CN1417031A - Ink jet print head chip - Google Patents
Ink jet print head chip Download PDFInfo
- Publication number
- CN1417031A CN1417031A CN 01134495 CN01134495A CN1417031A CN 1417031 A CN1417031 A CN 1417031A CN 01134495 CN01134495 CN 01134495 CN 01134495 A CN01134495 A CN 01134495A CN 1417031 A CN1417031 A CN 1417031A
- Authority
- CN
- China
- Prior art keywords
- ink
- print head
- head chip
- jet print
- ink jet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
The ink jet print head chip is mounted at the nose of ink cartridge and has the structure comprising silicon substrate, separating layer and jet sheet with two rows of ink jetting holes, as well as two rows of ink channels among the silicon substrate, the separating layer and the jet sheet and two separate control circuits outside the two rows of ink jetting holes. By means of the said configuration, relatively large area may be provided in the central position of ink jet print head chip for adhering the jet sheet. Flexible circuit board is used to transmit the outer control signal to the control circuits so as to start ink jet to form figure or writing.
Description
Technical field
The present invention relates to a kind of ink jet print head chip, relate to particularly that a kind of ink runner is distributed on the wafer between two row's jet orifice and control circuit is distributed in the ink jet print head chip in the relative outside of two row's jet orifice.
Background technology
Be broadly divided into two kinds at present, be respectively heated type ink jet print head chip and piezoelectric ink jet head wafer by the ink jet print head chip of widespread usage.Owing to the product competition fierceness, the pursuit improvement breaks through and makes excessive demands progress to cause the developer must rack one's brains ceaselessly, makes the structure of ink jet print head chip satisfy new demand at any time, and constantly pursues the reduction of cost and the lifting of yield rate on technology.This all depends on the breakthrough of structural design, technology and material aspect.With U.S. Pat 4,683, No. 481 " the heated type printhead (Thermal Ink Jet Common-Slotted Ink FeedPrint-head) of ink feed slot altogether " is example, be to dig a medial launder on the silicon substrate as ink delivery shared pathway in each black chamber to the silicon substrate, cover covers the spray nozzle sheet of layer of metal matter on this silicon substrate, the position of its spray orifice is aimed at one by one with the black chamber on the silicon substrate, when the heating resistor in any one black chamber is energized, near the resistance ink is just sharply heated and instant vaporization, thereby makes ink from this metallic spray nozzle sheet ejection.
Because process technology is progressive not as today in the past, the system groove is quite time-consuming together operation in the middle of silicon substrate.After U.S. Pat 5 is arranged, 635, No. 966 " sending the thermal head structure and the method for making (Edge Feed Ink Delivery Thermal Inkjet Print-headStructure And Method of Fabrication) thereof of China ink from lateral margin " proposes following improvement structure and gives up the structure and the operation of digging medial launder.This contains below flexible circuit board 20 at the ink jet print head chip 30 of its nose 11 through the structure outward appearance of improvement as shown in Figure 1, becomes imperceptible jet orifice 22 through special Laser Processing on this flexible circuit board 20, therefore has the function of general spray nozzle sheet.Because this jet orifice 22 utilizes laser to be processed on flexible circuit board 20, each jet orifice 22 could be binded on ink jet print head chip 30 after subsequently must superprecision ground aiming at each excitation chamber 33 in the ink jet print head chip 30, otherwise can't produce ink-jet function completely.
As shown in Figure 2, can further learn the cross-section structure of the nose 11 of this Inkjet Cartridge 10, be provided with an intermediate channel 12 in the inside of nose 11, in the fixing silicon substrate 31 of the end of intermediate channel 12, utilize the edge, both sides 310 of silicon substrate 31 to constitute a pair of separate and ink runner 13 that communicate with intermediate channel 12 with space between the nose 11.Ink enters excitation chamber 33 at last from the middle conduit 12 silicon substrate edge 310 of flowing through, and by exciting element 34 to excite, thereby can turn to ink droplet from 22 ejections of the jet orifice on the flexible circuit board 20.
Can further understand again from three-dimensional cutaway view shown in Figure 3, ink enters excitation chamber 33 along big arrow 40 directions among the figure through the edge 310 of silicon substrate 31, the ink excitation chamber 33 in can be by exciting element 34 to excite jet orifice 22 from the flexible circuit board 20 spray and become ink droplet.The formation of so-called excitation chamber 33 can be understood with reference to figure 4 simultaneously, and the face profile of Regional Representative's separate layer 32 of site is arranged in Fig. 4.Separate layer 32 is on the surface of silicon substrate 31, and the pattern-making after etching becomes some barriers, forms the excitation chamber 33 of some ink entries 321, constriction mouth 320 and inner terminal in regular turn, is equipped with one in the inside of each excitation chamber 33 and excites element 34.Exciting element 34 can be resistance thermometer clement or piezoelectric element, can Inkjet Cartridge 10 can be complied with instruct control and spray ink droplet from jet orifice 22 according to golden 21 signals that imported into that fill up of signal input through the decipher of control circuits 35 and reaction action respectively.
, just bind between separate layer 32 and the flexible circuit board 20 with after excitation chamber 33 is aimed at one by one in whole jet orifice 22 with thin bonding coat 23, utilize simultaneously the glutinous material 24 of envelope will around bind.At last, as shown in Figure 5, all elements all cover under the flexible circuit board 20, and wherein this imperceptible jet orifice 22 is only exposed on nose 11 surfaces of Inkjet Cartridge 10.
After manyly continue to use said structure, for example: U.S. Pat 5,638,101, patent such as No. 5,946,012, US 5,648,805 and US all discloses approximate structure with a series of United States Patent (USP)s.Because it is quite difficult that trickle jet orifice 22 will be aimed at each excitation chamber 33 fully on each flexible circuit board 20, involve and avoid adhesive to overflow again fully when temperature, the humidity control of assembly environment and flexible circuit board 20 bind with separate layer 32 and stop up jet orifice 22 or excitation chamber 33, therefore need extremely expensive high-precision equipment.If will expand production capacity, just mean the equipment investment that needs are huge.
Summary of the invention
In order to reduce the technical difficulty of making the said goods, and reduce the production equipment cost, the present invention is just improved at the structure of this product.
The object of the present invention is to provide a kind of ink jet print head chip, utilize the change of structure, need the technical problem of fine registration flexible circuit board 20 and separate layer 32 when exempting assembling.It mainly changes, be above-mentioned ink runner is moved on to from the outside of jet orifice the inboard of jet orifice, and the control circuit of centre is divided into two, move on to the relative outside of two row's jet orifice, the flexible circuit board that is provided with window is joined, to abdicate of the bonding of the middle area of this wafer for spray nozzle sheet in the outer rim and the control circuit of wafer.
Be placed in the nose of Inkjet Cartridge and electrically engage with flexible circuit board according to ink jet print head chip of the present invention, wherein this wafer comprises at least:
The surface is provided with the silicon substrate that a plurality of inks excite element;
Be positioned on this silicon substrate, have a plurality of separate layers that excite the ink excitation chamber of unit around ink;
Have the spray nozzle sheet of a plurality of jet orifice that are divided into two rows and almost parallel, the distributing position of jet orifice excites element corresponding with these a plurality of inks, can be for being in the interior ink of this ink excitation chamber respectively from wherein ejection;
Be distributed in the pair of control circuit in the relative outside of this two rows jet orifice,, make this ink excite the element action to receive its external control signal in order to electrically to engage with aforesaid flexible circuit board; And
Be distributed in a pair of ink runner of the inboard between this two rows jet orifice, arrive in this ink excitation chamber in order to supply and additional ink.
Description of drawings
Fig. 1 is existing Inkjet Cartridge outward appearance perspective view.
Fig. 2 is the cross-section structure of existing Inkjet Cartridge nose.
Fig. 3 is the broken section perspective view of existing ink jet print head chip.
Fig. 4 is the separate layer of existing ink jet print head chip and the relativeness schematic diagram of Inkjet Cartridge nose.
Fig. 5 is the relativeness schematic diagram of existing ink jet print head chip and flexible circuit board.
Fig. 6 is the relativeness schematic diagram of ink jet print head chip of the present invention and flexible circuit board.
Fig. 7 is the cutaway view along the A-A line of Fig. 6.
Fig. 8 is an Inkjet Cartridge outward appearance perspective view of the present invention.
For allowing above-mentioned and other purposes of the present invention, feature and advantage become apparent, below describe the present invention in conjunction with the accompanying drawings in detail with preferred embodiment.
The specific embodiment
Again with reference to existing structure shown in Figure 5, ink jet print head chip 30 is provided with control circuit 35 in the centre, but owing to do not possess spray nozzle sheet on this ink jet print head chip 30, so need utilize laser equipment on flexible circuit board 20, to process jet orifice in a row 22 in addition, and aim at the back formation spray nozzle sheet of fitting.In other words, if do not fit flexible circuit board 20, or the jet orifice on flexible circuit board 20 22 has a hole not aim at or sealed by glutinous agent for some reason, and the Inkjet Cartridge 10 that then last assembling is finished can become substandard products and can't fully bring into play its ink-jet function.Because the processing of ink jet print head chip 30 and the process of flexible circuit board 20 are discontinuous mutually, thereby its cost is that the environment control that need rely on expensive precision equipment and strictness when combination could be overcome.
As shown in Figure 6 and Figure 7, ink jet print head chip 30A of the present invention has a pair of control circuit of dividing right and left 56,57, is electrically connected with flexible circuit board 70.In addition, ink jet print head chip 50 has a spray nozzle sheet 55, makes this spray nozzle sheet 55 can expose its jet orifice 550 at least and have a window on the flexible circuit board 70.Because the manufacturing process and the material of this spray nozzle sheet are not emphasis of the present invention, so do not repeat them here, but can be made with reference to present existing various patented technologies, for example: U.S. Pat 4,809, No. 428 disclosed methods can directly be finished excitation chamber and the nickel matter spray nozzle sheet with resistance thermometer clement with same set of manufacturing process; Or, finish excitation chamber and spray nozzle sheet with same set of manufacturing process with piezoelectric element with reference to the technology contents of No. 5,376,856, United States Patent (USP) UA.In addition, this spray nozzle sheet material also can be macromolecular material, and for example U.S. Pat 4,829, and the mould pressing method of No. 319 disclosures can be produced with Merlon or with the made spray nozzle sheet of the polyacrylate material of acryl series.
The formation of ink jet crystal plate 50 of the present invention has a silicon substrate 51 and a separate layer 53 at least.In the silicon substrate 51 ink supply groove 52 can be set, make ink be flowed into ink runner 54, and enter in the excitation chamber that communicates with ink runner 54.Spray nozzle sheet 55 is being pasted in the top of separate layer 53, this separate layer 53 is made the profile (promptly adding the zone of site) that the pattern after etching becomes identical or approximate separate layer 32 shown in Figure 4 through shadow mask earlier, form barrier and constitute some excitation chamber, and heating element heater or piezoelectric element be set in each excitation chamber, in order to excite the ink in excitation chamber, make it ejection from the jet orifice 550 of spray nozzle sheet 55.
The difference of comparison diagram 5 and Fig. 6, the present invention and the different place of structure shown in Figure 5 are as follows: one. and the present invention is provided with window at flexible circuit board 70, and spray nozzle sheet 550 is not covered by this flexible circuit board 70; Two. in order to increase the gluing area of spray nozzle sheet 55 and ink jet print head chip 50, to originally be divided into two at ink jet print head chip 30 middle control circuit 35A, make it to change the left and right control circuit 56,57 in jet orifice 550 outsides that are distributed on the ink jet print head chip 50 of the present invention, and the ink runner that is positioned at the outside is originally moved on to the inboard of jet orifice 550.Flexible circuit board 70 electrically connects with left and right control circuit 56,57, is provided with the signal input gold pad 71 that exposes to Inkjet Cartridge 10 sides in the other end, and the control signal from the outside can be conveyed to left and right control circuit 56,57.The outward appearance of finishing product at last as shown in Figure 8.
Describe the present invention in detail above, but be not in order to limit the present invention with preferred embodiment.Those of ordinary skill in the field use the present invention to make other easy equivalence designs and remodeling without departing from the spirit and scope of the present invention again when having the ability.Therefore, protection scope of the present invention is when being as the criterion with the scope that accompanying claims were defined.
Claims (10)
1. ink jet print head chip is placed in the nose of Inkjet Cartridge and electrically engages with flexible circuit board, and wherein this wafer comprises at least:
One silicon substrate, surface are provided with a plurality of inks and excite element;
One separate layer is positioned on this silicon substrate, has a plurality of ink excitation chamber that excite element around described ink;
One spray nozzle sheet has a plurality of jet orifice that are divided into two rows and almost parallel, and the distributing position of this jet orifice excites element corresponding with described a plurality of inks, can be for the individually therefrom ejection of ink that is in the described ink excitation chamber;
The pair of control circuit is distributed in the relative outside of described two row's jet orifice, in order to electrically to engage with described flexible circuit board, makes described ink excite element action to receive its external control signal; And
A pair of ink runner is distributed in the inboard between described two row's jet orifice, arrives in the described ink excitation chamber in order to supply and additional ink.
2. ink jet print head chip as claimed in claim 1 is characterized in that described flexible circuit board is provided with a window, makes the surface of described spray nozzle sheet expose its jet orifice at least.
3. ink jet print head chip as claimed in claim 1 is characterized in that described flexible circuit board has some signal input gold pads, can be connected to the signal from the outside described control circuit.
4. ink jet print head chip as claimed in claim 1 is characterized in that the signal input gold pad of described flexible circuit board exposes to the Inkjet Cartridge side.
5. ink jet print head chip as claimed in claim 1 is characterized in that it is a piezoelectric element that described ink excites element.
6. ink jet print head chip as claimed in claim 1 is characterized in that it is a heating element heater that described ink excites element.
7. ink jet print head chip as claimed in claim 1 is characterized in that described spray nozzle sheet is constituted by metal material.
8. ink jet print head chip as claimed in claim 7 is characterized in that the material of described spray nozzle sheet can be nickel metal or nickel metallic compound.
9. ink jet print head chip as claimed in claim 1 is characterized in that described spray nozzle sheet is that macromolecular material is made.
10. ink jet print head chip as claimed in claim 9, the macromolecular material that it is characterized in that described spray nozzle sheet is meant the polyacrylate material of Merlon or acryl series.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 01134495 CN1417031A (en) | 2001-11-06 | 2001-11-06 | Ink jet print head chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 01134495 CN1417031A (en) | 2001-11-06 | 2001-11-06 | Ink jet print head chip |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1417031A true CN1417031A (en) | 2003-05-14 |
Family
ID=4672540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 01134495 Pending CN1417031A (en) | 2001-11-06 | 2001-11-06 | Ink jet print head chip |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1417031A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100421947C (en) * | 2005-12-30 | 2008-10-01 | 研能科技股份有限公司 | Ink jet head structure |
TWI789529B (en) * | 2018-07-30 | 2023-01-11 | 瑞士商西克帕控股有限公司 | A multi-chip module (mcm) assembly |
-
2001
- 2001-11-06 CN CN 01134495 patent/CN1417031A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100421947C (en) * | 2005-12-30 | 2008-10-01 | 研能科技股份有限公司 | Ink jet head structure |
TWI789529B (en) * | 2018-07-30 | 2023-01-11 | 瑞士商西克帕控股有限公司 | A multi-chip module (mcm) assembly |
US11584126B2 (en) | 2018-07-30 | 2023-02-21 | Sicpa Holding Sa | Multi-chip module (MCM) assembly |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6997540B2 (en) | Substrate for fluid ejection devices | |
US5719605A (en) | Large array heater chips for thermal ink jet printheads | |
US5322594A (en) | Manufacture of a one piece full width ink jet printing bar | |
EP0423324B1 (en) | Bubble jet print cartridge | |
EP1232867B1 (en) | Electrical circuit for wide-array inkjet printhead assembly | |
EP3369573B1 (en) | Liquid ejection head, recording device and method for producing liquid ejection head | |
CN109070074B (en) | Monolithic carrier structure for digital distribution | |
JP2002086742A (en) | Method for forming ink-jet printing head assembly and ink-jet printing head assembly | |
CN102802958A (en) | A thermal inkjet print head with solvent resistance | |
CN100406259C (en) | Liquid ejection element and manufacturing method therefor | |
US6164762A (en) | Heater chip module and process for making same | |
EP1243416B1 (en) | Hybrid carrier for wide-array inkjet printhead assembly | |
US6951778B2 (en) | Edge-sealed substrates and methods for effecting the same | |
EP1415812B1 (en) | Fluid delivery for printhead assembly | |
US20090008027A1 (en) | Inkjet Printheads | |
US6880246B2 (en) | Method of forming substrate with fluid passage supports | |
US6733112B2 (en) | Carrier for printhead assembly including fluid manifold and isolation wells for electrical components | |
US20050012780A1 (en) | Printhead arrangement | |
CN1417031A (en) | Ink jet print head chip | |
US6497470B2 (en) | Ink jet printhead with large size silicon wafer and relative manufacturing process | |
US6736488B1 (en) | Electrical interconnect for printhead assembly | |
EP1485254B1 (en) | Composite ink jet printhead and relative manufacturing process | |
US6409307B1 (en) | Coplanar mounting of printhead dies for wide-array inkjet printhead assembly | |
US20030052948A1 (en) | Inkjet printhead chip | |
JP2006502023A (en) | Parallel inkjet printing apparatus and manufacturing method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |