CN1360204A - Interface bonding strength laser impact quantitative determination method and device - Google Patents
Interface bonding strength laser impact quantitative determination method and device Download PDFInfo
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- CN1360204A CN1360204A CN 01137326 CN01137326A CN1360204A CN 1360204 A CN1360204 A CN 1360204A CN 01137326 CN01137326 CN 01137326 CN 01137326 A CN01137326 A CN 01137326A CN 1360204 A CN1360204 A CN 1360204A
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Abstract
The invention relates to the field of laser technology and material performance test, in particular to a laser impact quantitative determination method and a laser impact quantitative determination device for interface bonding strength, which are suitable for determining the adhesive force of a film or an adhesive and determining the interface bonding strength of various composite materials. The laser beam emitted by laser is passed through external optical path system and impacted on the surface of sample system of equilateral right-angle triangular prism or its deformation body to form high-amplitude compression stress wave, which is reflected by sample inclined plane and converted into tensile stress wave, then acted on interface to produce interface pure tensile stripping, and the interference measuring beam is divided into two paths by spectroscope, and respectively acted on the inclined plane and right-angle plane of sample to implement two-point interference, at the same time, the trigger switch is used to control opening of double-channel oscilloscope, and the stress wave signal is transmitted to computer processing terminal by oscilloscope to make analysis treatment. By applying the device, a pure tensile stress area can be formed on the right-angle surface to be measured and even the whole lower area by utilizing the conversion of the stress waveform on the sample inclined surface.
Description
Technical field
The present invention relates to laser technology and material properties test field, refer in particular to a kind of laser-impact method for quantitatively determining and device of interface bond strength, the quantitative measurement of the pulling strengrth at column type interface in the planar interface of the mensuration of the adhesion of its suitable film or tackifier, various compound substance such as laminate type compound substance, the globular interface of particulate reinforced composite and the fibre reinforced composites, and the mensuration of the interface bond strength of other type.
Background technology
Interface bond strength is most important in interface science research, but a difficult problem how direct, that the quantitative measurement interface bond strength remains puzzlement countries in the world scientist so far.Accurately say to have only interface tension strength just to reflect real interface bond strength, yet experiment interface tension strength quantitative, that directly measure is very difficult.At present, the sign of interface bond strength is mainly assessed indirectly according to the macroscopical testability energy and the fractography analysis of system.Show different interface shear strengths on the thin film system macroscopic view of different interface tension strengths, so the interface shear strength of easily surveying with macroscopic view characterizes interface bond strength indirectly usually.Existing assay method mostly is to measure interface shear strength, promptly sets up the critical stress value that an inelastic process begins.Combination can excite identical process but different normal stress is with shearing stress, and this fact makes problem become complicated.Up to now, though the assay method of proposition kind surplus in the of 20 nearly, as pulling method, indentation method, scarification, bending method and fracture mechanics method etc.But all there is limitation Buddhist monk problem to be solved in every kind of method on measuring technique and Mechanics Calculation.
Only directly peel off under simple action of pulling stress at the interface, and the fracture critical value that records could really reflect the true bond strength in interface, and laser slabbing technology provides possibility for this reason.It is that people such as Gupta by Massachusetts Institute Technology take the lead in carrying out that laser slabbing standard measure is measured plane film interface bond strength, and apply for a patent at Dartmouth College: System and method for measuring theinterface tensile strength of planar interfaces, approval number is US5438402.Its principle is to use short-pulse laser (pulsewidth is generally 2ns-8ns) impact specimen, rely on the stretching ripple and the incident compression stress wave tension when meeting at the interface that form from free-surface reflection to produce slabbing, but nearly all research all is qualitatively.They use doppler interferometer and adopt a bit to interfere at the sample dorsal part heart is accepted to arrive stress wave on the Free Surface (record be velocity wave form), the incident stress wave waveform that the laser-impact that adopts fitting method to obtain estimating again in view of the above produces obtains contact bed resistance to spalling as known conditions in conjunction with the input FEM (finite element) calculation with it.Other the external scholar such as Sigrit (the Optical Engineering.1995 of Switzerland, 34 (7): 1916-1922), Sartori (the Surface and CoatingsTechnology.1998 of France, 106:251-261) etc., domestic indivedual scholars (investigation of materials journal, 1996,10 (4), 393~396) all copy Gupta work to study, they obtain the critical laser-impact projectile energy threshold values of the film slabbing of different matrix and thin film system, but do not calculate interface bond strength, main cause is because laser and material coupling produce the process complexity of high-amplitude stress wave, with laser-impact parameter and material property parameter is initial conditions, can't set up correct relatively at present, unified again stress wave computation model.
So existing laser slabbing technology, it still exists the mistake and the insurmountable problem of some essence on measuring principle and Mechanics Calculation:
1. Bauschinger effect can't be avoided (investigation of materials journal, 1996,10 (4), 393~396).Plate sample causes film slabbing mistake
Always bear compressive stress in the journey earlier and bear tension again, because it can only rely on the incident compression stress wave back free-surface reflection shape
Become tensile stress wave, itself and incident compression stress wave are in stack at the interface, and generation is peeled off, and can't form simple tensile stress area.
Therefore Bauschinger effect can't be got rid of the influence of measurement result, causes measured value bigger than normal.
2. measurement result does not directly reflect interface bond strength.On slabbing differentiation problem, must only can observe by microscope at present
The situation that film not only ftractures but also peels off can't detect for the situation of film unsticking and crack propagation.So existing measurement result
All are synthesis result of contact bed resistance to spalling and film energy to failure.Look down upon greatly from the laser projectile energy of correspondence, film separation be
Unpeeled 2-6 times, so measurement result is seriously bigger than normal.This is that the measuring principle defective causes.
3. Free Surface stress wave behind some interferometries of the film surface interface can't obtain incident stress wave amplitude and waveform, in the calculating only
Can adopt the match waveform or estimate waveform, not so can only use the qualitative sign of laser projectile energy critical value.And prior art only
Can measure the plane interface.
4. slabbing intensity is calculated and is had mistake.Prior art uses at first by a narrow margin that laser incident obtains desirable stress wave waveform, will survey again
Free Surface stress history data and this desirable complete stress wave waveform match, its result calculates as input or the numerical value mould
Fit finite element analysis.This process has lost the film slabbing information in the measured waveform on the one hand, causes initial conditions on the other hand
Uncertain problem, its result of calculation exists equally than large deviation.
5. film thickness is limited can only be several microns even thinner.Because the interface peel off the stretching that must rely on through the film free-surface reflection
Stress wave, this slabbing mechanism is also brought restriction to the thickness of film simultaneously, generally only can detect several microns very thin film.
6. do not meet practical application,, must adopt the laser beam impinge of a series of different capacities a series of with a kind of sample because in test,
Grope the critical laser projectile energy threshold values of film slabbing, estimate slabbing intensity again.Because the film bond strength of various sample
Undulatory property, and the complicacy of laser and material coupling, the means scarcity differentiated of slabbing in addition causes this work can only office
Be limited to laboratory study qualitatively.
Summary of the invention
The purpose of this invention is to provide and a kind ofly can overcome above-mentioned shortcoming, method and device that can accurate realization interface bond strength laser-impact more direct, more science quantitative measurement.The mensuration of the interface bond strength of its suitable film, coating, tackifier and various compound substances etc.
The present invention realizes by following technical scheme:
The laser beam that laser instrument sends is passed through outside optical system impact specimen system surface, after it is characterized in that the sample of laser beam impinge equilateral right angle triangular prism or its deformable body, form the high-amplitude compression stress wave, after the reflection of sample inclined-plane, convert tensile stress wave to, remake and use the interface, produce the simple stretch release in interface, the while stress wave signal is transferred to the Computer Processing terminal by oscillograph and carries out analyzing and processing.
Interferometric beams is divided into two-way through spectroscope and acts on respectively and realize 2 interference on the inclined-plane of sample and the right angle face.Adopt the unlatching of trigger switch control dual channel oscilloscope.
Realize the device of this method, comprise laser instrument, outside optical system, frock clamp system, sample system, interferometer, oscillograph, control system, Computer Processing terminal, it is characterized in that sample body is equilateral right angle triangular prism or its deformable body.The integral type flexible lamina that sample system surface is sticked and is made up of transparent restraint layer and energy-absorbing layer, oscillograph are dual channel oscilloscope, and the frock clamp system is made up of the clamping screw of lower plate that the sample system is installed and band right angle groove.
Its course of work is undertaken by following step:
(1) laser beam of being sent by laser instrument is installed in a right-angled surface of the sample to be tested that is equilateral right angle triangular prism or its deformable body in the anchor clamps by the outside optical system vertical impact, pastes shock wave effect that flexible lamina on this face is subjected to induced with laser and produces high-amplitude compression stress wave to the sample internal communication;
(2) the high-amplitude compression stress wave is at first propagated to triangular prism sample inclined-plane along incident right angle face normal direction, when compression stress wave propagates into the sample inclined-plane, be transformed into tensile stress wave through reflection, and perpendicular to another right angle face vertical transmission of stress wave incident direction to sample, and on this right angle face, arrive simultaneously, because the distance of each point stress wave propagation is identical in the shock surface, the decay of shock wave conforms with the phase structure variation and all is consistent, and after this continues to propagate with the plane wave form.
(3) Zhuan Huan tensile stress wave at first vertically acts on the interface to be measured, causes the interface directly to be peeled off under simple drawing stress effect, and the interface slabbing stress when being in critical conditions is interface tension strength, also is interface bond strength.
(4) when laser instrument gives off laser beam, trigger switch is delayed start-up high frequency dual channel oscilloscope (500M or more than the 1G) simultaneously or quantitatively, and the Free Surface under inclined-plane and right angle to be measured face, inclined-plane before and after the interface tension that interferometer interferes online in real time to be accepted with two point is peeled off and the particle displacement history on the bottom surface or speed history are (if adopt displacement interference instrument, the tracer signal differential is obtained the speed history, calculate according to theory of stress wave again and convert the stress history to), be transferred to dual channel oscilloscope, obtain interface peel front and back stress wave signal.
(5) stress wave signal before and after the interface peel that record is obtained is as the initial conditions in numeric value analysis and the finite element analysis simulation process.Simultaneously as a comparison, can utilize the slabbing information that stress wave waveform carries behind the interface peel, when utilizing-frequency analysis and wave form analysis, can accurately determine the slabbing moment, the slabbing degree of depth, slabbing face size, judge the film slabbing stage of living in (film unsticking, crack propagation, film separation), the interface tension peel stress of getting critical conditions is interface tension strength, therefore realizes single-impact, once measures.
The sample system is by surface of the work the be sticked transparent restraint layer that constitutes integral type and the flexible lamina of energy-absorbing layer.The pulse width of the laser beam that the modulator in the laser instrument produces is 1ns-10ns, wavelength 1064 nanometers, 532 nanometers or littler.Regulate parameters such as laser pulse width, energy, beam diameter and adjust the size of the stress wave of generation.
The present invention proposes the experiment quantitative measuring method of the interface bond strength of film and compound substance, and for the plane interface, under the tensile stress wave effect, the critical drawing stress of peeling off is interface bond strength.For particulate reinforced composite and fibre reinforced composites, on the slabbing face, the interface of globular interface, cylindrical interface and other shape by specific distribution rule cycle or non-periodic be distributed on the slabbing face.According to its distribution characteristics, applied mathematics parsing, finite difference or finite element analysis method decompose the slabbing stress on the slabbing face on each interface to be measured, thereby obtain the bond strength at interface to be measured.
The present invention has following technical advantage:
(1) thoroughly eliminated unavoidable Bauschinger effect in the conventional test methodologies.Use this device and can utilize the conversion of sample inclined-plane upper stress waveform, form simple tensile stress area at right angle to be measured face and even whole lower area, design interface to be measured in this zone, the interface will produce simple stretch release, realized the interface stress by first compression chord again the tension stress transmission become and be subjected to tension earlier.Thereby fundamentally eliminated Bauschinger effect, principle is science more, and the result is more accurate.
(2) accept the stress wave signal of effect before and after the interface with the method for 2 interference (inclined-plane and right angle face), and with it as known conditions, this has solved the difficult problem that laser-impact produces in numerical simulation and the finite element analysis stress wave can't quantitatively be determined.
(3) the realization single-impact is once measured interface bond strength, need not The Fitting Calculation incident stress wave.Can utilize simultaneously the slabbing information that stress wave waveform carries after the slabbing, when utilizing-frequency analysis and wave form analysis, can accurately determine the slabbing moment, the slabbing degree of depth, slabbing face size, judge the film slabbing stage of living in (film unsticking, crack propagation, film separation), the realization single-impact is once measured the film bond strength.
(4) film and coating do not have thickness limits.Because the interface is again at first to bear drawing stress, and the rising edge of stress wave is very little, about 1-5 nanosecond, so the thickness of film is also had no requirement, can detect infinite thick in theory.
(5) except that can measuring the plane interface bond strength, also can measure discontinuous, the non-regularly arranged interface bond strength in particle enhancing or the fibre reinforced composites.
(6) adopt flexible lamina at surface of the work, it has the dual-use function of energy-absorbing layer and restraint layer.This double-deck flexible lamina covers pending right-angled surface, has not only improved utilization ratio of laser energy, and makes laser-impact convenient, efficient, low-cost.
Description of drawings
Fig. 1 interface bond strength laser-impact quantitative determination system device synoptic diagram
Fig. 2 triangular column type film or coating sample system synoptic diagram
Fig. 3 triangular prism deformable body film or coating sample system synoptic diagram
Fig. 4 triangular column type compound substance sample system synoptic diagram
Interfacial stress decomposing schematic representation on Fig. 5 composite layer broken face
Fig. 6 frock clamp and sample system assembling synoptic diagram
1 laser instrument, 2 spectroscopes 3 contain energy-absorbing layer 8 speculums 9 sample systems 10 speculums 11 spectroscopes 12 interferometric beams 13 displacement interference instruments 14 terminals 15 oscillographs 16 photodiode trigger switches 17 matrixes 18 inclined-planes 19 interference signals of the transparent restraint layer 7 integrated flexible pad pastings of the leaded light of attenuator and beam splitting system 4 focus lamps 5 pulse laser beams 6 integrated flexible pad pastings and accept bottom surface 20 interface to be measured 21 films or coating 22 reflected tensile stress wave 23 incident compression stress wave 24 empty triangular prism right angle faces 25 slabbing faces 26 composite fortifying fibres 27 slabbing stress, 28 train wheel bridges, 29 clamping screws, 30 lower plates
Embodiment
Describe the method for testing that the present invention proposes and the details and the working condition of device in detail below in conjunction with accompanying drawing, with and with the difference of conventional test methodologies.
The device that the present invention proposes is made up of laser instrument 1, outside optical system, frock clamp system, sample system 9, interferometer 13, oscillograph 15, control system, computer data processing terminal 14.Outside optical system comprises incident pulse laser beam light path system of being made up of spectroscope 2, the leaded light that contains attenuator and beam splitting system 3, focus lamp 4 and the interfering beam light path system of being made up of spectroscope 11, catoptron 8,10, the frock clamp system is made up of the clamping screw 29 of the train wheel bridge 28 that sample system 9 is installed, lower plate 30 and band right angle groove, and control system comprises photodiode trigger switch 16.Sample system 9 is the triangular prism form, the be sticked flexible lamina of the integral type formed by transparent restraint layer 6 and energy-absorbing layer 7 of one right-angled surface, and link to each other with laser instrument 1 with the leaded light incident pulse laser beam light path system that constitutes that links to each other with beam splitting system 3 and focus lamp 4 successively via spectroscope 2 passages through which vital energy circulates impulse light beams 5, the interferometric beams 12 that displacement interference instrument 13 sends links to each other with catoptron 8,10 respectively and is divided into two the tunnel through spectroscope 11, act on respectively on the inclined-plane and another right angle face of sample system 9, realization displacement interference instrument 13 is connected with sample system 9.Dual channel oscilloscope 15 1 ends link to each other with displacement interference instrument 13, receive stress wave signal, its other end links to each other with computer data processing terminal 14, stress wave signal is transferred out, photodiode trigger switch 16 1 ends are connected with spectroscope 2 through light path and are excited beam signal, the other end its unlatching of control that links to each other with dual channel oscilloscope 15.
Method of the present invention is the flexible lamina energy-absorbing layer 7 of direct radiation sample system 9 after laser instrument 1 incoming laser beam 5 line focuses of sending, its instantaneous vaporization also forms high-temperature plasma, they expand and are subjected to the restriction of transparent restraint layer 6 in the flexible lamina, like this, plasma is violent to heat up and then heavy explosion, produces the incident compression stress wave 23 to sample system 9 internal communications.This moment, shock wave was along specific propagated in the equilateral right angle triangular prism sample, when it propagates into sample inclined-plane 18, be transformed into tensile stress wave 22 through reflection, and propagate to another right angle face of sample, and arrive this right angle face simultaneously perpendicular to the shock wave incident direction.Tensile stress wave after the conversion at first acts on the interface 20 to be measured like this, and directly peel off under the drawing stress effect at the interface.When laser instrument 1 sends pulse laser beam 5,16 whiles of photodiode trigger switch or quantitative delayed start-up oscillograph 15, displacement interference instrument 13 online in real time are accepted the stress wave before and after the slabbing of record interface.Computer Processing terminal 14 calculates interface slabbing stress history, gets critical interface peel value, is interface tension strength.
Fig. 2 is a sample system synoptic diagram.The integrated flexible lamina of being made up of transparent restraint layer 6 and energy-absorbing layer 7 tightly is attached on the right angle face of matrix of samples 17, designs interface to be measured 20 parallel and this right angle face on another right angle face of matrix of samples 17.
Fig. 3 is the synoptic diagram of another sample system embodiment, it prolongs below equilateral right angle triangular prism, increase a rectangular area and be referred to as empty triangular prism, the interference signal of film or coating 21 is accepted bottom surface 19 and is in this below, zone, and this zone is simple tensile stress area.
Fig. 4 is a compound substance sample system synoptic diagram.Sample system shape invariance, just in sample system 9, there is not planar interface, slabbing face 25 is by the decision of experiment back, be transformed into the planar stretch stress wave later on according to the right-angle side of tensile stress wave below process after the inclined-plane reflection, so slabbing face 25 still is parallel to empty triangular prism right angle face 24.
Fig. 5 is the quantitative decomposing schematic representation of experiment of the interface bond strength of compound substance, for particulate reinforced composite and fibre reinforced composites, on slabbing face 25, the interface of cylindrical fortifying fibre 26 and the interface of other shape by specific distribution rule cycle or non-periodic be distributed on the slabbing face.According to its distribution characteristics, applied mathematics parsing, finite difference or finite element analysis method decompose the slabbing stress 27 on the slabbing face on each interface to be measured, thereby obtain the bond strength at interface to be measured.
Fig. 6 is the frock clamp synoptic diagram.Sample system 9 is installed on the lower plate 30, and top is with right angle groove clamping screw 29 to hold out against through train wheel bridge 28.Bottom and right flank are used to detect interferometric beams 12 incidents, and left surface is used for pulse laser beam 5 incidents.
The variation of different sample system forms all may realize different measurements, only illustrates its technical scheme and part embodiment here.
Claims (7)
1. interface bond strength laser-impact method for quantitatively determining, it passes through outside optical system impact specimen system surface with the laser beam that laser instrument sends, after it is characterized in that the sample of laser beam impinge equilateral right angle triangular prism or its deformable body, form compression stress wave, after the reflection of sample inclined-plane, convert tensile stress wave to, remake and use the interface, produce the simple stretch release in interface, the while stress wave signal is transferred to the Computer Processing terminal by oscillograph and carries out analyzing and processing.
2. interface bond strength laser-impact method for quantitatively determining according to claim 1 is characterized in that interferometric beams is divided into two-way through spectroscope to act on respectively and realize 2 interference on the inclined-plane of sample and the right angle face.
3. according to the interface bond strength laser-impact method for quantitatively determining that claim 1 proposed, it is characterized in that adopting the unlatching of trigger switch control dual channel oscilloscope.
4. realize the device of the described interface bond strength laser-impact of claim 1 method for quantitatively determining, it comprises laser instrument (1), outside optical system, frock clamp system, sample system (9), interferometer (13), oscillograph (15), control system, computer data processing terminal (14), it is characterized in that sample system (9) is equilateral right angle triangular prism or its deformable body.
5. the device of interface bond strength laser-impact method for quantitatively determining according to claim 4 is characterized in that the integral type flexible lamina that sample system (9) surface is sticked and is made up of transparent restraint layer (6) and energy-absorbing layer (7).
6. the device of interface bond strength laser-impact method for quantitatively determining according to claim 4 is characterized in that oscillograph is dual channel oscilloscope (15).
7. the device of interface bond strength laser-impact method for quantitatively determining according to claim 4 is characterized in that the frock clamp system is made up of the clamping screw (29) of the lower plate (30) that the sample system is installed and train wheel bridge (28) and band right angle groove.
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