CN1385887A - Screen use interface for chip tester and pretreating method thereof - Google Patents
Screen use interface for chip tester and pretreating method thereof Download PDFInfo
- Publication number
- CN1385887A CN1385887A CN 01116961 CN01116961A CN1385887A CN 1385887 A CN1385887 A CN 1385887A CN 01116961 CN01116961 CN 01116961 CN 01116961 A CN01116961 A CN 01116961A CN 1385887 A CN1385887 A CN 1385887A
- Authority
- CN
- China
- Prior art keywords
- file
- wafer tester
- wafer
- tester
- screen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
A screen interface of a chip ester includes a first window for search for a first file, a first button electrol connected with a first window transferred to the second file according to the first file data when touching which is in conformity in grammar with the crystal autoamtic tester, which preset process method contains providing a usage manual, file, selecting test data to get the first file, to turn the first one to the second file to conform grammer of chip ester and transfer the second file to the crystal tester.
Description
The screen that the present invention relates to a kind of wafer tester uses interface and pre-process method.
Finish the processing procedure of a certain product as the integration engineering teacher after, all can be eager to want to understand the relevant parameter of the feeler switch (testkey) of themselves design, whether problem be arranged to understand processing procedure.
They often suffer from and must set up a wafer sort program (WAT program) of being write as with program language (HP Basic or C language) in early days, when program is made mistakes when needing debug (debug), may spend very big mental and physical efforts, manpower and time go to carry out debug, because a common program all is very long.
Recently, the function of wafer tester promotes significantly, the wafer tester that has has not needed the user to remove to write those numerous test programs that is difficult for debug again, make to use the mode at interface (GUI, Graphic User Interface) into, only need on the panel (referring generally to screen) of operation with screen, key in the project (rule) of relevant parameter, test, assembly, the pin position data such as (Pad) of desire test, can test, but such practice but still has and improves part not to the utmost.
Now lifting HP4071 WAT System is example, sees also Fig. 1.Can easily develop and carry out WAT (Wafer Access Test) test in order to make the operator, the screen that provides cover Hewlett-Packard (HP) semiconductor processes to estimate magnetic core software (SPECS) (Semiconductor Process Evaluation Core Software) in the HP4071 wafer testing system uses interface (GUI) test environment, it comprises three major parts: SPECS framework 11 (Framework), test plan guide 12 (Test Plan Navigator) and test rule program library 13 (AlgorithmLibrary), running by GUI core 1, can be engaged in the control of accepting host computer 14 (Host computer), output is report 15 (report) as a result, storage data 16 (data storage) and control detector 17 functions such as (prober), and then reach the purpose of controlling the HP4071 tester.
See also Fig. 2.Above-mentioned Test Plan narration test contents comprises wafer (Wafer) and goes up the information (Information) of desiring test suite (Device), and every hurdle information is called specification (Specification).Specification has four kinds: wafer specification 21 (Wafer spec), chip specification 22 (Die spec), test specification 23 (Test spec) and detector specification 24 (Probe spec).The user inserts relevant data as long as on the field of each specification, can measure the parameter (parameters) of assembly, and need not write numerous and diverse test program that is difficult for debug.
See also Fig. 3.In SPECS, the framework of wafer is by the wafer specification, and chip specification and test specification are formed.Wafer 31 (wafer) comprises many chips 32 (die), and each chip 32 has number of modules 33 (module), and each module is made up of many assemblies 35 (device) again, and each assembly may be connected on the different pin positions 34 (pad).
See also Fig. 4.If the characteristic that desire is tested an assembly then need define the affiliated wafer of described element, the pin position (pad) that chip, module and described assembly are shared could correctly be tested described assembly.That is define and still need behind wafer and the chip be defined module 41, assembly 42, assembly pin position 45 clear, cooperate the parameter 43 and the testing algorithm 44 (Algorithm) of input again, test to export its parameter 46 (out parameters).
Now lifting and measuring breakdown voltage (VBD, broken down voltage) is example, sees also table one.Table one is depicted as the form that must set up on the SPEC GUI before testing.The title of the first row input module is (as E01, E02), the title (as NwGox_area, NwGox_edge etc.) of the second row input module, the testing algorithm (being VBD) that the third line input institute desire is used at this, then import relevant parameter (as Ar, S etc.), input pin position (as p1, p2 etc.), the then title of definition output (as Vbd_E01_NwGox_area etc.), after importing one by one and defining, the action that can test.
Table one
| Module name | Device?Name | Algorithm | Input | Pad?Number | Output | Limit | Comment |
| ALGO_COMS | Input Vdd＝3.3 | ||||||
| E01 | NwGox_area NwGox_edge | VBD VBD | Ar＝724200 Ar＝207000 | P1＝2，P2＝1 P1＝10，P2＝22 | Vbd_E01_NwGox_area Vbd_E01_NwGox_edge | ||
| E02 | NwGox_area NwGox_edge | VBD VBD | S＝-1，Ar＝724200 S＝-1，Ar＝207000 | P1＝2，P2＝1 P1＝10，P2＝22 | Vbd_E02_NwGox_area Vbd_E02_NwGox_edge | ||
| #E03 | ...... | ...... | ...... | ...... | ..... | ||
| #E04 | ...... | ...... | ...... | ...... | ..... | ||
| #E05 | ...... | ...... | ...... | ...... | ..... |
The assembly of above-mentioned desire test, the pin position of assembly etc. must be operated according to service manual file (user menual file).Each product all can have a service manual file, and the service manual file is to be set up by the designer in advance, is putting down in writing the feeler switch (test key) on the wafer in it, uses for test.Feeler switch is made up of some pin position (pad), is designer's characteristic according to circuit when design, analyzes the key component that influences circuit function most, classifies the pin position (pad) of this key component as test emphasis place, promptly so-called feeler switch (test key).In other words, the assembly that is positioned on the feeler switch may be the most difficult realization on the processing procedure, or the easiest part of makeing mistakes of circuit, if the module testing on the feeler switch is errorless, can guarantee that then entire circuit has had suitable qualification rate.
In the GUI of SPEC, really can save the time of many programmings (programming) and program debugging, but non-common people were willing to be engaged in numerous and diverse work for foundation test this class of form, and last trillion assemblies are arranged on the wafer, though can not all be tested by each assembly, but still must sample and be enough to guarantee to test the assembly of accuracy rate (according to the service manual file), like this, the test form that test is each time set up, it will be gigantic project, also and so huge form essential hundred is close and none is dredged, tester just can be accepted, if an error in data is arranged, just must in the data heap huge, be corrected for number, this makes that the work of debug is extraordinarily arduous.
The screen that the purpose of this invention is to provide a kind of wafer tester uses interface and pre-process method thereof, and can realize: (1) obtains wafer sort data (WAT data) fast; (2) save the time that debug wafer sort program is spent; (3) need not write a program and just can test; And (4) test automation.
For achieving the above object, provide a kind of screen of wafer tester to use the interface according to an aspect of the present invention, in order to be spendable second file of a described wafer tester with one first file conversion, it comprises: one first window, in order to search described first file; One first button is electrically connected to described first window, when touching, is converted to described second file according to the data of described first file, and the grammer of described second file meets described wafer automatic tester.
Described wafer tester is HP4071 wafer testing system (WAT System); First file is the service manual file (user manual file) that cuts from the wafer of a described wafer tester desire test.
The screen of described wafer tester uses second window and one second button on the interface, is electrically connected to described first button and described first window, in order to inspect described second file; Its 3rd button is electrically connected to described second window and described wafer tester, in order to described second file is sent to described wafer tester; The 3rd input field is electrically connected to described first button, in order to determine the test mode of described wafer tester; The 4th input field is electrically connected to described first button, in order to determine the test voltage of described wafer tester.
Certainly, described first window and described second window comprise one first input field and one second input field respectively, in order to the input file title.
For achieving the above object, provide a kind of pre-process method of wafer tester according to a further aspect of the invention, comprise the following step: a service manual file is provided; From described service manual file intercept the test of desire wherein data partly with one first file; Changing described first file becomes one second file, to meet the grammer of described wafer tester; And transmit described second file to described wafer tester, to finish the pre-process of described wafer tester.
The document definition of service manual described in the method one chip (die) is desired the pin position (pad) of test suite, and the method that transmits described second file is file transfer protocol (FTP) (FTP), and intercepting wherein, desire test data partly are to finish by a text editor.
Adopt such scheme of the present invention, owing to utilize the skill of file conversion, just need not repeat to import some existing data, therefore can avoid unnecessary debug, save the time of programming, can reach the purpose that obtains the wafer sort data fast and can realize test automation.
For clearer understanding purpose of the present invention, characteristics and advantage, specify the present invention below in conjunction with accompanying drawing.
Fig. 1 is the screen use interface (GUI) that existing HP4071 semiconductor processes is estimated magnetic core software (SPECS);
Fig. 2 is existing test plan (test plan);
Fig. 3 is the classification of existing test specification;
Fig. 4 is the flow process of existing test specification;
Fig. 5 is that screen of the present invention uses interface (GUI);
Fig. 6 is a pre-process flow process of the present invention.
Main figure number in the accompanying drawing is as follows:
63: the first files of 54: the first buttons
67: the second files of 591: the four input fields
As mentioned above, in fact defined the pin position of each assembly on the service manual file, the indispensable data of test such as parameter, these class data can repeat input once really again on wafer tester.Certainly, the grammer of the form of service manual file and the program of wafer tester is inequality, but each product is also just re-entering data relevant on the service manual file on the wafer tester when test.Generally behind input test form on the wafer tester, can store into certain form when storing, described form has its fixing grammer, for different products, and the change on the just service manual file that wherein changes.Therefore, can utilize the skill of program conversion, be converted the service manual file of each product to be measured to meet wafer tester form, again it is sent on the wafer tester, can reach the purpose of simplifying testing process, key in to save unnecessary data.At this, be to use the method at interface (GUI) to be realized by screen the skill of format transformation.
See also Fig. 5.It is first window 51 and first button 54 that the screen of wafer tester of the present invention uses interface (GUI) main.On first window, can search the service manual file (user manual file) of each product, also can utilize first input field, 511 direct import file names certainly.First button can be second file with first file conversion then.First file is to be adapted a little by the service manual file.The assembly of all desires test is defined in the service manual file, and during test, may get whole or part wherein.Therefore, can in the service manual file, before the assembly of institute's desire test, add mark.When first button 54 was pressed, program can convert the assembly that respectively is marked to the form of wafer tester according to the assembly that is marked in the service manual file.Wherein, be that another kind of form can be realized by programming with a kind of file conversion of form, this is a prior art and for those skilled in the art person is familiar with, ought not giving unnecessary details at this.
After being converted to the wafer sort form, can select relative file name at second window, 52 usefulness mouses, inspected by second button again.Directly import file name of second input field is arranged in second window.
Inspect errorless after, it can be sent on the wafer tester, test.The method that transmits is generally all used file transfer protocol (FTP) (FTP).
About the pattern of desire test, can generally have some special projects in 601 inputs of the 3rd input field or directly circle choosing for technology definition (TD).The voltage Vdd of test then can import or enclose choosing on the 4th field 591, be preset as 5V.Secondly, button helps (HELP) can seek to assist on the line, withdraws from (EXIT) and then can finish operation.
See also Fig. 6.The flow process of pre-process of the present invention is: at first select the service manual file (user manual file) that the engineer has set up, for example a tk5176.rtf on above-mentioned first input field.Because most service manual file 62 is to set up with microsoft word, must be adapted for first file 63 more a little earlier with changing into pure words file (* .rtf or * .doc change into * .txt).
In operation, can only allow first button 54 the 4th button 53 light earlier, push the wrong button with prevention, can quicken the speed of operator study like this, therefore the accuracy of carrying out conversion certainly also can improve.When operator operation not to the time, can demonstrate relevant information in good time, tell the using method that it is correct.
Then, press first the file 63 whether search 64 earlier of first button has file tk5176.txt by name.There is not the then information of display operation mistake, have then and (write as by perl by conversion program, because its available short content gets it, also available VB, VC etc. for it, but it is more numerous and diverse) 65 one-tenth second files 67 (tk5176.tst, filename is the same) that meet wafer tester form (referring to the form of HP SPECS) of contrast map table (mapping table) format transformation at this.If change successfully, then demonstrate relevant information (as the output result file istk5176.tst).Certainly, can inspect the result of conversion at second window, the result is errorless then can pass through file transfer protocol (FTP) (ftp) with file transfer on wafer tester.
With HP SPECS, also have specifications such as wafer, chip and detector in its test plan.This three narrates the information and the configuration of pin position thereof of chip, module (module) relevant position respectively.
So far promptly finish a test plan,, then can carry out wafer (WAT) and measure if the image program of detector is also finished.
Certainly, wafer tester of the present invention is meant HP 4071, HP 4071 provide one the cover SPECS GUI, also applicable for other similar wafer tester.
By above-mentioned diagram and explanation as can be known, from only needing the very short time to finishing a test plan after the service manual file conversion, so can save time, and raise the efficiency, and further realize the wafer sort automation.
Claims (20)
1. the screen of a wafer tester uses the interface, in order to be spendable second file of a described wafer tester with one first file conversion, it is characterized in that it comprises:
One first window is in order to search described first file;
One first button is electrically connected to described first window, when touching, is converted to described second file according to the data of described first file, and the grammer of described second file meets described wafer automatic tester.
2. the screen of wafer tester as claimed in claim 1 uses the interface, it is characterized in that described wafer tester is HP4071 wafer testing system (WAT System).
3. the screen of wafer tester as claimed in claim 1 uses the interface, it is characterized in that, described first file cuts the service manual file from the wafer of a described wafer tester desire test.
4. the screen of wafer tester as claimed in claim 1 uses the interface, it is characterized in that, also comprises one second window and one second button, is electrically connected to described first button and described first window, in order to inspect described second file.
5. the screen of wafer tester as claimed in claim 4 uses the interface, it is characterized in that described first window and described second window comprise one first input field and one second input field respectively, in order to the input file title.
6. the screen of wafer tester as claimed in claim 4 uses the interface, it is characterized in that, also comprises one the 3rd button, is electrically connected to described second window and described wafer tester, in order to described second file is sent to described wafer tester.
7. the screen of wafer tester as claimed in claim 1 uses the interface, it is characterized in that, also comprises one the 3rd input field, is electrically connected to described first button, in order to determine the test mode of described wafer tester.
8. the screen of wafer tester as claimed in claim 1 uses the interface, it is characterized in that, also comprises one the 4th input field, is electrically connected to described first button, in order to determine the test voltage of described wafer tester.
9. the pre-process method of a wafer tester is characterized in that, comprises the following step:
One service manual file is provided;
From described service manual file intercept the test of desire wherein data partly with one first file;
Changing described first file becomes one second file, to meet the grammer of described wafer tester; And
Transmit described second file to described wafer tester, to finish the pre-process of described wafer tester.
10. the pre-process method of wafer tester as claimed in claim 9 is characterized in that, described service manual document definition one chip is desired the pin position of test suite.
11. the pre-process method of wafer tester as claimed in claim 9 is characterized in that, the method that transmits described second file is a file transfer protocol (FTP).
12. the pre-process method of wafer tester as claimed in claim 9 is characterized in that, intercepting wherein, desire test data partly are to finish by a text editor.
13. a wafer tester screen uses the method for operation at interface, comprising:
If one can search first window of first file;
If one first button is electrically connected to described first window;
After touching described first button, the data of described first file can be converted to spendable second file of described wafer tester.
14. the screen of wafer tester as claimed in claim 13 uses the method for operation at interface, it is characterized in that described wafer tester is the HP4071 wafer testing system.
15. the screen of wafer tester as claimed in claim 13 uses the method for operation at interface, it is characterized in that, described first file cuts the service manual file from the wafer of a described wafer tester desire test.
16. the screen of wafer tester as claimed in claim 13 uses the method for operation at interface, it is characterized in that, also comprises one second window and one second button, is electrically connected to described first button and described first window, in order to inspect described second file.
17. the screen of wafer tester as claimed in claim 16 uses the method for operation at interface, it is characterized in that described first window and described second window comprise one first input field and one second input field respectively, in order to the input file title.
18. the screen of wafer tester as claimed in claim 16 uses the method for operation at interface, it is characterized in that, also comprise one the 3rd button, be electrically connected to described second window and described wafer tester, in order to described second file is sent to described wafer tester.
19. the screen of wafer tester as claimed in claim 13 uses the method for operation at interface, it is characterized in that, also comprises one the 3rd input field, is electrically connected to described first button, in order to determine the test mode of described wafer tester.
20. the screen of wafer tester as claimed in claim 13 uses the method for operation at interface, it is characterized in that, also comprises one the 4th input field, is electrically connected to described first button, in order to determine the test voltage of described wafer tester.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01116961 CN1385887A (en) | 2001-05-10 | 2001-05-10 | Screen use interface for chip tester and pretreating method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01116961 CN1385887A (en) | 2001-05-10 | 2001-05-10 | Screen use interface for chip tester and pretreating method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1385887A true CN1385887A (en) | 2002-12-18 |
Family
ID=4662640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01116961 Pending CN1385887A (en) | 2001-05-10 | 2001-05-10 | Screen use interface for chip tester and pretreating method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1385887A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100461127C (en) * | 2006-07-18 | 2009-02-11 | 英业达股份有限公司 | Computer screen display controller test approach and system |
| CN101581754B (en) * | 2008-05-13 | 2011-07-06 | 京元电子股份有限公司 | File conversion system and file conversion method |
| TWI399658B (en) * | 2008-04-22 | 2013-06-21 | King Yuan Electronics Co Ltd | Pattern conversion method and system |
-
2001
- 2001-05-10 CN CN 01116961 patent/CN1385887A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100461127C (en) * | 2006-07-18 | 2009-02-11 | 英业达股份有限公司 | Computer screen display controller test approach and system |
| TWI399658B (en) * | 2008-04-22 | 2013-06-21 | King Yuan Electronics Co Ltd | Pattern conversion method and system |
| CN101581754B (en) * | 2008-05-13 | 2011-07-06 | 京元电子股份有限公司 | File conversion system and file conversion method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5157668A (en) | Method and apparatus for locating faults in electronic units | |
| JPS6076100A (en) | Memory array tester system | |
| KR20010013719A (en) | Low cost, easy to use automatic test system software | |
| CN109783346B (en) | Keyword-driven automatic testing method and device and terminal equipment | |
| US20060136794A1 (en) | Computer peripheral connecting interface system configuration debugging method and system | |
| CN101206130A (en) | Automatic verification/calibration/test platform for electronic instrument | |
| EP1012615B1 (en) | System for storing and searching named device parameter data in a test system for testing an integrated circuit | |
| US11009544B2 (en) | Inspection system, wafer map display, wafer map display method, and computer program | |
| CN114580326A (en) | Netlist derivation method, server and storage medium for device function simulation | |
| JP2830354B2 (en) | Equivalent data item detection method | |
| Munson et al. | Toward a quantifiable definition of software faults | |
| CN1385887A (en) | Screen use interface for chip tester and pretreating method thereof | |
| US20070011544A1 (en) | Reprogramming of tester resource assignments | |
| CN114863986A (en) | Bit failure data acquisition method and device, storage medium and electronic equipment | |
| Noble | IDA: A tool for computer-aided failure analysis | |
| CN116187226B (en) | Comparison method and comparison device for PDK engineering and electronic equipment | |
| CN117741391A (en) | ATE test engineering conversion method and device, ATE test equipment and storage medium | |
| Langford et al. | The identification and analysis of systematic yield loss | |
| JPH036630A (en) | Check system for interactive processing program | |
| CN118132355A (en) | Log file corresponding method, device, equipment and storage medium for display screen TP test | |
| CN116301858A (en) | Construction method of digital debugging process tool model of electronic product | |
| JPH11118889A (en) | Test program generating system | |
| McCluskey | Memorial session for SH Caldwell (1904-1960) | |
| CN114327875A (en) | Resource migration method, device, equipment and storage medium | |
| CN111783404A (en) | Data processing method and system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |