CN1415473A - Method for manufacturing copper foil in transfer printing type with carrier - Google Patents
Method for manufacturing copper foil in transfer printing type with carrier Download PDFInfo
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- CN1415473A CN1415473A CN 01119303 CN01119303A CN1415473A CN 1415473 A CN1415473 A CN 1415473A CN 01119303 CN01119303 CN 01119303 CN 01119303 A CN01119303 A CN 01119303A CN 1415473 A CN1415473 A CN 1415473A
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- copper foil
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Abstract
A process for preparing transfer-type copper foil with carrier includes providing a carrier, cleaning and roughening the first surface of carrier, generating a metallic medium layer on the first surface by gas-phase deposition, chemically plating copper layer, and roughening the surface of copper foil.
Description
Technical field
The present invention relates to a kind of method for manufacturing copper foil, a kind ofly have carrier and the method for manufacturing copper foil in transfer printing type with carrier of output extra thin copper foil but particularly relate to.
Background technology
From nineteen thirty-seven the U.S. maximum produce the copper Anaconda of company and develop technology with the continuous manufacturing copper foil of electrolysis after, make cost that Copper Foil can be cheap supply the base copper plate in a large number and use, facilitate nineteen fifty popularizing relatively for the back printed circuit board (PCB).And with the trend of high speed, lightweight and the miniaturization of computer communication apparatus in recent years, its internal circuit plate also must relative engagement adopts the design of circuit miniaturization and Copper Foil thin typeization.
A kind of existing copper foil for printed circuit board manufacturing installation as shown in Figure 1, be in the electrolytic cell 72 that is equipped with copper electrolyte 71, to be provided with drum-type rotating cathode 73 and several the fixing electrolysis anodes 74 that a SUS316 stainless steel is made at interval, and, make the copper electroplating deposition form one deck electrolytic copper foil 75 in described rotating cathode 73 surfaces in described rotating cathode 73 and electrolysis 74 energisings of anode.
Though Copper Foil 75 thickness of above-mentioned existing apparatus output can change by adjusting size of current and drum-type rotating cathode 73 rotating speeds, but in practical operation, described Copper Foil 75 need have certain thickness, make the adhesive force of Copper Foil tensile strength greater than the described relatively drum-type rotating cathode 73 of Copper Foil, can take out from drum-type rotating cathode 73 surface isolation, so in fact it be unable to supply the following extra thin copper foil as 6 μ m (micron).And, the Copper Foil 75 of described device output is because of being the laminar of extremely fragile sensitivity, not only its store, transport and successive process get that to put operation all very difficult, Copper Foil 75 itself is easier to form flaws such as fold, pinprick and holes in the described process, influences the acceptance rate of subsequent product.
And the principal disadvantage of thicker Copper Foil, after itself and substrate pressing form copper clad laminate, in the subsequent etch program, because of its Copper Foil 81 height problem, easily cause 81 of former as shown in Figure 2 Copper Foils of isolating each other than the further lateral bending contact in upper strata, and produce the side etching phenomenon of improper short circuit, thus be difficult for forming fine rule road (as the live width line-spacing of 3mil), and can't meet the circuit miniaturization trend demand of electronics internal circuit board now.And, thicker Copper Foil need expend higher-energy and long period when laser beam perforation, expend cost relatively and reduce productive rate, and because of it needs higher laser energy, easily causing as shown in Figure 4, substrate 82 resins of copper foil layer 81 bottoms melt and gasify and formation reaming phenomenon, and compare with the normal punching finished product of Fig. 3, obviously influence the circuit board electrical performance.More because thicker Copper Foil needs higher laser beam perforation energy, in the practical puncture process, often need temporary transient the interruption, treat that temperature suitably cools off the back and the beginning proceed, cause Copper Foil bottom resin high-temperature gasification to form reaming, yet but increase the operation time-histories relatively and reduce output to avoid the energy concentrations.
Based on this, acquisition is to be trend of the times than the manufacturing that thin copper foil is beneficial to the fine rule road, and in view of above-mentioned thick Copper Foil all shortcomings that can't overcome in actual job, thereafter just having the pressing of 1/2oz (ounce) Copper Foil is copper clad laminate, then through Copper Foil being stung erosion to reduce another existing method consequentiality of thickness as the strong acid soup, yet described processing procedure not only increases the soup cost and the environmental issue of strong acid soup and heavy metal subsequent treatment of deriving, and it is also inhomogeneous that its reality is stung erosion thickness to Copper Foil.
Further with regard to a kind of existing copper foil base plate making method shown in Fig. 5,6, it is upper cover plate 91 (top board) and the lower shoe 92 (carrier board) that all right one way or the other pressing in opposite directions is provided earlier, and 93 on brown paper 93, two brown paper that upper cover plate 91 lower surfaces and each liner one of lower shoe 92 upper surfaces have the protection cushioning effect then are provided with a mirror steel plate 94 from top to bottom in regular turn, go up copper foil layer 95, a baseplate material (or claiming Prepreg) layer 96, copper foil layer 97 and another mirror steel plate 98 down; Then in opposite directions above-mentioned each layer therebetween pressurizeed gradually by upper cover plate 91 and lower shoe 92, and through heat, vacuumize and the supervisor of lowering the temperature after, copper foil layer 97 fully is incorporated into substrate material layer 96 upper and lower surfaces to make copper foil layer 95 reach down, and forms the copper clad laminate 99 among Fig. 6.
But in the above-mentioned processing procedure, because of being extremely fragile laminar, in the pressing process, very easily produce fold even breakage just as aforementioned described upper and lower copper foil layer 95,97; And especially as shown in Figure 6, substrate material layer 96 resins of melting see through copper foil layer 95 most probably, 97 holes leaks out to mirror steel plate 94,98 and it is polluted, so all must clean after each pressing program and grind mirror steel plate 94 with emery cloth, 98, to remove the glutinous slag 941 of resin on it and to keep one and decide flatness, so when increasing consumptive material and expending scavenger, the brush grinding machine of general clean steel also can only be removed the glutinous slag that is attached to the mirror steel plate surface, just can't handle going deep into steel plate top layer person, virtually and shorten expensive mirror steel plate service life.
In addition, because substrate material layer 96 generally all contains glass fibre and resinous principle, easily produce fine bits slag and directly attach to copper foil layer 95,97, or to be settled down to copper foil layer 95 surfaces as 951 states of suspended particulates among Fig. 5, make it in the pressing process, form small shrinkage pool (pit) in copper foil layer 95,97 surfaces, cause when forming circuit board line thereafter, easily cause improper short circuit or open circuit and have a strong impact on the yield of product.
Summary of the invention
But main purpose of the present invention is to provide a kind of method for manufacturing copper foil in transfer printing type with carrier of output extra thin copper foil, and the copper foil in transfer printing type supply that can be attached to carrier does not have manufacturer's use of Copper Foil electroplating device, and its carrier also can reduce pollution and the heat energy of absorption bore operation.
For achieving the above object, the method for manufacturing copper foil in transfer printing type with carrier of the present invention comprises the steps: that (1) provides a carrier with a first surface; (2) described first surface is cleaned and roughening treatment; (3) make described first surface form a metallic dielectric layer in the physical vapour deposition (PVD) mode; And (4) to the electro-coppering of described metallic dielectric layer surface chemistry to form a copper foil layer; And (5) carry out roughening treatment to described copper foil layer surface.
Adopt such scheme of the present invention, can optionally produce ultra-thin Copper Foil, and applicable all size demand and be convenient to its after etching and the perforation operation, and the manufacturer's use that can directly supply no Copper Foil electroplating device, the carrier of described Copper Foil then can reduce the heat that pollutes and absorb the bore operation generation.
Be clearer understanding purpose of the present invention, characteristics and advantage, the present invention is described in detail below in conjunction with drawings and Examples:
Description of drawings
Fig. 1 is the manufacturing installation mode of operation schematic side view of an existing copper foil for printed circuit board;
Fig. 2 is the Copper Foil normal condition partial schematic sectional view of an existing copper foil substrate;
Fig. 3 is the partial schematic sectional view of an existing copper foil substrate after by normal laser beam perforation;
To be an existing copper foil substrate form partial schematic sectional view after the reaming phenomenon by improper laser beam perforation to Fig. 4;
Fig. 5 is the first mode of operation schematic side view that adopts existing copper foil base plate making method;
Fig. 6 is the second mode of operation schematic side view of the existing copper foil base plate making method of Fig. 5;
Fig. 7 is the flow chart of a preferred embodiment of the present invention;
Fig. 8 is the copper foil in transfer printing type finished product schematic side view with carrier by a preferred embodiment of the present invention institute output;
Fig. 9 will have the copper foil in transfer printing type finished product and the stacked pressing schematic side view of a substrate material layer of carrier among Fig. 8;
Figure 10 is the schematic side view after black box shown in Figure 9 is disassembled, and wherein copper clad laminate takes out earlier;
Figure 11 is the copper clad laminate schematic side view that obtains after Fig. 9 disassembles step.
The specific embodiment
Shown in Fig. 7,8, a preferred embodiment of the manufacture method of the copper foil in transfer printing type with carrier of the present invention comprises the steps:
At first, step 11 provides a roughly rectangular tabular carrier 2, described carrier 2 can be metal (as aluminium, copper, iron etc.) or nonmetallic materials (as the polyethylene of bakelite plate, Teflon, release liners, VHD, the resiniferous glass fabric of pre-hardening etc.) and makes, and has a smooth first surface 21.
Shown in step 12, first surface 21 to described carrier 2 carries out cleaning again, to remove the unclean or attachment of microcosmic on it, described cleaning surfaces is handled and can any existing mode be carried out, as the chemical method that directly cleans with cleaning agent, interface activating agent, or the physics clean method by ultraviolet and ozone light irradiation and plasma (plasma) etc.
For another example shown in the step 13, again described first surface 21 is carried out roughening treatment, to increase and the bond strength of metal level thereafter, described cleaning surfaces is handled and also can any existing mode be carried out, as with chemical agents such as dilute sulfuric acid, NaOH, or the physics method of roughening by ultraviolet and ozone light irradiation and plasma etc.
Then shown in step 14, in first surface 21 in any existing physical vapour deposition (PVD) mode, (or claim vacuum coating as vacuum plating, vacuum plating), vacuum splashing and plating (vacuum sputtering) or ion gun technology such as (iron gun), the film metal dielectric layer 3 that formation one is made of copper, chromium, zinc, nickel, titanium or the alloy of above-mentioned metal more than two kinds can be also applicable in the alternate manner that described first surface 21 forms film metal dielectric layers 3.
Then as step 15, on the metallic dielectric layer 3 that first surface 21 forms, form the copper foil layer 4 of a predetermined thickness with existing electroless plating technology, owing to be to adopt plating mode, copper foil layer 4 controllable thickness that generate are formed on as in the atomic scope below 6 microns.Wherein, when above-mentioned steps 14 is when directly being formed at first surface 21 with the copper metal by the physical vapour deposition (PVD) mode, if the copper metal thickness of described formation meets the final finished demand, this step 15 just can be omitted, and the copper metal layer that directly forms with step 14 is as the copper foil layer of final finished.On the contrary,, then can further increase the copper metal layer thickness, make it meet the copper foil layer specification of final finished by this step 15 if during the still not enough trimmed size thickness of the copper metal thickness that step 14 forms.And when step 14 be when being formed at first surface 21 with non-copper metal, then this step 15 just can not be omitted, with the copper foil layer 4 that forms thickness up to specification.
For another example shown in the step 16, described copper foil layer 4 is further carried out surface coarsening to be handled, to increase its bond strength, described roughening treatment also can be adopted above-mentioned steps 13 described any existing modes, make copper foil layer 4 surfaces form needle-like, warty or other fine outstanding attachment, just then obtain the copper foil in transfer printing type finished product 5 with carrier of the present invention as step 17.
Obtain to have as shown in Figure 8 the copper foil in transfer printing type finished product 5 of carrier through above steps, it further combines with substrate to constitute the mode of copper clad laminate, with regard to as illustrated in Fig. 9, two copper foil in transfer printing type finished products 5 with carrier are stacked in opposite directions with its copper foil layer 4,4 of two copper foil layers and folder are established a substrate material layer 6 and (or are claimed Prepreg, can be mixture or other suitable material of glass fibre and resin etc.), again with described two finished products more than 5, the upper cover plate 71 of downside, lower shoe 72 pressurizes relatively, and through heating, vacuumize, after the general pressing programs such as (cold pressing) of colding pressing, as shown in figure 10 with upper cover plate 71, lower shoe 72 is oppositely disassembled, two copper foil layers 4 just are incorporated into described substrate material layer 6 by similar transfer printing effect as shown in figure 11, and form a copper clad laminate 8.
By implementation step, can obtain following remarkable advantage than prior art by the invention described above:
One, by Copper Foil by the present invention produced, its thickness depends on physical vapour deposition (PVD) (as vacuum plating, vacuum splashing and plating or ion gun etc.) thickness, and can be controlled to the extra thin copper foil specification that reaches 1 micron, the demand that not only applicable various base copper plate structure dress density and live width spacing are dwindled, do not have the shortcoming on many processing procedures of aforementioned thick Copper Foil yet, be convenient to processing operations such as its after etching and laser beam perforation.
Two, described Copper Foil can be supplied printed circuit board (PCB) manufacturing or assembling manufacturer in the lump together with its carrier, it is required expensive as equipment such as vacuum electricity (spattering) plating and electroless platings to make described manufacturer need not to be provided with voluntarily the invention described above processing procedure, just can obtain the Copper Foil of ultra-thin specification and directly apply to its circuit board process, so, especially can save considerable equipment relevant cost for described manufacturer.
Three, the carrier of described Copper Foil is except that having the carrying fixation of adhering to for Copper Foil, and can be in machine drilling operation thereafter, minimizing causes pollution to drill bit because of resin dissolves, and when described carrier is metal (as aluminium) material, has more the effect that the drill bit high-speed drilling produces heat energy that absorbs.
Four, in above-mentioned processing procedure, copper foil layer is attached to carrier surface by modes such as plating earlier, then then through being pressed on the baseplate material laminar surface, so the neither meeting of described from start to finish copper foil layer is the laminar of very fragile sensitivity as the Copper Foil that existing alternate manner makes, in other words, the copper foil layer that the present invention obtains to be attached to carrier can be exempted existing sheet Copper Foil fully and transport and get the puzzlement of putting inconvenience, more do not have in described process and form fold, flaws such as holes and influence the problem of subsequent product acceptance rate, and get because of its transportation and to put conveniently, can machine tool make and produce more automation.
Five, in addition with regard to its follow-up circuit board process, because each copper foil layer is evenly to be attached to carrier surface through modes such as plating, when itself and substrate material layer are stacked, can obtain the higher flatness that engages, compare that the existing copper foil substrate is stacked and placed on substrate with each monolithic Copper Foil and the mode of pressing more can significantly promote its circuit board product electrical performance.
Claims (15)
1. the method for manufacturing copper foil in transfer printing type with carrier is characterized in that comprising the steps:
(1) provide a carrier, described carrier has a first surface;
(2) first surface in described carrier forms a metallic dielectric layer;
(3) in the electro-coppering of described metallic dielectric layer surface chemistry, to form a copper foil layer that is attached to described carrier.
2. the method for manufacturing copper foil in transfer printing type with carrier as claimed in claim 1 is characterized in that:
Described step (2) is to form described metallic dielectric layer by the physical vapour deposition (PVD) mode.
3. the method for manufacturing copper foil in transfer printing type with carrier as claimed in claim 2 is characterized in that:
The physical vapour deposition (PVD) mode that described step (2) adopts is the vacuum plating method.
4. the method for manufacturing copper foil in transfer printing type with carrier as claimed in claim 2 is characterized in that:
The physical vapour deposition (PVD) mode that described step (2) adopts is the vacuum splashing and plating method.
5. the method for manufacturing copper foil in transfer printing type with carrier as claimed in claim 2 is characterized in that:
The physical vapour deposition (PVD) mode that described step (2) adopts is the ion marksmanship.
6. the method for manufacturing copper foil in transfer printing type with carrier as claimed in claim 1 or 2 is characterized in that:
Described method also comprises between between described step (1) and (2) described first surface being carried out the step (1-1) of cleaning.
7. the method for manufacturing copper foil in transfer printing type with carrier as claimed in claim 6 is characterized in that:
After described method also is included in described step (1-1), described first surface is carried out the step (1-2) of roughening treatment.
8. the method for manufacturing copper foil in transfer printing type with carrier as claimed in claim 1 or 2 is characterized in that:
Described method also is included in the step (4) that roughening treatment is carried out to described copper foil layer surface in described step (3) back.
9. the method for manufacturing copper foil in transfer printing type with carrier is characterized in that comprising the steps:
(1) provide a carrier, described carrier has a first surface;
(2) form a copper foil layer by the physical vapour deposition (PVD) mode in the first surface of described carrier.
10. the method for manufacturing copper foil in transfer printing type with carrier as claimed in claim 9 is characterized in that:
The physical vapour deposition (PVD) mode that described step (2) adopts is the vacuum plating method.
11. the method for manufacturing copper foil in transfer printing type with carrier as claimed in claim 9 is characterized in that:
The physical vapour deposition (PVD) mode that described step (2) adopts is the vacuum splashing and plating method.
12. the method for manufacturing copper foil in transfer printing type with carrier as claimed in claim 9 is characterized in that:
The physical vapour deposition (PVD) mode that described step (2) adopts is the ion marksmanship.
13. the method for manufacturing copper foil in transfer printing type with carrier as claimed in claim 9 is characterized in that:
Described method also comprises the step (1-1) of described first surface being carried out cleaning between between described step (1) and (2).
14. the method for manufacturing copper foil in transfer printing type with carrier as claimed in claim 13 is characterized in that:
Described method also is included in the step (1-2) that roughening treatment is carried out to described first surface in described step (1-1) back.
15. the method for manufacturing copper foil in transfer printing type with carrier as claimed in claim 9 is characterized in that:
Described method also is included in the step (3) that roughening treatment is carried out to described copper foil layer surface in described step (2) back.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01119303 CN1415473A (en) | 2001-10-29 | 2001-10-29 | Method for manufacturing copper foil in transfer printing type with carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01119303 CN1415473A (en) | 2001-10-29 | 2001-10-29 | Method for manufacturing copper foil in transfer printing type with carrier |
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| CN1415473A true CN1415473A (en) | 2003-05-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01119303 Pending CN1415473A (en) | 2001-10-29 | 2001-10-29 | Method for manufacturing copper foil in transfer printing type with carrier |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101992646A (en) * | 2009-08-20 | 2011-03-30 | 汉达精密电子(昆山)有限公司 | Method for manufacturing three-dimensional pattern with metal texture and star diamond effect |
| CN110004404A (en) * | 2019-05-07 | 2019-07-12 | 晏梦雨 | A kind of preparation method of self-supporting micron copper foil |
| CN113858603A (en) * | 2021-09-13 | 2021-12-31 | 深圳市信维通信股份有限公司 | Preparation method of polymer flexible copper clad laminate |
-
2001
- 2001-10-29 CN CN 01119303 patent/CN1415473A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101992646A (en) * | 2009-08-20 | 2011-03-30 | 汉达精密电子(昆山)有限公司 | Method for manufacturing three-dimensional pattern with metal texture and star diamond effect |
| CN101992646B (en) * | 2009-08-20 | 2014-11-12 | 汉达精密电子(昆山)有限公司 | Method for manufacturing three-dimensional pattern with metal texture and star diamond effect |
| CN110004404A (en) * | 2019-05-07 | 2019-07-12 | 晏梦雨 | A kind of preparation method of self-supporting micron copper foil |
| CN113858603A (en) * | 2021-09-13 | 2021-12-31 | 深圳市信维通信股份有限公司 | Preparation method of polymer flexible copper clad laminate |
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