CN1375839A - Polymer-base thermosensitive impedance element and its making process - Google Patents
Polymer-base thermosensitive impedance element and its making process Download PDFInfo
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- CN1375839A CN1375839A CN 01109711 CN01109711A CN1375839A CN 1375839 A CN1375839 A CN 1375839A CN 01109711 CN01109711 CN 01109711 CN 01109711 A CN01109711 A CN 01109711A CN 1375839 A CN1375839 A CN 1375839A
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Abstract
This invention is related to a thermal element made of high molecular compound materials filled by a conductive filling material which presents different resistance variations according to different temperatures and its production method. The method is to cross link the high molecular base material filled with a conductive particle to be enabled to have the property of shape memory, then to be plainly sheared making its strain quantity larger than one percent to change the microscopic structure and so which can be with different electric properties.
Description
The present invention relates to a kind of resistive element and manufacture method thereof, specifically be meant and a kind ofly use the polymer composite that the conductive fill material fills and under different temperatures, present the temperature-sensitive element and the manufacture method thereof of different resistance variations.
Thermosensitive impedance element has been widely used in fields such as temperature detection, security control, temperature-compensating.In the past, thermosensitive impedance element mainly was to be material with the pottery, but pottery needs the higher temperature manufacturing, and temperature is many to be needed to consume a large amount of energy taking the photograph more than formula 900 degree, and processing procedure is more complicated also.
Then, polymer-based thermosensitive impedance element is developed, because the manufacturing temperature of polymer-base thermosensitive impedance element is about taking the photograph below formula 300 degree, than being easier to processing, moulding, energy resource consumption is less, and processing procedure is simple, with low cost, so application is day by day broad.
Yet, the temperature coefficient of the polymer composite that these conductive fill materials are filled, content difference and microstructure difference with the conductive fill material can be different positive temperature coefficient resistor characteristics, can utilize this characteristic to make various resistive elements and thermosensitive resistor with positive temp coefficient.
U.S. RAYCHEM company; promptly utilize this characteristic; make a series of can answer type thermosensitive resistor with positive temp coefficient (Resetable PPTC; UP4237441); when thermistor temp arrives certain switching temperature (Switching Temperature) when above; component resistance promptly rises rapidly, can be applicable to temperature and overcurrent protection.(Constant Wattage Element hereinafter to be referred as CW type element, UP4304987), can be applicable to heater design also can to do the low resistive element of paired variations in temperature susceptibility.
But thermosensitive impedance element that this type of polymer-based thermistor element all is a positive temperature coefficient or the low resistive element of variations in temperature susceptibility, its resistance value are not to improve with temperature to raise, be exactly do not vary with temperature.That is to say that in side circuit, the thermistor element of circuit design is used, and all must be subject to the above-mentioned relevance of temperature and resistance value.Illustrate,, must design in addition, use complicated circuit to reach if the circuit that temperature value of desire design can start when reaching certain altitude then can't directly use traditional macromolecular thermosensitive resistor element.
One of the object of the invention is to provide a kind of polymer-base thermosensitive resistive element, has negative temperature coefficient, makes the design of circuit and application can not be subject to traditional high molecular positive temperature coefficient temperature-sensitive element, makes the application category of high molecular heat sensitive component more broad.
Another object of the present invention is to provide a kind of polymer-base thermosensitive resistive element, it is when first the use, maintain high relatively resistance value, but after a high temperature uses, after component temperature rose to the glass transition temperature (Glass-transition temperarure) or fusing point of polymer base material, its resistance value can reduce relatively.
Another purpose of the present invention is to provide a kind of manufacture method of polymer-base thermosensitive resistive element, and it uses the processing of skeleton symbol shearing force, can change the microstructure of conductive fill material.
A further object of the present invention is to provide a kind of manufacture method of polymer-base thermosensitive resistive element, and the polymer-base thermosensitive element that its conductive filler that can produce different sensitive characteristics is filled makes the application of processing procedure and possibility that brand-new viewpoint be arranged.
For achieving the above object, polymer-base thermosensitive resistive element provided by the present invention comprises: the polymer composite that a conductive filler is filled, this polymer composite comprises polymer base material, and is provided with electroconductive particle in this polymer base material.And this electroconductive particle forms discontinuous phase according to single direction.And this polymer composite has the characteristic of shape memory, in that (this uniform temperature to the thermoplastic of non-crystalline type, or thermosets, is meant glass transition temperature through uniform temperature; For crystalline thermoplastic, be meant fusing point) time, the discontinuous electroconductive particle of this single direction is engaged becomes conduction continuous phase.Therefore, the thermal sensitivity element that this is polymer-based, after temperature raise, machining stress was eliminated, and conductivity improves, and can become the high molecular heat sensitive component of negative temperature coefficient, or after being heated, impedance is reduced to the element of definite value etc.Be with, the design of interlock circuit and application can not be subject to traditional high molecular positive temperature coefficient temperature-sensitive element, make the application category of high molecular heat sensitive component more broad.
In addition, the manufacture method of polymer-base thermosensitive resistive element provided by the present invention, its polymer base material that conducting particles is filled carries out crosslinked, makes this whole polymer composite structure of supporting by the arm conducting particles have the characteristic of shape memory.To this polymer composite, carry out the processing of skeleton symbol shearing force again, make this macromolecule dependent variable greater than one of percentage, and make the microstructure of conductive fill material change, have different electrical characteristics.
Below consult and examine accompanying drawing the present invention will be described in detail, in the accompanying drawing:
Fig. 1 is the schematic diagram of filled composite materials.
Fig. 2 is a process schematic diagram of first embodiment of the invention;
Fig. 3 is another process schematic diagram of first embodiment of the invention;
Fig. 4 is a process schematic diagram again of first embodiment of the invention;
Fig. 5 is that the temperature-sensitive element of first embodiment of the invention is made schematic diagram;
Fig. 6 is an electrical key diagram of the temperature-sensitive element of first embodiment of the invention;
Fig. 7 is another electrical key diagram of the temperature-sensitive element of first embodiment of the invention;
Fig. 8 is a process schematic diagram of second embodiment of the invention;
Fig. 9 is another process schematic diagram of second embodiment of the invention;
Figure 10 is a process schematic diagram again of second embodiment of the invention;
Figure 11 is that the temperature-sensitive element of second embodiment of the invention is made schematic diagram;
Figure 12 is the machining deformation schematic diagram of second embodiment of the invention;
Figure 13 is an electrical key diagram of the temperature-sensitive element of second embodiment of the invention;
Figure 14 is another electrical key diagram of the temperature-sensitive element of second embodiment of the invention;
Figure 15 is a process schematic diagram of third embodiment of the invention;
Figure 16 is another process schematic diagram of third embodiment of the invention;
Figure 17 is a process schematic diagram again of third embodiment of the invention;
Figure 18 is that the temperature-sensitive element of third embodiment of the invention is made schematic diagram;
Figure 19 is an electrical key diagram of the temperature-sensitive element of third embodiment of the invention;
Figure 20 is another electrical key diagram of the temperature-sensitive element of third embodiment of the invention.
Embodiment 1: constant impedance type (CW type; Constant Wattage)
See also Fig. 2 to Fig. 4, be the manufacture method program diagram of first embodiment of the invention.In this embodiment, use high density polyethylene (HDPE) (HDPE) LH606 (this is Taiwan polymerization company commodity) as polymer base material 11, (this is Dutch AKZO company commodity to use the high conductive black 30 Ketjenblack EC of high structure, DBP (Dibutyl Phthalate, dibatyl phithalate) oil absorption is about 360ml/100g, see also United States Patent (USP) the 4th, 304, No. 987) as electroconductive particle.Electroconductive particle 12 that is arranged in first direction and the electroconductive particle 13 that is arranged in second direction have been shown among Fig. 2.The weight ratio percentage that this electroconductive particle dopes can be by 50 5 percent to percent.In the present embodiment, the electroconductive particle ratio that dopes is a weight ratio 10.Make this polymer base material of supporting by the arm electroconductive particle 11 become filled composite materials 10.(consulting Fig. 1)
If to the filled composite materials using dosage is gamma-rays (GammaRays) more than the 10Mrads or the electron beam (Electron Beams) that uses suitable intensity irradiation, can make polymer base material produce crosslinked (Cross Link) mutually, allow whole filled composite materials have the characteristic of shape memory.Or add per-compound (Peroxides) to make composite material produce chemical action and crosslinked, make composite material have shape memory.In the present embodiment, the crosslinked composite material 10 of cobalt 60 radiation gamma to these filled composite materials 10 using dosages are 15Mrads allows filled composite materials 10 become the filled composite materials 10 ' with shape memory characteristic.
See also Fig. 4, again this filled composite materials 10 ' with shape memory characteristic is carried out skeleton symbol shearing force (Simple Shear) processing.This skeleton symbol shearing force processing dependent variable (Simple ShearStrain) can be by 300 5 percent to percent.Use the dependent variable of processing to be about absolutely (100%) at present embodiment.Make first direction electroconductive particle 12, change the electroconductive particle 12 ' of single direction discontinuous phase into by original conduction continuous phase, that is the arrangement of this electroconductive particle 12 ' has been nonconducting.And have the filled composite materials 10 ' of shape memory characteristic, become processing back filled composite materials 10 ".
Consult Fig. 5, at this filled composite materials 10 " on add electrode 91 and 92, again this is added back filled composite materials 10 " cut into the temperature-sensitive element 90 that diameter is 15mm.To 90 heating of this temperature-sensitive element, and the selection of this heating-up temperature, mainly be will be more than the HDPE fusing point, so that filled composite materials 10 " be returned to memorized shape, and the HDPE fusing point is about 130 degree Celsius.Present embodiment uses the formula of taking the photograph 150 degree heating to make the HDPE fusing.Make the filled composite materials 10 that originally is subjected to the shearing force machining deformation " return back to original memorized shape 10 ', simultaneously, the conductive fill phase conducting particles 12 ' of first direction is also replied the continuous structure 12 of conduction once more.And resistance value also is reduced to low impedance state (seeing also Fig. 6).This filled composite materials 10 ' structure, behind temperature retrieval, the conductive fill phase conducting particles 12 of first direction, structure still can be kept low-impedance structure.
See also Fig. 6, it is the electrical characteristic key diagram of temperature-sensitive element 90 before heating.Transverse axis is a temperature, and the longitudinal axis is impedance.When temperature-sensitive element begins heating by room temperature, the initial resistance of this temperature-sensitive element 90 is high impedance Ro, after rising to polymer base material fusing point Ta, temperature (takes the photograph formula 130 degree approximately), filled composite materials 10 " crystalline phase begins fusing; and the conducting particles 12 ' of original first direction conductive fill phase is replied the continuous structure (first direction conducting particles 12) of conduction, and resistance value is reduced to the Low ESR R1 (wherein Ro＞100 R1) that A is ordered.Afterwards, temperature retrieval is to room temperature T1, and the Low ESR R2 that B is ordered is reduced in the impedance meeting of temperature-sensitive element 90.Thereafter, even temperature-sensitive element is heated again, temperature surpasses fusing point, but the impedance of temperature-sensitive element also no longer is returned to Ro (seeing also Fig. 7).
But because use the difference of polymer base material and conducting particles prescription and composition, can make the electrical characteristic of temperature-sensitive element 90 to improve, and make impedance slightly raise or descend with temperature, but the difference of resistance value and R1, comparing with the difference of former Ro, has been quite small.
In fact, in polymer base material 20 used in the present invention, employed material is not limited to high density polyethylene (HDPE) (HDPE), as long as the mechanical strength (MechanicalStrength) of composite material is enough to support the dependent variable of shearing processing, and tool conduction power not, to those skilled in the art, when changing selected macromolecular material, for example various crystalline polymer materials, as low density polyethylene (LDPE) (LDPE), LLDPE (LLDPE), polypropylene, or other vinyl copolymer such as ethylene-acrylic acid copolymer (Ethylene-Acrylic AcidCopolymer), or other amorphous macromolecular material, can reach similar effects.And conducting particles can be other conductive material such as nickel powder, silver powder or graphite and can reach similar effects.Embodiment 2: the high molecular positive temperature coefficient temperature-sensitive element
See also Fig. 8 to Figure 10, be the manufacture method program diagram of second embodiment of the invention.In this embodiment, use high density polyethylene (HDPE) (HDPE) LH901 (this is Taiwan polymerization company commodity) as polymer base material 21, the graphite powder (Nickel/Graphite CompositePowder, this is Canadian Westaim Specialty Materials Corporation company commodity) that uses nickel plating is as electroconductive particle.The weight ratio percentage that this electroconductive particle dopes can be by 90 65 percent to percent.In the present embodiment, the electroconductive particle ratio that dopes is a weight ratio 75 percent.Electroconductive particle 22 that is arranged in first direction and the electroconductive particle 23 that is arranged in second direction have been shown among Fig. 8.Make this polymer base material of supporting by the arm electroconductive particle become filled composite materials 20.
Same, if be radiation gamma more than the 10Mrads, can allow whole filled composite materials have the characteristic of shape memory so that polymer base material produces crosslinkedly mutually to filled composite materials 20 using dosages.In the present embodiment, to this filled composite materials 20, using dosage is crosslinked this filled composite materials 20 of the cobalt 60 radiation gamma of 20Mrads, so that polymer base material 20 produces mutually is crosslinked, forms the filled composite materials 20 ' (Fig. 9) with shape memory characteristic.
See also Figure 10, again this filled composite materials 20 ' with shape memory characteristic is carried out the processing of skeleton symbol shearing force.This skeleton symbol shearing force processing dependent variable can be by one of percentage to 300 percent.The processing dependent variable of using at present embodiment is about one of percentage hundred.Make first direction electroconductive particle 22, change the electroconductive particle 22 ' of single direction discontinuous phase by original conduction continuous phase into.And have the filled composite materials 20 ' of shape memory characteristic, become processing back filled composite materials 20 ".That is to say the filled composite materials 20 after the processing " in the arrangement of first direction electroconductive particle 22 ', non-conductive.
Consult Figure 11, at this filled composite materials 20 " on add electrode 93 and 94, cutting into diameter again is the temperature-sensitive element 95 of 15mm.This temperature-sensitive element 95 is heated to the formula of taking the photograph 150 degree, makes the HDPE fusing.Originally be subjected to the filling composite wood material 20 of shearing force distortion " return back to original memorized shape 20 '.Though originally caused hundred-percent strain to be eliminated, because of composite material 20 " be heated to fusing point when above, can be because of HDPE base material phase, volumetric expansion reaches more than 10.See also Figure 12, because use the graphite powder of electroconductive particle as nickel plating, engaging force between conducting particles, to be low than the conductive black of the high structure of embodiment one, make that the graphite powder of electroconductive particle nickel plating is strutted owing to base material expands mutually, make the arrangement of first direction conducting particles 22 ' and second direction conducting particles 23 ', all form discontinuous cut-off structure.
See also Figure 13 and Figure 14, the resistance value of this temperature-sensitive element when rising to the formula of taking the photograph 150 degree T2 by the T1 temperature, can maintain the high impedance R1 state that D is ordered.When temperature returned room temperature T1, the HDPE base material made the conducting particles that was originally strutted by the HDPE base material reply the conduction state of binding once more mutually once more because of the crystallization volume significantly shrinks.Thereby, the Low ESR R2 state that resistance drop is ordered to E.Thereafter element reverts back to general semistor (PPTC), can maintain low impedance state when room temperature, and is warming up to the polymer base material fusing point again when above, and resistance can maintain high impedance status.Embodiment 3: the high molecular positive temperature coefficient temperature-sensitive element
See also Figure 15 to Figure 17, be the manufacture method program diagram of third embodiment of the invention.In this embodiment, use high density polyethylene (HDPE) (HDPE) Petrothene LB832 (this is U.S. Equistar company commodity) as polymer base material 30, (this is U.S. Equistar company commodity to use the conductive black RaVen450 that hangs down structure, DBP (Dibuiyl Phthalate, phthalic acid two fourth vinegar) oil absorption is about 65ml/100g) as electroconductive particle, the weight ratio percentage that dopes of this electroconductive particle is weight ratio 50 percent in the present embodiment.Disclose as Figure 14, conducting particles is arranged in the electroconductive particle 32 of first direction, and the electroconductive particle 33 that is arranged in second direction.Make this polymer base material of supporting by the arm electroconductive particle become filled composite materials 30.
To this filled composite materials 30, using dosage is the above radiation gamma of 10Mrads, and it is crosslinked that polymer base material is produced mutually, the characteristic filled composite materials 30 ' (Figure 16) that allows filled composite materials 30 become to have shape memory.And the present embodiment using dosage is the cobalt 60 radiation gamma of 20Mrads.
See also Figure 17, next, this filled composite materials 30 ' is carried out the processing of skeleton symbol shearing force, this skeleton symbol shearing force dependent variable can be by one of percentage to 300 percent.And the dependent variable that present embodiment uses is about one of percentage hundred, makes filled composite materials 30 ' become processing back filled composite materials 30 ".Make the electroconductive particle 32 of first direction, arrange the electroconductive particle 32 ' that changes discontinuous phase into by original conduction continuous phase and arrange.That is to say that the arrangement of this electroconductive particle 32 ' has been nonconducting.
Consult Figure 18, at this filled composite materials 30 " on add electrode 96 and 97, again with this filled composite materials 30 " cut into the temperature-sensitive element 98 that diameter is 15mm.This temperature-sensitive element is heated to the formula of taking the photograph 150 degree, makes the HDPE fusing.Originally be subjected to the filling composite wood material 30 of shearing force distortion " return back to original memorized shape 30 '.Though originally causing hundred-percent strain is eliminated, but because of composite material 30 ' is heated to fusing point when above, can be because of HDPE base material phase, volumetric expansion reaches more than 10, make that the carbon black particle of low structure is strutted owing to base material expands mutually, and form discontinuous cut-off structure.See also Figure 19, the former resistance value R0 that this temperature-sensitive element 98 is ordered by F is heated to the G point when taking the photograph formula 150 degree (T2), can keep high impedance R1 state.When temperature returns room temperature T1, HDPE base material phase, once more because of the crystallization volume significantly shrinks, the feasible conducting particles that was originally strutted by the HDPE base material is replied the conduction state that links once more.Thereby resistance drop is to Low ESR R2.Thereafter element reverts back to general semistor (PPTC), when room temperature T1, can maintain low impedance state, and is warming up to the polymer base material fusing point again when above, and resistance can maintain high impedance status (consulting Figure 20).
By above-mentioned explanation as can be known, polymer-base thermosensitive resistive element provided by the present invention, can have negative temperature coefficient in the first time in the heating process, make the design and the application of circuit, can not be subject to traditional high molecular positive temperature coefficient temperature-sensitive element, make the application category of high molecular heat sensitive component more broad.
In addition, the present invention also provides a kind of polymer-base thermosensitive resistive element, when first the use, maintain high relatively resistance value, but after a high temperature used, after component temperature rose to the glass transition temperature or fusing point of polymer base material, resistance value can reduce relatively.
Simultaneously, the present invention provides a kind of manufacture method of polymer-base thermosensitive resistive element again, and it uses the processing of skeleton symbol shearing force, can change the microstructure of conductive fill material, and then change its electrical characteristic, has broader application space.
In addition, the invention provides a kind of manufacture method of polymer-base thermosensitive resistive element, the polymer-base thermosensitive element that its conductive filler that can produce different sensitive characteristics is filled makes the application of processing procedure and possibility that brand-new viewpoint be arranged.
Though the present invention explains with the above embodiments, do not represent that protection scope of the present invention exceeds with above-mentioned explanation.To those skilled in the art, when doing various modifications, for example, change selected macromolecular material, for example various crystalline polymer materials are as low density polyethylene (LDPE) (LDPE), LLDPE (LLDPE), polypropylene, or other vinyl copolymer such as ethylene-acrylic acid copolymer, or the amorphous macromolecular material, described just as preamble, as long as composite material is born the dependent variable of shearing force processing; And the addition of conducting particles mainly is to consider through after the shearing force processing, and conductive fill can become nonconducting state by the continuous conduction structure mutually; Or, change the shearing force dependent variable of filled composite materials in response to the difference of selecting material, or the change heating-up temperature (and heating-up temperature, to the macromolecular thermoplastic material of amorphous (amorphous), or the macromolecule thermosets, be meant glass transition temperature; For crystalline material, be meant fusing point); Change the ratio that dopes of conducting particles; Or after the processing of skeleton symbol shearing force, impose other processing or processing again, and reach identical effect.Only these modifications should not break away from spirit of the present invention, still belong in protection scope of the present invention.Protection scope of the present invention, what must look claims state is main.
Claims (59)
1, a kind of manufacture method of polymer-base thermosensitive resistive element comprises the steps:
One polymer base material is provided;
This polymer base material is doped conducting particles, make this polymer base material of supporting by the arm electroconductive particle become filled composite materials;
Carry out crosslinked to this filled composite materials;
Filled composite materials to this crosslinked mistake carries out the processing of skeleton symbol shearing force, and the dependent variable that makes this filled composite materials is greater than one of percentage.
2, the manufacture method of polymer-base thermosensitive resistive element as claimed in claim 1, wherein said polymer base material are high density polyethylene (HDPE).
3, the manufacture method of polymer-base thermosensitive resistive element as claimed in claim 1, wherein said conducting particles are high conductive black.
4, the manufacture method of polymer-base thermosensitive resistive element as claimed in claim 1, wherein the weight ratio of the conducting particles that is doped is 50 5 percent to percent.
5, the manufacture method of polymer-base thermosensitive resistive element as claimed in claim 4, wherein the weight ratio of the conducting particles that is doped is 10.
6, the manufacture method of polymer-base thermosensitive resistive element as claimed in claim 1 is wherein carried out crosslinkedly to this filled composite materials, be to use radiation gamma.
7, the manufacture method of polymer-base thermosensitive resistive element as claimed in claim 6 is wherein carried out crosslinkedly to this filled composite materials, be to use the above radiation gamma of 10Mrads.
8, the manufacture method of polymer-base thermosensitive resistive element as claimed in claim 7 is wherein carried out crosslinkedly to this filled composite materials, be to use the above cobalt 60 radiation gamma of 15Mrads.
9, the manufacture method of polymer-base thermosensitive resistive element as claimed in claim 1, the skeleton symbol shearing force of wherein being carried out processing reaches between 300 5 percent to percent the dependent variable of this filled composite materials.
10, the manufacture method of polymer-base thermosensitive resistive element as claimed in claim 1, the skeleton symbol shearing force of wherein being carried out processing makes the dependent variable of this filled composite materials reach one of percentage hundred.
11, the manufacture method of polymer-base thermosensitive resistive element as claimed in claim 1, wherein said conducting particles are nickel-plated graphite powder.
12, the manufacture method of polymer-base thermosensitive resistive element as claimed in claim 11, wherein the weight ratio of the conducting particles that is doped is 90 65 percent to percent.
13, the manufacture method of polymer-base thermosensitive resistive element as claimed in claim 12, wherein the weight ratio of the conducting particles that is doped is 75 percent.
14, the manufacture method of polymer-base thermosensitive resistive element as claimed in claim 11, the skeleton symbol shearing force of wherein being carried out processing makes the dependent variable of described filled composite materials reach one of percentage between 300 percent.
15, the manufacture method of polymer-base thermosensitive resistive element as claimed in claim 1, wherein said conducting particles are conductive black.
16, the manufacture method of polymer-base thermosensitive resistive element as claimed in claim 15, wherein the weight ratio of the conducting particles that is doped is 50 percent.
17, the manufacture method of polymer-base thermosensitive resistive element as claimed in claim 16 is wherein carried out crosslinkedly to this filled composite materials, be to use the above cobalt 60 radiation gamma of 20Mrads.
18, a kind of manufacture method of filled composite materials temperature-sensitive element comprises the steps: to establish a composite material of supporting by the arm conducting particles; Then carry out crosslinked to this composite material of supporting by the arm conducting particles; Composite material to this crosslinked mistake carries out shearing processing again, makes the conducting particles in this composite material form discontinuous phase in a direction.
19, the manufacture method of filled composite materials temperature-sensitive element as claimed in claim 18, wherein said composite material are high density polyethylene (HDPE).
20, the manufacture method of filled composite materials temperature-sensitive element as claimed in claim 18, wherein said conducting particles are high conductive black.
21, the manufacture method of filled composite materials temperature-sensitive element as claimed in claim 18, wherein the weight ratio of the conducting particles that is doped is 50 5 percent to percent.
22, the manufacture method of filled composite materials temperature-sensitive element as claimed in claim 18 is wherein carried out crosslinkedly to this filled composite materials, be to use radiation gamma.
23, the manufacture method of filled composite materials temperature-sensitive element as claimed in claim 18 is wherein carried out crosslinkedly to described filled composite materials, be to use the above radiation gamma of 10Mrads.
24, the manufacture method of filled composite materials temperature-sensitive element as claimed in claim 18, the skeleton symbol shearing force of wherein being carried out processing reaches between 300 5 percent to percent the dependent variable of described filled composite materials.
25, the manufacture method of filled composite materials temperature-sensitive element as claimed in claim 18, the skeleton symbol shearing force of wherein being carried out processing makes the dependent variable of described filled composite materials reach one of percentage hundred.
26, the manufacture method of filled composite materials temperature-sensitive element as claimed in claim 18, wherein said conducting particles are nickel-plated graphite powder.
27, as the manufacture method of filled composite materials temperature-sensitive element as described in the claim 26, wherein the weight ratio of the conducting particles that is doped is 90 65 percent to percent.
28, the manufacture method of filled composite materials temperature-sensitive element as claimed in claim 18, wherein said conducting particles are conductive black.
29, the manufacture method of filled composite materials temperature-sensitive element as claimed in claim 18, wherein the weight ratio of the conducting particles that is doped is 50 percent.
30, the manufacture method of filled composite materials temperature-sensitive element as claimed in claim 18, wherein said composite material are vinyl copolymer.
31, the manufacture method of filled composite materials temperature-sensitive element as claimed in claim 30, wherein said vinyl copolymer are low density polyethylene (LDPE).
32, the manufacture method of filled composite materials temperature-sensitive element as claimed in claim 31, wherein said vinyl copolymer are polypropylene.
33, the manufacture method of filled composite materials temperature-sensitive element as claimed in claim 18, wherein said composite material are the amorphous macromolecular material.
34, a kind of polymer-base thermosensitive element comprises: a macromolecule filled conductive composite material, and this macromolecule filled conductive composite material comprises polymer base material, and is provided with electroconductive particle in this polymer base material; And this electroconductive particle forms discontinuous phase according to single direction; And this macromolecule filled conductive composite material has the characteristic of shape memory, through after the above temperature of fusing point of this polymer base material, makes the discontinuous electroconductive particle joint of this single direction become conduction continuous phase.
35, polymer-base thermosensitive element as claimed in claim 34, wherein said polymer base material is a high density polyethylene (HDPE).
36, polymer-base thermosensitive element as claimed in claim 34, wherein said conducting particles is high conductive black.
37, polymer-base thermosensitive element as claimed in claim 36, wherein the weight ratio of conducting particles is 50 5 percent to percent.
38, polymer-base thermosensitive element as claimed in claim 34, wherein said conducting particles is a nickel-plated graphite powder.
39, polymer-base thermosensitive element as claimed in claim 38, wherein the weight ratio of this conducting particles is 90 65 percent to percent.
40, polymer-base thermosensitive element as claimed in claim 34, wherein said conducting particles is a conductive black.
41, polymer-base thermosensitive element as claimed in claim 40, wherein the weight ratio of conducting particles is 50 percent.
42, polymer-base thermosensitive element as claimed in claim 34, wherein said polymer base material is a vinyl copolymer.
43, polymer-base thermosensitive element as claimed in claim 42, wherein said vinyl copolymer is a low density polyethylene (LDPE).
44, polymer-base thermosensitive element as claimed in claim 43, wherein said vinyl copolymer is a polypropylene.
45, polymer-base thermosensitive element as claimed in claim 34, wherein said polymer base material is the amorphous macromolecular material.
46, a kind of polymer-base thermosensitive element comprises: a polymer base material; Conducting particles is located in this polymer base material, and forms discontinuous phase according to single direction; This polymer base material that is provided with conducting particles has the characteristic of shape memory, and after uniform temperature, making this single direction form discontinuous electroconductive particle joint becomes conduction continuous phase.
47, polymer-base thermosensitive element as claimed in claim 46, wherein said polymer base material is a high density polyethylene (HDPE).
48, polymer-base thermosensitive element as claimed in claim 46, wherein said conducting particles is high conductive black.
49, polymer-base thermosensitive element as claimed in claim 48, wherein the weight ratio of conducting particles is 50 5 percent to percent.
50, polymer-base thermosensitive element as claimed in claim 46, wherein said conducting particles is a nickel-plated graphite powder.
51, polymer-base thermosensitive element as claimed in claim 50, wherein the weight ratio of conducting particles is 90 65 percent to percent.
52, polymer-base thermosensitive element as claimed in claim 46, wherein said conducting particles is a conductive black.
53, polymer-base thermosensitive element as claimed in claim 52, wherein the weight ratio of conducting particles is 50 percent.
54, polymer-base thermosensitive element as claimed in claim 46, wherein said polymer base material is a vinyl copolymer.
55, polymer-base thermosensitive element as claimed in claim 54, wherein said vinyl copolymer is a low density polyethylene (LDPE).
56, polymer-base thermosensitive element as claimed in claim 54, wherein said vinyl copolymer is a polypropylene.
57, polymer-base thermosensitive element as claimed in claim 46, wherein said polymer base material is the amorphous macromolecular material.
58, polymer-base thermosensitive element as claimed in claim 46, wherein this uniform temperature is meant glass transition temperature.
59, polymer-base thermosensitive element as claimed in claim 46, wherein this uniform temperature is meant fusing point.
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| CN 01109711 CN1375839A (en) | 2001-03-19 | 2001-03-19 | Polymer-base thermosensitive impedance element and its making process |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102796333A (en) * | 2012-09-06 | 2012-11-28 | 哈尔滨工业大学 | Preparation method of polyvinylidene-fluoride-base temperature-sensitive resistance material with negative temperature coefficient effect |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102796333A (en) * | 2012-09-06 | 2012-11-28 | 哈尔滨工业大学 | Preparation method of polyvinylidene-fluoride-base temperature-sensitive resistance material with negative temperature coefficient effect |
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