CN1422983A - Reinforced coin product and its making method - Google Patents
Reinforced coin product and its making method Download PDFInfo
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- CN1422983A CN1422983A CN 01139613 CN01139613A CN1422983A CN 1422983 A CN1422983 A CN 1422983A CN 01139613 CN01139613 CN 01139613 CN 01139613 A CN01139613 A CN 01139613A CN 1422983 A CN1422983 A CN 1422983A
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Abstract
The invention provides coin, gems, a plating design and souvenir badge which are designed by plating and holograph with picture pattern. It is made up through pressing, light anti-corrosion painting, the exposal, the projecting of pattern and holograph imaging, chemical treatment, and plating and so on different method.
Description
Technical field
The present invention relates to have the plating design of photo-patterns and coin, jewel, the souvenir badge series products of hologram design, they are to use punching press, the photo-resist coating, use the photographic exposure of mask, the various combination means of image projection and holographic imaging, chemical treatment and plating etc. are made.Particularly, the present invention relates to a kind of reinforced coin series products and preparation method thereof
Technical background
The method that metal productss such as coin are carried out artistic decoration is with manually coating such as propionic acid enamelled electrically insulating material on the designated area of product in ancient times, electroplate with gold or other metals then, the surface that is insulated the material covering so can not plate metal plating.This artificial technology comparatively costliness, out of true and production consumption is big.The method that adopts before another kind of is to bring replacement coating with a kind of viscosity insulation, with this adhesive tape whole coin is covered earlier, removes the adhesive tape that will plate the metal part with artificial mowing then.Also having a kind of method is to fill out in the designated area of coin to stamp a kind of insulating material, electroplates then.
These decorative electroplating treatment technology resolving power are low, and the cover accuracy is poor, and man-hour is long.
Coin was after getting in the past, and also the hologram that gets on of mold pressing is thereon once decorated.In this method, a kind of instrument of mold pressing on certain little smooth region of coin.This instrument is a kind of a kind of mould that is duplicated the nickel mould that forms by electroforming relief type master hologram that is pasted with on certain little even surface.The hardness of this nickel mould can only be born the mold pressing of tens coins at most and be made, and the quality of hologram just will seriously descend afterwards.Sometimes on coin by holographic hot pressing sheet metal or a kind of hologram of the cold subsides of non-setting adhesive, a kind of imitation of coin of contour forging is provided.
Summary of the invention
An object of the present invention is to propose a kind of improved method and control the zone that to carry out electroplating processes on the coin.Second purpose is that proposition is a kind of improved at coin, jewellery, and the method for hologram is made in the compacting of souvenir badge series products patrix.
First aspect of the present invention provides a kind of and has had ornamental or sacrificial metal coating or have the coin of the diffraction embossing pattern of direct mold pressing on its surface, souvenir badge, jewellery or other metal products at selection area.
The present invention also provides a kind of method that metal products is imposed decoration, comprise with a kind of predetermined pattern and electroplating, by apply described pattern with photo-resist, according to described pattern described photo-resist is exposed, to described development of photoresist, described goods are electroplated, then removed described photo-resist, obtain described pattern thus.
The present invention also provides a kind of method that metal products is imposed decoration, comprise, the material that outward appearance is different from the metal that constitutes described goods deposits, metal products is coated photo-resist, according to described pattern, to described photo-resist exposure, described photo-resist is developed, the described material of the area deposition of removing photographic developer on described goods then, is removed described photo-resist and is stayed intact deposition material.
The present invention provides a kind of method of making the stamping parts goods again, comprise, make a kind of cap of press tool, on its working face, have holographic relief pattern and basse-taille pattern, and described cap is made with hard metal, this cap attached on the press tool, and utilize described press tool that the workpiece face of this cap is pressed to the surface of goods, thereby product surface is got on according to the basse-taille pattern forming and the surface that described holographic relief pattern also is molded into described goods.
The present invention further provides a kind of pressed part that has holographic effect, these goods are made by the method in the claim 4.
The present invention can utilize the light to described photo-resist sensitivity, and described image projection to described photo-resist, is finished according to described pattern the photo-resist step of exposing with this.
The present invention also can be imaged on the step of finishing described projection image on the described coin with a kind of active spatial light modulator.
The present invention can be unique for each coin with wherein said image or its part image.
Description of drawings
Fig. 1 illustrates a kind of sectional view that is coated with the coin of photo-resist, and this coin sees through a kind of photographic mask board to explosure.This photographic mask plate can be common black and white base plate or egative film, chrome mask, and the ornamental engraving mask plate, hologram, or the combination of hologram and mask etc., unrestricted.This photographic mask has transparent and opaque section.
Fig. 2 illustrate a kind of on it designated area the sectional view of the coin that the mask material such as photo-resist is covered with is arranged.
Fig. 3 illustrates a kind of sectional view that is coated with on it such as the coin of the decorative material of gold etc. on the zone that is not covered with such as the mask material of photo-resist.
Fig. 4 illustrates a kind of sectional view that is coated with the coin of photo-resist, this coin is to use reflective spatial light modulator, optical projection system, and light source and alternative spatial filter carry out the imaging exposure-processed.
Fig. 5 illustrates that a kind of coin decorates golden word and golden-rimmed edge are arranged, and a kind of with hologram around the portrait of making background.
Fig. 6 illustrates a kind of sectional view of coin staking punch, and its stamping surface scribbles photo anti-corrosion agent material.
Fig. 7 illustrates a kind of sectional view of stamping surface of coin staking punch, after its stamping surface is coated photo anti-corrosion agent material, by a kind of photographic mask board to explosure.
Fig. 8 illustrates a kind of sectional view of stamping surface of coin staking punch, after its stamping surface is coated photo anti-corrosion agent material, accepts the exposure of interference figure by a kind of photographic mask plate.
Fig. 9 illustrates the sectional view of the stamping surface of a coin staking punch, and its stamping surface only scribbles in the designated area and causes anticorrosive additive material, and this is that the step described in application drawing 7 and Fig. 8 is made.On the photo-resist that keeps on the coin, has the graphic embossment figure of a kind of holography, also can be with a kind of deformable material such as vinylformic acid, or form hologram pattern after a kind of thin resin process mold pressing of cast material as the process UV treatment, replace the photo-resist of handling through holographic exposure.
Figure 10 sectional view illustrates a kind of electroplating device, and it can be used to that hard metal is plated to the stamping surface that a kind of part has the coin staking punch of embossing hologram and gets on.This hologram pattern can be by mold pressing, casting, and injection moulding or etch transfer are gone to the coin surface, or transfer to the layer of substance that is coated in the coin surface and get on.The two-layer expression of device bottom is as galvanized material, and vertical part is represented an insulating material such as pvc pipe etc. that will original pattern surrounds, and limits plating and occurs in above the particular outer shape.
Figure 11 explanation is coated the skim conducting metal by the method for heating evaporation in a vacuum on the stamping surface of staking punch, have the surface relief hologram in specific portion on this stamping surface.
The sectional view of the inversion pattern staking punch that Figure 12 explanation is duplicated with a kind of female punching press pattern in equipment shown in Figure 10.
Figure 13 illustrates a kind of sectional view of electroplating device, use this equipment and be applicable to a kind of first-generation counter-rotating copying pattern that forms a kind of master pattern shown in Figure 11, or a kind of s-generation that forms a kind of first-generation inversion pattern shown in Figure 12 is just being changeed pattern.
Thereby Figure 14 illustrates the sectional view by a kind of staking punch that a kind of punching press cap sleeve that forms in the plating of the equipment shown in Figure 13 is formed on a kind of blank impact head surface.
Figure 15 illustrates a kind of contour forging equipment of coin, comprise a kind of cross section that the container of coin is housed, a kind of softish die work mother matrix, a kind of staking punch that raised areas is arranged, and a kind of mechanism of mobile die work mother matrix is used for that the different partly location of work on the mother matrix are stamped into coin and gets on.
Figure 16 explanation some particular surface on a kind of coin powers on and has plated metal, and other particular surface patrixes have forced up the sectional view of relief type hologram.
Figure 17 illustrates a kind of sectional view that is used to produce the hologram device that photo-resist that a kind of interference figure projects a coin surface gets on.
Figure 18 illustrates a kind of sectional view that hologram pattern projects the holography point array 1 system that the lip-deep photo-resist of coin gets on that is used to produce.The skewed crossing arrow of below represents that a kind of X-Y translation mechanism is used for mobile coin, can expose hologram pattern in the specific region of coin among the figure.
Embodiment:
Fig. 1 illustrates first step among a kind of embodiment of the present invention.The one or both sides of a coin 150 are coating positive photoresist such as SipleyAZ1848 earlier.After photo-resist 125 dryings, expose by a kind of photographic mask plate 140 usefulness ultraviolet ray 100 of almost being close to the coin surface.Some zone 105 is opaque on the photographic mask plate, and other zone is transparent, the photo-resist above the zone 135 that needs plated metal above the coin is exposed, and does not expose in other zone 130.The development of photo-resist be rely on to use appropriate solvent exposed areas dissolve and finish.When using positive photoresist such as SipleyAZ1848, solvent is the solution of alkalescence.There is not exposed areas not dissolve.If the use negative photoresist, do not expose in the zone that then needs to electroplate metal, and will expose in the zone that does not need to electroplate metal.
As shown in Figure 2, will be immersed in the electrolytic solution of gold at the coin that does not have exposed areas 200 still to have photo-resist.Gold only is deposited on the zone 210 that does not have the photo-resist protection on the coin.Fig. 3 illustrates a kind of post-depositional coin, shows a kind of gold layer 300 and the remaining photo-resist face 310 of metal refining not.With coin with water rinse after, again it is immersed in the organic solvent such as acetone and removes remaining photo-resist 310.The result obtains a kind of coin that has deposited metal on the fixed zone of photographic mask plate gauge.Because contact exposure has high resolving power and pinpoint accuracy, can very accurately be deposited on the specified zone of coin as on the literal end face of some projections with this method metal.Other the electroplate liquid such as chromium, silver, nickel or platinum can be used to deposit other metals except that gold.Perhaps, can be with other surface treatment method such as anodic oxidation, vacuum deposition, dyeing, or chemical corrosion waits and replaces electroplating.Key factor in every kind of situation is to select the surface of photo-resist or other materials protection coin for use, stops the surface treatment on specific zone.
Other embodiment of the present invention comprise:
1. replace positive photoresist among first embodiment with negative photoresist, and use a kind of suitable developing solution to make post-develop cause resist only to remain on the exposed areas on the coin.
2. with electroplating the gold in first embodiment such as silver, platinum, nickel, iridium or copper.
3. use vacuum deposition method to come metal refining or other materials to replace electro-plating method among first embodiment.Vacuum deposition method includes but are not limited to the use sputter, evaporation and plasma-deposited.
4. use chemical deposition such as silver-colored reduction method, deposition of diamond thin films, methods such as electroless nickel deposition or metal oxide generation replace the electro-plating method among first embodiment.
5. use the template 140 that lens or speculum replace one of application shown in Figure 1 to be close to contact and focus on a kind of ultraviolet light image to the coin surface that scribbles photo-resist, so that ultraviolet exposure (or expose with other effective sunlights according to the characteristic of used photo-resist) is accepted in the zone of specific photo-resist.For example, in the situation as shown in Figure 4, a kind of micro reflector array (TexasInstrument manufacturing) or other spatial light modulator can or be concerned with or the incoherent light irradiation with UV-light, and be imaged onto the coin 445 that scribbles photo-resist 440 and get on, make exposure image easily with coin conversion one by one, or several different patterns are exposed successively to same coin, go.Liquid crystal television screen can be as the same purpose of realization, still less selecting for use.Because standard LCTV liquid crystal and glass have the intensive sorption to UV-light.
6. laser may is directly inscribed on photo-resist, thereby just can expose on the specific region without mask plate.Like this, can use any commercial lasers writing system, wherein select to generate laser the optical wavelength of photo-resist sensitivity.
7. can use a kind of high resolving power dot matrix print system and print little printing ink point on coin, its effect is equivalent to resist, electroplate or other surface treatment step in, metal or other ornamental materials are only attached to the place that does not have stencil point on the coin.In this embodiment, need be with a kind of printing ink with viscosity and very fast exsiccation.
8. in another embodiment of the present invention, for will be on coin embossed hologram, need make a kind of mold pressing head with following step:
Do a kind of master (concavity) coin mold pressing 640 (as describing among Fig. 6) with ordinary method at first, earlier.
Secondly, this mold pressing head will apply positive photoresist 650.
In the 3rd step, this mold pressing head will double expose, shown in Fig. 7,8.
Exposure for the first time has high energy levels and is needing get on 775 location of hologram of mold pressing not have energy in 770 zones that do not need embossed hologram.As the exposure second time among Fig. 8 is the holographic interference pattern 835 that forms by a kind of mask plate 810.Exposure for the second time is incoherent (wherein will remove photo-resist) for the place in the high-energy exposure first time, and in the zone 840 that needs embossed hologram enough the exposure photo-resist hologram pattern that only generates a kind of embossment with after development (opposite) with whole removals be abundant necessity.This hologram mask plate 810 can have zone of opacity 830 to go to stop any luminous energy to transmit or be diffracted in those zones to go.
The 4th, the development photo-resist removing the photo-resist in high-energy exposed areas 770 fully, and generates embossing pattern in 840 zones of less energy exposure.This pattern is corresponding to the holographic interference pattern.Shown in Figure 9 is a kind of master mold pressure head 900 of photo-resist of the development with embossment holographic interference pattern 925.
The 5th, the mold pressing head is immersed in carries out Passivation Treatment in ammonium dichromate or the potassium bichromate solution, this passivation step can make processed surface keep electroconductibility but weaken electrodeposit metals and the coin surface between sticking power, thereby make after the deposition layer and the coin surface isolation.Perhaps, also can carry out passivation before the coating photo-resist on the coin.
The 6th, the silver that the coin surface applied hundreds of dust () of passivation is thick or the metal 1140 of other conductions, hydatogenesis 1130 methods in the applied vacuum or realize this purpose with the chemical process of for example spray silver, this conductive layer can be used as conducting surface in electrodeposition step subsequently.
The 7th, one or more thick metal layers 1045,1055 duplicates by the electrodeposition process on silver layer, and shown in Figure 10,13, thickness is that 1MM---10MM is comparatively suitable, but thicker or thin a bit can fine work.
The 8th, remove this deposition layer 1045,1055 on the mold pressing head, and use suitable solvent cleaning, with remove any remnants photo-resist.
The 9th, this deposition layer is carried out passivation, form the replica in this drift chamber as shown in figure 13 as a kind of core body of electroplating usefulness, difference is that this mold pressing head has increased a kind of surface relief pattern in the predetermined zone that keeps the photo-resist and the holographic interference pattern that exposes.In Figure 13, electric current flows between electrode 1365 and core body 1345, depositing metal layers 1385 and 1375, and non-conductive mould 1325 limit electrolysis only take place in a garden column space.Passivation can be passed through, and for example finishes in the potassium dichromate aqueous solution with coin input 5%.
The tenth, the replica of making in step 9 can be modified if necessary, and its back side can be ground smoothly if necessary, is installed in as shown in figure 14 then in the mold pressing 1420.Drift 1450 can stick with glue, the two sides adhesive tape, and pressure fitted, or other suitable means cling, the mold pressing head of making like this can be used for mold pressing coin or other products, and can occur the hologram pattern of embossment on the product of punching press.
9, step 3 and the 4 in addition another kind of concrete treatment processs for the foregoing description are just to develop in a rarer developing solution after photo-resist exposes for the first time, to remove the photo-resist of exposure area, and then carry out the exposure second time, followed by developing with a denseer developing solution.Exposure and development cycle are removed the photo-resist that carried out originally in the exposure area for the first time, and relatively do not influence the photo-resist that does not originally carry out in the exposure area, and exposure/development cycle is developed the surface relief pattern in the photo-resist that keeps for the second time, and is corresponding with the holographic interference pattern.For some photo-resist, it is bigger that its exposure and the dissolution rate that do not have an exposure area differ with rarer photographic developer the time.
If 10 photo-resists and coin surface meet very goodly and the extremely thin artistic details on coin surface that do not make is unclear, at this moment in fact can need only on the coin surface and apply photo-resist, make it accept the exposure of holographic relief pattern as shown in figure 17 in the designated area, then carry out enough developments and reveal a holographic relief pattern, then it as a core body, form a coin mold pressing head again.In Figure 17, a laser beam 1730 shines on the hologram 1700, forms reference and subject beam 1740, constitutes the interference figure on the photo-resist layer 1710 in a coin or the coin mold pressing 1720.
11, in another embodiment of the present invention, a holographic working plate 1533 is positioned on the coin 1551, as shown in figure 15, an instrument 1536 is used for working plate 1533 is pressed to the designated area on coin surface, thereby the hologram on the working plate is molded on the coin.This working plate can also be positioned on the next coin, the part that does not have mold pressing on the working plate can be molded on the next coin like this.A coin clamping device the 1554, the 1557th is used for supporting coin and keeps it to be positioned at accurate position.Holographic working plate is a nickel version (about 50 micron thickness) normally, is with electric plating method electronickelling on a holographic surface relief mother matrix, separates from mother matrix then and makes.
First specific embodiment:
These specific embodiments of the invention are all respects that combine above-mentioned several embodiment, and are as described below:
A kind of silver coin that obtains from certain mint has been suppressed with a kind of camegraph of people's face and the word " MEDALLION " of projection above.Only require now edge 510 plated with gold (see figure 5)s at the word 530 and the silver coin of projection.
Scan this silver coin with commercial image analyzer and obtain its digitized image.With ADOBEPHOTOSHOP or other image processing software this digitized image is edited, making letter and edge section all is white for black other part.Utilize business-like artistic treatment process with this image printing to film, utilize the contact exposure method with the copying image on the film to the photograph sheet glass, thereby make a hard glass mask 140, as shown in Figure 1, wherein word on the silver coin image and edge are transparent, and every other part all is opaque.Utilize the method for standard to plate the antireflection rete, reduce the unwanted reflection on mask surface on glass mask version two sides.
Can utilize centrifugal rotational method (per minute 16000 changes) that the AZ1848 photo-resist is coated on the silver coin.Carefully word on the glass mask and edge are aimed at the corresponding part on the silver coin, shone silver coin by mask plate, so only exposed in the place that needs on the silver coin to expose with UV-light.Then silver coin is immersed the development of photoresist liquid as acetone, remove the photo-resist of exposure area.
Then silver coin is carried out electrogilding, have only the edge of silver coin and literal to plate golden layer, and other are partly kept intact.At last with silver coin at development of photoresist liquid or rinsing in such as the solvent of acetone, remove remaining photo-resist.
Second specific embodiment:
A silver coin that obtains from certain mint has been suppressed with the image of a face 500, as shown in Figure 5 above.Word " MEKDALLION " 530 is the word of projection below face.Needing now to generate layout is plated with gold layer on edge and letter, and presents holographic chromatic coin in the back of face and literal background.
The same with first specific embodiment, obtain a digitized image thereby scan this silver coin, also to prepare two mask.First mask has only background partly opaque, and second mask has only edge and literal " MEDALLION " partly transparent.
Apply this silver coin with photo-resist, at first carry out heavy exposure, thereby make on the silver coin that all parts are all exposed except background by first mask.Remove first mask then.Under situation without mask, a hologram pattern is exposed on photo-resist, make all parts that comprise background on the silver coin surface all accept exposure thus.After this exposed for the second time, background had partly only been accepted the exposure of hologram, but edge and literal then this double exposure all accepted.Then photo-resist is developed, all photo-resists partly except that removing background, and generate a surface relief hologram in the photo-resist on background surface.
This silver coin is placed among 5% potassium dichromate aqueous solution then, the part that is not covered by photo-resist on the passivation silver coin (also can just carry out passivation to silver coin before not covering photo-resist).The silver coin of this passivation covers skim conducting metal 1140 as shown in figure 11 by the method for vacuum plating again.This sheet metal makes nickel can be plated to whole surface as the negative electrode of electrolytic nickel cell, can intactly remove after deposition but passivation guarantees the nickel dam that plates.Before electronickelling, get up with nonconducting mould 1300 shieldings in the limit of coin and the back side, as shown in figure 13, so that galvanic deposit can only be occurred on the processed face of coin.The thickness that is plated in the lip-deep nickel of coin passivation is 5 millimeters.
Take nickel dam and coin away from the PVC mould, they are drawn back separation mutually.Then nickel spare is put into the acetone rinsing to remove any remaining photo-resist, rinsing in distilled water again dries up with dried nitrogen vapour.This nickel spare (1225 among Figure 12) is a recessed duplicate of coin, and it clearly partly presents the hologram diffraction color in background.
The nickel spare that this is recessed be placed on carry out passivation in the potassium bichromate and a suitable mold electronickelling to be formed into an intermediary core body, as shown in figure 13.Core body is a convexity duplicate of original coin in the middle of this, but hologram color is arranged on background.
At last, by core body in the middle of the passivation and place it in the mould shown in Figure 13 electrodeposited chromium or other hard metals with one of final formation " coin punching press cap ", its top end surface is processed into the plane and polishes, then this cap is sticked on the light face of a coin staking punch, as shown in figure 14 with a kind of high-temperature resin.The instrument of making so just can be used to the punching press coin, and its background partly has identical hologram diffraction pattern.
These coins successively described in first specific embodiment on literal and edge electrogilding, the photo-resist on the coin is only exposed by second mask, thereby makes only at needed regional electrogilding.
The 3rd specific embodiment:
Coin 1765 usefulness spraying and applying methods are coated photo-resist in Figure 17.This coin is accepted the exposure by the light beam almost being close to hologram 1700 diffraction on coin surface and coming, usefulness be 441 nanometer lasers 1730 of helium cadmium laser, exposure energy is approximately 50 millijoule/square centimeters.Also can be with an optical projection system with laser radiation (as shown in Figure 4) from a coin hologram 1700 far away or a standard to real image of coin projection, holography method according to standard, by a compound reference laser beam 425 and real image light beam 435, thereby produce an interference figure on coin surface 445.Then photo-resist (440 and 1710) is carried out development treatment, the result has formed a surface relief hologram in the lip-deep photo-resist of coin.Coin is placed on passivation in the potassium bichromate solution, applies up the chromium layer of 10 nanometer thickness skim dimantines again with the method for vacuum plating, be plated to 5 mm thick with electrochemical plating again.Come from the coin branch together electroplating the chromium layer and the dimantine layer that get on, the end face of chromium layer grinds gentle polishing, adheres to then on the press tool.The surface of dimantine has the embossing pattern of the coin that comprises the holographic relief pattern.The staking punch of making like this is used for the punching press coin, can demonstrate on the surface of the coin of making like this to be included in the hologram 1700 or to be recorded in hologram image in the optical projection system among Fig. 4.
The 4th specific embodiment:
A coin is coated photo-resist, some strong ultraviolet photoetching in zone, can remove all photo-resists in these zones like this in developing process after this, on the coin expose with the hologram pattern that a dot matrix holographic printing system as shown in figure 18 produces in other zone.In an illustrated embodiment, beam of laser 1805 by a diffraction grating 1800 separately, by lens 1820 part that is illuminated on the diffraction grating is imaged on the photo-resist 1825 then, the position that this coin constantly moves to many settings makes that many differences expose on the coin, and diffraction grating can rotate or change the direction and the cycle of the grating of controlling each measuring point with other.This coin that is coated with photo-resist develops, the result removes all through the photo-resist of the part of heavy exposure, simultaneously formed a surface relief hologram at the exposed part that only receives dot matrix holographic printing system, this coin carries out utilizing the method for describing in the 3rd specific embodiment to make a coin staking punch again after the passivation.
General consideration:
The purpose that these or other embodiment of the present invention here discusses is the principle of this invention of explanation, does not therefore limit this scope of invention.Any characteristic of coin or its making step can change over other equivalent characteristic or step, or other can cause having the step of identical net result, all do not depart from the spirit and scope of the present invention.
In the claim below and in the superincumbent specific embodiment, " commemorative coin " and " coin " can exchange application.In addition, other project is jewellery, tableware, the colored merit band of medal, prize for example, or other are general, and to use thing that precious metals or high value thing make be to consider to be included among " commemorative coin " and " coin ", and this is produced on these above thing owing to above-described method steps can directly apply to gold or other decorative metals.
In above-mentioned any embodiment, a laser apparatus, gas discharge lamp, ultraviolet LED, Jupiter or incandescent light can be used as light source and go photo-resist is exposed, and this will see will be with coherent light or incoherent light, with ultraviolet lamp or visible light, which kind of light to be suitablely to decide with.
Claims (8)
1, has ornamental or sacrificial metal coating or have coin, souvenir badge, jewellery or other metal products of the diffraction embossing pattern of direct mold pressing on its surface at selection area.
2, metal products is imposed the method for decoration, comprise, electroplate with a predetermined pattern, by apply described pattern with photo-resist, according to described pattern described photo-resist is exposed,, described goods are electroplated described development of photoresist, then remove described photo-resist, obtain described pattern thus.
3, metal products is imposed the method for decoration, comprise, the material that outward appearance is different from the metal that constitutes described goods deposits, metal products is coated photo-resist, according to described pattern, to described photo-resist exposure, described photo-resist is developed, the described material of the area deposition of removing photographic developer on described goods then, is removed described photo-resist and is stayed intact deposition material.
4, a kind of method of making the stamping parts goods comprises,
Make a kind of cap of press tool, on its working face, have holographic relief pattern and basse-taille pattern, and described cap is made with hard metal.
This cap attached on the press tool, and
Utilize described press tool that the workpiece face of this cap is pressed to the surface of goods, thereby product surface is got on according to the basse-taille pattern forming and the surface that described holographic relief pattern also is molded into described goods.
5, a kind of pressed part that has holographic effect, these goods are made by the method in the claim 4.
6, method as claimed in claim 3 is characterized in that, utilizes the light to described photo-resist sensitivity, and described image projection to described photo-resist, is finished according to described pattern the photo-resist step of exposing with this.
7, method as claimed in claim 6 is characterized in that, an active spatial light modulator is imaged on the step of finishing described projection image on the described coin.
8, method as claimed in claim 6 is characterized in that wherein said image or its part image are unique for each coin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01139613 CN1422983A (en) | 2001-11-23 | 2001-11-23 | Reinforced coin product and its making method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01139613 CN1422983A (en) | 2001-11-23 | 2001-11-23 | Reinforced coin product and its making method |
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| CN1422983A true CN1422983A (en) | 2003-06-11 |
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| CN 01139613 Pending CN1422983A (en) | 2001-11-23 | 2001-11-23 | Reinforced coin product and its making method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101472746A (en) * | 2006-06-14 | 2009-07-01 | 阿万托尼有限公司 | Anti-counterfeit hologram |
| CN102582337A (en) * | 2011-01-18 | 2012-07-18 | 上海造币有限公司 | Manufacturing method for thin-type large-size high-relief commemorative coin (medallion) |
| CN103366439A (en) * | 2012-04-05 | 2013-10-23 | 深圳国宝造币有限公司 | Metal badge and coin, machine-readable anti-counterfeiting system thereof, and machine-readable anti-counterfeiting method of same |
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2001
- 2001-11-23 CN CN 01139613 patent/CN1422983A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101472746A (en) * | 2006-06-14 | 2009-07-01 | 阿万托尼有限公司 | Anti-counterfeit hologram |
| CN101472746B (en) * | 2006-06-14 | 2013-01-23 | 阿万托尼有限公司 | Product comprising diffractive microstructure area, device and method for manufacturing the products |
| CN102582337A (en) * | 2011-01-18 | 2012-07-18 | 上海造币有限公司 | Manufacturing method for thin-type large-size high-relief commemorative coin (medallion) |
| CN102582337B (en) * | 2011-01-18 | 2015-04-08 | 上海造币有限公司 | Manufacturing method for thin-type large-size high-relief commemorative coin (medallion) |
| CN103366439A (en) * | 2012-04-05 | 2013-10-23 | 深圳国宝造币有限公司 | Metal badge and coin, machine-readable anti-counterfeiting system thereof, and machine-readable anti-counterfeiting method of same |
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