CN1407663A - Structure for reducing solder overflow of electronic device terminals - Google Patents
Structure for reducing solder overflow of electronic device terminals Download PDFInfo
- Publication number
- CN1407663A CN1407663A CN 01131415 CN01131415A CN1407663A CN 1407663 A CN1407663 A CN 1407663A CN 01131415 CN01131415 CN 01131415 CN 01131415 A CN01131415 A CN 01131415A CN 1407663 A CN1407663 A CN 1407663A
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- Prior art keywords
- terminal
- circuit board
- solder
- electronic device
- collecting hole
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Abstract
A structure for eliminating solder overflow at the terminals of electronic device consists of an insultive shell and at least a terminal group. The insulative shell has a pass for terminal going through and fixed. The end of the terminal stretches out of the pass and contacts with the electric circuit board electrically. A solder collecting hole is arranged near the opening in the pass to prevent from short pass between terminals.
Description
Technical field
The present invention relates to a kind of structure that reduces solder overflow of electronic device terminals, be meant that especially a kind of can the reduction because of solder overflow influences the predetermined terminal structural strength or cause the structure of the minimizing solder overflow of electronic device terminals of short circuit phenomenon between terminal.
Background technology
(the present invention mainly is to be example with the connector to general electronic installation, but the present invention is when practical application, then be not to be to exceed with connector) terminal with circuit on the circuit board two kinds of electric modes that contact are arranged: the one, the mode (Through Hole) of passing circuit board with terminal, and, make electric connector terminal and circuit on the circuit board be electrical and contact terminal and circuit board solid welding; Another kind of mode is to utilize contact (Pad) solid welding of surface mount technology (Surface Mounting Technology is called for short SMT) with terminal and circuit board surface, makes electric connector terminal and circuit junction on the circuit board be electrical and contacts.For convenient a large amount of electronic installations is fixed on the circuit board, utilize surface mount technology (SMT) that positive and negative two faces of circuit board are followed electronic installation at present mostly, its processing procedure is for being coated with earlier some conducting mediums (being generally tin cream) on circuit board, again electronic installation is placed on the circuit board, the barbecue of process high temperature furnace melts conducting medium and is attached on terminal and the circuit board at last, after the conducting medium condensation, terminal is fixed on the contact of circuit board is electrical contact.
Because connector terminals is to be fixed on the circuit board, so the insulation shell of electric connector must have holding channel to be placed through in the electric connector by terminal.If the holding channel opening of insulation shell is very near circuit board, then when circuit board when crossing high temperature furnace, conducting medium just can produce siphonage along the holding channel of terminal and insulation shell, and the structural strength that this phenomenon (being commonly referred to as solder overflow) tends to cause the short-circuit of terminals or cause terminal changes; Moreover, no matter various electronic equipments are volumes of mobile phone or computer, more and more littler trend is all arranged, therefore the dealer has also relatively designed some and can effectively save the space and reach compact connector, or electric connector is installed in the tow sides of circuit board, and will need the circuit board spaces that are used for device connector reduced originally more, little a lot of even whole electronic installation can become.
See also shown in Figure 7, one the connector that belongs to electronic installation can be established a holding channel A1 at insulation shell A mostly and place for terminal B, the butt end B1 of this terminal B and fixed connecting end B2 are exposed to the holding channel A1 two ends of insulation shell A respectively, wherein butt end B1 as with butt connector dock termination contact usefulness, and fixed connecting end B2 does the electrical usefulness that contacts with the road on the circuit board C.Because above-mentioned constituting utilizes the SMT technology to be fixed in connector on the circuit board C; therefore on circuit board C, can be provided with contact C1; this contact C1 be in order to the affixed usefulness of terminal B fixed connecting end B2; and usually can on contact C1, smear some tin cream C11 earlier, just be welded on the contact C1 after making terminal B cross high temperature furnace.
But, when the back side of circuit board needs that connector or other electronic installations are established in weldering again, whole printed circuit board (PCB) can be turned over after a high temperature furnace, and this tin cream C11 that is used for fixing terminal B fixed connecting end B2 and circuit board C contact C1 originally can produce dissolving once more because of the high temperature of high temperature furnace, and tin cream C11 that should liquid state just can ooze eight and produce siphonage along the minim gap that terminal B and holding channel A1 ask, the elastic force that causes terminal B is different when designing.
See also shown in Figure 8, No. the 340672nd, Taiwan patent, the terminal B that discloses connector in its diagram is fixed on the printed circuit board (PCB) in the mode of passing through, and it mainly is that holding channel A1 is shortened, allow the opening of holding channel A1 leave circuit board one segment distance, too serious with the phenomenon of avoiding excessive tin.Because the volume of electronic installation is more and more littler, and at present the volume minimum its height of connector in addition less than 0.9mm, it is fixing that insulation shell almost can only allow terminal pass, there is no too many space can provide and do isolation, therefore, this structure has not met the compact evolution trend of present connector.Moreover, be used to aforementioned two sides when all being equiped with the circuit board of electronic component if use the connector of this structure, then earth gravity makes the connector of this structure can't reach to avoid the phenomenon of tin of overflowing probably at all, still have and improve the space so plant prior art, and remain a kind of connector construction that can effectively reduce the bonder terminal solder overflow of industry redesign.
Summary of the invention
For solving the disappearance of above-mentioned existing structure, the present invention's side opening in holding channel is provided with a solder collecting hole, makes electronic installation when crossing high temperature furnace generation solder overflow, tin liquor can be concentrated in this solder collecting hole and solidify, and flows to the butt end of terminal to prevent tin liquor.
Main purpose of the present invention is to provide a kind of structure that reduces solder overflow of electronic device terminals, this connector construction can significantly reduce the generation of the solder overflow of bonder terminal applicable to utilizing the SMT technology to be fixed in the electronic device terminals of circuit board surface.
The present invention is a kind of structure that reduces solder overflow of electronic device terminals, it comprises an insulation shell and at least one Zhi Duanzi at least, this insulation shell is provided with that holding channel passes through for terminal and is fixing, this terminal is provided with a fixed connecting end and is exposed to outside the aforementioned holding channel, making terminal be exposed to the outer fixed connecting end of insulation shell must be electrical with circuit board and contact, the fixed connecting end of aforementioned terminal has at least a section surface to be exposed to outside insulation shell and the circuit board, and in aforementioned terminal near holding channel on the outer panel face of side opening for offering a solder collecting hole, when tin liquor produces siphonage, the tin liquor of exhausted major part is concentrated in this solder collecting hole.
When if the electronic installation of application the technology of the present invention produces the phenomenon of the tin that overflows when crossing high temperature furnace, the reason that this tin liquor can not passed holding channel is: the present invention is provided with solder collecting hole on terminal, tin liquor can make tin liquor can't continue to spread, so can only be piled up also condensation in this solder collecting hole place to the butt end of terminal.
Description of drawings
Fig. 1 is a stereo appearance figure of the present invention;
Figure 1A is the stereo appearance figure of terminal of the present invention;
Fig. 2 is a vertical view of the present invention;
Fig. 3 is a sectional perspective profile of the present invention;
Fig. 4 is that the present invention utilizes the SMT technology that connector is fixed in generalized section before the circuit board;
Fig. 5 is that the present invention utilizes the SMT technology that connector is fixed in generalized section behind the circuit board;
Fig. 6 is the preferred embodiment figure of another terminal of the present invention;
Fig. 7 is that prior art utilizes the SMT technology that connector is fixed in generalized section on the circuit board;
Fig. 8 is a connector construction of avoiding excessive solder overflow in No. the 340672nd, the TaiWan, China patent announcement.
Embodiment
Because connector is belong to electronic installation a kind of, therefore explanation of the present invention is to be example with the connector, is not to limit practical range of the present invention with this.For achieving the above object and construct, technological means that the present invention adopts and effect thereof, describe its step in detail with regard to preferred embodiment of the present invention in conjunction with the accompanying drawings and function as follows.
See also Fig. 1 of the present invention, Figure 1A, Fig. 2, Fig. 3 and shown in Figure 4, for utilizing the SMT technology that connector is fixed in circuit board, this kind connector mainly is made up of an insulation shell 1 and at least one Zhi Duanzi 2, this insulation shell 1 is provided with that holding channel 11 passes through for terminals 2 and is fixing, the butt end 21 of this terminal 2 and fixed connecting end 22 are exposed to respectively outside the holding channel 11 of aforementioned dielectric housing 1, make the butt end 21 of terminal 2 become electrically to contact with butt connector (not expression in the diagram), and the fixed connecting end 22 of terminal 2 also can electrically contact for 3 one-tenth with circuit board, and make fixed connecting end 22 have at least a section surface to be exposed to insulation shell 1 outside, and aforementioned terminal 2 near on the outer panel face of side openings in the holding channel 11 for offering a solder collecting hole 23, can directly enter these solder collecting hole 23 places concentrated (as shown in Figure 5) for the tin liquor that produces siphonage.
Owing to be bound to allow terminal 2 have one section to be exposed to outside connector insulation shell 1 and the circuit board 3 after general connector and circuit board mutually combine, the usefulness that it mainly provides the scolding tin set and accelerates the tin liquor cooling, and the present invention is provided with solder collecting hole 23 on terminal 2, can make the tin liquor that produces siphonage pile up also condensation in these solder collecting hole 23 places, and avoid tin liquor can't continue to spread to the butt end of terminal 2 21 directions, so tin liquor can only be piled up also condensation in these solder collecting hole 23 places.
Moreover, see also shown in Figure 5, when being turned over, back of circuit board adheres to other electronic installations in addition and during after a high temperature furnace, because most scolding tin with condensation outside insulation shell 1 and circuit board 3, so when crossing high temperature furnace for the second time, the scolding tin of condensation can be melted once more, and the tin liquor after melting can make tin liquor can't continue to spread to the butt end 21 of terminal 2 because of solder collecting hole 23 stops.
In addition, see also shown in Figure 6, preferred embodiment figure for another terminal of the present invention, by learning among the figure, the solder collecting hole 23 of its terminal 2 as can be similar with the width of butt end 21, when solder overflow takes place, can complications not advance when flowing because of tin liquor, so will being more prone to concentrate on these solder collecting hole 23 places, tin liquor piles up condensation.
In sum, the present invention is a kind of structure that reduces solder overflow of electronic device terminals, can reach its effect and purpose really, so the present invention really is the invention of a practicality excellence, meets the application important document of patent of invention in fact, now files an application in accordance with the law.
The above only is preferred embodiment of the present invention, non-so and arrest limit claim of the present invention, simple and easy modification that every utilization specification of the present invention and graphic content are done and equivalent structure change, and all should in like manner be contained in the claim of the present invention.
Claims (3)
1, a kind of structure that reduces solder overflow of electronic device terminals, comprise an insulation shell and at least one Zhi Duanzi, this insulation shell is provided with that holding channel passes through for terminal and is fixing, this terminal is provided with a fixed connecting end and is exposed to outside the aforementioned holding channel, making the fixed connecting end of terminal be electrical with circuit board contacts, the fixed connecting end of described terminal has at least a section surface to be exposed to outside insulation shell and the circuit board, it is characterized in that: near the outside of the holding channel opening of insulation shell inboard for being provided with a solder collecting hole, this solder collecting hole can be concentrated the tin liquor that produces siphonage and can make tin liquor pile up also condensation in this solder collecting hole place, and avoids tin liquor to spread towards the butt end direction of terminal.
2, the structure of minimizing solder overflow of electronic device terminals according to claim 1 is characterized in that: the terminal of described electronic installation is to be fixed on the circuit board with surface mount technology (SMT).
3, the structure of minimizing solder overflow of electronic device terminals according to claim 1 is characterized in that: wherein the width of this solder collecting hole is approximately identical with the width of butt end, uses to strengthen intercepting the tin liquor that flows.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01131415 CN1198364C (en) | 2001-09-07 | 2001-09-07 | Structure for reducing solder overflow of electronic device terminals |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01131415 CN1198364C (en) | 2001-09-07 | 2001-09-07 | Structure for reducing solder overflow of electronic device terminals |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1407663A true CN1407663A (en) | 2003-04-02 |
| CN1198364C CN1198364C (en) | 2005-04-20 |
Family
ID=4670566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01131415 Expired - Fee Related CN1198364C (en) | 2001-09-07 | 2001-09-07 | Structure for reducing solder overflow of electronic device terminals |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1198364C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107069284A (en) * | 2017-03-31 | 2017-08-18 | 海能达通信股份有限公司 | Connector and its connection male, connection female seat |
| CN111883955A (en) * | 2020-08-28 | 2020-11-03 | 康舒电子(东莞)有限公司 | Electric connection structure of power converter |
-
2001
- 2001-09-07 CN CN 01131415 patent/CN1198364C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107069284A (en) * | 2017-03-31 | 2017-08-18 | 海能达通信股份有限公司 | Connector and its connection male, connection female seat |
| CN111883955A (en) * | 2020-08-28 | 2020-11-03 | 康舒电子(东莞)有限公司 | Electric connection structure of power converter |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1198364C (en) | 2005-04-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: XUANDETECHNOLOGY CO., LTD. Free format text: FORMER NAME OR ADDRESS: XUANDE CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: Taoyuan County of Taiwan Province Patentee after: Polytron Technologies Inc Address before: Taoyuan County of Taiwan Province Patentee before: Xuande Co., Ltd. |
|
| CI01 | Correction of invention patent gazette |
Correction item: Alteration of the name or name of the patent holder Correct: Xuande Science and Technology Co., Ltd. False: Polytron Technologies Inc Number: 24 Page: 1016 Volume: 22 |
|
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |