CN1393340A - Process for preparing pierzelectric ink-jet head - Google Patents
Process for preparing pierzelectric ink-jet head Download PDFInfo
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- CN1393340A CN1393340A CN 01129551 CN01129551A CN1393340A CN 1393340 A CN1393340 A CN 1393340A CN 01129551 CN01129551 CN 01129551 CN 01129551 A CN01129551 A CN 01129551A CN 1393340 A CN1393340 A CN 1393340A
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Abstract
A technology for preparing piezoelectric ink-jet head includes such steps as preparing inlet and outlet on a substrate, preparing an optical rotation-sensitive high-molecular film on the substrate, preparing the bottom film of ink cavity with several ink inlets and ink outlets, generating another optical rotation-sensitive high-molecular film, generating ink cavity wall with ink cavity in it, and finally aligning and sticking the piezoelectric ceramic layer on the top of ink cavity.
Description
The present invention relates to a kind of manufacture method of piezoelectric ink-jet head, the particularly a kind of black chamber that the exposure imaging technology makes ink gun and method of nozzle utilized.
The operation principle of tradition inkjet technology mainly is divided into two classes: a class is thermal bubble type (Thermal bubble) inkjet technology, and another kind of is piezoelectric type (Piezoelectric) inkjet technology.The Thermal Bubble Ink-jet Printer printing technique is to utilize heater with ink moment gasification, produces high pressure bubble promotion ink and is penetrated by nozzle.This type is because low cost of manufacture already by HP and successfully commercialization of CANON, produces very large in the world ink-jet printer market.But because the operation principle of its high-temperature gasification makes that the selectivity that is suitable for ink (mainly being water solvent) is less, thereby the application of extending is limited.
The piezoelectric ink jet printing technique is to utilize the piezoelectric push moving plate to produce deformation when applying voltage, and then extruding liquid produces high pressure and liquid is sprayed.With respect to the Thermal Bubble Ink-jet Printer printing technique, the piezoelectric ink jet printing technique has following advantage: the ink of piezoelectric ink jet printing technique can not produce chemical change because of high-temperature gasification, influences the situation of quality of colour; And, therefore has splendid durability owing to need not use high thermal stress repeatedly.The employed piezoelectric ceramics reaction speed of piezoelectric ink jet printing technique is fast, can improve print speed, and the Thermal Bubble Ink-jet Printer printing technique then can be subjected to the restriction of heat conduction velocity.The piezoelectric ink jet printing technique is controlled the size of drop easily, can improve print quality.
Fig. 1 is the construction profile of known a kind of conventional piezoelectric formula ink gun.The manufacturing process of conventional piezoelectric ink gun is that the ceramic thick films such as piezoelectric push moving plate (actuator), ink cavity wall 13 and bottom film of ink cavity 14 that utilize the formation of ceramic thick film (thick film) technology to have upper electrode layer 11a, piezoelectric layer 12a, lower electrode layer 11b and ceramic layer 12b (ceramic) are given birth to embryo (green tape), carries out the ceramic structure sintering after according to certain sequence the living embryo pressing of the ceramic thick film of different layers being adhered together again.The piezoelectric ink-jet head produced of EPSON company for example.
Figure 1B is the plan structure schematic diagram of this conventional piezoelectric formula ink gun.This figure illustrates a kind of transparent plan view of traditional ink gun, and wherein inking chamber 17 has stored from ink entrance 15 and drawn to the ink of inking chamber 17, by the distortion of piezoelectric layer, ink is sprayed by ink outlet port 16.
In said method, owing to after all modular constructions all utilize ceramic thick film technology to make respectively to finish in the ink gun manufacture process, carry out contraposition pressing bonding again.Because the size of ink gun is quite little, the precision of requirement is very high, and therefore this contraposition pressing assembling is not easy very much, causes substandard products to improve, and increases process time and manufacturing cost.
And after contraposition pressing assembling finishes, also must carry out the sintering of ceramic structure, because the complex structure of ink gun tend to cause stress rupture because the pottery contraction is inhomogeneous in sintering, so the qualification rate of product is very low.
Therefore purpose of the present invention is exactly to be to provide a kind of integrated manufacture method to replace the method for making of adhesion assembling.So can solve the problem that assembling is difficult for, cause qualification rate to improve, reduce process time and cost of manufacture.
In order to reach above-mentioned purpose of the present invention, a kind of manufacture method of piezoelectric ink-jet head is proposed, be in substrate, to form two openings that run through substrate.Then on this substrate, form one deck first photosensitive macromolecular film, and in the first photosensitive macromolecular film, define a plurality of ink outlet port patterns and a plurality of ink entrance pattern, form bottom film of ink cavity with a plurality of ink outlet ports and a plurality of ink entrances.Then on bottom film of ink cavity, form the second photosensitive macromolecular film, and in the second photosensitive macromolecular film, define the inking chamber pattern, and form ink cavity wall with inking chamber.To adhere on the ink cavity wall top, the ceramic layer of electrode position just in time at last to make ink gun.
In addition also can manufacture finish ink gun after, remove this substrate, or with ink entrance change on ceramic layer.According to method of the present invention, progressively moulding makes ink gun, and reaches the qualification rate that improves finished product, the purpose that reduces process time and cost of manufacture.
For above and other objects of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. elaborate:
The drawing explanation:
Figure 1A is a kind of side structure schematic diagram of conventional piezoelectric formula ink gun;
Figure 1B is a kind of plan structure schematic diagram of conventional piezoelectric formula ink gun;
Fig. 2 is the process structure schematic diagram of the piezoelectric ink-jet head of first embodiment of the invention;
Fig. 3 is the perspective view of the piezoelectric ink-jet head of first embodiment of the invention;
Fig. 4 is the plan structure schematic diagram of the piezoelectric ink-jet head of first embodiment of the invention;
Fig. 5 is the side-looking structural representation of the piezoelectric ink-jet head of second embodiment of the invention;
Fig. 6 is the side-looking structural representation of the piezoelectric ink-jet head of third embodiment of the invention;
Fig. 7 is the side-looking structural representation of the piezoelectric ink-jet head of fourth embodiment of the invention.
The drawing explanation:
11a, 21a, 31a: upper electrode layer
11b, 21b, 31b: lower electrode layer
12a, 22a, 32a: piezoelectric layer
12b, 22b, 32b: ceramic layer
13,23,33: ink cavity wall
14,24,34: bottom film of ink cavity
15,25,35: ink entrance
16,26,36: ink outlet port
17,27,37: inking chamber
29: opening
39: go out opening
30,40: substrate
Embodiment one:
With reference to shown in Figure 2, be the process structure schematic diagram of the piezoelectric ink-jet head of preferred embodiment of the present invention.At first, in substrate 30 (as silicon or potsherd), utilize etching, machining or in the mode of particle hits, form two openings 29 that run through substrate 30, the form of opening 29 comprises square type raceway groove, and its size plays by ear.
Then, on substrate 30, form one deck first photosensitive macromolecular film, afterwards, utilize traditional exposure imaging mode to form to have the bottom film of ink cavity 24 of a plurality of ink entrances 25 and a plurality of ink outlet ports 26, wherein the bore scope of each ink entrance 25 comprise 10 μ m to 1000 μ m between, the bore scope of each ink outlet port 26 then comprise 10 μ m to 200 μ m between.
Then, on bottom film of ink cavity 24, form one deck second photosensitive macromolecular film, afterwards, utilize the UV light source to expose and step of developing, in the second photosensitive macromolecular film, to form ink cavity wall 23 with a plurality of inking chambers 27.The bottom of each inking chamber 27 is that the part bottom film of ink cavity 24 that includes an ink entrance 25 and an ink outlet port 26 constitutes.The surrounding wall of inking chamber 27 is constituted by part ink cavity wall 23.Also can directly utilize the mode of etching, machining or particle hits to be formed in the substrate 30 ink outlet port 26 and ink entrance 25 in addition, so can omit the first photosensitive high molecular film and further simplify technology.
At last, form ceramic layer 22b at the top of this ink cavity wall 23, be formed with piezoelectric layer 22a on ceramic layer 22b, the both sides up and down of piezoelectric layer 22a have the bottom electrode 21b and the top electrode 21a of a plurality of correspondences.27 one-tenth corresponding relations in position and each inking chamber of each top electrode 21a and each bottom electrode 21b.The corresponding at least top electrode 21a of each inking chamber 27 or a bottom electrode 21b.Wherein the material of top electrode 21a and bottom electrode 21b comprises one of copper (Cu), gold (Au), silver (Ag), platinum (Pt) or palladium (Pd) five or its alloy or other conductive material, and the material of piezoelectric layer 22a comprise plumbous zirconium titanium admixture (lead zirconate titanate, PZT) or piezoelectric polymer.Piezoelectric polymer comprise poly-difluoroethylene (Poly (VinylideneFluoride), PVDF).The thickness of ceramic layer 22b is about tens of microns to the number millimeter.
With reference to shown in Figure 3, be the perspective view of the piezoelectric ink-jet head of the present invention's first preferred embodiment.With reference to shown in Figure 4, be the plan structure schematic diagram of the piezoelectric ink-jet head of the present invention's first preferred embodiment in addition.By Fig. 3 and Fig. 4 can be clearer detailed understand outward appearance after the prepared ink gun moulding of the present invention and each assembly relative position of this ink gun.
Embodiment two:
Please refer to Fig. 5, is the side-looking structural representation of the piezoelectric ink-jet head of second embodiment of the invention.The piezoelectric ink-jet head that first embodiment is prepared places etchant, utilizes wet etch method to remove substrate 30, to form the piezoelectric ink-jet head of present embodiment.
Embodiment three:
Please refer to Fig. 6, is the side-looking structural representation of the piezoelectric ink-jet head of third embodiment of the invention.At first, in substrate 40 (as silicon or potsherd), utilize the mode of etching, machining or particle hits, form one run through substrate 40 go out opening 39, the form that goes out opening 39 comprises square type raceway groove, its size plays by ear.
Then, form one deck first photosensitive macromolecular film on substrate 40, afterwards, develop and have the bottom film of ink cavity 34 of a plurality of ink outlet ports 36 with formation in the back of exposing, and wherein the bore scope of each ink outlet port 36 is comprising between 10 μ m to the 300 μ m.
Then, on bottom film of ink cavity 34, form one deck second photosensitive macromolecular film, afterwards, utilize the UV light source to expose back the development, in this second photosensitive macromolecular film, defining the ink cavity wall pattern, and form ink cavity wall 33 with a plurality of inking chambers 37.The bottom of each inking chamber 37 is constituted by the part bottom film of ink cavity 34 that includes an ink outlet port 36, and the surrounding wall of inking chamber 37 is constituted by part ink cavity wall 33.
Then, utilize the machining or the mode of particle hits, form a plurality of ink entrances 35 that run through ceramic layer 32b in ceramic layer 32b, the position of each ink entrance 35 is corresponding with each ink outlet port 36 position, and lays respectively at the diagonal angle in the inking chamber 37.Wherein the bore scope of each ink entrance 35 is comprising 20 μ m to 1, between the 000 μ m.Then ceramic layer 32b is adhered to the top of this ink cavity wall 33.Be formed with a plurality of bottom electrode 31b, piezoelectric layer 32a and a plurality of top electrode 31a on the ceramic layer 32b, and the position of each bottom electrode 31b is corresponding with each inking chamber 37.The position of each top electrode 31a is corresponding with each bottom electrode 31b.Wherein the material of top electrode 31a and bottom electrode 31b comprises one of copper, gold, silver, platinum and palladium or its alloy or other conductive material, and the material of piezoelectric layer 32a comprises plumbous zirconium titanium admixture or piezoelectric polymer.Piezoelectric polymer comprises poly-difluoroethylene.The thickness of ceramic layer 32b is about tens of microns to several millimeters.
Embodiment four:
Please refer to Fig. 7, is the side-looking structural representation of the piezoelectric ink-jet head of fourth embodiment of the invention.The piezoelectric ink-jet head that the 3rd embodiment is prepared places etchant, utilizes wet etch method to remove substrate 40, to form the piezoelectric ink-jet head of present embodiment.
The material of employed in the present invention photosensitive macromolecular film comprises dry film photoresistance, liquid photoresistance, positive photoresistance, negative one of photoresistance, the polyimides (Polyimide) of sensing optical activity or epoxy resin photosensitive macromoleculars such as (Epoxy) of sensing optical activity in addition.Wherein the dry film photoresistance can directly utilize the mode of hot pressing to fit on the base material.
Liquid in addition photoresistance is one to have the liquid photosensitive macromolecular of " flowable " in use, utilizes the mode of coating to be formed on substrate 30 or the bottom film of ink cavity 24 it, is shaped through sclerosis afterwards.And utilize a UV light source exposure imaging to go out needed pattern, finish the preparation of photosensitive macromolecular film.
By the invention described above preferred embodiment as can be known, the present invention has following feature: because bottom film of ink cavity, ink cavity wall etc. all continue to make in the mode of exposure imaging in the manufacture process, its process time will be shorter than traditional process time, and employed equipment cost and human cost will significantly reduce, and the qualification rate of finished product also can increase.
Though the present invention with a preferred embodiment openly as above, it is not that any those skilled in the art without departing from the spirit and scope of the present invention, can be used for a variety of modifications and variations in order to qualification the present invention.But protection scope of the present invention should be with being as the criterion that claims limit.
Claims (11)
1. the manufacture method of a piezoelectric ink-jet head is characterized in that: comprise the following steps:
In a substrate, form an opening;
In this substrate, form one first photosensitive macromolecular film;
Remove this first photosensitive macromolecular film of part, to form a bottom film of ink cavity, this bottom film of ink cavity has a plurality of ink entrances and a plurality of ink outlet port;
On this bottom film of ink cavity, form one second photosensitive macromolecular film;
Remove this second photosensitive macromolecular film of part, to form an ink cavity wall, this ink cavity wall has a plurality of inking chambers, and one of those inking chambers are respectively around one of those ink entrances and one of those ink outlet ports;
On this ink cavity wall, form a ceramic membrane, and one of those top electrodes are distinguished one of corresponding those inking chambers with one of those bottom electrodes with a plurality of top electrodes, a piezoelectric layer and a plurality of bottom electrodes.
2. the manufacture method of piezoelectric ink-jet head according to claim 1 is characterized in that: the formation method of this opening comprise utilize etching method or cutter wear method both one of.
3. the manufacture method of piezoelectric ink-jet head according to claim 1 is characterized in that: the formation method of those ink entrances and those ink outlet ports comprises the exposure imaging method of using.
4. the manufacture method of piezoelectric ink-jet head according to claim 1 is characterized in that: the formation method of those inking chambers comprises the exposure imaging method of using.
5. the manufacture method of piezoelectric ink-jet head according to claim 1 is characterized in that: also be included in after the step that forms this ceramic membrane on this ink cavity wall, remove this substrate.
6. the manufacture method of a piezoelectric ink-jet head is characterized in that: comprise the following steps:
Etching one goes out opening in a substrate;
In this substrate, form one first photosensitive macromolecular film;
Remove this first photosensitive macromolecular film of part, to form a bottom film of ink cavity, this bottom film of ink cavity has a plurality of ink outlet ports;
On this bottom film of ink cavity, form one second photosensitive macromolecular film;
Remove this second photosensitive macromolecular film of part, to form an ink cavity wall, this ink cavity wall has a plurality of inking chambers, and one of those inking chambers are respectively around one of those ink outlet ports;
On this ink cavity wall, form a ceramic membrane;
Form a plurality of ink entrances in this ceramic membrane, one of those ink entrances are corresponding with one of those ink outlet ports, and lay respectively at the diagonal position of one of those inking chambers;
On this ceramic membrane, form a plurality of bottom electrodes, one of respectively corresponding those inking chambers of one of those bottom electrodes;
On those bottom electrodes, form a piezoelectric layer;
On this piezoelectric layer, form a plurality of top electrodes.
7. the manufacture method of piezoelectric ink-jet head according to claim 6, it is characterized in that: this formation method that goes out opening comprises utilizes etching, machining or particle hits thrin.
8. the manufacture method of piezoelectric ink-jet head according to claim 6 is characterized in that: the formation method of those ink entrances and those ink outlet port patterns comprises the exposure imaging method of using.
9. the manufacture method of piezoelectric ink-jet head according to claim 6 is characterized in that: the formation method of those inking chambers comprises the exposure imaging method of using.
10. the manufacture method of piezoelectric ink-jet head according to claim 6 is characterized in that: the formation method of those ink entrances comprise machining or particle hits both one of.
11. the manufacture method of piezoelectric ink-jet head according to claim 6 is characterized in that: also be included in after the step that forms a plurality of top electrodes on this piezoelectric layer, remove this substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01129551 CN1393340A (en) | 2001-06-26 | 2001-06-26 | Process for preparing pierzelectric ink-jet head |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01129551 CN1393340A (en) | 2001-06-26 | 2001-06-26 | Process for preparing pierzelectric ink-jet head |
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| CN1393340A true CN1393340A (en) | 2003-01-29 |
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| CN 01129551 Pending CN1393340A (en) | 2001-06-26 | 2001-06-26 | Process for preparing pierzelectric ink-jet head |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100453333C (en) * | 2005-04-27 | 2009-01-21 | 佳能株式会社 | Recording apparatus |
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2001
- 2001-06-26 CN CN 01129551 patent/CN1393340A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100453333C (en) * | 2005-04-27 | 2009-01-21 | 佳能株式会社 | Recording apparatus |
| US7537312B2 (en) | 2005-04-27 | 2009-05-26 | Canon Kabushiki Kaisha | Recording apparatus |
| US8251493B2 (en) | 2005-04-27 | 2012-08-28 | Canon Kabushiki Kaisha | Recording apparatus |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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