CN1391118A

CN1391118A - Technology for preparing electrostatic-type full-light switch for miniature machine

Info

Publication number: CN1391118A
Application number: CN02135279A
Authority: CN
Inventors: 徐永青; 杨拥军; 梁春广; 赵彦军
Original assignee: Inst No13 Of Electronics Ministry Of Information Industry
Current assignee: Inst No13 Of Electronics Ministry Of Information Industry
Priority date: 2002-07-25
Filing date: 2002-07-25
Publication date: 2003-01-15
Anticipated expiration: 2022-07-25
Also published as: CN1188722C

Abstract

A technology for preparing an electrostatic micromechanical light switch features that a large scale integration technique is used to prepare the fixed teeth, moving teeth, their drive electrodes, folded santilever, triangular balance beam, intermediate beam, silicon micromirror, vertical groove, and V-shaped groove of light switch on N-type monocrystal substrate. Under the action of electrostatic force, the silicon micromirror can move in optical fibre for blocking or reflecting light in optical fibre, so realizing on or off action. Its advantages are low cost, high reliability, small size, light weight and low energy consumption.

Description

Technology for preparing electrostatic-type full-light switch for miniature machine

Technical field

The present invention relates to a kind of technology for preparing electrostatic-type full-light switch for miniature machine in the photoelectron technology field, be specially adapted to do in the large-scale at a high speed full light Networks of Fiber Communications manufacturing of light shutter device.

Background technology

Modern optical fiber communication forward all optical communication direction develops, at a high speed, broadband, jumbo development trend be increasing to the demand of photoswitch, it is more and more higher to require.Traditional light one an electric light (OEO) photoswitch shows following shortcoming: speed is low, volume is big, cost is high.Optical fiber optical communication all-optical network mainly contains two parts and forms, it is the exchange of light transmission and light, at present owing to adopt wavelength-division multiplex (WDM) technology to make the transmittability of light improve greatly, therefore this has just strengthened the pressure to the light exchange, the core of light exchange at present is light one an electric photoswitch (OEO switch), its switching process need be passed through O/E, E/O conversion, be subjected to the restriction of light transmission speed, exchange rate is near the hump speed of electronics at present, and along with the optical switch module scale increases and the raising of traffic rate, the volume and the expense of OEO switch rise straight line.Adopt optical cable to substitute copper cable and adopt the optical communication of wavelength-division multiplex technique at backbone network, the OEO switch directly has influence on the speed of development of optical fiber communication.

Summary of the invention

Technical matters to be solved by this invention just provides a kind of employing large scale integrated circuit microelectronics manufacture technology and produces technology for preparing electrostatic-type full-light switch for miniature machine, and technology of the present invention is simply ripe, cheap for manufacturing cost, operation is made simple and easy, the micromechanics all-optical switch of manufacturing of the present invention also has simple in structure, good reliability, characteristics such as volume is little, and in light weight, energy consumption is low.

Technical matters to be solved by this invention realizes that by following technical proposal it comprises step:

Diffusion one deck heavily boron layer 14 is coated with one deck photoresist 15 on the heavily boron layer 14 on n type single crystal silicon 1 substrate;

Be placed on the photoresist 15 with a cube electrode mask, the contraposition exposure imaging, exposure imaging goes out to decide the photoresist window shape of tooth drive electrode 2, moving tooth drive electrode 5 on the photoresist 15, exposes heavily boron layer 14;

Cover metal film to deciding tooth drive electrode 2, moving tooth drive electrode 5 photoresist windows and the sputter of photoresist face, peel off the metal film on photoresist 15 and the photoresist 15, bonding is decided 5 one-tenth points of tooth drive electrode 2 and moving tooth drive electrode metal level 9;

Be coated with one deck photoresist 16 once more on the heavily boron layer 14 of n type single crystal silicon 1 substrate;

Deciding tooth 3, moving tooth 4, folding overarm 6, triangle balance beam 7, intermediate beam 8, silicon micromirror 10, vertical channel 12 masks with one is placed on the photoresist 16, the contraposition exposure imaging, exposure imaging goes out to decide the photoresist window shape of tooth 3, moving tooth 4, folding overarm 6, triangle balance beam 7, intermediate beam 8, silicon micromirror 10, vertical channel 12 on the photoresist 16, exposes heavily boron layer 14;

With inductively coupled plasma deep etching photoresist window shape heavily boron layer 14, etching depth exposes low-doped n type single crystal silicon 1 substrate greater than heavily boron layer 14 thickness;

Mark n type single crystal silicon 1 silicon substrate with the wafer dicing machine along scribe line;

N type single crystal silicon 1 silicon chip is put into the EPW corrosive liquid carry out wet etching and expose low-doped n type single crystal silicon 1 substrate, till corrosion depth the deciding tooth 3, moving tooth 4, folding overarm 6, triangle balance beam 7, intermediate beam 8, silicon micromirror 10 and break away from fully to the heavily boron layer 14 with n type single crystal silicon 1 substrate; Corrosion vertical channel 12 degree of depth are to vertical channel 12 bottom n type single crystal silicons 1 substrate forming V-shape groove 13 structures;

Manually break sheet off with the fingers and thumb, form singulated dies, tube core is bonded on the photoelectricity shell with insulating gel, and optical fiber 11 is seated in vertical channel 12 and the V-shaped groove 13;

With spun gold the metal level 9 of deciding tooth drive electrode 2, moving tooth drive electrode 5 is connected sealing cap with the pin of shell.

The present invention compares background technology and has following advantage:

1, the present invention adopts large scale integrated circuit microelectronics manufacture technology, be easy to produce in enormous quantities, easy of integrationization, convenient expansion array of photoswitch is as one tunnel output of input two-way (1 * 2), two-way input and output (2 * 2) ... N * N plurality of specifications product satisfies requirements of different users.

2, manufacturing process of the present invention is simply ripe, cheap for manufacturing cost, and operation is made simple and easy.

3, the micromechanics all-optical switch with manufacturing of the present invention has simple in structure, good reliability, little, in light weight, the low power consumption and other advantages of volume, and it is irrelevant to have parameters such as the form that is used for optical fiber communication and signal of communication, wavelength, agreement, modulation system, polarization, transmission direction.

Description of drawings

Fig. 1 is the structural representation of the electrostatic micromechanics all-optical switch made of the present invention.

Fig. 2 is that the electrostatic micromechanics all-optical switch A-A that makes of the present invention is to the sectional structure synoptic diagram.

Embodiment

With reference to Fig. 1, Fig. 2, the present invention takes following steps:

(1) utilize commercially available general diffusion furnace on n type single crystal silicon 1 substrate, to spread one deck heavily boron layer 14, it is 100000 that embodiment spreads heavily boron layer 14 thickness, heavily boron layer 14 stops layer certainly as the EPW wet etching, forms P between heavily boron layer 14 and n type single crystal silicon 1 substrate simultaneously ⁺⁺The n knot is isolated as the electricity of deciding tooth drive electrode 2 and moving tooth drive electrode 5.

(2) be coated with one deck AZ1450 type photoresist 15 on heavily boron layer 14, the thickness of embodiment resist coating 15 is 8000 , and toasts 15 minutes for 100 ℃ in temperature with baking oven.

(3) be placed on the photoresist 15 with a cube electrode mask, contraposition exposed for 10 seconds on the rotine exposure machine, being put into Tetramethylammonium hydroxide again equals than water to develop for 10 to 60 seconds in 1: 3 the developer solution, on photoresist 15, obtain deciding the photoresist window shape of tooth drive electrode 2 and moving tooth drive electrode 5, expose heavily boron layer 14, embodiment decides tooth drive electrode 2 and is made into rectangle strip structure, and moving tooth drive electrode 5 is made into two square dice structures arranged side by side.

(4) adopt commercially available general magnetic control platform to deciding the heavily boron layer 14 splash-proofing sputtering metal films of tooth drive electrode 2 and moving tooth drive electrode 5 photoresist windows and photoresist face with sputtering technology, one sputter of embodiment covers metal film and adopts the multilayer composite metal material.Adopt commercially available general ultrasonic generator with stripping technology, peel off the useless metal film on photoresist 15 and the photoresist 15, to decide tooth, moving tooth drive electrode 2,5 metal film bondings are processed into a metal level 9.

(5) be coated with one deck AZ1450 type photoresist 16 once more on n type single crystal silicon 1 substrate heavily boron layer 14, the thickness of embodiment resist coating 16 is 8000 , and toasts 15 minutes for 100 ℃ in temperature with baking oven.

(6) deciding tooth 3, moving tooth 4, folding overarm 6, triangle balance beam 7, intermediate beam 8, silicon micromirror 10, vertical channel 12 masks with one is placed on the photoresist 16, contraposition exposed for 10 seconds on the rotine exposure machine, being put into Tetramethylammonium hydroxide again equals than water to develop for 10 to 60 seconds in 1: 3 the developer solution, on photoresist 16, obtain deciding the photoresist window shape of tooth 3, moving tooth 4, folding county beam 6, triangle balance beam 7, intermediate beam 8, silicon micromirror 10, vertical channel 12, expose heavily boron layer 14.Embodiment vertical channel 12 is produced on the n type single crystal silicon 1 substrate peripheric surface, and is the structure that intersects vertically mutually between the vertical channel 12.Silicon micromirror 10 be produced on vertical channel 12 intersect vertically a little in, with vertical channel 12 angles at 45.

(7) the silicon chip deep etching equipment of employing micromachined special use carries out poor deeply etching photoresist window shape heavily boron layer 14 with inductively coupled plasma (ICP), and etching depth exposes n type single crystal silicon 1 substrate of doping greater than heavily boron layer 14 thickness.

(8) adopt commercially available general wafer dicing machine to mark n type single crystal silicon 1 silicon substrate along scribe line.

(9) n type single crystal silicon 1 silicon chip being put into the EPW corrosive liquid carries out wet etching and exposes low-doped n type single crystal silicon 1 substrate releasing structure, because the EPW corrosive liquid is n type single crystal silicon 1 substrate that exposes of corrosion to the selectivity of doping content and only, the decide tooth 3, moving tooth 4, folding overarm 6, triangle balance beam 7, intermediate beam 8, silicon micromirror 10 of corrosion depth to the heavily boron layer 14 is detached into suspension structure fully with n type single crystal silicon 1 substrate.Corrosion vertical channel 12 degree of depth are to vertical channel 12 bottom n type single crystal silicons 1 substrate forming V-shape groove 13 structures, and the embodiment wet etching time is 25 to 30 minutes.

(10) n type single crystal silicon 1 silicon chip is manually broken off with the fingers and thumb sheet, be made into single all-optical switch tube core, tube core is bonded on the photoelectricity shell with insulating gel, and optical fiber 11 is seated in vertical channel 12 and the V-shaped groove 13 then, and silicon micromirror 10 processing and fabricatings are in vertical channel 12 and V-shaped groove 13 intersect vertically a little optical fiber 11.When embodiment silicon micromirror 10 is made minute surface vertical with n type single crystal silicon 1 substrate and with optical fiber 11 angles at 45, be used to transmit light.

(11) metal level 9 that adopts commercially available general ultrasonic bond platform will decide tooth drive electrode 2, moving tooth drive electrode 5 with spun gold is connected sealing cap, cost of manufacture invention all-optical switch device with the pin of shell.

The concise and to the point principle of work of the present invention is as follows: deciding tooth, moving tooth drive electrode 2, apply DC voltage between 5, this moment with decide tooth, moving tooth drive electrode 2, what be connected on 5 decides tooth 3, produce electrostatic force between the moving tooth 4, folding overarm 6 is bent, driving silicon micromirror 10 moves on the direction that is parallel to n type single crystal silicon 1 substrate, silicon micromirror 10 plays the effect of a light trap plate, when silicon micromirror 10 is drawn back, optical fiber light by corresponding photoswitch for opening state, when silicon micromirror 10 resets, the optical fiber light corresponding photoswitch that is reflected is an off status, thereby realizes the on-off action of light.There is not opto-electronic conversion in the present invention in the photoswitch process, be a kind of all-optical switch, is specially adapted to do in the large-scale at a high speed full light Networks of Fiber Communications manufacturing of all-optical switch device.

Claims

1, a kind of technology for preparing electrostatic-type full-light switch for miniature machine comprises step:

Diffusion one deck heavily boron layer (14) is coated with one deck photoresist (15) on the heavily boron layer (14) on n type single crystal silicon (1) substrate;

It is characterized in that also comprising step:

Be placed on the photoresist (15) with a cube electrode mask, contraposition exposure imaging, photoresist (15) are gone up the photoresist window shape that exposure imaging goes out to decide tooth drive electrode (2), moving tooth drive electrode (5), expose heavily boron layer (14);

Cover metal film to deciding tooth drive electrode (2), moving tooth drive electrode (5) photoresist window and the sputter of photoresist face, peel off the metal film on photoresist (15) and the photoresist (15), bonding is decided tooth drive electrode (2) and is become some metal level (9) with moving tooth drive electrode (5);

Be coated with one deck photoresist (16) once more on the heavily boron layer (14) of n type single crystal silicon (1) substrate;

Deciding tooth (3), moving tooth (4), folding overarm (6), triangle balance beam (7), intermediate beam (8), silicon micromirror (10), vertical channel (12) mask with one is placed on the photoresist (16), the contraposition exposure imaging, photoresist (16) is gone up the photoresist window shape that exposure imaging goes out to decide tooth (3), moving tooth (4), folding overarm (6), triangle balance beam (7), intermediate beam (8), silicon micromirror (10), vertical channel (12), exposes heavily boron layer (14);

With inductively coupled plasma deep etching photoresist window shape heavily boron layer (14), etching depth exposes low-doped n type single crystal silicon (1) substrate greater than heavily boron layer (14) thickness;

Mark n type single crystal silicon (1) silicon substrate with the wafer dicing machine along scribe line;

N type single crystal silicon (1) silicon chip is put into the EPW corrosive liquid carry out wet etching and expose low-doped n type single crystal silicon (1) substrate, till corrosion depth the deciding tooth (3), moving tooth (4), folding overarm (6), triangle balance beam (7), intermediate beam (8), silicon micromirror (10) and break away from fully to the heavily boron layer (14) with n type single crystal silicon (1) substrate; Corrosion vertical channel (12) degree of depth is to vertical channel (12) bottom n type single crystal silicon (1) substrate forming V-shape groove (13) structure;

Manually break sheet off with the fingers and thumb, form singulated dies, tube core is bonded on the photoelectricity shell with insulating gel, and optical fiber (11) is seated in vertical channel (12) and the V-shaped groove (13);

With spun gold the metal level (9) of deciding tooth drive electrode (2), moving tooth drive electrode (5) is connected sealing cap with the pin of shell.