CN1409586A - Soldering-inhibiting method for printed circuit board - Google Patents
Soldering-inhibiting method for printed circuit board Download PDFInfo
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- CN1409586A CN1409586A CN 01141427 CN01141427A CN1409586A CN 1409586 A CN1409586 A CN 1409586A CN 01141427 CN01141427 CN 01141427 CN 01141427 A CN01141427 A CN 01141427A CN 1409586 A CN1409586 A CN 1409586A
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- circuit board
- welding
- welding material
- pcb
- printed circuit
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Abstract
A welding-prevention method for printed circuit board is to coat a layer of half-solid welding-preventing material with a same expansion coefficient with the circuit board base material on one or two surfaces of the circuit board and a metal foil covering on the said resin material, to apply a predetermined pressure onto it and to be baked for a predetermined time for solidification, then to remove the metal foil on the copper surface to be exposed by etching with chemical solvent, to remove the to-bo-exposed solid welding material above the copper surface with electric etching for exposing the above mentioned copper surface, and at least to remove the remained metal foil and dry film covered on the material with chemical solvent to finish the welding-prevention operation of the circuit board.
Description
Technical field
The present invention is relevant with the manufacture method of printed circuit board (PCB) (PCB), particularly about the soldering-inhibiting method of printed circuit board (PCB).
Background technology
The general printed circuit board (PCB) of making after the completing of outer-layer circuit, must impose anti-welding protection to this outer-layer circuit and handle, to avoid this outer-layer circuit oxidation or solder shorts.
And the anti-welding processing method of known printed circuit board (PCB); be with the coating of screen painting, drum-type, curtain is coated with or mode such as electrostatic spraying will be gathered the green lacquer of weldering and is coated on the plate face of this circuit board; earlier but cool after the preliminary drying drying; utilize the mode of exposure imaging, development to remove the green lacquer that must not keep again; and in the end the resin in the green lacquer that retains is hardened fully with high-temperature baking, form the protective layer of the circuit of this circuit board of protection.
The known anti-welding processing method of this kind has following shortcoming:
1, utilize modes such as screen painting or drum-type coating that anti-welding green lacquer is coated on the mode of printed circuit board (PCB), must could accumulate green lacquer to required thickness by repeatedly wire mark or roll printing program, comparatively complicated on program.
2, this printed circuit board (PCB) is being carried out in the process of high-temperature baking, because the resin material in this anti-welding green lacquer is different with the coefficient of expansion of this board substrate, therefore be easy to generate internal stress between this resin material and this circuit board, and make this circuit board produce the phenomenon of deflection.
3, the thickness of this anti-welding green enamelled coating is wayward, causes the electrical shakiness of this circuit board.
4, applying the anti-welding green easy bubble that infiltrates in the process of circuit board that coats with lacquer, cause anti-welding reliability bad, and the life-span of the welding resisting layer that forms is shorter.
5, apply and anti-weldingly greenly to coat with lacquer in the mode of circuit board and can't make anti-welding green lacquer fill up through hole on this circuit board, therefore generally before coating, earlier with the insulation padding clog these through holes and brushing smooth after, carry out the coating of anti-welding green lacquer again, thereby increased the time and the cost of print circuit plates making.
6, apply anti-welding greenly when coating with lacquer on circuit board, difficultly on copper foil circuit form coat, and conjugation is relatively poor therebetween.
Summary of the invention
Main purpose of the present invention is to provide a kind of anti-welding quality good, and can not cause the soldering-inhibiting method of the printed circuit board (PCB) of circuit board deflection.
For reaching aforesaid goal of the invention, the soldering-inhibiting method of a kind of printed circuit board (PCB) provided by the invention includes the following step:
1, in treat anti-welding circuit board have circuit one side or two-sided on, be provided with the coefficient of expansion of one deck predetermined thickness semisolid anti-welding material identical or close with this board substrate and the metal forming that is covered in the predetermined thickness on this anti-welding material, this metal forming is an aluminium foil;
2, bestow predetermined pressure on this metal forming, the anti-welding material between this metal forming and this circuit board is closely being covered on this circuit board, and toast a scheduled time, make this semi-solid anti-welding material cured with a predetermined temperature;
3, utilize the chemical solvent etching mode to remove the locational metal forming of the copper face of desiring to expose on this circuit board with the etching of ferric trichloride solvent, with the method for electric paste etching the solid-state anti-welding material above the copper face of desiring to expose on this circuit board is removed again, to expose above-mentioned copper face;
4, utilize chemical solvent such as phosphide or hydrochloric acid to remove and be covered in remaining metal forming on this anti-welding material, finish the anti-welding operation of this printed circuit board (PCB).
Wherein the material of the base material of this printed circuit board (PCB) is multi-functional epoxy resin (Multi-functionEpoxy); And the anti-welding material of the described semisolid of this step 1 is to be all the multi-functional epoxy resin identical with the coefficient of expansion of this base material (Multi-function Epoxy) to add organic solvent, and forms through preliminary drying.
Wherein this anti-welding material is to be coated on earlier on the one side of this metal forming, is covered on this circuit board desire with the anti-welding material on this metal forming again and does on the anti-welding one side, makes this anti-welding material clip between between this circuit board and this aluminium foil.
Wherein the thickness of this aluminium foil is between 20 μ m-40 μ m, and this ferric trichloride (FeCl
3) proportion (specific gravity) between 13-1.5, temperature is between 40 ℃-60 ℃, and this phosphoric acid (H
3PO
4) volume ratio (volume to Volume) of solvent between 60%-80%, temperature between 50 ℃-80 ℃, the concentration of this hydrochloric acid (HCl) solvent between 10%-40%, temperature between 20 ℃-40 ℃.
Wherein this anti-welding material is to be coated on earlier on the one side of this metal forming, and the about 30 μ m-100 μ m of coating thickness are covered on this circuit board desire with the anti-welding material on this metal forming again and do on the anti-welding one side, make this anti-welding material clip between between this circuit board and this aluminium foil; And the described pressure of bestowing of this step 2 is 10-40kgw/cm
2all insist on and continuous continue about 1.5 hours-3 hours, the described baking temperature of this step 2 is 185 ℃ and continues about 1.5 hours-3 hours.
Description of drawings
In order to more clearly understand the present invention, especially exemplified by preferred embodiment of the present invention, and cooperate following accompanying drawing to elaborate, wherein:
Fig. 1 is the flow chart of the inventive method;
Fig. 2 is the enforcement schematic diagram of the inventive method.
Embodiment
See also Fig. 1, the step of the soldering-inhibiting method of printed circuit board (PCB) of the present invention is as follows:
1, covering of anti-welding material: in treat anti-welding circuit board have circuit one side or two-sided on, be provided with the coefficient of expansion of one deck predetermined thickness semisolid anti-welding material identical or close and the metal forming that is covered in the predetermined thickness on this anti-welding material with this board substrate.
2, the pressing of anti-welding material and curing: bestow predetermined pressure this full genus on the paper tinsel, make the anti-welding material between this metal forming and this circuit board closely cover work on this circuit board, and toast a scheduled time with a fixed temperature, make this semi-solid anti-welding material cured.
3, the removal of inessential anti-welding material: utilize the chemical solvent etching mode that the metal forming above the copper face of desiring to expose on this circuit board is removed, with the method for electric paste etching the solid-state anti-welding material above the copper face of desiring to expose on this circuit board is removed again, to expose above-mentioned copper face.
4, the removal of metal forming: utilize chemical solvent to remove and be covered in remaining metal forming on this anti-welding material, finish the anti-welding operation of this printed circuit board (PCB).
More than be method step of the present invention, below, lift a preferred embodiment and cooperate Fig. 2, describe the inventive method in detail.
See also Fig. 2, the soldering-inhibiting method of the printed circuit board (PCB) of present embodiment, main in order to have finished on the printed circuit board (PCB) 1 of steps such as drilling through hole, plated-through-hole and outer-layer circuit making one, do the anti-welding anti-welding processing of this circuit board 1 outer-layer circuit, and base material 11 materials of this printed circuit are multi-functional epoxy resin (Multi-function Epoxy); Therefore, in the present embodiment, have most through holes 12 and predetermined outer copper foil circuit 13 (shown in Fig. 2 A) on this printed circuit board (PCB) 1.And the soldering-inhibiting method of this printed circuit board (PCB) 1 is as follows:
1, covering of anti-welding material:
At first, prepare the aluminium foil 2 of a thickness, and on the one side of this aluminium foil 2, be coated with the anti-welding material 3 that reveals the about 30 μ m-100 μ m of thickness between 20 μ m-40 μ m.This anti-welding material 3 is to form to add organic solvent with the multi-functional epoxy resin lacquer of the base material 11 identical materials of this circuit board 1, and forms semisolid shape (being sticky shape) through preliminary drying.Be covered on this circuit board 1 desire with the anti-welding material 3 on this aluminium foil 2 and do on the one side of anti-welding processing, make these anti-welding material 3 folders between this circuit board 1 and 3 on this aluminium foil (shown in Fig. 2 B).
2, the pressing of anti-welding material and curing:
The equal power of bestowing 10-40kgw/cm square on this aluminium foil 2, and bestow 185 ℃ temperature baking should this anti-welding material 3, lasting about 15 hours-3 hours, cause:
1) this anti-welding material 3 is clogged micropore such as through hole 12 on full this circuit board 1, blind hole and is overlying on nearly on circuit board 1 because of the pressure of being bestowed, and forms one and covers the work layer.
2) organic solvent in this anti-welding material 3 volatilizees because of being heated, and the epoxy resin in this anti-welding material 3 solidifies gradually, forms an anti-welding protective layer.
Treat the epoxy resin cure in this anti-welding material 3 and after forming an anti-welding protective layer, remove pressure and the temperature bestowed.
3, the removal of inessential anti-welding material:
Establish a dry film photoresistance 4 (shown in Fig. 2 C) on this aluminium foil 2 with suitable temperature and pressure pressure, cooperate an egative film that this dry film photoresistance 4 is carried out exposure light irradiation subsequently, make on this dry film photoresistance 4, with respect on this circuit board 1 not the position of the exposed circuit of desire produce and develop; Again with the ferric trichloride (FeCl of 40 ℃-60 ℃ of carbonated water solvent and proportion (specific gravity) 1.3-1.5, temperature
3) solvent respectively etching remove the dry film 4a and the aluminium foil 2a of not development place, make the epoxy resin at this aluminium foil place of being removed be exposed to outer (shown in Fig. 2 D), remove remaining dry film 4 with the NaOH (NaOH) of 45 ℃-65 ℃ of 1-3wt%, temperature again.
Subsequently, the epoxy resin etching that utilizes the mode of electric paste etching to expose is removed, and makes that the exposed Copper Foil 13a of desire exposes (shown in Fig. 2 E) on this circuit board 1.
4, the removal of metal forming:
At last, phosphoric acid (H3PO4) solvent with 50 ℃-80 ℃ of volume ratio (volume to volume) 60%-80%, temperature, or remove remaining aluminium foil 2 (shown in Fig. 2 F) with the hydrochloric acid (HCl) of 20 ℃-40 ℃ of concentration 10%-40%, temperature, finish whole anti-welding operation, plating, the operation of nickel gold that this printed circuit board (PCB) 1 just can continue and expose Copper Foil 13a.Can be because phosphoric acid or hydrochloric acid can corrode aluminium to strong corrosion copper, so present embodiment is selected the coating of aluminium foil as anti-welding material for use, be based on this because of.
Because it is known technology commonly used that above-mentioned pressure is established technology such as dry film, exposure and development, electric paste etching, does not just have the necessity that illustrates further at this.
Advantage of the present invention is as follows:
1, the thickness of this anti-welding material 3 can once be set and finish, and can reduce production process, to lower cost of manufacture.
2, because this anti-welding material 3 is the multi-functional epoxy resin identical with the base material 11 of this circuit board 1, its coefficient of expansion is identical with the base material 11 of this circuit board 1, and in the process of the baking of above-mentioned steps two, 1 of this anti-welding material 3 and this circuit board can not produce the facts that occurs causing this circuit board 1 deflection because of internal stress.Especially, in the bake process of step 2, simultaneously this is executed equal power to circuit board 1, can prevent the distortion of this circuit board 1.
3, since this anti-welding material 3 invest on this circuit board 1 after; equal power that receives is kept a period of time every being situated between this aluminium foil 2 for it; thereby this anti-welding material 3 can thickness equably be overlying on this circuit board 1; and form the uniform anti-welding protective layer of thickness in solidifying the back, make the electrically comparatively stable of this circuit board 1.
4, since this anti-welding material 3 invest on this circuit board 1 after, equal power that receives is maintained until its curing every being situated between this aluminium foil 2 for it, the difficult infiltration of this length bubble, and can improve the quality of anti-welding protective layer, and prolong its life-span.
5, this anti-welding material 3 can be clogged micropores such as through hole on full this circuit board 1, blind hole simultaneously because of the pressure of being bestowed, this circuit board 1 is before anti-welding, must be not earlier with the insulation padding clog these through holes and brushing smooth, can save the Production Time of this printed circuit board (PCB), and can lower cost of manufacture.
6, this anti-welding material 3 mode of heating with pressurization and is overlying on this circuit board 1, can be easily on the copper foil circuit 13 of this circuit board 1 cover, can not have cover bad or cut open from phenomenon.
In sum, the present invention can reach aforementioned goal of the invention really as can be known, and has the effect of enhancement really, has the value of industry and can effectively promote industrial technology.
Claims (8)
1. the soldering-inhibiting method of a printed circuit board (PCB) is characterized in that, includes the following step:
1) in treat anti-welding circuit board have circuit one side or two-sided on, be provided with the coefficient of expansion of one deck predetermined thickness semisolid anti-welding material identical or close and the metal forming that is covered in the predetermined thickness on this anti-welding material with this board substrate;
2) bestow predetermined pressure on this metal forming, make the anti-welding material between this metal forming and this circuit board closely cover work on this circuit board, and toast a scheduled time, make this semi-solid anti-welding material cured with a predetermined temperature;
3) utilize the etching of chemical solvent etching mode to remove the locational metal forming of the copper face of desiring to expose on this circuit board, with the method for electric paste etching the solid-state anti-welding material above the copper face of desiring to expose on this circuit board is removed again, to expose above-mentioned copper face;
4) utilize chemical solvent to remove and be covered in remaining metal forming on this anti-welding material, finish the anti-welding operation of this printed circuit board (PCB).
2. according to the soldering-inhibiting method of the described printed circuit board (PCB) of claim 1, it is characterized in that, wherein this metal forming is to be aluminium foil, and this step 3 3) the etching of the using chemical solvent of removing aluminium foil be the ferric trichloride solvent, and this step 4) uses the chemical solvent of removal aluminium foil to be the phosphoric acid solvent.
3. according to the soldering-inhibiting method of the described printed circuit board (PCB) of claim 1, it is characterized in that, wherein this metal forming is to be aluminium foil, and the chemical solvent of etching that this step 3) is used removal aluminium foil is the ferric trichloride solvent, and this step 4) uses the chemical solvent of removing aluminium foil to be the hydrochloric acid solvent.
4. according to the soldering-inhibiting method of the described printed circuit board (PCB) of claim 1, it is characterized in that wherein the material of the base material of this printed circuit board (PCB) is a multi-functional epoxy resin; And the anti-welding material of the described semisolid of this step 1) is to be all the multi-functional epoxy resin identical with the coefficient of expansion of this base material to add organic solvent, and forms through preliminary drying.
5. according to the soldering-inhibiting method of the described printed circuit board (PCB) of claim 1, it is characterized in that, wherein this anti-welding material is to be coated on earlier on the one side of this metal forming, be covered on this circuit board desire with the anti-welding material on this metal forming again and do on the anti-welding one side, make this anti-welding material clip between between this circuit board and this aluminium foil.
6. according to the soldering-inhibiting method of the described printed circuit board (PCB) of claim 2, it is characterized in that, wherein the thickness of this aluminium foil is between 20 μ m-40 μ m, and the proportion of this ferric trichloride is (between 13-1.5, temperature is between 40 ℃-60 ℃, and the volume ratio of this phosphoric acid solvent (volume to Volume) between 60%-80%, temperature between 50 ℃-80 ℃.
7. according to the soldering-inhibiting method of the described printed circuit board (PCB) of claim 3, it is characterized in that, wherein the thickness of this aluminium foil is between 20 μ m-40 μ m, and the proportion of this ferric trichloride is between 13-1.5, temperature is between 40 ℃-60 ℃, and the concentration of this hydrochloric acid solvent between 10%-40%, temperature between 20 ℃-40 ℃.
8. according to the soldering-inhibiting method of the described printed circuit board (PCB) of claim 3, it is characterized in that, wherein this anti-welding material is to be coated on earlier on the one side of this metal forming, the about 30 μ m-100 μ m of coating thickness, be covered on this circuit board desire with the anti-welding material on this metal forming again and do on the anti-welding one side, make this anti-welding material clip between between this circuit board and this aluminium foil; And this step 2) described to bestow pressure be that 10-40kgw/cm square all insist on is continuous continues about 1.5 hours-3 hours, this step 2) described baking temperature is 185 ℃ and continues about 1.5 hours-3 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01141427 CN1409586A (en) | 2001-09-24 | 2001-09-24 | Soldering-inhibiting method for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01141427 CN1409586A (en) | 2001-09-24 | 2001-09-24 | Soldering-inhibiting method for printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN1409586A true CN1409586A (en) | 2003-04-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01141427 Pending CN1409586A (en) | 2001-09-24 | 2001-09-24 | Soldering-inhibiting method for printed circuit board |
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|---|---|
| CN (1) | CN1409586A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114302578A (en) * | 2021-12-14 | 2022-04-08 | 生益电子股份有限公司 | PCB preparation method and PCB |
-
2001
- 2001-09-24 CN CN 01141427 patent/CN1409586A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114302578A (en) * | 2021-12-14 | 2022-04-08 | 生益电子股份有限公司 | PCB preparation method and PCB |
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| ASS | Succession or assignment of patent right |
Owner name: LIANCE SCIENCE AND TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: XUXIANG CO., LTD. Effective date: 20030225 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20030225 Applicant after: Liance Science and Technology Co., Ltd. Applicant before: Xuxiang Co., Ltd. |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |