CN1435509A - Pre-plating nickel dipping solution for chemical plating aluminium and aluminium alloy with nickel - Google Patents
Pre-plating nickel dipping solution for chemical plating aluminium and aluminium alloy with nickel Download PDFInfo
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- CN1435509A CN1435509A CN 02133822 CN02133822A CN1435509A CN 1435509 A CN1435509 A CN 1435509A CN 02133822 CN02133822 CN 02133822 CN 02133822 A CN02133822 A CN 02133822A CN 1435509 A CN1435509 A CN 1435509A
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- nickel
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- alloy
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Abstract
A Ni-dipping liquid used before chemical plating of Al and Al alloy is disclosed. After the surface of Al or Al alloy is treated, it is immersed in said Ni-dipping liquid to generate a firm, uniform and compact Ni layer with catalytic activity. Said Al or Al alloy can then be directly nickelplated chemically.
Description
This invention belongs to aluminium and aluminum alloy chemically plating.
Existing aluminium and Electroless Nickel Plating of Aluminum Alloy pretreatment technology carry out with reference to the galvanized pre-treating process of aluminium.The one, soak zinc at the cleaning aluminium material surface, zinc-iron alloy or admiro, form the middle layer that one deck is difficult for oxidation, but because there is technical deficiency in this method, as soak zinc (zinc alloy) layer certain dissolubility is arranged in acidic nickel plating solution, it is low directly to carry out the acid chemical plating nickel yield rate, and solving zinc pollutes plating bath again.The 2nd, adopt pre-electroplate or chemical nickel plating (neutral, weakly alkaline) treats that aluminium material surface is changed over to acid chemical plating nickel by nickel after topped fully again, but this method need cross device program in advance and expense is more.For overcoming above-mentioned shortcoming, to cut preplating, reduce the electroless plating cost, improve yield rate, prevent to pollute, thereby soak nickel liquid before inventing a kind of plating.
A kind ofly soak the nickel fluid component and content is:
Single nickel salt 30-50g/l
Sodium tartrate and Trisodium Citrate 20-30g/l
Ammonium acetate or ammonium sulfate 20-30g/l
Quadrol and aniline 5ml/l
2-ethylhexyl sodium sulfonate 1g/l
Hydrofluoric acid 1-5ml/l
The raw materials used known available product that are of the present invention adopt the usual way mixing to form.Utilizing the present invention to carry out chemical nickel plating is called for short and soaks nickel and directly plate.
Compared with the prior art, the present invention has following characteristics:
1, soak the straight depositing process of nickel simple, save the preplating operation than soaking the zinc pre-plating process, save pre-coating apparatus and preplating starting material.
2, soak nickel and directly plate the yield rate height, soak zinc (zinc alloy) preplating in neutrality, weakly alkaline plating bath, because zinc-impregnating layer is softer, flow, stir, produce under the gas percussion effect at plating bath, plating leakage is located easily to produce in plating piece corner, the region between the heart and the diaphragm hole etc., if plating piece is complex-shaped, and this defective of easier generation.
3, soak nickel and directly plate and make coating and matrix bond jail, evenly, densification.Plated finished product, file, saw do not fall layer, and the test of shaking of 300 degree heat is non-foaming, does not peel.
4, it is good to soak the straight nickel layer corrosion stability of nickel, as soaking nickel with identical two aluminum components respectively and soaking zinc, and plating 80 minutes in same chemical nickel-plating liquid then, the thick about 20 μ m of coating, drop into again in the same concentrated nitric acid and move back nickel, soak the decortication of zinc-nickel spare 4-5 hour coating or come off, soak and also do not have the decortication phenomenon in nickel spare 2-3 days.In damp atmosphere, soak zinc nickel plating part lateral encroaching easily takes place, make nickel layer decortication or peel off.
5, soak nickel dam surfactivity height, soak plating 1-2 plating second behind the nickel, bright dipping yield rate 100% in 5 minutes.
Claims (1)
1. soak nickel liquid before the plating of aluminium and Electroless Nickel Plating of Aluminum Alloy, it is characterized in that the composition and the content that soak nickel liquid are:
Single nickel salt 30-50g/l
Sodium tartrate and Trisodium Citrate 20-30g/l
Ammonium acetate or ammonium sulfate 20-30g/l
Quadrol and aniline 5ml/l
2-ethylhexyl sodium sulfonate 1g/l
Hydrofluoric acid 1-5ml/l
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02133822 CN1435509A (en) | 2002-09-27 | 2002-09-27 | Pre-plating nickel dipping solution for chemical plating aluminium and aluminium alloy with nickel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02133822 CN1435509A (en) | 2002-09-27 | 2002-09-27 | Pre-plating nickel dipping solution for chemical plating aluminium and aluminium alloy with nickel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1435509A true CN1435509A (en) | 2003-08-13 |
Family
ID=27628622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02133822 Pending CN1435509A (en) | 2002-09-27 | 2002-09-27 | Pre-plating nickel dipping solution for chemical plating aluminium and aluminium alloy with nickel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1435509A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102747345A (en) * | 2012-07-19 | 2012-10-24 | 哈尔滨工业大学 | Method for chemically plating nickel on surface of copper circuit of PCB (printed circuit board) by dipping and activating nickel |
| CN110714214A (en) * | 2019-11-19 | 2020-01-21 | 东莞市百镀通五金电镀实业有限公司 | Electroplating pretreatment process for die-casting aluminum alloy |
| CN111266601A (en) * | 2020-04-03 | 2020-06-12 | 赣州有色冶金研究所 | WC-Ni composite powder, WC-Ni hard alloy and preparation method thereof |
-
2002
- 2002-09-27 CN CN 02133822 patent/CN1435509A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102747345A (en) * | 2012-07-19 | 2012-10-24 | 哈尔滨工业大学 | Method for chemically plating nickel on surface of copper circuit of PCB (printed circuit board) by dipping and activating nickel |
| CN110714214A (en) * | 2019-11-19 | 2020-01-21 | 东莞市百镀通五金电镀实业有限公司 | Electroplating pretreatment process for die-casting aluminum alloy |
| CN111266601A (en) * | 2020-04-03 | 2020-06-12 | 赣州有色冶金研究所 | WC-Ni composite powder, WC-Ni hard alloy and preparation method thereof |
| CN111266601B (en) * | 2020-04-03 | 2022-07-26 | 赣州有色冶金研究所有限公司 | WC-Ni composite powder, WC-Ni hard alloy and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |