CN1365106A - Laser head device - Google Patents
Laser head device Download PDFInfo
- Publication number
- CN1365106A CN1365106A CN 01143982 CN01143982A CN1365106A CN 1365106 A CN1365106 A CN 1365106A CN 01143982 CN01143982 CN 01143982 CN 01143982 A CN01143982 A CN 01143982A CN 1365106 A CN1365106 A CN 1365106A
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- mentioned
- head assembly
- laser head
- encapsulant
- frame
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Abstract
To provide an optical head device which effectively removes a discharge of noises from a switching circuit and also enables even electromagnetic shielding. In the optical head device 1, a shielding case 60 which covers a high frequency superposing module 412 and a grounding plate 50 are attached to a frame 3 by a common screw, and moreover the shielding case 60 is electrically connected to a ground pattern of the high frequency superposing module 412 via a noise filter 414.
Description
Technical field
The invention relates to record, the used laser head assembly of regenerating of a kind of CD (Zip disk) and DVD optical recording medias such as (digital video disks).More particularly, the invention relates to the structure that is used for anti-electromagnetic noise in the laser head assembly.
Background technology
The record of optical recording media such as CD and DVD, the used laser head assembly of regeneration import object lens by light-guiding system with the light that light source penetrates, and this object lens convergent light is converged on optical recording media.At this moment, drive object lens by lens driver to tracking direction and focus direction.About the light that from optical recording media, returns, still by light-guiding system lead-in light sensing device.Here, the various opticses that constitute light-guiding system carry assigned position on frame with light source and photosensitive device etc.Also be equipped with on the frame to be equipped with and be intended to the printed circuit board (PCB) that light source is supplied with the on-off circuit of additional high rate on the signal.
On-off circuit turns round under high-frequency, so can produce noise.At present, be equipped with on the printed circuit board (PCB) of on-off circuit, noise filters such as noise eliminating capacitor and inductor are installed, and the noise of this filtrator being eliminated by ground plate is released into heat sink.
But the problem that exists at existing laser head assembly is that the noise that enters the printed circuit board ground pattern is eliminated by noise filter, directly is released into outside noise but can't eliminate from on-off circuit
In view of the above problems, problem of the present invention is: providing a kind of can be used for the laser head assembly of electromagnetic screen when effectively eliminating the noise that discharges in the on-off circuit.
Summary of the invention
For solving above-mentioned problem, laser head assembly of the present invention is provided with: light source; Driving is penetrated the lens driver that light converges on the object lens of optical recording media with this light source; The photosensitive device of the light that reception is returned from optical recording media; Above-mentioned light source is supplied with the on-off circuit of signal additional high rate; Carry the frame of above-mentioned light source, said lens drive unit, said switching circuit and above-mentioned photosensitive device.It is characterized in that the encapsulant that covers said switching circuit is housed, by the grounded parts that noise is electrically connected the said switching circuit ground wire on the above-mentioned frame, simultaneously, above-mentioned encapsulant keeps being electrically connected between above-mentioned noise filter and above-mentioned grounded parts.
According to the present invention, dispose the encapsulant that covers on-off circuit, encapsulant is under the state of being electrically connected between connection and noise filter and the grounded parts, so on-off circuit is in the electromagnetic sealing state by encapsulant.Therefore, can interdict the noise that from on-off circuit, directly is released into the outside, can not cause the electromagnetic wave obstacle being disposed at laser head assembly machine on every side.
In the present invention, above-mentioned grounded parts and above-mentioned encapsulant are electrically connected with this preferably by being installed on the above-mentioned frame with general screw.Take this kind structure, can use identical screw that grounded parts and encapsulant are fixed on the frame, be electrically connected grounded parts and encapsulant.
In the present invention, above-mentioned encapsulant preferably is provided with the thin narrow part that is equipped with the welding of the printed circuit board (PCB) of said switching circuit.When being electrically connected encapsulant and printed circuit board (PCB), if the flat part of encapsulant is welded on the printed circuit board (PCB), it is excessive to produce encapsulant side thermal capacity, the problem that can't weld smoothly, or template and encapsulant problem of short-circuit on the generation printed circuit board (PCB).If but thin narrow part is set on encapsulant, and should thin narrow part weld with printed circuit board (PCB), because thermal capacity is little,, avoid short circuit in advance so can successfully weld.
In the present invention, above-mentioned encapsulant preferably is provided with and bends towards the rightabout enhancing rib of said switching circuit.In laser head assembly, must avoid weight to increase and produce vibration, and if with enhancing rib enhanced leaktightness material, can realize in light weightly, and constitute high-intensity encapsulant.Be provided with when strengthening rib,, then can not influencing the printed circuit board (PCB) that on-off circuit is housed if the end of encapsulant is bent towards the reverse direction of on-off circuit position side.In the on-off circuit position side, be provided with the miscellaneous part of laser head assembly, if the end of encapsulant is bent towards on-off circuit position side reverse direction, can prevent that encapsulant from having influence on the miscellaneous part of laser head assembly.
In the present invention, above-mentioned encapsulant is provided with the box-shaped of the printed circuit board (PCB) opposite face that constitutes this on-off circuit side for the printed circuit board (PCB) of said switching circuit is housed relatively, and, preferably be provided with the heat transmission opening on this box-shaped encapsulant.For preventing that noise directly is released into the outside from on-off circuit, preferably use the box-shaped encapsulant that can surround on-off circuit, and, if this box-shaped encapsulant is provided with opening, can dispel the heat thus, so also can prevent to be in the case condition of high temperature.
The present invention is effective especially under the resinous situation in above-mentioned frame.That is to say,, frame itself can be used as grounded parts also have the effect of sealing simultaneously if be the aluminum frame.And under the situation of resin system frame, then do not possess this function.
The description of the drawings
Fig. 1 is the planimetric map of the significant points of suitable laser head assembly of the present invention; Fig. 2 (A), (B), (C), (D) are respectively planimetric map, left side view, right side view and the ground plan that is suitable for laser head assembly of the present invention; Fig. 3 (A), (B), (C), (D) are respectively planimetric map, left side view, right side view and the ground plan of laser head assembly shown in Figure 2 with resin system frame; Fig. 4 is in the laser head assembly 1 shown in Figure 1, the key diagram of the high-frequency stack module covering structure of installing on the circuit board.Fig. 5 is the exploded perspective view of structure around the seal construction circuit board shown in Figure 4; Fig. 6 (A), (B) are respectively from the key diagram of left oblique upper finding sealing structure and the key diagram of constructing from right oblique upper finding sealing.
Embodiment
Below, with reference to drawing suitable laser head assembly of the present invention is described once
One-piece construction
Fig. 1 is the planimetric map of laser aid significant points that carries out the record regenerating of CD, CD-R and DVD.Fig. 2 (A), (B), (C), (D) are respectively planimetric map, left side view, right side view and the ground plan of laser head assembly shown in Figure 1.Fig. 3 (A), (B), (C), (D) are respectively planimetric map, left side view, right side view and the ground plan of laser head assembly shown in Figure 1 with resin system frame.
As Fig. 1, Fig. 2 and shown in Figure 3, laser head assembly 1 is provided with resin system frame 3.This frame 3 can move along axis of guide 2A, 2B by 2 axis of guide 2A, 2B perforation connecting portions 301,302,303 that relative machine is parallel to each other and installs.This axis of guide 3 is provided with optical system as described below.
The optical system of laser head assembly 1 is provided with the DVD laser diode that penetrates the 1st laser L1, the CD laser diode 5 that penetrates the 2nd laser L2, common light path 6 can lead the 1st and the 2nd laser L1, the L2 that penetrates from each laser diode 4,5, utilize this common light path 6, carry out the record regenerating of CD, CD-R and DVD.
Common light path 6 is provided with photosensitive device 11, sensing lens 10, light-guiding system 20, collimation lens 7 and the rising mirror 8 that is equipped on the frame 3, the object lens 9 that are arranged in rising mirror 8 tops.
DVD is used for the DVD record regenerating with laser diode 4, penetrates the 1st laser L1 of wavelength 650nm or 635nm.CD is CD and CD-R record regenerating usefulness with laser diode 5, penetrates the 2nd laser L2 of wavelength 780～800nm.Laser diode 4,5 is arranged in the homonymy of common light path, and optical axis L 10, L11 are parallel to each other.In illustrated example, compare DVD laser diode 4 more close photosensitive device 11 sides with laser diode 5 with CD.
Directly inject light-guiding system 20 from DVD with the 1st laser L1 that penetrates the laser diode 4.Inject in the light-guiding system 20 by the diffraction grid with the 2nd laser L2 that penetrates the laser diode 5 from CD, diffraction grid 12 has the diffraction characteristic of regulation, will be divided into 3 road light beams with the 2nd laser L2 that penetrates the laser diode 5 from CD.
DVD is installed is adhesively fixed on the side 317 of frame 3 by earthy plate with the printed circuit board (PCB) 410 of laser diode 4, and, be stamped the seal box of narrating in detail the back 60 on this printed circuit board (PCB) 410.Thus, DVD is disposed at the intake section in the hole 305 on the frame 3 with laser diode 4, by this hole 305, with the 1st laser L1 directive light-guiding system 20.About plate 50, in Fig. 2 (D), be the bottom right hatched example areas.
Being installed with CD is adhesively fixed on the side 316 of frame 3 with the heat sink 40 of laser diode 5.Thus, CD sees through this hole 306 with the intake section of laser diode 5 configuration with the hole 306 on the frames 3, by diffraction grid 12 with the 2nd laser L2 directive light-guiding system 20.
The circuit board 110 that photosensitive device 11 is installed is adhesively fixed on the side 311 of frame 3, and thus, photosensitive device 11 is equipped on the frame 3.
Here, DVD is housed with the circuit board 410 of laser diode 4 and be equipped with in the circuit board 110 of photosensitive device 11, be close to the inside side of common flexible print wiring board 77 mutually with thick plate, be connected the CD that is fixed on the heat sink with on the laser diode 5.About flex plate 77, in Fig. 2 (A), (C), be upper right hatched example areas.
Light-guiding system 20 is by the semi-transparent semi-reflecting lens 21 that is provided with part reflecting face, the prism 22 that is provided with part reflecting face.The optical axis L 10 of the 1st laser L1 that semi-transparent semi-reflecting lens 21 its part reflecting faces penetrate from laser diode 4 relatively becomes 45 degree to tilt.20 one-tenths 45 degree inclinations of optical axis L of the 2nd laser L2 that prism 22 part reflecting faces penetrate from laser diode 5 relatively.
In this routine laser head assembly 1 of this kind structure, the DVD that injects semi-transparent semi-reflecting lens 21 is with the 1st laser L1, and by the part reflecting face of semi-transparent semi-reflecting lens 21, closely the light composition of half is reflected, and reflected light optical axis crooked 90 is spent, and injects the part reflecting face of prism 22.And the major part of injecting the laser L1 of this part reflecting face can be thoroughly to rising catoptron 8.On the other hand, the CD that injects prism 22 is with the part reflecting face of the 2nd laser L2 by prism 22, and closely the light composition of half is reflected, and crooked 90 degree of its optical axis are injected rising catoptron 8.All be imported into common light path 6 by the light-guiding system 20, the 1 that constitutes by above-mentioned semi-transparent semi-reflecting lens 21 and prism 22 and the 2nd laser L1, L2.
The DVD that imports common light path 6 by light-guiding system 20 after the reflection of rising catoptron 8 right angles, becomes parallel beam by collimation lens 7 with laser L1 and CD laser L2.The laser L1 optically focused that becomes parallel beam becomes the light groove.CD becomes the light groove with laser L2 at the record surface optically focused of optical recording media CD or CD-R.
The back light of optical recording media laser light reflected L1, L2 returns object lens 9, collimation lens 7 and rising catoptron 8, and the back light guiding systems 20 once more.In these back lights, DVD is back to semi-transparent semi-reflecting lens 21 with the part reflecting face that the major part of the back light of laser L1 sees through prism 22.Half sees through the part reflecting face of semi-transparent semi-reflecting lens 21 and injects sensing lens 10.CD returns semi-transparent semi-reflecting lens 21 with half part reflecting face through prism 22 of the back light of laser L2, and injects sensing lens 10 through the reflecting surface of semi-transparent semi-reflecting lens 21.Then, each back light is concentrated on common photosensitive device 11 by sensing lens 10.Sensing lens 10 produce the lens of astigmatism for laser L1, the L2 that makes both sides.
In this form, sensing lens 10 are disposed at the exit portion in set hole 307 on the frame 3, and photosensitive device 11 detects the light that by this hole 307, also sees through semi-transparent semi-reflecting lens 21.
In the laser head assembly 1 of this kind structure, the objective lens device 70 that focusing direction and tracking direction drive object lens 9 is provided with the lens mount 71 that keeps object lens 9.The cylindrical bearing portion 73 that this lens mount 71 is provided with housing 72 cylindraceous and is located at these housing 72 inboards.Housing 72 is driven with coil 81 and a pair of focusing driving by a pair of tracking and constitutes with coil 82.
Being fixed on the diapire of the frame holding components 35 on the frame 3 uprightly has fulcrum 91, and this fulcrum 91 inserts the inboard of the bearing portion 73 of lens mounts 71.Frame holding components 35 is provided with outer wall 356 and inwall 357, is equipped with and follows the tracks of on the outer wall 356 with drive coil 81 face-offs, constitutes a pair of tracking magnet 83 of tracking magnetic circuit.Therefore, with lens mount 71 rotation around fulcrum 91, can revise tracking error.
On the outer wall 356, relative focusing is provided with a pair of focusing magnet 84 that constitutes the focusing magnetic circuit with drive coil 82.Therefore, the direction of principal axis of lens mount 71 along fulcrum 91 moved, can revise error of focusing.
Lens mount 71 is connected with the flex plate 77 that blinds board 359 centre positions of frame holding components 35 are supported.Be coated with above the frame holding components 35 and cover 355.(with reference to Fig. 2 (A))
(seal construction)
Fig. 4 is for showing in this form laser head assembly 1 key diagram of the high-frequency of installation stack module covering structure on the circuit board 410.Fig. 5 is for showing the exploded perspective view of constructing around the seal construction circuit board 410.Fig. 6 (A), (B) are respectively from the key diagram of left oblique upper finding sealing structure and the key diagram of constructing from right oblique upper finding sealing.
As Fig. 4 and shown in Figure 5, in this form laser head assembly 1, in circuit board 410, towards the hole 305, DVD is outstanding to the inside with laser diode 4, be equipped with in face side simultaneously, when writing down with 5 couples of CD-R of laser diode by CD, be provided with the high-frequency stack module 412 (on-off circuit) with the on-off element 411 of laser diode signal overlapped high-frequency rate, and enter the noise filtering device 414 that the noise eliminating of the noise in the ground connection template (part) 413 of circuit board 410 constitutes with inductor by electric cut-out this CD.And flexible print wiring board 77 extends upward from circuit board 410.
Be coated with the seal box 60 of setting forth in detail with reference to Fig. 5 and Fig. 6 on the circuit board 410, sealing case 60, noise filtering device 414 and dividing plate 50 are electrically connected as shown in Figure 4.That is to say that the ground connection template 413 and the dividing plate 50 of circuit board 410 are electrically connected by noise filtering device 414, seal box 60 will be electrically connected between this noise filtering device 414 and the dividing plate 50 simultaneously.
When adopting above-mentioned seal construction, in this form, the lateral parts of the frame 3 of mounting circuit boards 410, dividing plate 50, circuit board 410, seal box 60 adopt as Fig. 5 and structure shown in Figure 6.
At first, in Fig. 5, on the side 317 of resin system frame 3, be provided with configuration with DVD with laser diode 4 usefulness holes 305, the while is in its side, is provided with screw 370 below the frame 3.
When dividing plate 50 can be used as grounded parts, also has the function of thermal component.On dividing plate 50, frame 3 sides institute cover part is provided with the hole 501 with laser diode 4 patchholes 305 with DVD, simultaneously, in its end, is provided with hole 503 on the overlapping coupling part 502 below 3 of frames.
In an end of seal box 60, at the nearly middle body of short transverse, claw 604 bends towards the inside side from the side end face level.Relative therewith, crooked laterally from its bottom in the end side of seal box 60 with the coupling part 606 that the coupling part 502 of dividing plate 50 is overlapping, also be provided with hole 617 on this coupling part 606.
In the bottom of seal box 60, with the bending of regulation amplitude, constitute to strengthen and use rib 608 towards face side.
On the front 607 of seal box 60, side is posted insulation film 609 within it.
Utilize the seal box 60 of this kind structure, high-frequency stack module 412 is carried out sealing, in this form, at first, under state on the side 317 that dividing plate 50 is overlapped frame 3, circuit board 410 is overlapped on the dividing plate 50, DVD is pressed into the hole 305 of frame 3 with laser diode from the hole 501 of dividing plate 50.Its result, circuit board 410 and dividing plate 50 are temporarily fixed on the frame 3.
Then, on circuit board 410, cover seal box 60.Under this state, at the lower face of frame 3, the connecting portion 502 of dividing plate 50 is overlapping with the connecting portion 606 of seal box 60, so from these connecting portions 502,606, metallic screw (not shown) is screwed in the screw 370 of frame 3.Its result, dividing plate 50 and seal box 60 are installed on the frame 3, and dividing plate 50 is electrically connected with seal box 60 simultaneously.
Under this state, the claw 605 of seal box 60 still is in the state that rearward bends up, so at this claw 605 of inside bend of circuit board 410, by the end of claw 605 jack-up circuit boards 410.Under this state, in circuit board 410, in the side that high-frequency module 412 is housed, and the end be coated with seal box 60.But in seal box 60, below side be in complete open state, the top is provided with opening 601, so circuit board 410 is not in sealing state.
And, under this state, the leading section 604 of the thin narrow part 603 of seal box 60, on circuit board 410, overlapping with the ground connection module 415 that extends out from noise filtering device 414, so, insert flatiron from peristome 601, the leading section 604 of welding ground connection module 415 and thin narrow part 603.Its result, seal box 60 is electrically connected at noise filtering device 414 and 50 on dividing plate.Then, flexible print wiring board 77 is bent to the shape of regulation.
In the laser head assembly 1 of as above structure, cover high-frequencies stack modules 412 with seal box 60, so, can attract directly to diffuse to outside noise from high-frequency stack module 412.And the ground connection module 413 of circuit board 410 is connected with earthy dividing plate by noise filtering device 414, so the noise that enters in the ground connection module 413 can be eliminated by noise filtering device 414, can prevent that noise from diffusing to the outside.Seal box 60 is electrically connected at noise filtering device 414 and 50 on dividing plate, so high-frequency overlapping 412 and circuit board 410 are in the electromagnetic sealing state by seal box 60.Therefore, can be to not being disposed at machine around the laser head assembly 1 obstacle that generates electromagnetic waves.
And ground dummy board 50 is installed on the frame 3 with the same screw of seal box 60 usefulness, so can shorten assembling procedure, simultaneously dividing plate 50 and seal box 60 is done practical being electrically connected.
And seal box 60 is provided with and bends towards the rightabout enhancing of high-frequency stack module 412 position side with rib 608, so under the purpose of weight reduction, promptly use metal sheet to make seal box 60, also has enough intensity, so, can not produce vibration etc.Seal box 60 can not touch circuit board 410, than its high high-frequency stack module 412 or constitute the miscellaneous part of laser head assembly 1.
Just as explained above, in laser head assembly of the present invention, the ground wire of on-off circuit is connected on the grounded parts by the noise filtering device, so the noise that enters in the circuit module of the printed circuit board (PCB) that on-off circuit is housed can be eliminated by the noise filtering device, makes it not expand to the outside.Encapsulant is electrically connected between noise filtering device and grounded parts, so on-off circuit is in the electromagnetic sealing state under the encapsulant effect, therefore, can be to not being disposed at machine around the laser head assembly obstacle that generates electromagnetic waves.
Claims (6)
1. laser head assembly, it is provided with light source; Driving is with the lens driver of this light source from the object lens of ejaculation light pinching on optical recording media; The photosensitive device of the light that reception is returned from optical recording media; Above-mentioned light source is supplied with the on-off circuit of signal overlapped high-frequency rate; Carry above-mentioned light source, said lens drive unit, said switching circuit, and the frame of above-mentioned photosensitive device, it is characterized in that, on above-mentioned frame, be provided with the encapsulant that covers said switching circuit; Be electrically connected the grounded parts of the ground wire of said switching circuit by the noise filtering device; Above-mentioned encapsulant is electrically connected at above-mentioned noise filtering device and above-mentioned grounded parts intercropping.
2. laser head assembly as claimed in claim 1 is characterized in that, above-mentioned grounded parts and above-mentioned encapsulant are installed on the above-mentioned frame by same screw.
3, laser head assembly as claimed in claim 1 is characterized in that, above-mentioned encapsulant is provided with and is equipped with the thin narrow part of the printed circuit board (PCB) welding of said switching circuit.
4. laser head assembly as claimed in claim 1 is characterized in that, above-mentioned encapsulant is provided with and bends towards the rightabout enhancing rib of said switching circuit position side.
5. laser head assembly as claimed in claim 1 is characterized in that, above-mentioned encapsulant is a box-shaped, and the above-mentioned relatively on-off circuit printed circuit board (PCB) that is equipped with is provided with and the relative face of this on-off circuit formation side printed circuit board (PCB) face.
6. laser head assembly as claimed in claim 1 is characterized in that, above-mentioned frame is a resin system.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000392453A JP3785040B2 (en) | 2000-12-25 | 2000-12-25 | Optical head device |
| JP392453/00 | 2000-12-25 | ||
| JP392453/2000 | 2000-12-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1365106A true CN1365106A (en) | 2002-08-21 |
| CN1192373C CN1192373C (en) | 2005-03-09 |
Family
ID=18858441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011439823A Expired - Fee Related CN1192373C (en) | 2000-12-25 | 2001-12-25 | Laser head device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3785040B2 (en) |
| CN (1) | CN1192373C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010118124A (en) * | 2008-11-14 | 2010-05-27 | Pioneer Electronic Corp | Optical pickup device and information recording and reproducing device |
-
2000
- 2000-12-25 JP JP2000392453A patent/JP3785040B2/en not_active Expired - Fee Related
-
2001
- 2001-12-25 CN CNB011439823A patent/CN1192373C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1192373C (en) | 2005-03-09 |
| JP3785040B2 (en) | 2006-06-14 |
| JP2002197702A (en) | 2002-07-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: NIDEC SANKYO CORP. Free format text: FORMER NAME OR ADDRESS: SANKYO SEIKI MFG. SEISAKUSHO K.K. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: Nagano Patentee after: Sankyo Seiki Seisakusho KK Address before: Nagano Patentee before: Sankyo Seiki Manufacturing Co., Ltd. |
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| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050309 Termination date: 20100125 |