | |
| CN1160833C (en) | High density connector having ball type of contact surface | |
| CN1130306A (en) | Semiconductor and its producing method | |
| CN109324444A (en) | The welding method of area source backlight module and liquid crystal display panel, LED chip | |
| CN1193462C (en) | Electric connector and chip soldered dot leveling method | |
| CN112654172A (en) | Circuit board production process | |
| CN2415468Y (en) | Array connector | |
| CN100358186C (en) | Surface installed plug socket assembly | |
| CN108581121A (en) | A kind of auxiliary tool that electronic component is fixed on to PCB circuit board welding | |
| US7040903B2 (en) | Method of connecting a contact with a solder and an electronic device using the method | |
| CN201601902U (en) | Wave-soldering plug-in component fixing device | |
| CN207364732U (en) | A kind of cushion block, lamp bar, backlight module and display | |
| CN1595724A (en) | Tin ball leveling method | |
| CN100499293C (en) | A making method for electric connector | |
| CN101771228A (en) | Area array adaptor | |
| CN1514203A (en) | Flatness detecting method and detecting instrument thereby | |
| CN1137612C (en) | Soldering method for electric connection between mother board and electronic elements | |
| CN109449613A (en) | Data connection head and its welding method, data connector | |
| CN220698481U (en) | Welding head and welding structure | |
| TW466660B (en) | Integrated circuit device process and the leakage current testing device thereof | |
| CN201112630Y (en) | Electric connector with balance function | |
| EP1311029A1 (en) | High density connector and method of manufacture | |
| CN1189938C (en) | Wire solder free semiconductor device and package method thereof | |
| CN1595626B (en) | Tin-ball forming method for electronic component | |
| CN2814703Y (en) | Coupling structure for electric connector terminal and circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |