CN1385556A - Stabilizer for plating tin-bismuth alloy and preparation method thereof - Google Patents
Stabilizer for plating tin-bismuth alloy and preparation method thereof Download PDFInfo
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- CN1385556A CN1385556A CN 02115454 CN02115454A CN1385556A CN 1385556 A CN1385556 A CN 1385556A CN 02115454 CN02115454 CN 02115454 CN 02115454 A CN02115454 A CN 02115454A CN 1385556 A CN1385556 A CN 1385556A
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- bismuth alloy
- stabilizer
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Abstract
The basic composition of stabilizing agent for electroplating tio-bismuth alloy includes polyglycol 2-8g/l aqueous solution, vitamin C 2-6g/l aqeous solution and sodium subphosphite 10-30 g/l aqueous solution and its preparation method includes the following steps: dissolving sodium subphosphite in water, under the condition of stirring adding vitamin C; dissolving polyglycol in hot water, then cooling to room temp.; under the condition of stirring adding the polyglycol solution into the solution containing sodium subphosphite and vitamin so as to obtain the invented stabilizing agent for electroplating tin-bismuth alloy. Said stabilizing agent can remove and reduce free oxygen in the solution, can prevent Sn(2+) from being oxidized into Sn (4+), and the oxidized component in the stabilizing agent, for example vitamin C can be reduced on the cathode.
Description
Technical field
The present invention relates to a kind of stabilizer for plating tin-bismuth alloy and preparation method thereof.
Background technology
Along with the development of microelectronics, the application of the surface mount device of multioutlet is more and more, lead spacing constantly reduce (≤0.1mm), the immersed solder material can not satisfy specification of quality, the scolder plating will become standard wire overcoating technology.In addition, the quality of coating welding property is relevant with the oxide thickness that coating surface generates.Oxide thickness is big more, and the weldability of coating is just poor more.Because bright coating is fine and close, so its oxide on surface thickness is less, welding property is all right.Non-bright coating surface oxide layer is thicker, so welding property is just poor; If non-bright coating is behind hot melt, the degree that its welding property descends can reduce.
Tin is to find early and use one of metal more widely.The shortcoming that changes to gray tin when existing easy generation whisker and low temperature as the weldability tin coating, this is that stable existence is the β type more than 13.2 ℃, is called tin because it has α and two kinds of allotropic substances of β, and is soft; 13.2 stable existence below ℃ is the α type, is called gray tin.Tin becomes fragile a little less than melting temperature the time, and because of the density of β type tin is bigger than α type, when being lower than 13.2 ℃, volume became big when β type tin changed to α type tin, and it is powder that the stress of generation makes it cracked.But this transformation is very slow, and is only just remarkable in time below-40 ℃.This variation begins rapid spread by a bit, causes at last that monoblock tin is cracked to be called " tin pest ", can suppress this variation when adding bismuth, nickel, antimony in the tin.
Because developing rapidly of electronic technology is more and more higher to the welding requirements of discrete component, therefore the welding property to coating has proposed requirements at the higher level.Owing to pure tin fusing point higher (232 ℃), the thermal damage to matrix during welding is also more serious in addition, and oxidation-resistance is also good not as its alloy, so present widespread use tin-based alloy is as weldability coating; As consisting of stanniferous 60%, plumbous 40% Sn-Pb alloy, its fusing point is 183 ℃, existing positive widespread use.But because leaded in the coating, thus no matter the electroplating operations process still be product after use, all can pollute environment.Along with the enhancing of people's environmental consciousness, more and more require to replace deleterious Sn-Pb alloy layer.Ag-Sn alloy and Au-Sn alloy also can be used as weldability coating but because cost is higher, use wideless.
The Sn-Bi alloy is because its weldability is better, and fusing point lower (being lower than 160 ℃), has therefore caused people's attention gradually.Though the price of bismuth is a little more than lead, but because the weldability of Sn-Bi alloy is better, can keep alloy welding property preferably on the one hand, plumbous use can be replaced after in Sn-Pb coating, introducing bismuth on the other hand, the development trend of electroplating weldability coating will be become so reduce plumbous usage quantity or replace the existing lead-coat that contains.
Zinc-plated have sulfuric acid type, pyrophosphate salt type, metilsulfate type and stannate type etc. with the tin alloy system.No matter technology existence in the past is sulfuric acid system, fluoroboric acid system, or metilsulfate type system, and problem of their common is Sn
2+Oxidation and hydrolysis: Sn in the aqueous solution
2+Ion easily is oxidized to Sn
4+, Sn
4+In pH＞0.5 o'clock hydrolysis and adsorb Sn
2+Form a kind of yellow colloid, thereby cause the instability of plating bath, make the plating bath cisco unity malfunction.
Summary of the invention
Problem to be solved by this invention is at Sn in the plating bath
2+Be oxidized to Sn easily
4+Thereby, cause the plating bath problem of unstable, a kind of electroplated Sn-Bi alloy solution stabilizer that can improve bath stability and preparation method thereof is provided.
Technical scheme provided by the invention is: a kind of stabilizer for plating tin-bismuth alloy, it basic composition is: polyoxyethylene glycol 2～8 grams per liter aqueous solution, the Catergen～6 grams per liter aqueous solution, inferior sodium phosphate 10～30 grams per liter aqueous solution.
The preparation method of above-mentioned stabilizer for plating tin-bismuth alloy, inferior sodium phosphate is soluble in water, under agitation add vitamins C; Polyoxyethylene glycol is dissolved in the hot water, then cool to room temperature; Under agitation polyglycol solution is added in the solution of inferior sodium phosphate and VITAMIN and promptly gets required stabilizer for plating tin-bismuth alloy.
The free oxygen in the solution can be removed or reduce to gained stabilizer for plating tin-bismuth alloy of the present invention, prevents Sn
2+Be oxidized to Sn
4+And component such as vitamins C oxidized in the stablizer continue to recycle after being reduced on the negative electrode, thereby improve the stability of plating bath.
Embodiment
Embodiment one: it basic composition is the polyoxyethylene glycol 2 grams per liter aqueous solution, the VITAMIN 6 grams per liter aqueous solution, the inferior sodium phosphate 15 grams per liter aqueous solution stabilizer for plating tin-bismuth alloy.
Embodiment two: it basic composition is the polyoxyethylene glycol 5 grams per liter aqueous solution, the VITAMIN 2 grams per liter aqueous solution, the inferior sodium phosphate 30 grams per liter aqueous solution stabilizer for plating tin-bismuth alloy.
Embodiment three: it basic composition is the polyoxyethylene glycol 8 grams per liter aqueous solution, the VITAMIN 3 grams per liter aqueous solution, the inferior sodium phosphate 10 grams per liter aqueous solution stabilizer for plating tin-bismuth alloy.
Embodiment four: 10～30 gram inferior sodium phosphate are dissolved in 50～60 ml waters, under agitation add 2～6 gram vitamins Cs; 2～8 gram polyoxyethylene glycol are dissolved in 20 milliliters of hot water, then cool to room temperature; Under agitation polyglycol solution is added in inferior sodium phosphate and the ascorbic solution, thin up to a liter promptly gets required stabilizer for plating tin-bismuth alloy.
Embodiment five: the stabilizer for plating tin-bismuth alloy of embodiment one～three can make corresponding component with reference to embodiment four by its content requirement such as method.
Claims (2)
1. stabilizer for plating tin-bismuth alloy, it basic composition is: polyoxyethylene glycol 2～8 grams per liter aqueous solution, the Catergen～6 grams per liter aqueous solution, inferior sodium phosphate 10～30 grams per liter aqueous solution.
2. the preparation method of the described stabilizer for plating tin-bismuth alloy of claim 1 is soluble in water with inferior sodium phosphate, under agitation adds vitamins C; Polyoxyethylene glycol is dissolved in the hot water, then cool to room temperature; Under agitation polyglycol solution is added in the solution of inferior sodium phosphate and VITAMIN and promptly gets required stabilizer for plating tin-bismuth alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02115454 CN1385556A (en) | 2002-01-23 | 2002-01-23 | Stabilizer for plating tin-bismuth alloy and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02115454 CN1385556A (en) | 2002-01-23 | 2002-01-23 | Stabilizer for plating tin-bismuth alloy and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1385556A true CN1385556A (en) | 2002-12-18 |
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ID=4743664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02115454 Pending CN1385556A (en) | 2002-01-23 | 2002-01-23 | Stabilizer for plating tin-bismuth alloy and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1385556A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102304733A (en) * | 2011-08-22 | 2012-01-04 | 武汉吉和昌化工科技有限公司 | High-temperature-resistant bright tin-plating stabilizing agent |
| CN105002529A (en) * | 2015-08-21 | 2015-10-28 | 无锡桥阳机械制造有限公司 | Bismuth-plating electroplating liquid and pulse plating method for bismuth thin film |
-
2002
- 2002-01-23 CN CN 02115454 patent/CN1385556A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102304733A (en) * | 2011-08-22 | 2012-01-04 | 武汉吉和昌化工科技有限公司 | High-temperature-resistant bright tin-plating stabilizing agent |
| CN102304733B (en) * | 2011-08-22 | 2013-04-17 | 武汉吉和昌化工科技有限公司 | High-temperature-resistant bright tin-plating stabilizing agent |
| CN105002529A (en) * | 2015-08-21 | 2015-10-28 | 无锡桥阳机械制造有限公司 | Bismuth-plating electroplating liquid and pulse plating method for bismuth thin film |
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